Wavecom M2106+ Product Specification

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Plug & Play Wireless CPU

Integra M2106+

Product Specification

Reference:

WA_DEV_M2106+_PTS_003

Revision:

001

Date:

April, 2007

Supports Open AT

embedded ANSI C applications

Integra M2106+

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Document Information

Revision Date History of the evolution

001 April 2007 Creation

Integra M2106+

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Caution

Information furnished herein by Wavecom is accurate and reliable. However, no responsibility is assumed for its use. Please read carefully the safety precautions for an application based on the Integra M2106+ Wireless CPU

Trademarks

WAVECOM®, Open AT®, Wireless CPU® are trademarks or registered trademarks of WAVECOM SA. All other company and/or product names mentioned may be trademarks or registered trademarks of their respective owners.

This manual is copyrighted by WAVECOM with all rights reserved. No part of this manual may be reproduced in any form without the prior written permission of WAVECOM. No patent liability is assumed with respect to the use of the information contained herein.

Integra M2106+

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Web Site Support

General information about Wavecom and its range of products:

www.wavecom.com

Carrier/Operator approvals: www.wavecom.com/approvals

Open AT® Introduction: www.wavecom.com/OpenAT

Developer support for software and hardware: www.wavecom.com/forum

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Overview

This document defines and specifies the Integra M2106+ Plug & Play Wireless CPU®. It also contains guidelines for application design and recommendations to use the Integra development kit.

This Plug and Play Wireless CPU

is an E-GSM/GSM - GPRS Class 10 900/1800 product, based on the

Q24 Wireless CPU

which supports Open AT® by default.

Open AT

is the world’s most comprehensive cellular development environment, which allows embedded

standard ANSI C applications to be natively executed directly on the Wireless CPU

This Product Specification document covers the Wireless CPU

alone and does not include the

programmable capabilities provided via the use of Open AT

Software Suites.

For detailed software programming guides, refer to the documents shown in the “

Reference Documents”

section.

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Contents

1 References ........................................................................................................................................... 10

1.1 Reference Documents........................................................................................................................... 10

1.1.1 Open AT

Software Documentation............................................................................................

1.1.2 AT Software Documentation ....................................................................................................... 10

1.1.3 Other Documents ........................................................................................................................ 10

2 General Description ............................................................................................................................ 13

2.1 Presentation .......................................................................................................................................... 13

2.2 Key Features ......................................................................................................................................... 14

2.3 Difference between M2106B and M2106+ Wireless CPU®.................................................................. 14

2.4 GSM/GPRS Services ............................................................................................................................ 15

2.5 Functional Description........................................................................................................................... 16

2.5.1 Block Diagram............................................................................................................................. 16

2.5.2 RF Functionalities ....................................................................................................................... 17

2.5.3 Firmware ..................................................................................................................................... 17

2.6 CE Conformity ....................................................................................................................................... 17

2.7 RoHS Compliance................................................................................................................................. 17

3 Interfaces.............................................................................................................................................. 18

3.1 General Purpose Connector.................................................................................................................. 18

3.1.1 Pin Allocation .............................................................................................................................. 19

3.1.2 Signal Description ....................................................................................................................... 20

3.2 Power Supply ........................................................................................................................................ 22

3.3 ON/~OFF Control .................................................................................................................................. 24

3.3.1 General Description .................................................................................................................... 24

3.3.2 Operating Sequences ................................................................................................................. 25

3.4 Alternative Download Control (BOOT pin) ............................................................................................ 28

3.5 Reset Signal (~RST) ............................................................................................................................. 29

3.5.1 General Presentation .................................................................................................................. 29

3.5.2 Reset Sequence.......................................................................................................................... 30

3.6 Serial Link.............................................................................................................................................. 31

3.6.1 Interface Description ................................................................................................................... 31

3.6.2 Application Note with Level Shifter ............................................................................................. 32

3.7 SPI Bus.................................................................................................................................................. 32

3.8 Keyboard Interface ................................................................................................................................ 33

3.9 Audio Interface ...................................................................................................................................... 34

3.9.1 Microphone Inputs....................................................................................................................... 34

3.9.2 Speaker Outputs ......................................................................................................................... 36

3.10 General Purpose Input/Output .............................................................................................................. 38

3.11 Analog to Digital Converter (ADC) ........................................................................................................ 39

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3.12 Activity Status Indication (Flashing LED) .............................................................................................. 39

3.13 RF Interface........................................................................................................................................... 41

3.13.1 RF Interface Characteristics........................................................................................................ 41

3.13.2 RF Performance .......................................................................................................................... 41

3.13.3 Antenna Specifications................................................................................................................ 42

3.14 SIM Card Interface ................................................................................................................................ 43

3.14.1 Internal SIM Card Interface ......................................................................................................... 44

3.14.2 External SIM Card Interface........................................................................................................ 45

4 Technical Specifications..................................................................................................................... 47

4.1 Environmental Constraints .................................................................................................................... 47

4.2 Mechanical Specifications ..................................................................................................................... 47

4.2.1 Mechanical Overview .................................................................................................................. 47

4.2.2 Mechanical Characteristics ......................................................................................................... 48

4.2.3 Mechanical Drawings .................................................................................................................. 48

4.3 Electrical Specifications......................................................................................................................... 50

4.3.1 Power Mode ................................................................................................................................ 50

4.3.2 Power Consumption without Open AT® Processing ................................................................... 51

4.3.3 Power Consumption with Open AT® Processing ........................................................................ 52

4.3.4 Current Consumption Waveform ................................................................................................ 53

5 Applicable Normative Documents..................................................................................................... 54

5.1 Normative Specifications....................................................................................................................... 54

5.2 Environmental Specifications ................................................................................................................ 55

6 Using the Integra Wireless CPU®....................................................................................................... 58

6.1 Firmware Upgrade................................................................................................................................. 58

6.1.1 Nominal Upgrade Procedure....................................................................................................... 58

6.1.2 Alternative Procedure.................................................................................................................. 58

6.2 Guidelines for Application Design ......................................................................................................... 58

6.2.1 Hardware Recommendations...................................................................................................... 58

6.2.2 Antenna....................................................................................................................................... 59

6.2.3 Minimum Hardware Interface to Get Started .............................................................................. 59

6.3 3 V/5 V SIM Management ..................................................................................................................... 60

6.4 Installation of the Integra M2106+ Wireless CPU® on an Application Board ........................................ 61

6.5 Integra Development Kit Board Presentation........................................................................................ 63

6.5.1 Getting Started ............................................................................................................................ 64

6.5.2 Setting up Terminal Emulator...................................................................................................... 64

6.5.3 Example of AT Commands ......................................................................................................... 65

7 Troubleshooting.................................................................................................................................. 68

7.1 Not Connecting Through the Serial Link ............................................................................................... 68

7.2 Receiving 'no carrier' Messages .......................................................................................................... 69

7.3 Receiving error Messages..................................................................................................................... 71

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8 Annexes................................................................................................................................................ 73

8.1 Supplier Information .............................................................................................................................. 73

8.1.1 General Purpose Connector ....................................................................................................... 73

8.1.2 Antenna connector ...................................................................................................................... 74

8.1.3 SIM Card Holder ......................................................................................................................... 74

8.2 Safety Recommendations (for information only) ................................................................................... 75

8.2.1 RF Safety .................................................................................................................................... 75

8.2.2 General safety............................................................................................................................. 76

8.2.3 Safety Standards......................................................................................................................... 77

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List of Figures

Figure 1: M2106+ view .................................................................................................................................... 13

Figure 2: Integra M2106+ Wireless CPU

connectors .................................................................................... 13

Figure 3: Functional architecture ..................................................................................................................... 16

Figure 4: 50-pin connector............................................................................................................................... 18

Figure 5: Pin allocation .................................................................................................................................... 19

Figure 6: Power-ON sequence diagram (no PIN code activated) ................................................................... 25

Figure 7: Power-OFF sequence diagram ........................................................................................................ 27

Figure 8: BOOT application schematic............................................................................................................ 28

Figure 9: Reset application schematic............................................................................................................. 29

Figure 10: Reset sequence diagram ............................................................................................................... 30

Figure 11: Level shifter application diagram for serial link* ............................................................................. 32

Figure 12: MIC2 input connection.................................................................................................................... 35

Figure 13: MIC1 differential connection........................................................................................................... 36

Figure 14: Speaker differential connection ...................................................................................................... 37

Figure 15: Speaker single-ended connection.................................................................................................. 37

Figure 16: SIM card holder extraction ............................................................................................................. 44

Figure 17: Schematic for external SIM card holder ......................................................................................... 46

Figure 18: Mechanical overview 1/3 ................................................................................................................ 47

Figure 19: Mechanical overview 2/3 ................................................................................................................ 47

Figure 20: Mechanical overview 3/3 ................................................................................................................ 48

Figure 21: Schematic for a SIM level shifter to manage 5 V SIM cards.......................................................... 60

Figure 22: Recommended footprint ................................................................................................................. 62

Figure 23: Integra development kit board description ..................................................................................... 63

Figure 24: High and low profile CLP connectors ............................................................................................. 73

Figure 25: Flexible flat cable (Part number: FFSD-20-S-10-01-N).................................................................. 73

Figure 26: Flex cable connector (Part number: FLE 125 01LDVA)................................................................. 73

Figure 27: MMCX connector example (right angle)......................................................................................... 74

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1 References

1.1 Reference Documents

Note: All below documents are related to V3.12 Open AT

Software and 6.57a Open AT® Firmware.

