Mean on-state current. T
Mean on-state current. T
Mean on-state current. T
Nominal RMS on-state current. T
D.C. on-state current. T
Peak non-repetitive surge tp=10ms, VRM=0.6V
Peak non-repetitive surge tp=10ms, V
2
t capacity for fusing tp=10ms, VRM=0.6V
I2t capacity for fusing tp=10ms, V
Maximum rate of rise of on-state current (repetitive), (Note 6)200A/µs
Maximum rate of rise of on-state current (non-repetitive), (Note 6)400A/µs
Peak reverse gate voltage5V
Mean forward gate power4W
Peak forward gate power30W
Non-trigger gate voltage, (Note 7)0.25V
Operating temperature range-40 to +125°C
Storage temperature range-40 to +150°C
=55°C, (note 2)1132A
sink
=85°C, (note 2)781A
sink
=85°C, (note 3)476A
sink
=25°C, (note 2)2228A
sink
=25°C, (note 4)1945A
sink
, (note 5)14.3kA
RRM
≤
10V, (note 5)
RM
, (note 5)1.02×10
RRM
≤
10V, (note 5)
RM
Data Sheet Issue:- 1
MAXIMUM
LIMITS
MAXIMUM
LIMITS
15.7kA
6
1.23×10
6
UNITS
UNITS
A2s
A2s
Notes: -
1)
De-rating factor of 0.13% per °C is applicable for Tj below 25°C.
2)
Double side cooled, single phase; 50Hz, 180° half-sinewave.
3)
Single side cooled, single phase; 50Hz, 180° half-sinewave.
4)
Double side cooled.
5)
Half-sinewave, 125°C Tj initial.
6)
VD=67% V
7)
Rated V
Data Sheet. Types N1132NC300 to N1132NC360 Issue 1.Page 1 of 10January, 2002
, ITM=2000A, IFG=2A, t
DRM
.
DRM
≤
0.5µs, T
r
case
=125°C.
WESTCODE
Positive development in power electronics
Characteristics
N1132NC300 to N1132NC360
PARAMETERMIN.TYP.MAX. TEST CONDITIONS
V
V
r
dv/dtCritical rate of rise of off-state voltage1000--VD=80% V
I
I
V
I
I
t
t
Q
Q
I
t
t
q
R
Maximum peak on-state voltage--2.08ITM=1830AV
TM
Threshold voltage--1.15V
0
Slope resistance--0.51
S
Peak off-state current--100Rated V
DRM
Peak reverse current--100Rated V
RRM
Gate trigger voltage--3.0V
GT
Gate trigger current--300
GT
Holding current--1000Tj=25°CmA
H
Gate controlled turn-on delay time-0.51.0
gd
Turn-on time-1.02.0
gt
Recovered Charge-4200-µC
rr
Recovered Charge, 50% chord-20002300µC
ra
Reverse recovery current-130-A
rm
Reverse recovery time, 50% chord-30-
rr
-400600
Turn-off time
-650900
Thermal resistance, junction to
th(j-hs)
heatsink
--0.024 Double side cooledK/W
--0.048 Single side cooledK/W
T
I
FG
I
TM
I
TM
ITM=1000A, tp=1ms, di/dt=10A/µs,
V
ITM=1000A, tp=1ms, di/dt=10A/µs,
V
DRM
RRM
=25°C, VD=10V, IT=3A
j
=2A, tr=0.5µs, VD=67%V
=1000A, di/dt=10A/µs, Tj=25°C
=1000A, tp=1ms, di/dt=10A/µs, Vr=50V
=50V, Vdr=80%V
r
=50V, Vdr=80%V
r
(Note 1)
, linear ramp, gate O/C
DRM
DRM
, dVdr/dt=20V/µs
DRM
, dVdr/dt=200V/µs
DRM
,
UNITS
m
V/µs
mA
mA
mA
µs
µs
µs
FMounting force19-26kN
W
Weight-510-g
t
Ω
Notes: -
Unless otherwise indicated Tj=125°C.
1)
Data Sheet. Types N1132NC300 to N1132NC360 Issue 1.Page 2 of 10January, 2002
2.0 Extension of Voltage Grades
This report is applicable to other and higher voltage grades when supply has been agreed by
Sales/Production.
3.0 De-rating Factor
A blocking voltage de-rating factor of 0.13%/°C is applicable to this device for Tj below 25°C.
4.0 Repetitive dv/dt
Standard dv/dt is 1000V/µs.
5.0 Rate of rise of on-state current
The maxim um un-primed rate of ris e of on-s tate c urr ent must not exceed 400A/µs at any time during tur non on a non-repetitive basis. For repetitive performance, the on-state rate of rise of current must not
exceed
total device current including that from any local snubber network.
6.0 Gate Drive
The recomm ended pulse gate drive is 30V, 15Ω with a short-circuit current rise time of not more than
0.5µs. This gate drive must be applied when using the full di/dt capability of the device.
200A/µs at any time during turn-on. Note that these values of rate of rise of current apply to the
DRM VDSM VRRM
V
V
RSM
V
V
V
D
DC V
R
The pulse duration may need to be configured acc ording to the application but should be no shorter than
20µs, otherwise an increase in pulse current may be needed to supply the necessary charge to trigger.
7.0 Computer Modelling Parameters
7.1 Device Dissipation Calculations
∆
2
4
=
I
AV
Where V0=1.15V, rs=0.51m
R
= Supplementary thermal impedance, see table below.
th
ff
= Form factor, see table below.
Conduction Angle30°60°90°120°180°270°d.c.
Square wave Double Side Cooled0.02930.02850.02780.02710.02610.02490.024
Square wave Single Side Cooled0.05340.0530.05240.05180.05090.04970.048
Sine wave Double Side Cooled0.02860.02760.02690.02630.0248
Sine wave Single Side Cooled0.05310.05230.05170.05110.0497
00
⋅⋅
2
rff
Ω,
⋅⋅⋅++−
WrffVV
AVs
and:
s
Supplementary Thermal Impedance
W
AV
=
R
T
th
max
−=∆
TTT
Hsj
Form Factors
Conduction Angle30°60°90°120°180°270°d.c.
Square wave3.462.4521.731.411.151
Sine wave3.982.782.221.881.57
Data Sheet. Types N1132NC300 to N1132NC360 Issue 1.Page 3 of 10January, 2002
WESTCODE
p
p
7.2 Calculating VT using ABCD Coefficients
Positive development in power electronics
N1132NC300 to N1132NC360
The on-state characteristic I
(i) the well established V
(ii) a set of constants A, B, C, D, forming the coefficients of the representative equation for V
terms of I
The constants, derived by curve fitting soft ware, are given below for both hot and c old c harac teris tic s. T he
resulting values for V
that plotted.
7.3 D.C. Thermal Impedance Calculation
Where p = 1 to n, n is the number of terms in the series and:
The information contained herein is confidential and is protected by Copyright. The information may not be used or
disclosed except with the written permission of and in the manner permitted by the proprietors Westcode Semiconductors
Ltd.
In the interest of product improvement, Westcode reserves the right to change specifications at any time without prior
notice.
Devices with a suffix code (2-letter or letter/digit/letter combination) added to their generic code are not necessarily subject
to the conditions and limits contained in this report.