t capacity for fusing tp=10ms, VRM≤10V, (note 5)
Maximum rate of rise of on-state current (repetitive), (Note 6) 1000 A/µs
Maximum rate of rise of on-state current (non-repetitive), (Note 6) 1500 A/µs
Peak reverse gate voltage 5 V
Mean forward gate power 2 W
PGM Peak forward gate power 30 W
VGD Non-trigger gate voltage, (Note 7) 0.25 V
THS Operating temperature range -40 to +125 °C
T
Storage temperature range -40 to +150 °C
stg
Notes:-
1) De-rating factor of 0.13% per °C is applicable for T
2) Double side cooled, single phase; 50Hz, 180° half-sinewave.
3) Single side cooled, single phase; 50Hz, 180° half-sinewave.
4) Double side cooled.
5) Half-sinewave, 125°C T
6) V
=67% V
D
7) Rated V
Data Sheet Type R1211NC12x Issue 3 Page 1of 12 August 2012
, IFG=2A, tr≤0.5µs, T
DRM
.
DRM
initial.
j
=55°C, (note 2) 1211 A
sink
=85°C, (note 2) 771 A
sink
=85°C, (note 3) 424 A
sink
=25°C, (note 2) 2497 A
sink
=25°C, (note 4) 1927 A
sink
, (note 5) 17.6 kA
RRM
, (note 5) 15.48×105 A
RRM
below 25°C.
j
=125°C.
case
MAXIMUM
LIMITS
MAXIMUM
LIMITS
UNITS
UNITS
19.4 kA
s
18.82×10
5
A
2
s
Distributed gate thyristor type R1211NC12x
r
r
r
r
r
r
Characteristics
PARAMETER MIN. TYP. MAX. TEST CONDITIONS (Note 1)UNITS
VTM Maximum peak on-state voltage - - 2.18 ITM=2000A V
VT0 Threshold voltage - - 1.7 V
rT Slope resistance - - 0.2
(dv/dt)cr Critical rate of rise of off-state voltage 200 - - VD=80% V
I
Peak off-state current - - 150 Rated V
DRM
I
Peak reverse current - - 150 Rated V
RRM
, linear ramp
DRM
mA
DRM
mA
RRM
VGT Gate trigger voltage - - 3.0 Tj=25°C V
IGT Gate trigger current - - 300 Tj=25°C VD=10V, IT=3A mA
IH Holding current - - 1000 Tj=25°C mA
Q
- - 0.048 Single side cooled K/W
F Mounting force 19 - 26 kN
Wt Weight - 510 - g
mΩ
V/µs
µC
µs
Notes:-
1) Unless otherwise indicated T
2)
The required tq (specified with dVdr/dt=200V/µs) is represented by an ‘x’ in the device part number. See ordering information for
details of t
codes.
q
=125°C.
j
Data Sheet Type R1211NC12x Issue 3 Page 2of 12 August 2012
Distributed gate thyristor type R1211NC12x
Notes on Ratings and Characteristics
1.0 Voltage Grade Table
Voltage Grade
V
DRM VDSM VRRM
V
V
RSM
V
VD VR
DC V
12 1200 1300 810
2.0 Extension of Voltage Grades
This report is applicable to other and higher voltage grades when supply has been agreed by
Sales/Production.
3.0 Extension of Turn-off Time
This Report is applicable to other t
/re-applied dv/dt combinations when supply has been agreed by
q
Sales/Production.
4.0 Repetitive dv/dt
Higher dv/dt selections are available up to 1000V/µs on request.
5.0 De-rating Factor
A blocking voltage de-rating factor of 0.13%/°C is applicable to this device for T
below 25oC.
j
6.0 Rate of rise of on-state current
The maximum un-primed rate of rise of on-state current must not exceed 1500A/µs at any time during
turn-on on a non-repetitive basis. For repetitive performance, the on-state rate of rise of current must not
exceed 1000A/µs at any time during turn-on. Note that these values of rate of rise of current apply to the
total device current including that from any local snubber network.
7.0 Square wave ratings
These ratings are given for load component rate of rise of forward current of 100 and 500 A/µs.
8.0 Duty cycle lines
The 100% duty cycle is represented on all the ratings by a straight line. Other duties can be included as
parallel to the first.
9.0 Maximum Operating Frequency
The maximum operating frequency is set by the on-state duty, the time required for the thyristor to turn off
(t
) and for the off-state voltage to reach full value (tv), i.e.
q
f
max
=
1
vqpulsettt
++
Data Sheet Type R1211NC12x Issue 3 Page 3of 12 August 2012
Distributed gate thyristor type R1211NC12x
(
)
⋅−=
(
)
⋅+⋅
10.0 On-State Energy per Pulse Characteristics
These curves enable rapid estimation of device dissipation to be obtained for conditions not covered by
the frequency ratings.
Let E
Let R
and T
Then the average dissipation will be:
be the Energy per pulse for a given current and pulse width, in joules
p
be the steady-state d.c. thermal resistance (junction to sink)
th(J-Hs)
be the heat sink temperature.
SINK
⋅=125
11.0 Reverse recovery ratings
is based on 50% Irm chord as shown in Fig. 1 below.
(i) Q
ra
(ii) Q
is based on a 150µs integration time.
rr
i.e.
=
.)(max
150
RWT and fEW
()
−
Fig. 1
s
µ
dtiQ
.
rrrr
∫
0
HsJthAVSINKPAV
1
t
(iii)
12.0 Reverse Recovery Loss
12.1 Determination by Measurement
From waveforms of recovery current obtained from a high frequency shunt (see Note 1, Page 5) and
reverse voltage present during recovery, an instantaneous reverse recovery loss waveform must be
constructed. Let the area under this waveform be E joules per pulse. A new heat sink temperature can
then be evaluated from:
where k = 0.227 (°C/W)/s
E = Area under reverse loss waveform per pulse in joules (W.s.)
f = rated frequency Hz at the original heat sink temperature.
R
Data Sheet Type R1211NC12x Issue 3 Page 4of 12 August 2012
= d.c. thermal resistance (°C/W).
th(J-Hs)
FactorK=
−=
)()(
2
t
RfkETT
()
−
HsJthoriginalSINKnewSINK
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