Wavecom recommends that the developer should check the web site for the latest documentation

1.1.1 Open AT

Software Documentation

[1] Getting started with Open AT

(Ref. WM_ASW_OAT_CTI_00001)

[2] Open AT

Tutorial (Ref. WM_ASW_OAT_UGD_00001)

[3] Tools Manual (Ref. WM_ASW_OAT_UGD_00003)

[4] Open AT

Basic Development Guide (Ref. WM_ASW_OAT_UGD_00002)

[5] Open AT

ADL guide (Ref. WM_ASW_OAT_UGD_00006)

[6] Open AT

V3.12 Customer Release Note (Ref. WM_DEV_OAT_DVD_165)

1.1.2 AT

Software Documentation

[7] AT commands Interface Guide for X57 Release

(Ref. WM_ASW_OAT_UGD_00044)

[8] Open AT

6.57a FW Release Note (Ref. WM_DEV_OAT_DVD_237)

1.1.3 Other Documents

[9] Environmental conditions and environmental tests for telecommunication equipment - ETS 300 019

[10] Wavecom Acceptance and Verification Plan (Ref. WAVE Plan, Release 1.4)

[11] Power Consumption Modes Application note (Ref. WM_ASW_OAT_APN_012)

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1.2 List of Abbreviations

Abbreviation Description

Alternating Current

ADC

Analog to Digital Converter

A/D

Analog to Digital conversion

ATtention (prefix for modem commands)

AUX

AUXiliary

CBS

Cell Broadcast Service

CLK

CLocK

CMOS

Complementary Metal Oxide Semiconductor

CTS

Clear To Send

Decibel

Direct Current

DCD

Data Carrier Detect

DCS

Digital Cellular System

DSR

Data Set Ready

DTR

Data Terminal Ready

E-GSM

Extended GSM

ENable

ESD

Electro

Static Discharges

ETSI

European Telecommunications Standards Institute

GND

GrouND

GPIO

General Purpose Input Output

GPO

General Purpose Output

GPRS

General Packet Radio Service

GSM

Global System for Mobile communications

Hi Z

High impedance (Z)

I/O

Input / Output

KSPS

Kilo Samples Per Second

LED

Light Emitting Diode

LSB

Less Significant Bit

MAX

MAXimum

MIC

MICrophone

MIN

MINimum

Mobile Originated

Mobile Station

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Mobile Terminated

Personal Computer

PCB

Printed Circuit Board

PCS

Personal Communications Service

RAM

Random Access Memory

Radio Frequency

Ring Indicator

RST

ReSeT

RTS

Request To Send

Receive

SAR

Specific Absorption Rate

SIM

Subscriber Identification Module

SMS

Short Message Service

SPI

Serial Peripheral Interface

SPK

SPeaKer

SRAM

Static RAM

TAC

Type A

pproval Code

TDMA

Time Division Multiple Access

Typical Urban fading profile

TUHigh

Typical Urban, High speed fading profile

TVS

Transient Voltage Suppressor

Transmit

TYP

TYPical

UART

Universal Asynchronous Receiver-Transmitter

USSD

Unstructured Supplementary Service Data

VSWR

Voltage Stationary Wave Ratio

WAP

Wireless Application Protocol

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2 General Description

2.1 Presentation

The Integra M2106+ Wireless CPU® is a self-contained E-GSM/GSM-GPRS 900/1800 dual-band Wireless CPU

and is GPRS class 10 capable.

Figure 1: M2106+ view

It includes a Quik Q24 Wireless CPU

and its interfaces are available through:

• A 50-pin connector for Baseband analog and digital interfaces (General Purpose Connector)

• A RF connector, MMCX type

• A SIM card holder

RF connector

SIM card holder

50-pin connector

Figure 2: Integra M2106+ Wireless CPU

connectors

The mating connectors for the General Purpose connector and RF connector are standard and easy-to-find.

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2.2 Key Features

Integra M2106+ Wireless CPU® features:

• Open AT® programmable:

o Native execution of embedded standard ANSI C applications, o Custom AT command creation, o Custom application library creation, o Standalone operation.

• Overall dimensions: 46 x 64 x 12 mm,

• Complete shielding,

• 2-Watt E-GSM 900 radio section,

• 1-Watt GSM1800 radio section,

• Full GSM or GSM / GPRS software stack,

• GPRS class 10,

• 32 Mbits of Flash memory and 16 Mbits of SRAM,

• Internal 3V/1.8V SIM interface,

• Real Time Clock (RTC) with calendar,

• Echo cancellation + noise reduction,

• Complete interfacing through a 50-pin General Purpose Connector:

o Power supply, o Serial link, o Audio interface, o SIM card interface, o Keyboard interface, o GPIO.

2.3 Difference between M2106B and M2106+ Wireless CPU

The Integra M2106+ Wireless CPU® is designed for replacing Integra M2106B Wireless CPU®. There are some feature differences between these two.

M2106B Wireless CPU® M2106+ Wireless CPU®

SIM Interface 3V only 3V / 1V8

SRAM size 4 Mbits 16 Mbits

RF functionalities Dual band capability

(E-GSM900 / 1800)

Quad band capability*

(GSM850/ E-GSM900 / DCS1800 /

PCS1900)

Signal description -- I/O type and Reset state

See section

3.1.2 details

(*) See section 2.5.2 for further details

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2.4 GSM/GPRS Services

The basic services provided by the Integra M2106+ Wireless CPU® are listed in the table below:

Standard

• 900 MHz, E-GSM compliant; Class 4 (2 W).

• 1800 MHz ; Class 1 (1 W)

• GSM phase 2

• GPRS Class 10

Interface

• Serial interface V.24/CMOS

• AT command set based on V.25ter and GSM 07.05 & 07.07.

• Auto-bauding function between 2400 bits/s and 19200 bits/s

• No auto-framing available

Audio

• Half rate / Full rate / Enhanced Full rate operation

• Accessories (options): Handset, Car Kit

SMS

• Mobile Originated (MO) and Mobile Terminated (MT)

• Mode Text & PDU point to point

• Cell broad cast

• In accordance with GSM 07.05

Data

• Asynchronous 2400, 4800, 9600, 14400 bits/s

• Transparent and Non Transparent mode

• In Non Transparent Mode: 300, 1200, 1200/75 bauds

• Mode 3.1 kHz (PSTN) and V110 (ISDN)

Fax

• 2400/4800/7200/9600 bits/s, GSM teleservice 62 in Transparent Mode

• Class 1 & Class 2

• Group 3 compatible

GPRS

• Class 10

• Coding schemes: CS1 to CS4

• Compliant with SMG31bis

SIM

• Plug-In SIM 3V/1.8V

• Full compatible with GSM 11.11

• SIM Toolkit Release 97

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2.5 Functional Description

2.5.1 Block Diagram

Q24 Wireless

CPU

Antenna connector

Audio

Int erfac e

Pow er

Supply

BOOT

RESET

50-pin

connecto r

SIM VCC

Microphone

Speaker

SIM card

Socket

SIM card

Holder

Integra M2106+ W ireless CPU

Serial Interface

GPIO & ADC

SPI In terface

Keypad Interface

Operat ing Status Indication

VBat

Figure 3: Functional architecture

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2.5.2 RF Functionalities

The Radio Frequency (RF) functionalities comply with the Phase II E-GSM 900 / DCS 1800 recommendations.

The frequencies are:

Transmit band (TX) Receive band (RX)

EGSM 900 880 to 915 MHz 925 to 960 MHz

DCS 1800 1710 to 1785 MHz 1805 to 915 MHz

The Integra M2106+ Wireless CPU

also gives a quad band capability (GSM850, EGSM900, DCS 1800 and

PCS 1900) and it is qualified by Wavecom.

Warning:

The Integra M2106+ Wireless CPU

is not certified for American market for operation band of

GSM850 and PCS1900. Customers wishing to sell the Integra M2106+ Wireless CPU

in American

region shall be wholly responsible for any certifications and carrier approval required.

2.5.3 Firmware

The Integra M2106+ Wireless CPU

is designed to integrate into various types of applications. For

applications using an external processor to control the Wireless CPU

, the firmware offers a software

interface based on AT commands.

A development kit for the Integra M2106+ Wireless CPU

is also available to test customer software

applications.

2.6 CE Conformity

The Integra M2106+ Wireless CPU® bears the CE marking. This symbol guarantees the compliance of the design and implementation of the Integra M2106+ Wireless CPU

with the R&TTE directive.

2.7 RoHS Compliance

The Integra M2106+ Wireless CPU® is now compliant with RoHS (Restriction of Hazardous Substances in Electrical and Electronic Equipment) Directive 2002/95/EC which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE)”.

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3 Interfaces

This chapter describes the hardware interfaces of the Integra M2106+ Wireless CPU®.

3.1 General Purpose Connector

A 50-pin standard connector provides the baseband analog and digital interfaces.

1 2

Figure 4: 50-pin connector

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3.1.1 Pin Allocation

 1

 3

 5

 7

 9

 11

 13

 15

 17

 19

 21

 23

 25

 27

 29

 31

 33

 35

 37

 39

 41

 43

 45

 47

 49

2 

4 

6 

8 

10 

12 

14 

16 

18 

20 

22 

24 

26 

28 

30 

32 

34 

36 

38 

40 

42 

44 

46 

48 

50 

GND

+5V

GND

SPK2N

MIC2P

GND

GPIO0

CT104/RX

CT105/RTS

COL4

ROW 3

SPI EN, GPO3

SIM RST

SIM PRES1

GPO0

SPK2P

SPK1P

SPK1N

MIC2N

MIC1P

MIC1N

COL2

COL0

ROW 1

SPI CLK

GND

+ 5 V

CT109/DCD

GPIO4

ON /~ O FF

BOOT

CT103/TX

CT107/DSR

CT108-2/DTR

COL3

ROW 2

SIM CLK

SIM VCC

SIM DA TA

CT125/RI

FLASHING LED

CT106/CTS

AUXV0

~RST

GND

COL1

ROW 4

ROW 0

SPI IO

Figure 5: Pin allocation

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3.1.2 Signal Description

The following table presents the main characteristics of the 50-pin connector.

Name I/O

Reset

State

I/O type Description Comment

1 GND -- Ground High current 2 GND -- Ground High current 3 + 5 V I -- Supply High current 4 + 5 V I -- Supply High current

5 CT109/DCD O High Z 2X

Serial Link

Data Carrier Detect 6 GND -- Ground High current 7 GPIO4 I/O High Z CMOS/2X General Purpose I/O

8 SPK2N O High Z Analog

Speaker2 negative

output

9 CT125/RI O High Z 2X

Serial Link

Ring Indicator

10 SPK2P O High Z Analog

Speaker 2

positive output

11 Flashing LED I/O High Z CMOS/2X

Operating mode

indication LED

Driven by Wireless

CPU

12 SPK1P O High Z Analog

Speaker 1

positive output

13 CT106/CTS O High Z 1X

Serial Link

Clear To Send

14 SPK1N O High Z Analog

Speaker 1

negative output

15 ON/~OFF I Pull down -- Power control signal

ON = VCC

16 MIC2P I High Z Analog

Microphone 2

positive input

17 AUXV0 I HZ Analog Auxiliary ADC input

Can be tied to GND if

not used

18 MIC2N I High Z Analog

Microphone 2 negative input

19 ~RST I/O -- SCHMITT Reset active low

To be driven by an

Open Collector.

Internal pull-up

4.7 kΩ.

20 MIC1P I High Z Analog

Microphone 1

positive input

21 GND -- Ground

High Current

22 MIC1N I High Z Analog

Microphone 1 negative input

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Name I/O

Reset

State

I/O type Description Comment

23 BOOT I Pull up CMOS

Alternative download

mode selection

To be driven by

Open Collector Internal pull-up

100 kΩ

24 GND -- Ground

High current

25 CT103/TX I Pull down CMOS Serial Link - Transmit

Pull up to +5V with

100kΩ when not used

26 GPIO0 I/O High Z CMOS/2X General Purpose I/O

27 CT107/DSR O

Output

high

Serial Link

Data Set Ready

28 CT104/RX O

Output

high

1X Serial Link – Receive

29 CT108-2/DTR I Pull down CMOS

Serial Link

Data Terminal Ready

Pull up to +5V with

100 kΩ when not used

30 CT105/RTS I Pull down CMOS

Serial Link

Request To Send

Pull up to +5V with

100 kΩ when not used

31 COL3 I/O Pull up CMOS/1X Keyboard column

32 COL4 I/O Pull up CMOS/1X Keyboard column

33 COL1 I/O Pull up CMOS/1X Keyboard column

34 COL2 I/O Pull up CMOS/1X Keyboard column

35 ROW4 I/O Pull down CMOS/1X Keyboard row

36 COL0 I/O Pull up CMOS/1X Keyboard column

37 ROW2 I/O Pull down CMOS/1X Keyboard row

38 ROW3 I/O Pull down CMOS/1X Keyboard row

39 ROW0 I/O Pull down CMOS/1X Keyboard row

40 ROW1 I/O Pull down CMOS/1X Keyboard row

41 NC -- Not connected

SPI_EN or

GPO3

Output

high

1X or 3X

SPI enable or General

purpose output

Multiplexed

43 SPI_IO I/O Pull up CMOS/1X SPI Data

44 SPI_CLK O Pull up 1X SPI Clock

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Name I/O

Reset

State

I/O type Description Comment

45 SIM_CLK O Output low --

Clock for SIM

Interface

3V /1.8V mode

46 SIM_RST O Output low --

Reset for SIM

interface

3V /1.8V mode

47 SIM_VCC O -- Supply SIM card supply

3V /1.8V mode 6 mA max

48 SIM_PRES I High Z CMOS SIM card detect

Connected to SIM

connector pin 8.

Pin 4 of SIM

connector must be

pulled down to GND

with 1 kΩ

49 SIM_DATA I/O Output low -- I/O for SIM interface

3V /1.8V mode

50 GPO0* O

Output

high

General purpose

output

Multiplexed

* GPO0 is a general purpose output for selection of external 3 V or 5 V SIM.

Table 1: Integra M2106+ operating conditions

Parameter I/O type Min Max Condition

input low

CMOS -0.5 V 0.8 V

input high

CMOS 2.1 V 3.0 V

1X 0 V 0.2 V IOL = -1 mA 2X 0 V 0.2 V IOL = -2 mA

output low

3X 0 V 0.2 V I

= -3 mA 1X 2.6 V 2.86 V IOH = 1 mA 2X 2.6 V 2.86 V IOH = 2 mA

output high

3X 2.6 V 2.86 V I

= 3 mA

I clamp CMOS 40µA Vf max = 0.33V

3.2 Power Supply

The main power supply is provided through four pins of the General Purpose Connector:

• Pins 3 and 4 for the + 5 V

• Pins 1 and 2 for the ground (GND)

Pins 6, 21, and 24 are also the ground connection for the correct ground plane required for correct RF functionality.

A 5 V ± 5% - 1.5 A power unit is required to supply the Wireless CPU

in order to avoid serious RF

malfunctions. However, the Wireless CPU

does not need a constant 1.5 A current at 5 V on this power

supply.

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Pin description

Pin number Name Reset state Description Comment

1 GND -- Ground High Current 2 GND -- Ground High Current 3 + 5 V -- Supply High Current 4 + 5 V -- Supply High Current

6 GND -- Ground High Current 21 GND -- Ground High Current 24 GND -- Ground High Current

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3.3 ON/~OFF Control

3.3.1 General Description

This input is used to switch ON or OFF the Integra Wireless CPU

A high level signal must be provided on the ON/~OFF pin to switch ON the Wireless CPU

To switch OFF, the ON/~OFF signal must be reset and an AT+CPOF command must be sent to the Wireless CPU

Pin description

Signal Pin number I/O Reset State I/O type Description

ON/∼OFF

15 I Pull down -- Power Control Signal

Electrical characteristics

Parameter Min Max Unit

Input Impedance ( R ) 47

kΩ

Input Impedance ( C ) 50 pF

Operating conditions

Parameter I/O type Min Max Unit

VIL -- 0 0.6 V

VIH -- 3.4 5.6 V

Warning: All external signals must be inactive when the Wireless CPU

is OFF to avoid any damage when

starting and allow Integra Wireless CPU

to start and stop correctly.

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3.3.2 Operating Sequences

3.3.2.1 Power-ON

Once the Wireless CPU

is supplied the ON/~OFF signal must be asserted high during a delay of T

on-hold

(Hold delay on the ON/~OFF signal) to power-ON.

After this delay, once the firmware has completed its power-up sequence, an internal logic maintains the Wireless CPU

in power ON condition.

You must not de-assert this ON/~OFF signal before this internal logic is internally asserted by the firmware; the Wireless CPU

would not start-up otherwise

POW ER SUPPLY

ON/

~OFF

ST A TE O F T H E

Wireless CPU

OFF

T answ ers « OK »

Wireless CPU

REA D Y

on-ho ld

SIM and Netw ork dependent

RESET m ode

INTERNA L RST

rst

(4 2 m s t y p )

Wireless CPU

(no loc. update)

Figure 6: Power-ON sequence diagram (no PIN code activated)

The duration of the firmware power-up sequence depends on several factors:

• firmware version used by the Wireless CPU

• need to perform a recovery sequence if the power has been lost during a flash memory modification.

Other factors have a minor influence

• number of parameters stored in EEPROM by the AT commands received so far

• ageing of the hardware components, especially the flash memory

• temperature conditions

The recommended way to de-assert the ON/~OFF signal is to use either an AT command or WIND

indicators: the application must detect the end of the power-up initialization and de-assert ON/~OFF afterwards.

• Send an “AT” command and wait for the “OK” answer: once the initialization is complete the AT interface answers « OK » to “AT” message

• Wait for the “+WIND: 3” message: after initialization, the Wireless CPU

, if configured to do so, will

return an unsolicited “+WIND: 3” message. The generation of this message is enabled or disabled via

If the application manages hardware flow control, an AT command can be sent during the initialisation phase.

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an AT command.

Note

See also “AT Commands Interface Guide”

[7] for more information on these commands.

Proceeding thus – by software detection - will always prevent the application from de-asserting the ON/~OFF signal too early.

If WIND indicators are disabled or AT commands unavailable or not used, it is still possible to de-assert

ON/~OFF after a delay long enough (T

on-hold

) to ensure that the firmware has already completed its power-up

initialization.

The table below gives the minimum values of T

on-hold

for all firmware versions:

on-hold

minimum values

on-hold

Open AT® Firmware

Safe evaluations of the firmware power-up

time

6.57 & above 8 s

The above figures take the worst cases into account: power-loss recovery operations, slow flash memory operations in high temperature conditions, and so on. But they are safe because they are large enough to ensure that ON/~OFF is not de-asserted too early.

Additional notes:

1. Typical power-up initialization time figures for best cases conditions (no power-loss recovery, fast and new flash memory…) approximate 3.5 seconds in every firmware version. But releasing ON/~OFF after this delay does not guarantee that the application will actually start-up if for example the power plug has been pulled off during a flash memory operation, like a phone book entry update or an AT&W command.

2. The ON/~OFF signal can be left at a high level until switch OFF. But this is not recommended as it will prevent the AT+CPOF command from performing a clean power-off. (see also Note in section

3.3.2.2 Power-OFF for an alternate usage).

3. When using a battery as power source, it is not recommended to let this signal high: If the battery voltage is too low and the ON/~OFF signal at low level, an internal mechanism switches OFF the Wireless CPU

. This automatic process prevents the battery to be over

discharged and optimize its life span.

4. During the power-ON sequence, an internal reset is automatically performed by the Wireless CPU

for 42 ms (typical). Any external reset should be avoided during this phase.

3.3.2.2 Power-OFF

To properly power-OFF the Integra Wireless CPU

, the application must reset the ON/~OFF signal to low

and then send the AT+CPOF command to de-register from the network and switch off the Wireless CPU

Once the « OK » response is issued by the Wireless CPU

, the external power supply can be switched off.

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POW ER SUPPLY

ON/

OFF

AT COM M AND

STATE OF THE

W ireless CPU

AT+CPOF

W ireless CPU

REA D Y

W ireless CPU

OFF

Netw ork dependent

OK response

Figure 7: Power-OFF sequence diagram

Note

• If the ON/~OFF pin is maintained to ON (High Level) then the Wireless CPU

can’t be switched OFF

and after using AT+CPOF command through the firmware, the Wireless CPU

enters in a Open AT® Max power consumption Mode (please refer to the “Power Consumption Modes” Application Note [11]).

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3.4 Alternative Download Control (BOOT pin)

If the standard X-modem download procedure does not work correctly, an alternative download procedure can be selected with the BOOT pin. This alternative procedure requires a specific downloading software tool. See section

6.1, "Firmware Upgrade" for details.

Pin description

Signal Pin # I/O Reset State I/O type Description

BOOT 23 I Pull up CMOS Alternative download mode selection

The alternative download procedure starts when this input is low during the Wireless CPU

power-ON. In

normal mode, this pin must be left open.

If used, this input must be driven either by an open collector or an open drain. See the example application diagram below.

Switch BOOT

BOOT pin

Switch BOOT

BOOT pin

Figure 8: BOOT application schematic

• If BOOT pin = 1, the Wireless CPU

is in normal mode

• If BOOT pin = 0, the Wireless CPU

is in alternative download mode

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3.5 Reset Signal (~RST)

3.5.1 General Presentation

This signal is used to force a reset procedure by providing a low level for at least 500 µs.

This signal must be considered as an emergency reset only. A reset procedure is automatically driven by an internal hardware component during the power-up sequence.

Pin description

Signal Pin # I/O Reset state I/O type Description

~RST 19 I/O -- SCHMITT Reset

This signal can also be used as an output to provide a reset to an external device. If no external reset is necessary, this input can be left open. If it is used (emergency reset), it must be driven either by an open collector or an open drain output:

Switch RESET

RESET pin

Switch RESET

RESET pin

Figure 9: Reset application schematic

• ~RST pin 19 = 0, to activate Reset,

• ~RST pin 19 = 1, to deactivate Reset.

Reset signal electrical characteristics

Parameter Min Max Unit

Input Impedance (R) 4.7

kΩ

Input Impedance (C) 10 nF

Reset signal operating conditions

Parameter Min Max Condition

*VT- 1.1 V 1.2 V

*VT+ 1.7 V 1.9 V

VOL 0.4 V IOL = -50 µA VOH 2.0 V IOH = 50 µA

* VT-, VT+: Hysteresis thresholds

• Additional comments on Reset procedure:

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The Reset process is activated either by the external ~RST signal or by an internal signal (coming from a reset generator). This automatic reset mode is activated at Power-up.

The Wireless CPU

remains in Reset mode as long as the Reset signal is held low.

• This signal should be used only for “emergency” resets:

A software reset is always preferred to a hardware reset.

3.5.2 Reset Sequence

To activate the « emergency » reset sequence, the ~RST signal must be set to low for 500 μs minimum.

As soon as the reset is completed, the AT interface answers « OK » to the application. For this, the application must send AT↵ to get the “OK” response.

If the application manages hardware flow control, the AT commands can be sent during the initialization phase. Another solution is to use the AT+WIND command to obtain an unsolicited status from the Wireless CPU

For further details, refer to the AT commands Interface Guide documentation

[7].

RESET m od e

BB+RF

=20

to 40 m A

EXT ERN A L R ES E T

STA TE O F T HE

W ireless CPU

W ireless CPU®

REA D Y

M in:500 μs Typ: 2 ms

T an sw ers “ OK”

W ireless CPU

REA D Y

SIM and netw ork dependent

Wireless CPU

BB+RF

<120 m A

w ithout loc update

Figure 10: Reset sequence diagram

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3.6 Serial Link

3.6.1 Interface Description

A serial link interface is available on the Integra M2106+ Wireless CPU

. It is compliant with V24 signaling protocol with a 2.8 V electrical interface except TX, RTS, and DTR inputs, which can be either 5 V or 3 V. This means the serial link not compliant with the V28 standard and a level shifter is required to connect to a PC.

The available signals are:

• Tx data (CT103/TX),

• Rx data (CT104/RX),

• Request To Send (CT105/RTS),

• Clear To Send (CT106/CTS),

• Data Terminal Ready (CT108-2/DTR),

• Data Set Ready (CT107/DSR).

Two additional signals are necessary to have the complete RS232 signal set:

• Data Carrier Detect (CT109/DCD),

• Ring Indicator (CT125/RI).

Pin description

Signal Pin # I/O Reset State I/O type Description

CT103 / TX 25 I Pull down CMOS Transmit serial data

CT104 / RX 28 O Output high 1X Receive serial data CT105 / RTS 30 I Pull down CMOS Request To Send CT106 / CTS 13 O Output high 1X Clear To Send

CT107 / DSR 27 O Output high 1X Data Set Ready

CT108-2 / DTR 29 I Pull down CMOS Data Terminal Ready

CT109 / DCD 5 O High Z 2X Data Carrier Detect

CT125 / RI 9 O High Z 2X Ring Indicator

CT102 / GND 21,24…* -- Ground

* Any of the available GND pins can be used.

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3.6.2 Application Note with Level Shifter

A level shifter (MAX3238, for example) can be used for an application requiring V28 levels.

VCC

DCE

DTE

Wireless

CPU

Lev el Sh if t er

Terminal

M AX3238

ERROR

VCC

Figure 11: Level shifter application diagram for serial link*

* This application note is valid for VCC ≥ 3.0 Volt (see MAX3238 specifications). Auto shutdown mode is not used in this example.

3.7 SPI Bus

The SPI bus includes a clock signal (SPI_CLK), an I/O signal (SPI_IO), and an enable signal (SPI_EN) complying with the SPI bus standard.

Pin description

Signal Pin # I/O Reset State I/O type Description

SPI_CLK 44 O Pull up 1X SPI Serial Clock

SPI_IO 43 I/O Pull up CMOS / 1X SPI Data

SPI_EN* 42 O Output high 1X SPI Enable

* Multiplexed with GPO3.

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3.8 Keyboard Interface

This interface provides 10 connections:

• 5 rows (R0 to R4) and

• 5 columns (C0 to C4).

Digital scanning and debouncing are performed within the M2106+ Wireless CPU

. No discrete components

such as R, C (Resistor, Capacitor) are required.

Pin description

Signal Pin # I/O Reset State I/O type Description

ROW0 39 I/O Pull down CMOS / 1X Row scan ROW1 40 I/O Pull down CMOS / 1X Row scan ROW2 37 I/O Pull down CMOS / 1X Row scan ROW3 38 I/O Pull down CMOS / 1X Row scan ROW4 35 I/O Pull down CMOS / 1X Row scan

COL0 36 I/O Pull up CMOS / 1X Column scan COL1 33 I/O Pull up CMOS / 1X Column scan COL2 34 I/O Pull up CMOS / 1X Column scan COL3 31 I/O Pull up CMOS / 1X Column scan COL4 32 I/O Pull up CMOS / 1X Column scan

WARNING: This interface is not fully available with AT commands. An AT command allows the input key code to be obtained (see AT+CMER command description).

This code must then be processed by the application. See the AT commands Interface Guide documentation

[7] for details.

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3.9 Audio Interface

Two different microphone inputs (MIC1 and MIC2 inputs) and two different speaker outputs (SPK1 and SPK2 outputs) are supported.

The connection can be either differential or single-ended but the use of a differential connection in order to reject common mode noise and TDMA noise is strongly recommended. When a single-ended connection is used, ensure to have a good ground plane, good filtering as well as shielding, in order to avoid any disturbance on the audio path.

The Integra Wireless CPU

also includes an echo cancellation feature, which allows hands-free function.

In some cases, ESD protection must be added on the audio interface lines.

3.9.1 Microphone Inputs

The MIC2 inputs already include the biasing for an electret microphone allowing easy connection to a handset.

The MIC1 inputs do not include an internal bias. MIC1 is appropriate for a hands-free system, headset or car kit. However, MIC1 can also be used for a handset with external biasing.

3.9.1.1 Common Microphone Input Characteristics

Both microphone inputs are designed with the following audio transmit characteristics:

Internal audio filter characteristics

Frequency Gain

0-150 Hz < -22 dB 150-180 Hz < -11 dB 180-200 Hz < -3 dB

200-3700 Hz 0 dB

> 4000 Hz < -60 dB

The gains in the MIC inputs are internally adjusted and can be tuned from -6.5dB to 51.3dB by using AT commands. Two different gain ranges (controller1 and controller2) are available and can be selected with AT command software (refer to the AT commands Interface Guide documentation

[7] for details).

The two microphone inputs are composed of a 1

order high pass filter with a cut-off frequency of 330Hz.

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Table 2: Microphone gain vs Max input voltage*

Using Controller 1 Using Controller 2

Transmit Gain (dB) Max Vin (mVrms) Transmit Gain (dB) Max Vin (mVrms)

+ 30 43.80 -6.5 3031 + 33 31.01 -6 2861 + 36 21.95 0 1434 + 39 15.54 +9.5 480 + 42 11.00 +10 454 + 45 7.79 +30.3 43.80 + 48 5.51 +30.8 41.36 + 51 3.90 +50.8 41.14

- - +51.3 3.90

* For further details, refer to the AT commands documentation [7]

3.9.1.2 Main Microphone Inputs (MIC2)

The MIC2 inputs are differential ones. They already include the convenient biasing for an electret microphone (1 mA and 2 volts). This electret microphone may be directly connected to these inputs. The impedance of the microphone on MIC2 must be around 2 kΩ.

These MIC2 characteristics are the standard for a handset design.

The input impedance is around 1.4kΩ +/- 20% between 400Hz and 4000Hz.

AC coupling is already embedded in the Wireless CPU

MIC2N

MIC2P

Figure 12: MIC2 input connection

CM = 22 pF to 100 pF; 33 pF recommended

CM must be as close to the microphone as possible. Microphone manufacturers provide this capacitor directly soldered on the microphone.

Pin description

Signal Pin # I/O Reset state I/O type Description

MIC2P 16 I High Z Analog Microphone 2 positive input

MIC2N 18 I High Z Analog Microphone 2 negative input

3.9.1.3 Auxiliary Microphone Inputs (MIC1 Inputs)

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The MIC1 inputs are differential and do not include internal bias. These inputs are the standard for an external headset or a hands-free kit.

To use these inputs with an electret microphone, bias has to be generated outside the Wireless CPU

according to the characteristics of this electret microphone.

These inputs are provided either for an external headset or a hands-free kit.

The input impedance is around 10kΩ +/- 30% between 400Hz and 4000Hz.

AC coupling is already embedded in the Wireless CPU

Pin description

Signal Pin # I/O Reset state I/O type Description

MIC1P 20 I High Z Analog Microphone 1 positive input MIC1N 22 I High Z Analog Microphone 1 negative input

Differential connection

MIC1P

MIC1N

Vcc

Figure 13: MIC1 differential connection

Vcc = 2.8 V from the analog power supply.

R1 = R4 = from 100 to 330 Ω.

R2 = R3 =1 kΩ to 3.3 kΩ according to the microphone characteristics.

CM = 22 pF to 100 pF.

C2 = 47 µF

R1 and R4 are used as a voltage supply filter with C2.

CM must be as close to the microphone as possible. Microphone manufacturers provide this capacitor

directly soldered on the microphone.

3.9.2 Speaker Outputs

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3.9.2.1 Common Speaker Output Characteristics

The connection can be differential or single-ended but the use of a differential connection to reject common mode noise and TDMA noise is strongly recommended. Moreover in single-ended mode, ½ of the power is lost. When using a single-ended connection, ensure to have a good ground plane, good filtering as well as shielding, in order to avoid any disturbance on the audio path.

Both SPK1 and SPK2 speaker outputs are push-pull amplifiers and can be loaded down to 32 Ω and up to

1 nF. The impedance of the speaker amplifier output in differential mode is: R ≤ 1 Ω±10 %.

These outputs are differential and the output power can be adjusted in steps of 2 dB (see details in

Table 3:

Speaker gain vs Max output voltage). The output can be directly connected to a speaker.

SPKxP

SPKxN

Figure 14: Speaker differential connection

In case of a single-ended connection, only half of the output power is available when compared to a differential connection.

SPKx P

SPKx N

Zhp

Speaker

33 to 100pF

Figure 15: Speaker single-ended connection

C1 = from 100 nF to 47 µF as per the speaker characteristics.

C2=C1

R1 = Speaker impedance

Nevertheless, in a 32

Ω speaker case, it is possible to use a cheaper and smaller solution: R1=82 Ω and

C2=4.7 µF ceramic.

The gain in the speaker outputs are internally adjusted and can be tuned by using an AT command (refer to the AT commands documentation

[7] for details).

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Table 3: Speaker gain vs Max output voltage

Receive Gain (dB)* Max output level (Vrms)

Min Speaker load (Ω)

+2 1.74 150

0 1.38 50

-2 1.099 32

-4 0.873 32

-6 0.693 32

-8 0.551 32

-10 0.437 32

-12 0.347 32

-14 0.276 32

-16 0.219 32

-18 0.174 32

-20 0.138 32

-22 0.110 32

-24 0.087 32

-26 0.069 32

* Analog gain: may not be significant

3.9.2.2 Speaker 2 Output

Pin description

Signal Pin # I/O Reset state I/O type Description

SPK2P 10 O High Z Analog Speaker 2 positive output SPK2N 8 O High Z Analog Speaker 2 negative output

3.9.2.3 Speaker 1 Output

Pin description

Signal Pin # I/O Reset state I/O type Description

SPK1P 12 O High Z Analog Speaker 1 positive output

SPK1N 14 O High Z Analog Speaker 1 negative output

3.10 General Purpose Input/Output

Integra M2106+ Wireless CPU® provides 2 General Purpose I/Os (GPIOs). These are useful to control any external device.

Pin description

Signal Pin # I/O Reset state I/O type Description

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GPIO0 26 I/O High Z CMOS/ 2X General Purpose I/O GPIO4 7 I/O High Z CMOS/ 2X General Purpose I/O

All digital I/Os comply with 3 volts CMOS.

Both GPIO0 and GPIO4 are low level at reset.

You can access (write or read) the GPIO value via AT+WIOW and AT+WIOR commands. See the AT commands Interface Guide documentation

[7] for more details.

3.11 Analog to Digital Converter (ADC)

An Analog to Digital Converter is provided by the Integra M2106+ Wireless CPU®. This converter is 10-bit resolution, ranging from 0 to 2.8 V. You can see the measurements via the AT+ADC command. See the AT commands Interface Guide documentation

[7] for more details and sampling rate.

Pin description

Signal Pin # I/O Reset state I/O type Description

AUXV0 17 I HZ Analog Auxiliary ADC input

A/D converter electrical characteristics

Parameter Min Max Unit

Resolution 10 bits

Input signal range 0 2.8 V

ADC reference accuracy 0.75 2 %

Integral accuracy +/- 1 LSB Differential accuracy +/- 1 LSB Input impedance (R) 10

Input impedance (C) 100 nF

3.12 Activity Status Indication (Flashing LED)

The activity status indication signal can be used to drive a Flashing LED through an open-collector transistor according to Wireless CPU

activity status.

Pin description

Signal Pin # I/O Reset state I/O type Description

Flashing LED 11 I/O High Z CMOS/2X Activity status indication

Operating status

LED status Integra M2106+ Wireless CPU® status

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OFF Wireless CPU® in download mode or Wireless CPU® switched OFF.

Permanent

Wireless CPU

switched ON, not registered

on the network

Slow flash

LED ON for 200 ms

OFF for 2 s

Wireless CPU

switched ON Registered on the network Idle mode

Quick flash

LED ON for200 ms

OFF for 600 ms

Wireless CPU

switched ON Registered on the network Communication in progress

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3.13 RF Interface

3.13.1 RF Interface Characteristics

The nominal impedance value is 50 Ω. The DC impedance is 0 Ω, connected to GND.

The RF connector is a MMCX (Miniature Micro Connector) type. (See section "

Supplier Information", 8.1.2)

MMCX connector characteristics and benefits:

• Standard type

• Small physical size type

• Easy-to-find product

An antenna can be directly connected through the mating connector or using a small adaptor if necessary (MMCX-SMA for example) (see section "

Supplier Information", 8.1.2).

The MMCX connector incorporates a 'snap-on' latching action in order to make connection easier with excellent RF performance. This type of connector is suitable for the standard ranges of flexible and semirigid cables.

3.13.2 RF Performance

RF performance is compliant with the GSM 05.05 recommendation.

The main

Receiver parameters are:

• E-GSM900 Reference Sensitivity = -104 dBm Static & TUHigh

• DCS1800 Reference Sensitivity = -102 dBm Static & TUHigh

• Selectivity @ 200 kHz: > +9 dBc

• Selectivity @ 400 kHz: > +41 dBc

• Linear dynamic range: 63 dB

• Co-channel rejection: >= 9 dBc

The main

Transmitter parameters are:

• Maximum output power (E-GSM 900): 33 dBm ± 2 dB at ambient temperature

• Maximum output power (DCS 1800): 30 dBm ± 2 dB at ambient temperature

• Minimum output power (E-GSM 900): 5 dBm ±- 5 dB at ambient temperature

• Minimum output power (DCS 1800): 0 dBm ±- 5 dB at ambient temperature

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3.13.3 Antenna Specifications

The antenna connected to the Integra M2106+ Wireless CPU® antenna via the MMCX connector should have the following characteristics:

Table 4: Antenna requirements

EGSM 900 DCS 1800

Frequency RX

925 to 960 MHz 1805 to 1880 MHz

Frequency TX

880 to 915 MHz 1710 to 1785 MHz

RF power stand

2 W at 2/8 duty cycle 1 W at 2/8 duty cycle

Impedance

50 Ω

Rx max

1.5 : 1

VSWR

Tx max

1.5 : 1

Typical radiated

gain

0 dBi in one direction at least

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3.14 SIM Card Interface

Integra M2106+ has an embedded SIM reader. This embedded SIM interface is for 3 V / 1V8 micro-SIM cards. If the application requires ISO SIM cards interface or 5 V SIM cards, the SIM interface signals are available on the General Purpose Connector.

The Integra M2106+ Wireless CPU

SIM interface consists of 5 signals:

• SIMVCC: SIM power supply

• SIMRST: Reset

• SIMCLK: Clock

• SIMDATA: I/O port

• SIMPRES1: SIM card presence detection

The SIM interface controls a 3V / 1V8 SIM (and a 5V SIM through an external SIM driver). This interface is fully compliant with the GSM 11.11 recommendations concerning SIM functionality.

To be fully compliant with GSM 11.11 recommendations concerning SIM functions, please add shielding for each SIM signals on the PCB

Electrical characteristics

Parameters Conditions Min Typ Max Unit

SIM_DATA VIH

IIH = ± 20 µA

0.7xSIMVCC V

SIM_DATA VIL

IIL = 1 mA 0.3xSIMVCC V

SIM_RST,

SIM_CLK VOH

Source current = 20 µA 0.9xSIMVCC V

SIM_DATA

Source current = 20 µA 0.8xSIMVCC V

SIM_RST,

SIM_DATA,

SIM_CLK VOL

Sink current = -200 µA 0.4 V

SIMVCC = 2.9V 2.84 2.90 2.96 V

SIM_VCC*

Output Voltage

SIMVCC = 1.8V 1.77 1.8 1.86 V

SIM_CLK

Rise/Fall Time

Loaded with 30 pF 20 ns

SIM_RST,

Rise/Fall Time

Loaded with 30 pF 20 ns

SIM_DATA,

Rise/Fall Time

Loaded with 30 pF 0.7 µs

SIM_CLK

Frequency

3.25 MHz

* Given for a 3 V interface. An external level shifter is needed to handle 5 V SIMs.

Transient Voltage Suppressor diodes are internally added on the signals connected to the SIM socket in order to prevent any damage by electrostatic discharge. TVS diodes with low capacitance (less than 10 pF) are used on SIMCLK and SIMDATA to avoid any disturbance of the rising and falling edges.

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3.14.1 Internal SIM Card Interface

This interface supports 3V / 1V8 Micro-SIM cards.

The SIM card (micro-SIM) is inserted in the extractible holder. In order to extract or insert the micro SIM card, press with a sharp element (a pen for example) the SIM card holder ejector.

Caution: If this procedure is not respected, the SIM card holder could be destroyed

SIM card holder

ejector

SIM card

holder

Figure 16: SIM card holder extraction

WARNING: Adding a capacitor between SIM_VCC and the ground may cause the Wireless CPU® to malfunction.

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3.14.2 External SIM Card Interface

The external SIM interface is available through the General Purpose Connector in order to use a stand-alone SIM card holder. This interface is 3V / 1V8, but

5 V SIMs can be driven by using an external level shifter.

See the application schematics in section 6.3.

Each SIM line must not exceed a length of 10 cm on the application PCB.

Although an internal ESD protection inside the Integra M2106+, there is a certain distance between the internal ESD protection circuitry and the external SIM card holder. This distance gives the electrostatic effect to other digital signals around.

Wavecom recommends adding Transient Voltage Suppressor diodes (ESD diode) on the external SIM signals, which are placed near to the external SIM socket. TVS diodes with low capacitance (less than 10 pF) are used on SIMCLK and SIMDATA to avoid any disturbance of the rising and falling edges.

Pin description

Signal Pin # I/O Reset state I/O type Description

SIM_CLK 45 O Output low 2V9/1V8

SIM Clock

SIM_RST 46 O Output low 2V9/1V8

SIM Reset

SIM_DATA 49 I/O Output low 2V9/1V8

SIM Data

SIM_VCC 47 O -- 2V9/1V8

Supply

SIM Power Supply

SIM_PRES 48 I High Z 2V8

CMOS

SIM Card Detect

GPO0 50 O Output high 2V8

SIM 3 V or 5 V

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SIM socket pin description

Signal Pin number Description

VCC 1 SIMVCC

RST 2 SIMRST CLK 3 SIMCLK CC4 4 Resistor connected to GROUND

GND 5 GROUND

VPP 6 Not connected

I/O 7 SIMDATA

CC8 8 SIMPRES1

SIMVCC 1 SIMRST 2 SIMCL

SIMDATA 7 SIMPRES1 8

1 K

VCC RST CL

CC4 GND VPP I / O CC8

GND

Figure 17: Schematic for external SIM card holder

When the external SIM card is used, the internal SIM card must be removed.

When no SIM card detection is required on the application, SIMPRES1 must be tied to VCC.

When SIM card detection is required on the application:

• A low-to-high transition means that the SIM card is inserted

• A high-to-low transition means that the SIM card is removed

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4 Technical Specifications

4.1 Environmental Constraints

Conditions Temperature range

Operating / Full GSM specification compliant -20°C to + 55°C

Storage -30°C to +85°C

4.2 Mechanical Specifications

4.2.1 Mechanical Overview

Integra is encased as shown in the figure below.

Figure 18: Mechanical overview 1/3

Figure 19: Mechanical overview 2/3

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Figure 20: Mechanical overview 3/3

4.2.2 Mechanical Characteristics Overall dimensions

46 x 64 x 12 mm

Weight

81 g

Volume

36.21 cm3

Casing

Complete shielding - stainless steel

Mounting

4 screw holes

For the M2106+ assembly on an application board, see the section

6.4.

4.2.3 Mechanical Drawings

The following page shows the Integra M2106+ Wireless CPU® mechanical drawings.

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PAGE RESERVEE

Insérer ici dans le PDF le fichier : wmoi3_assembly_A.pdf

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4.3 Electrical Specifications

4.3.1 Power Mode

The Integra M2106+ Wireless CPU® supports different power consumption modes:

Working modes Comments

OFF mode

The Wireless CPU® is in OFF mode.

FAST idle mode

The Wireless CPU® is synchronized with an RF GSM/GPRS network. The internal 26 MHz of the Wireless CPU

is constantly active.

SLOW idle mode

The Wireless CPU® is synchronized with an RF GSM/GPRS tester. The internal 26 MHz of the Wireless CPU

is not constantly active.

FAST Standby mode

The SIM and Radio interface are deactivated via AT command or Open AT API:

-The embedded application is running

-The serial port remains active (AT commands are available). The internal 26 MHz of the Wireless CPU

is constantly active.

SLOW Standby mode

This mode is similar to the FAST Standby mode. All the features are disabled (no GSM, no GPRS, no SIM and no Serial port). The internal 26 MHz of the Wireless CPU

is not constantly active.

Communication

mode

A GSM/GPRS communication is established with a RF GSM/GPRS network.

The power consumption depends on the configuration used. It is for this reason that the following power consumption values are given for each modes,

RF bands and software used (AT or Open AT®).

All the following information is given, by assuming a

50 Ω RF output.

5.0 VDC power supply value is used to measure the consumption.

For more information on power consumption measurement, hardware configuration, SIM used, and software Dhrystone application, see the AT command Interface Guide documentation

[7].

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4.3.2 Power Consumption without Open AT

Processing

The following measurement results are relevant only when:

• There is no Open AT

application,

• The Open AT

application is disabled,

• No processing is required by the Open AT

application.

Power supply: 5 V DC ± 5%, 1.5 A

Operating mode Parameters

NOM

average

MAX

peak

Unit

OFF Mode

16 NA µA

Paging 9

18.2 150

Fast Idle Mode

Paging 2

20.4 150

Paging 9

10.3 150

Slow Idle Mode

Paging 2

13.3 150

Fast Standby

17 -

Slow Standby

9.4 -

PCL5

226 1100

EGSM900

PCL19

102 240

PCL0

158 620

Connected Mode

DCS1800

PCL15

99 220

Gamma 3

212 1100

EGSM900

Gamma 17

92 210

Gamma 3

145 590

Transfer Mode

Class 8 (4Rx/1Tx)

DCS1800

Gamma 18

88 190

Gamma 3

377 1300

EGSM900

Gamma 17

134 240

Gamma 3

242 690

GPRS

Transfer Mode

Class 10 (3Rx/2Tx)

DCS1800

Gamma 18

127 220

means that the peak current is measured during a TX transmission burst

means that the peak current is measured during a RX reception burst

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4.3.3 Power Consumption with Open AT

Processing

The power consumption with Open AT

software used is the Dhrystone application and the following

consumption results were measured while performing on the Dhrystone application.

Power supply: 5 V DC /1.5 A

Operating mode Parameters

INOM

average

IMAX

peak

Unit

OFF Mode

TBC TBC

Paging 9 TBC TBC

Fast Idle Mode

Paging 2 TBC TBC

Paging 9 TBC TBC

Slow Idle Mode

Paging 2 TBC TBC

Fast Standby

TBC TBC

Slow Standby

TBC TBC

PCL5 TBC TBC

GSM850

EGSM900

PCL19

TBC TBC

PCL0 TBC TBC

Connected Mode

DCS1800

PCS1900

PCL15 TBC TBC

Gamma 3 TBC TBC GSM850

EGSM900

Gamma 17 TBC TBC

Gamma 3 TBC TBC

Transfer Mode

Class 8 (4Rx/1Tx)

DCS1800

PCS1900

Gamma 18 TBC TBC

Gamma 3 TBC TBC GSM850

EGSM900

Gamma 17 TBC TBC

Gamma 3 TBC TBC

GPRS

Transfer Mode

Class 10 (3Rx/2Tx)

DCS1800

PCS1900

Gamma 18 TBC TBC

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4.3.4 Current Consumption Waveform

The consumption waveforms are given for an EGSM900 network configuration with AT software running on the Wireless CPU

Power supply: 5 V DC /1.5 A

Four significant operating mode consumption waveforms are described as:

• Connected mode with one TX and one RX burst at PCL5 (33dBm)

• GPRS class 10 transfer mode with two TX bursts and three RX burst at Gamma 3 (33dBm)

• Slow Idle mode with a paging 9 (every 2 seconds)

• Fast Idle mode with a paging 9 (every 2 seconds)

The following waveform shows only the current form versus time:

Current Waveform

Connected mode with One TX burst at PCL5 and one

RX burst

Slow idle mode paging 9

0.2

0.4

0.6

0.8

1.2

024681012

Time (ms)

Current (A)

100

120

140

160

0123456

Time ( s )

Current (mA)

GPRS Class 10 Transfer mode with two TX bursts at

PCL5 and three RX burst

Fast idle mode paging 9

0.2

0.4

0.6

0.8

1.2

1.4

024681012

Time (m s)

Current (A)

100

120

140

160

0123456

Time (s )

Curre nt (mA)

RX bursts

RX burst

RX bursts

TX burst

TX Burst

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5 Applicable Normative Documents

5.1 Normative Specifications

Integra M2106+ Wireless CPU® is compliant with the applicable GSM ETSI, 3GPP and GCF recommendations for GSM/GPRS phase2.

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5.2 Environmental Specifications

Environmental Tests

(IEC TR 60721-4)

Environmental Classes

(IEC 60721-3)

Operation

Tests Standards

Storage

(IEC 60721-3-1)

Class IE13

Transportation

(IEC 60721-3-2)

Class IE23

Stationary

(IEC 60721-3-3)

Class IE35

Non-Stationary (IEC 60721-3-7)

Class IE73

Cold

IEC 60068-2-1:

Ab/Ad

-25°C, 16 h -40°C, 16 h -5°C, 16 h -5°C, 16 h

Dry heat

IEC 60068-2-2:

Bb/Bd

+70°C, 16 h +70°C, 16 h +55°C, 16 h +55°C, 16 h

Change of

temperature

IEC 60068-2-14:

Na/Nb

-33°C to ambient 2 cycles, t1=3 h

1 °C.min

-1

-40°C to ambient 5 cycles, t1=3 h

t2<3 min

-5°C to ambient 2 cycles, t1=3 h

0,5 °C.min-1

-5°C to ambient 5 cycles, t1=3 h

t2<3 min

Damp heat IEC 60068-2-56: Cb

+30°C, 93% RH

96 h

+40°C, 93% RH

96 h minimum

+30°C, 93% RH 96 h +30°C, 93% RH 96 h

Damp heat,

cyclic

60068-2-30: Db

Variant 1 or 2

+40°C, 90% to 100%

One cycle

Variant 2

+55°C

90% to 100% RH

Two cycles

Variant 2

+30°C,

90% to 100% RH

Two cycles

Variant 2

+40°C

90% to 100% RH

Two cycles

Variant 1

Vibration

(sinusoidal)

IEC 60068-2-6: Fc

1-200 Hz

2 m.s

-2

0,75 mm

3 axes

10 sweep cycles

1-500 Hz

10 m.s

-2

3,5 mm

3 axes

10 sweep cycles

1-150 Hz

2 m.s

-2

0,75 mm

3 axes

5 sweep cycles

1-500 Hz

10 m.s

-2

3,5 mm

3 axes

10 sweep cycles

Vibration (random)

IEC 60068-2-64: Fh -

10-100 Hz/

1,0 m

2.s-3

100-200 Hz /

-3 dB.octave

-1

200-2000 Hz /

0,5 m

2.s-3

3 axes

30 min

- -

Shock

(half-sine)

IEC 60068-2-2: Ea - -

50 m.s

-2

6 ms

3 shocks

6 directions

150 m.s

-2

11 ms

3 shocks

6 directions

Bump IEC 60068-2-29: Eb -

250 m.s

-2

6 ms

50 bumps

vertical direction

- -

Free fall ISO 4180-2 -

Two falls in each specified attitude

2 falls in each

specified attitude

0,025 m (<1kg)

Drop and topple IEC 60068-2-3: Ec -

One drop on relevant

corner

One topple about

each bottom edge

One drop on each

relevant corner

One topple on each

of 4 bottom edges

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Notes: Short description of Class IE13 (For more information see standard IEC 60721-3-1.)

"Locations without controlled temperature and humidity, where heating may be used to raise low temperatures, locations in buildings providing minimal protection against daily variations of external climate, prone to receiving rainfall from carrying wind"

Short description of Class IE23 (For more information see standard IEC 60721-3-2.)

"Transportation in unventilated compartments and in conditions without protection against bad weather, in all sorts of trucks and trailers in areas of well developed road network, in trains equipped with buffers specially designed to reduce shocks and by boat"

Short description of Class IE35 (For more information see standard IEC 60721-3-3.)

"Locations with no control on heat or humidity where heating may be used to raise low temperatures, to places inside a building to avoid extremely high temperatures, to places such as hallways, building staircases, cellars, certain workshops, equipment stations without surveillance"

Short description of Class IE73 (For more information see standard IEC 60721-3-7.)

"Transfer to places where neither temperature nor humidity are controlled, but where heat may be used to raise low temperatures, to places exposed to water droplets, products can be subjected to ice formation; these conditions are found in hallways and building staircases, garages, certain workshops, factory building and places for industrial processes and hardware stations without surveillance"

WARNING: The specification in the above table applies to the Integra M2106+ Wireless CPU

product only. Customers are advised to verify that the environmental specification of the SIM Card used is compliant with the M2106+ environmental specifications. Any application must be qualified by the customer with the SIM Card in storage, transportation and operation.

Notes

• The use of standard SIM cards may drastically reduce the environmental conditions in which the

Product can be used. These cards are particularly sensible to humidity and temperature changes. These conditions can produce oxidation of the SIM card metallic layers and cause, in the long term, electrical discontinuities. This is particularly true in left alone applications, where no frequent extraction/insertion of the SIM card is performed.

• In case of mobility when the application is moved through different environments with temperature

variations, some condensation may appear. These events have a negative impact on the SIM and can favor oxidation.

If no solution other than the use of standard SIM card, with exposition to the environmental conditions described above, is possible, special attention must be paid in the integration of the final application in order to minimize the impact of these conditions. The solutions that can be proposed are:

• Lubrication of the SIM card to protect the SIM Contact from oxidation.

• Putting the Wireless CPU

in a waterproof enclosure with desiccant bags.

Lubrication of the SIM card had been tested by Wavecom (using Tutela Fluid 43EM from MOLYDUVAL) and gives very good results.

If waterproof enclosure with a desiccant solution is used, check with your desiccant retailer the quantity that must be used according to enclosure dimensions. Ensure humidity has been removed before sealing the enclosure.

Any solution selected must be qualified by the customer on the final application.

Note: To minimize oxidation problem on the SIM card, its manipulation must be done with the greatest

precautions. In particular, the metallic contacts of the card must never bee touched with bare fingers or any

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matter which can contain polluted materials liable to produce oxidation (such as, e.g. substances including chlorine). In case a cleaning of the Card is necessary a dry cloth must be used (never use any chemical substance).

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6 Using the Integra Wireless CPU

6.1 Firmware Upgrade

The Integra firmware is stored in flash memory and can easily be upgraded.

The upgrade procedure is based on the X-modem protocol, but an emergency mode (backup procedure) based on a Wavecom specific downloader is also available.

6.1.1 Nominal Upgrade Procedure

The firmware file can be downloaded to the Wireless CPU® using the X-modem protocol.

To enter this mode, the AT+WDWL command (see description in the AT command Interface Guide documentation

[7]) must be sent to the Wireless CPU®.

The serial signals required to proceed with X-modem downloading are:

Rx, Tx, RTS, CTS and GND.

6.1.2 Alternative Procedure

If nominal upgrade mode cannot be used (due to critical corruption on the flash memory), an alternative procedure is available. This procedure requires Wavecom specific software to download the firmware file to the Wireless CPU

This tool must be run on a PC connected to the Wireless CPU

serial bus. As this procedure is highly specific

and required Wavecom tools, the process must be executed by your distributor.

The signals required to proceed with downloading are: Rx, Tx, RTS, CTS and GND.

Prior to running the Wavecom downloader, set the Wireless CPU

to download mode: the BOOT signal must

be set to low while powering ON (or resetting) the Wireless CPU

The application must support serial speed changes of up to 115,200 bps and hardware flow control (RTS/CTS connected).

6.2 Guidelines for Application Design

6.2.1 Hardware Recommendations

When designing the application board, specific attention must be paid to the following points:

• Having a common ground plane for analog, digital and RF grounds

• Length of the SIM interface lines: 10 cm maximum

• Bias of the Microphone inputs properly adjusted when using audio connectors (microphone + speaker)

• EMC protection on audio input/output (filters against 900 MHz)

• ESD protection on the serial link

• Avoid placing application processor or local oscillator circuits near the Wireless CPU

or the antenna

cable, in order to avoid any spurious emissions from the application

• Avoid placing the audio interface near the application antenna to reduce the risks of TDMA noise on

the audio

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6.2.2 Antenna

The choice of the antenna sub-system (type, performance, cable length and thermal resistance, etc.) and its integration in the application is a major issue. These elements could affect the performance of the GSM features such as sensitivity and transmitted power.

It is recommended to shield the application.

For applications including an antenna, poor shielding could dramatically affect the sensitivity of the terminal. Therefore, the antenna should be isolated to the maximum extent possible from the digital circuitry (application digital circuits and Integra Wireless CPU

interface). If not, the power transmitted through the

antenna could affect the application.

Product used within 20 cm from the head or body is required to undergo SAR testing. Because of the industrial application of the Integra M2106+, the Wireless CPU

has not been qualified for SAR. Customer

should make sure that the antenna placed is having a minimum distance of 20cm from human body.

6.2.3 Minimum Hardware Interface to Get Started

As a minimum, it is necessary to connect the following signals to operate the Integra M2106+ Wireless CPU® correctly within an application:

Minimum signals required to operate the Integra Wireless CPU®:

Pin # Signal Description

1 GND GROUND 2 GND GROUND 3 +5 V Power supply 4 +5 V Power supply

6 GND GROUND 13 CT106/CTS Clear To Send 15 ON/OFF Power On/OFF* 21 GND GROUND 24 GND GROUND 25 CT103/TX Transmit 28 CT104/RX Receive 30 CT105/RTS Request To Send

* Connected to + 5 V for example

See section

3.6 for implementation of the serial link level shifter

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6.3 3 V/5 V SIM Management

The figure below shows the schematic for a SIM level shifter to manage 5 V SIM cards.

Figure 21: Schematic for a SIM level shifter to manage 5 V SIM cards

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6.4 Installation of the Integra M2106+ Wireless CPU

on an Application Board

The Integra M2106+ Wireless CPU® can be mounted on the application PCB in two ways:

• The bottom side of the Wireless CPU

is assembled on the application PCB. The 50-pin connector of

the Wireless CPU

is directly connected to the mating connector assembled on the application PCB

• The top side of the Wireless CPU

is assembled on the application PCB. The 50-pin connector is

connected to the application board via a flex cable connector

Note:

The bottom side of the Wireless CPU

on the application is the recommended mounting option, because of

better Wireless CPU

immunity to noise generated on the application board.

For installation of the Integra M2106+ Wireless CPU

on an application board, Wavecom recommends:

• Use the recommended footprint described in Figure 22, if the bottom side of the Wireless CPU

is on

the application and reverse it, if the top side is on the PCB

• Connect the metallic pads around the fixing holes (1, 2, 3 & 4) of the Wireless CPU

to the application

board ground

Notes:

• If the connection of the 4 holes is not possible, at least 2 holes on opposite corners (e.g. 1 & 3 or 2 &

4) must be connected to the ground board

• For a better ground connection, it is recommended to use a ground plane on the application board

• If the Integra M2106 Wireless CPU

is assembled bottom side on the application PCB, Wavecom strongly recommends using fastening systems, which allows enough clearance to connect the Wireless CPU

• Do not use fastening systems, which do not allow a minimum clearance (such as threaded holes

directly on the PCB for example). This may result of being impossible to connect the Wireless CPU

• If the Wireless CPU

is mounted bottom side on the application PCB, use a low-profile connector as

the mating connector to the Wireless CPU

50-pin connector (See section 8.1.1 “General Purpose

Connector” for connector recommended reference)

• For Wireless CPU

fastening on the application use:

o Stainless steel material o Screw: Chc M2x16 (Qty=4) o Washer: flat or curved spring M2 (Qty=4) o Hex Nut: HM2 (Qty=4)

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• Do not put any components under the Wireless CPU

• For the overall dimensions of the Wireless CPU

, see section 4.2.3 (Mechanical drawings).

3 4

General tolerance : ±0.1mm

Top view

9.65

18.83

57.65

2.4

43.75

19.8

Figure 22: Recommended footprint

(Integra M2106 Wireless CPU

bottom side on application board)

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6.5 Integra Development Kit Board Presentation

The quickest way of getting started with the Integra Wireless CPU® is by using the Wavecom development kit board, also called as development kit board.

Integra Plug and Play SIM Card Ho lder

Res et

RS 232

serial link

Po w er S u p pl y

5V DC/1A5

Audio RJ 9

Handset and handsfree

An tenna Conn ecto r

Flex connector

ON/OFF

Dow nlo ad

Test

connecter

Status LED

Keypad

Figure 23: Integra development kit board description

The development kit board is manufactured by Wavecom. It can be ordered either directly from Wavecom or from your distributor.

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6.5.1 Getting Started

To use the Integra M2106+ Wireless CPU® with a Development kit board:

1. Mount the Integra Wireless CPU

on the Development kit board.

2. Insert one SIM card in the holder internal or external) and verify the SIM card fits in the holder correctly.

3. Connect the antenna to the Integra M2106+ RF connector.

4. Plug the handset into the RJ9 connector (HANDSET1).

5. Connect the RS232 cable to the Development kit board and Terminal (PC COM1 port, for example).

6. Ensure that:

• download Switch is not in the BOOT position,

• ON/OFF switch is ON.

7. Connect the power supply (DC 5 V) to the Development kit board.

8. After a short time, the status indication LED should come on.

The Wireless CPU

is now ready to operate.

The next section explains how to configure the PC for data exchange.

6.5.2 Setting up Terminal Emulator

An example based on the WindowsTM HyperTerminal application (terminal emulator program) is given below.

Setup:

1. START>PROGRAMS>ACCESSORIES>COMMUNICATION>HYPERTERMINAL, then run HYPERTRM.

2. Enter the name of your choice, and click an icon, then click “OK”

3. Select “Connect” using: direct to COM1 (or any other free serial port).

4. Set the following properties:

• 115,200 bps

• 8 bits data

• no parity

• 1 stop bit

• hardware flow control

and Click “OK”

Once HyperTerminal is open and configured, it can be used to send AT commands to the Integra M2106+ Wireless CPU

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6.5.3 Example of AT Commands

This section gives examples to get started with AT commands. Refer to the AT commands Interface Guide documentation

[7] for details.

6.5.3.1 Example of AT commands for Quick Starting the Wireless CPU

The table below lists the main AT commands required to start the Wireless CPU®.

Description AT commands

Wireless CPU®’s

response

Comment

OK PIN Code accepted.

+CME ERROR: 16

Incorrect PIN Code

(with +CMEE= 1 mode).

Enter PIN Code AT+CPIN=1234

+CME ERROR: 3

PIN already entered

(with +CMEE= 1 mode).

CREG= <mode>,1

Wireless CPU® synchronized on

the network.

CREG= <mode>,2

Synchronization lost, re-

synchronization attempt.

Wireless CPU®

synchronization

checking

AT+CREG?

CREG= <mode>,0

Wireless CPU® not synchronized

on the network, no synchronization

attempt.

Receiving an incoming call

ATA OK Answer the call.

OK Communication established.

+CME ERROR: 11

PIN code not entered (with +CMEE=

1 mode).

Initiate a call

ATD<phone

number>;

(Don’t forget the «;»

at the end for

« voice » call)

+CME ERROR: 3

AOC credit exceeded or the

communication is already

established.

Initiate an

emergency call

ATD112;

(Don’t forget the «;»

at the end for

« voice » call)

OK Communication established.

Communication loss NO CARRIER

Hang up ATH OK

Store the

parameters in

EEPROM

AT&W OK

The configuration settings are stored

in EEPROM.

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Example of set of AT commands, which can be used for quickly getting started with the Integra Wireless CPU

• AT+CGMI: Wireless CPU

response is “WAVECOM MODEM” when serial link is OK.

• AT+CPIN=<Pin Code>: enter a PIN code (if activated).

•

AT+CSQ: to check received signal strength.

• AT+CREG?: to check the registration of the Wireless CPU

on the network.

• ATD<phone number>; - to initiate a call.

• ATH: to hang up (end of call).

For further information on these AT commands and their associated parameters, refer to the AT commands Interface Guide documentation

[7].

6.5.3.2 Checking Received Signal Strength

The Integra Wireless CPU® establishes a call only if the received signal is sufficiently strong.

To check received signal strength:

• Enter the command AT+CSQ by using communication software such as the HyperTerminal program.

The value appears for the received signal strength.

• Check the result by comparing it with the values listed in the table below.

Received signal strength values

Received signal strength value

(AT+CSQ response)

(RSSI)

Interpretation of

received signal strength

0 - 10 Insufficient*

11 - 31 Sufficient*

Greater than 99 Insufficient*

* Based on general observations.

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6.5.3.3 Checking Wireless CPU

Network Registration

To check Wireless CPU® network registration:

5. Make sure a valid SIM card is previously inserted in the Wireless CPU

SIM card holder.

6. Enter the AT+CREG? command by using communication software such as the HyperTerminal program, The value appears as a response.

7. Check the result by comparing it with the values listed in the table below.

Network registration values

Value* Network registration

0,1 Yes 0,5 Yes (registered roaming)

* Refer to the AT commands Interface Guide documentation [7] for further information

about the other returned values and their meaning.

If the Wireless CPU® is not registered, perform the following procedure:

• Check the connection between the Wireless CPU

and the antenna.

• Check signal strength to determine the strength of the received signal (refer to section 6.5.3.2).

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7 Troubleshooting

This section describes:

• Problems that may be encountered when using the Integra Wireless CPU

• Possible causes

• Possible solutions

To review other troubleshooting information, refer to the 'FAQs' (Frequently Asked Questions) page either at

www.wavecom.com or use the following link:

http://www.wavecom.com/modules/movie/scenes/support/

7.1 Not Connecting Through the Serial Link

If the Wireless CPU® does not answer through the serial link on attempted transmission of data, refer to the table below for possible causes and solutions:

Table 5: Solutions for no connection through the serial link

If the Wireless CPU®

returns:

Then ask: Corrective Action:

Is the Wireless CPU® correctly

powered?

Provide a power supply to the

Wireless CPU

Is the serial cable correctly

connected to the Wireless CPU

and PC sockets?

Connect the cable.

Is the communication program

correctly configured?

Ensure the following Wireless CPU

settings:

• Data bits = 8

• Parity = none

• Stop bits = 1

• Baud = 9600 bps

Nothing

Is there another program

interfering with the

communication program?

Close the application in conflict on the

communication port (e.g. mouse or

printer driver)

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7.2 Receiving 'no carrier' Messages

If the Wireless CPU

returns a 'no carrier' message on an attempted transmission of data or voice signals,

refer to the next table for possible causes and solutions.

Table 6: Solutions for no carrier message

If the Wireless CPU®

returns

Then ask Corrective Action

Is the received signal strong

enough?

Refer to section

6.5.3.2 to check the

strength of the received signal.

No carrier

Is the antenna in accordance

with requirements and correctly

connected?

Refer to

Table 4 for antenna

requirements and antenna connection

check.

No carrier

(when trying to issue a

voice communication)

Is the semicolon (;) entered

immediately after the phone

number in the ATD command?

Make a new attempt with the

semicolon at the end of the AT

command:

e.g. ATD 1234;

Is the SIM card configured for

data/fax calls?

Contact your network provider for

activation of Data Fax services.

No carrier

(when trying to issue a

data or fax

communication)

Is the selected bearer type

supported by the called party

and by the network?

Check bearer type with the called

party and the network provider.

Try bearer selection by AT command:

AT+CBST=0,0,3

If the Integra Wireless CPU

returns a 'no carrier' message, and there is no solution in Table 6, investigate

the

extended error code by using the AT+CEER command. Refer to the following table for interpretation of

the

extended error code.

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Table 7: Interpretation of extended error codes for “no carrier”

Error Code Diagnostic Hint

1 Unallocated phone number 16 Normal call clearing 17 User busy 18 No user responding 19 User alerting, no answer 21 Call rejected 22 Number changed 31 Normal, unspecified

Not applicable

Requested facility not

subscribed

Check your subscription (data subscription

available?).

ACM equal or greater than

ACMmax

The credit of your pre-paid SIM card is

expired. 252 Call barring on outgoing calls 253 Call barring on incoming calls

Not applicable

3, 6, 8, 29, 34, 38, 41,42,

43, 44, 47, 49, 57, 58, 63,

65, 69, 70, 79, 254

Network causes Call the network provider.

See the AT commands Interface Guide documentation

[7] for further details.

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7.3 Receiving error Messages

If the Wireless CPU

returns an 'error' message on an attempted transmission of data or voice signals, refer

to the table below for possible causes and solutions:

Table 8: Solutions for error messages

If the Wireless CPU®

returns

Then ask Corrective Action

Is the Wireless CPU® registered

on the network?

Refer to section

6.5.3.3 to check that

the Wireless CPU

is registered on

the network.

Is the Wireless CPU® receiving

an incoming call or is it already in

communication?

End any communication using the

ATH command.

Is the selected bearer type

supported by the called party and

the network?

Ensure that the selected bearer type

is supported by the called party and

the network.

Ensure that the semicolon (;) is typed

immediately after the phone number

in the AT command.

e.g. ATD######;

Is the received signal strong

enough?

Refer to section

6.5.3.2 to check the

strength of the received signal.

Error

Is the antenna compliant with

requirements and correctly

connected?

Refer to

Table 4 for antenna

requirements and antenna connection

check.

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If the Integra Wireless CPU

returns an 'error' message and there is no solution in Table 8, investigate the

extended error code by using the AT+CMEE command. Refer to the table below for interpretation of the extended error code.

Table 9: Interpretation of extended error codes

Error Code Diagnostic Hint

0 Phone failure Call technical support. 3 Operation not allowed 4 Operation not supported

No action

SIM not inserted

Do one of the following:

• Insert the SIM card in the SIM card holder of the

Wireless CPU

• Check that the SIM card is clean and correctly inserted

in the holder

11 SIM PIN required Enter PIN code

12 SIM PUK required

Enter PUK code

Note: Call your network provider if you do not know this code.

13 SIM failure

Check the validity of your SIM card. If the SIM is damaged,

call your network provider. 16 Incorrect password Check the code you entered. 17 SIM PIN2 required Enter PIN2 code.

18 SIM PUK2 required

Enter PUK2 code.

Note: Call your network provider if you do not know this code. 26 Dialing string too long Check the phone number (max. 20 digits). 30 No network service No action

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8 Annexes

8.1 Supplier Information

8.1.1 General Purpose Connector

The mating connector for the Integra M2106+ Wireless CPU® General Purpose Connector is made by SAMTEC France (

http://www.samtec.com/).

Many SAMTEC products are available via SAMTEC dealers throughout the world.

Figure 24: High and low profile CLP connectors

For better fastening of the M2106+ on the application, Wavecom recommends the use of a low-profile connector.

Figure 25: Flexible flat cable (Part number: FFSD-20-S-10-01-N)

Figure 26: Flex cable connector (Part number: FLE 125 01LDVA)

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8.1.2 Antenna connector

The Integra M2106+ Wireless CPU® antenna connector is an MMCX connector (Miniature Micro Connector).

A mating MMCX connector for a cable or a mattng MMCX/SMA adaptor can be used for antenna connection.

Figure 27: MMCX connector example (right angle)

An antenna with mating connector can be ordered, for example, from:

IMS Connectors Systems GMBH

Obere Hauptstrasse 30

D-79843 Löffingen

Germany

Tel: +49 76 54 90 10

Fax: +49 76 54 90 11 99

http://www.imscs.com/

A MMCX/SMA adaptor can be ordered, for example, from:

Amphenol Socapex

http://www.amphenol.com/

Part Number: 908-31100

8.1.3 SIM Card Holder

The SIM card connector used in the Integra M2106+ Wireless CPU® is a MOLEX connector. It is possible to order only the SIM card holder if it is lost.

• Connector part number: 99228-0002

• Holder part number: 91236-0002

For more information on this connector:

http://www.molex.com/

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8.2 Safety Recommendations (for information only)

IMPORTANT

FOR THE EFFICIENT AND SAFE OPERATION OF YOUR

INTEGRA WIRELESS CPU®,

PLEASE READ THIS INFORMATION CAREFULLY

8.2.1 RF Safety

8.2.1.1 General

Your GSM terminal based on Integra Wireless CPU® is based on the GSM standard for cellular technology. The GSM standard is spread all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used telecommunication standard.

Your GSM terminal is actually a low power radio transmitter and receiver. It sends out as well as receives radio frequency energy. When a GSM application is used, the cellular system which handles your calls controls both the radio frequency and the power level of your cellular Wireless CPU

8.2.1.2 Exposure to RF Energy

There has been some public concern about possible health effects of using GSM terminals. Although research on health effects from RF energy has focused on the current RF technology for many years, scientists have begun research regarding newer radio technologies, such as GSM.

After existing research had been reviewed, and after compliance to all applicable safety standards had been tested, it has been concluded that the product was fitted for use.

If you are concerned about exposure to RF energy there are things you can do to minimize exposure. Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can reduce RF exposure by operating your cellular terminal efficiently by following the below guidelines.

8.2.1.3 Efficient Terminal Operation

For your GSM terminal to operate at the lowest power level, consistent with satisfactory call quality:

• If your terminal has an extendable antenna, extend it fully. Some models allow you to place a call with

the antenna retracted. However, your GSM terminal operates more efficiently with the antenna when it is fully extended.

• Do not hold the antenna when the terminal is « IN USE ». Holding the antenna affects call quality and

may cause the Wireless CPU

to operate at a higher power level than needed.

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8.2.1.4 Antenna Care and Replacement

Do not use the GSM terminal with a damaged antenna. If a damaged antenna comes into contact with the skin, a minor burn may result. You may repair antenna to yourself by following the instruction manual provided to you. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by a qualified technician.

Buy or replace the antenna only from the approved suppliers list. Using of unauthorized antennas, modifications or attachments could damage the terminal and may contravene local RF emission regulations or invalidate type approval.

8.2.2 General safety

8.2.2.1 Driving

Check with the laws and the regulations regarding the use of cellular devices in the area where you have to drive as you always have to comply with them. When using your GSM terminal while driving, please:

• give full attention to driving,

• pull-off the road and park before making or answering a call if driving conditions so require.

8.2.2.2 Electronic Devices

Most electronic equipment, for example in hospitals and motor vehicles, is shielded from RF energy. However, RF energy may affect some improperly shielded electronic equipment.

8.2.2.3 Vehicle Electronic Equipment

Check with your vehicle manufacturer/representative to determine if any on-board electronic equipment is adequately shielded from RF energy.

8.2.2.4 Medical Electronic Equipment

Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc) to determine if they are adequately shielded from external RF energy.

Turn your terminal

OFF in health care facilities when any regulations posted in the area instruct you to do so.

Hospitals or health care facilities may be using RF monitoring equipment.

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8.2.2.5 Aircraft

Turn your terminal OFF before boarding any aircraft.

• Use it on the ground only with crew permission.

• Do not use it in the air.

To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations require you should have prior permission from a crew member to use your terminal while the aircraft is on the ground. In order to prevent interference with cellular systems, local RF regulations prohibit using your Wireless CPU

while airborne.

8.2.2.6 Children

Do not allow children to play with your GSM terminal. It is not a toy. Children could hurt themselves or others (by poking themselves or others in the eye with the antenna, for example). Children could damage the Wireless CPU

, or make calls that increase your Wireless CPU® bills.

8.2.2.7 Blasting Areas

To avoid interfering with blasting operations, turn your unit OFF when you are in a « blasting area » or in areas posted: « turn off two-way radio ». Construction crew often uses remote control RF devices to set off explosives.

8.2.2.8 Potentially Explosive Atmospheres

Turn your terminal OFF in any area with a potentially explosive atmosphere. It is rare, but your Wireless

CPU

or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire

resulting in bodily injuries or even death.

Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fuelling areas such as petrol stations; below decks on boats; fuel or chemical transfer or storage facilities; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders.

Do not transport or store flammable gas, liquid, or explosives, in the compartment of your vehicle which contains your terminal or accessories.

Before using your terminal in a vehicle powered by liquefied petroleum gas (such as propane or butane) ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the vehicle is used.

8.2.3 Safety Standards

This Wireless CPU® complies with all applicable RF Safety Standards.

This cellular Wireless CPU

meets the standards and recommendations for the protection of public exposure

to RF electromagnetic energy established by governmental bodies and other qualified organizations.

Wavecom M2106+ Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual