WAGO 750-880, 750-880/025-000 User Manual

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Manual
WAGO-I/O-SYSTEM 750
ETHERNET Programmable Fieldbus Controller
750-880, 750-880/025-000
Version 1.0.1
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2 WAGO-I/O-SYSTEM 750 750-880, 750-880/025-000 ETHERNET Programmable Fieldbus Controller
© 2011 by WAGO Kontakttechnik GmbH & Co. KG All rights reserved.
WAGO Kontakttechnik GmbH & Co. KG
Hansastraße 27 D-32423 Minden
Phone: +49 (0) 571/8 87 – 0 Fax: +49 (0) 571/8 87 – 1 69
E-Mail: info@wago.com
Web: http://www.wago.com
=== Ende der Liste für Textmarke Einband_vorne ===
Technical Support
Phone: +49 (0) 571/8 87 – 5 55 Fax: +49 (0) 571/8 87 – 85 55
E-Mail: support@wago.com
Every conceivable measure has been taken to ensure the accuracy and completeness of this documentation. However, as errors can never be fully excluded, we always appreciate any information or suggestions for improving the documentation.
E-Mail: documentation@wago.com
We wish to point out that the software and hardware terms as well as the trademarks of companies used and/or mentioned in the present manual are generally protected by trademark or patent.
Manual Version 1.0.1
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WAGO-I/O-SYSTEM 750 Table of Contents 3 750-880, 750-880/025-000 ETHERNET Programmable Fieldbus Controller
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Table of Contents

1 Notes about this Documentation............................................................... 12
1.1 Validity of this Documentation............................................................... 12
1.2 Copyright................................................................................................. 12
1.3 Symbols................................................................................................... 13
1.4 Number Notation..................................................................................... 15
1.5 Font Conventions .................................................................................... 15
2 Important Notes......................................................................................... 16
2.1 Legal Bases ............................................................................................. 16
2.1.1 Subject
2.1.2 Personnel
2.1.3 Use of the 750 Series in Compliance with Underlying Provisions .... 16
2.1.4 Technical Condition of Specified Devices......................................... 17
2.2 Safety Advice (Precautions).................................................................... 18
3 System Description..................................................................................... 20
3.1 Manufacturing Number........................................................................... 21
3.2 Hardware Address (MAC ID)................................................................. 21
3.3 Component Update.................................................................................. 22
3.4 Storage, Assembly and Transport ........................................................... 22
3.5 Assembly Guidelines/Standards.............................................................. 22
3.6 Power Supply .......................................................................................... 23
3.6.1 Isolation.............................................................................................. 23
3.6.2 System Supply.................................................................................... 24
3.6.2.1 Connection..................................................................................... 24
3.6.2.2 Alignment ...................................................................................... 25
3.6.3 Field Supply........................................................................................ 28
3.6.3.1 Connection..................................................................................... 28
3.6.3.2 Fusing ............................................................................................ 29
3.6.4 Supplementary Power Supply Regulations ........................................ 33
3.6.5 Supply Example.................................................................................. 34
3.6.6
Power Supply Unit ............................................................................. 36
3.7 Grounding
3.7.1 Grounding the DIN Rail ..................................................................... 37
3.7.1.1 Framework Assembly.................................................................... 37
3.7.1.2 Insulated Assembly........................................................................ 37
3.7.2 Grounding Function............................................................................ 38
3.7.3 Grounding Protection ......................................................................... 39
3.8 Shielding (Screening).............................................................................. 40
3.8.1 General ............................................................................................... 40
3.8.2 Bus Conductors .................................................................................. 40
3.8.3 Signal Conductors .............................................................................. 40
3.8.4 WAGO Shield (Screen) Connecting System...................................... 41
to Changes ............................................................................. 16
Qualifications..................................................................... 16
............................................................................................... 37
4 Device Description
4.1 View
........................................................................................................ 45
..................................................................................... 42
4.2 Connectors............................................................................................... 47
4.2.1 Device Supply .................................................................................... 47
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4.2.2 Fieldbus Connection........................................................................... 47
4.3 Display Elements .................................................................................... 49
4.4 Operating Elements................................................................................. 51
4.4.1 Service Interface................................................................................. 51
4.4.2 Mode Selector Switch......................................................................... 52
4.4.3 Address Selection Switch................................................................... 54
4.4.4 Memory Card Slot.............................................................................. 54
4.4.4.1 Inserting a Memory Card............................................................... 55
4.4.4.2 Removing the Memory Card ......................................................... 56
4.5 Technical Data ........................................................................................ 57
4.5.1 Device Data ........................................................................................ 57
4.5.2 System Data........................................................................................ 57
4.5.3 Supply................................................................................................. 58
4.5.4 Fieldbus
4.5.5 Accessories
MODBUS/TCP.................................................................... 58
......................................................................................... 58
4.5.6 Wire Connection................................................................................. 58
4.5.7 Climatic environmental conditions..................................................... 59
4.5.8 Mechanical strength............................................................................ 60
4.6 Approvals ................................................................................................ 61
4.7 Standards and Guidelines........................................................................ 62
5 Assembly..................................................................................................... 63
5.1 Installation Position................................................................................. 63
5.2 Total Extension ....................................................................................... 63
5.3 Assembly onto Carrier Rail..................................................................... 65
5.3.1 Carrier Rail Properties........................................................................ 65
5.3.2 WAGO DIN Rail................................................................................ 66
5.4 Spacing.................................................................................................... 66
5.5 Assembly Sequence ................................................................................ 67
5.6 Inserting and Removing Devices ............................................................ 68
5.6.1 Inserting the Fieldbus Coupler/Controller.......................................... 69
5.6.2 Removing the Fieldbus Coupler/Controller ....................................... 69
5.6.3 Inserting I/O Module .......................................................................... 70
5.6.4 6 Connect Devices
6.1
6.2
Removing the I/O Module.................................................................. 71
......................................................................................... 72
Data Contacts/Internal Bus ..................................................................... 72
Power Contacts/Field Supply.................................................................. 73
6.3 Connecting a conductor to the CAGE CLAMP®.................................... 74
7 Function Description ................................................................................. 75
7.1 Operating System.................................................................................... 75
7.1.1 Run-up ................................................................................................ 75
7.1.2 PFC Cycle........................................................................................... 75
7.2 Process Data Architecture....................................................................... 77
7.2.1 Basic Structure.................................................................................... 77
7.2.2 Example of an Input Process Image................................................... 79
7.2.3 Example of an Output Data Process Image........................................ 80
7.2.4 Process Data MODBUS/TCP and EtherNet/IP.................................. 81
7.3 Data Exchange ........................................................................................ 82
7.3.1 Memory Areas.................................................................................... 84
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7.3.2 Addressing.......................................................................................... 87
7.3.2.1 Addressing of I/O Modules ........................................................... 88
7.3.2.2 Address Ranges ............................................................................. 89
7.3.2.3 Absolute Addressing...................................................................... 92
7.3.3 Data Exchange between MODBUS/TCP Master and I/O Modules... 94
7.3.3.1 Data Exchange between EtherNet/IP Master and I/O Modules .... 96
7.3.4 Data Exchange between PLC Function (CPU) and I/O Modules ...... 97
7.3.5 Data Exchange between Master and PLC Function (CPU)................ 98
7.3.5.1 Example of MODBUS/TCP Master and PLC Function (CPU) .... 98
7.3.6 Application Example........................................................................ 100
7.4 Memory Card Function......................................................................... 101
7.4.1 System Start (Automatic Loading of Device Settings from the
Memory Card) .................................................................................. 101
7.4.2
7.4.3
Back-up Function (Saving Device Settings on the Memory Card).. 103 Restore Function (Loading of Device Settings from the Memory Card)104
7.4.4 Inserting a Memory Card During Operation .................................... 107
7.4.5 Removing the Memory Card During Operation............................... 108
7.4.6 SPS Access to the File System of the Memory Card ....................... 109
7.4.7 FTP Network Access to the File System of the Memory Card........ 110
7.4.8 Directory Structure ........................................................................... 111
8 Commissioning......................................................................................... 112
8.1 Connecting Client PC and Fieldbus Nodes........................................... 113
8.2 Allocating the IP Address to the Fieldbus Node................................... 113
8.2.1 Assigning IP Address via Address Selection Switch ....................... 114
8.2.2 Assigning IP Address via DHCP...................................................... 116
8.2.2.1 Enable DHCP............................................................................... 116
8.2.2.2 Disabling DHCP .......................................................................... 117
8.2.3 Assigning the IP Address with a BootP Server................................ 121
8.2.3.1 Note MAC ID .............................................................................. 122
8.2.3.2 Determining IP addresses ............................................................ 123
8.2.3.3 Assigning the IP address and Enable BootP................................ 124
8.2.3.4 Disabling BootP........................................................................... 124
8.2.3.5
8.3
Reasons for Failed IP Address Assignment................................. 128
Testing the Function of the Fieldbus Node........................................... 129
8.4 Preparing the Flash File System............................................................ 131
8.5 Synchronizing the Real-Time Clock..................................................... 133
8.6 Restoring Factory Settings .................................................................... 136
9 Programming the PFC using WAGO-I/O-PRO.................................... 137
9.1 Configuration using the WAGO-I/O-PRO I/O Configurator................ 139
9.1.1 Configuration using the "EA-config.xml" File ................................ 142
9.2 ETHERNET Libraries for WAGO-I/O-PRO........................................ 144
9.3 Functional Restrictions and Limits ....................................................... 146
9.4 General Information about IEC Tasks .................................................. 149
9.4.1 IEC Task Sequence........................................................................... 151
9.4.2 Overview of Most Important Task Priorities.................................... 151
9.5 System Events ....................................................................................... 153
9.5.1 Enabling/disabling system events..................................................... 153
9.6
9.6.1
Transfer the IEC program to the controller........................................... 155
Transfer via Serial Service Port........................................................ 156
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9.6.2 Transfer via Fieldbus and ETHERNET ........................................... 159
10 Configuring via the Web-Based Management System (WBM)........... 161
10.1 Information............................................................................................ 161
10.2 Ethernet ................................................................................................. 163
10.3 TCP/IP................................................................................................... 166
10.4 Port ........................................................................................................ 167
10.5 SNMP.................................................................................................... 168
10.5.1 SNMP V1/V2c.................................................................................. 169
10.5.2 SNMP V3 ......................................................................................... 171
10.6 Watchdog .............................................................................................. 173
10.7 Clock ..................................................................................................... 174
10.8 Security ................................................................................................. 177
10.9 PLC ....................................................................................................... 179
10.10 Features
10.11 I/O
................................................................................................. 182
Config ............................................................................................. 183
10.12 Disk Info................................................................................................ 185
10.13 WebVisu................................................................................................ 186
11 Diagnostics................................................................................................ 188
11.1 LED Signaling....................................................................................... 188
11.1.1 Evaluating Fieldbus Status ............................................................... 188
11.1.2 Evaluating Node Status - I/O LED (Blink Code Table)................... 190
11.1.2.1 USR LED..................................................................................... 199
11.1.3 Evaluating Memory Card Status ...................................................... 199
11.1.4 Evaluating Power Supply Status ...................................................... 199
11.2 Fault Behavior....................................................................................... 200
11.2.1 Loss of Fieldbus ............................................................................... 200
11.2.2 Internal Data Bus Failure.................................................................. 202
12 Fieldbus Communication ........................................................................ 203
12.1 Implemented Protocols.......................................................................... 203
12.1.1 Communication Protocols ................................................................ 203
12.1.1.1 IP (Internet Protocol) ................................................................... 203
12.1.1.2 TCP (Transmission Control Protocol)......................................... 208
12.1.1.3
UDP (User Datagram Protocol)................................................... 208
12.1.2 Configuration and Diagnostics Protocols......................................... 209
12.1.2.1
BootP (Bootstrap Protocol).......................................................... 209
12.1.2.2 DHCP (Dynamic Host Configuration Protocol).......................... 211
12.1.2.3 HTTP (Hypertext Transfer Protocol)........................................... 213
12.1.2.4 DNS (Domain Name Systems).................................................... 213
12.1.2.5
12.1.2.6
SNTP-Client (Simple Network Time Protocol) .......................... 214
FTP-Server (File Transfer Protocol)............................................ 214
12.1.2.7 SNMP (Simple Network Management Protocol)........................ 215
12.1.2.7.1 MIB II Description.................................................................. 216
12.1.2.7.2 Traps........................................................................................ 217
12.1.3 Application Protocols....................................................................... 218
12.2 MODBUS Functions............................................................................. 219
12.2.1 General ............................................................................................. 219
12.2.2 Use of the MODBUS Functions....................................................... 222
12.2.3 Description of the MODBUS Functions .......................................... 223
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WAGO-I/O-SYSTEM 750 Table of Contents 7 750-880, 750-880/025-000 ETHERNET Programmable Fieldbus Controller
12.2.3.1 Function Code FC1 (Read Coils) ................................................ 224
12.2.3.2 Function Code FC2 (Read Input Discretes)................................. 226
12.2.3.3 Function Code FC3 (Read Multiple Registers) ........................... 228
12.2.3.4 Function Code FC4 (Read Input Registers)................................. 229
12.2.3.5 Function Code FC5 (Write Coil) ................................................. 230
12.2.3.6 Function Code FC6 (Write Single Register) ............................... 231
12.2.3.7 Function Code FC11 (Get Comm Event Counter) ...................... 232
12.2.3.8 Function Code FC15 (Force Multiple Coils)............................... 233
12.2.3.9 Function Code FC16 (Write Multiple Registers) ........................ 235
12.2.3.10 Function Code FC22 (Mask Write Register).............................. 236
12.2.3.11 Function Code FC23 (Read/Write Multiple Registers)............... 237
12.2.4 MODBUS Register Mapping ........................................................... 239
12.2.5 MODBUS Registers ......................................................................... 242
12.2.5.1
12.2.5.2 Watchdog
Accessing Register Values .......................................................... 243
Registers..................................................................... 243
12.2.5.3 Diagnostic Registers .................................................................... 248
12.2.5.4 Configuration Registers............................................................... 249
12.2.5.5 Firmware Information Registers.................................................. 254
12.2.5.6 Constant Registers ....................................................................... 256
12.3 EtherNet/IP (Ethernet/Industrial Protocol) ........................................... 258
12.3.1 General ............................................................................................. 258
12.3.2 Protocol overview in the OSI model ................................................ 259
12.3.3 Characteristics of the EtherNet/IP Protocol Software...................... 260
12.3.4 EDS File ........................................................................................... 260
12.3.5 Object Model.................................................................................... 261
12.3.5.1 General......................................................................................... 261
12.3.5.2 Class Overview............................................................................ 262
12.3.5.3 Explanation of the Table Headings in the Object Descriptions... 264
12.3.5.4 Identity (01
12.3.5.5 Message Router (02
12.3.5.6 Assembly Object (04
12.3.5.7 Connection (05
12.3.5.8 Connection Manager (06
12.3.5.9 Port Class (F4
12.3.5.10 TCP/IP Interface (F5
12.3.5.11 Ethernet Link (F6
12.3.5.12 Coupler/Controller Configuration (64
12.3.5.13 Discrete Input Point (65
12.3.5.14 Discrete Input Point Extended 1 (69
12.3.5.15 Discrete Input Point Extended 2 (6D
12.3.5.16 Discrete Input Point Extended 3 (71
12.3.5.17 Discrete Output Point (66
12.3.5.18 Discrete Output Point Extended 1 (6A
12.3.5.19 Discrete Output Point Extended 2 (6E
12.3.5.20 Discrete Output Point Extended 3 (72
12.3.5.21 Analog Input Point (67
12.3.5.22 Analog Input Point Extended 1 (6B
12.3.5.23 Analog Input Point Extended 2 (6F
12.3.5.24 Analog Input Point Extended 3 (73
12.3.5.25 Analog Output Point (68
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8 Table of Contents WAGO-I/O-SYSTEM 750 750-880, 750-880/025-000 ETHERNET Programmable Fieldbus Controller
12.3.5.26 Analog Output Point Extended 1 (6C
12.3.5.27 Analog Output Point Extended 2 (70
12.3.5.28 Analog Output Point Extended 3 (74
12.3.5.29 Module Configuration (80
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12.3.5.30 Module Configuration Extended (81
12.3.5.31 Input Fieldbus Variable USINT (A0
12.3.5.32 Input Fieldbus Variable USINT Extended 1 (A1
12.3.5.33 Input Fieldbus Variable USINT Extended 2 (A2
12.3.5.34 Output Fieldbus Variable USINT (A3
12.3.5.35 Output Fieldbus Variable USINT Extended 1 (A4
12.3.5.36 Output Fieldbus Variable USINT Extended 2 (A5
12.3.5.37 Input Fieldbus Variable UINT (A6
12.3.5.38 Input Fieldbus Variable UINT Extended 1 (A7
12.3.5.39 Output Fieldbus Variable UINT (A8
12.3.5.40 Output Fieldbus Variable UINT Extended 1 (A9
12.3.5.41 Input Fieldbus Variable UDINT (AA
12.3.5.42 Input Fieldbus Variable UDINT Offset (AB
12.3.5.43 Output Fieldbus Variable UDINT (AC
12.3.5.44 Output Fieldbus Variable UDINT Offset (AD
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13 I/O Modules .............................................................................................. 311
13.1 Overview............................................................................................... 311
13.2 Process Data Architecture for MODBUS/TCP..................................... 312
13.2.1 Digital Input Modules....................................................................... 313
13.2.1.1 1 Channel Digital Input Module with Diagnostics...................... 313
13.2.1.2 2 Channel Digital Input Modules ................................................ 313
13.2.1.3 2 Channel Digital Input Module with Diagnostics...................... 313
13.2.1.4 2 Channel Digital Input Module with Diagnostics and Output
Process Data................................................................................. 314
13.2.1.5 4 Channel Digital Input Modules ................................................ 314
13.2.1.6 8 Channel Digital Input Modules ................................................ 314
13.2.1.7 16 Channel Digital Input Modules .............................................. 315
13.2.2 Digital Output Modules.................................................................... 316
13.2.2.1
13.2.2.2
1 Channel Digital Output Module with Input Process Data........ 316
2 Channel Digital Output Modules.............................................. 316
13.2.2.3 2 Channel Digital Input Modules with Diagnostics and Input
Process Data................................................................................. 317
13.2.2.4 4 Channel Digital Output Modules.............................................. 318
13.2.2.5 4 Channel Digital Output Modules with Diagnostics and Input
Process Data................................................................................. 318
13.2.2.6 8 Channel Digital Output Module ............................................... 318
13.2.2.7 8 Channel Digital Output Modules with Diagnostics and Input
Process Data................................................................................. 319
13.2.2.8 16 Channel Digital Output Modules............................................ 319
13.2.2.9 8 Channel Digital Input/Output Modules .................................... 320
13.2.3 Analog Input Modules...................................................................... 321
13.2.3.1 1 Channel Analog Input Modules................................................ 321
13.2.3.2 2 Channel Analog Input Modules................................................ 321
13.2.3.3
13.2.4
4 Channel Analog Input Modules................................................ 322
Analog Output Modules ................................................................... 323
13.2.4.1 2 Channel Analog Output Modules ............................................. 323
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13.2.4.2 4 Channel Analog Output Modules ............................................. 323
13.2.5 Specialty Modules ............................................................................ 324
13.2.5.1 Counter Modules ......................................................................... 324
13.2.5.2 Pulse Width Modules................................................................... 326
13.2.5.3 Serial Interface Modules with alternative Data Format............... 326
13.2.5.4 Serial Interface Modules with Standard Data Format ................. 327
13.2.5.5 Data Exchange Module................................................................ 327
13.2.5.6 SSI Transmitter Interface Modules.............................................. 327
13.2.5.7 Incremental Encoder Interface Modules...................................... 328
13.2.5.8 DC-Drive Controller.................................................................... 330
13.2.5.9 Stepper Controller........................................................................ 331
13.2.5.10 RTC Module ................................................................................ 332
13.2.5.11 DALI/DSI Master Module........................................................... 332
13.2.5.12
13.2.5.13
EnOcean Radio Receiver............................................................. 333
MP Bus Master Module............................................................... 333
13.2.5.14 Bluetooth® RF-Transceiver.......................................................... 334
13.2.5.15 Vibration Velocity/Bearing Condition Monitoring VIB I/O....... 335
13.2.5.16 KNX/EIB/TP1 Module................................................................ 335
13.2.5.17 AS-interface Master Module ....................................................... 336
13.2.6 System Modules ............................................................................... 338
13.2.6.1 System Modules with Diagnostics............................................... 338
13.2.6.2 Binary Space Module .................................................................. 338
13.3 Process Data Architecture for EtherNet/IP ........................................... 339
13.3.1 Digital Input Modules....................................................................... 340
13.3.1.1 1 Channel Digital Input Module with Diagnostics...................... 340
13.3.1.2 2 Channel Digital Input Modules ................................................ 340
13.3.1.3 2 Channel Digital Input Module with Diagnostics...................... 341
13.3.1.4 2 Channel Digital Input Module with Diagnostics and Output
Process Data................................................................................. 341
13.3.1.5 4 Channel Digital Input Modules ................................................ 342
13.3.1.6 8 Channel Digital Input Modules ................................................ 342
13.3.1.7 16 Channel Digital Input Modules .............................................. 342
13.3.2
Digital Output Modules.................................................................... 343
13.3.2.1 1 Channel Digital Output Module with Input Process Data........ 343
13.3.2.2
2 Channel Digital Output Modules.............................................. 344
13.3.2.3 2 Channel Digital Input Modules with Diagnostics and Input
Process Data................................................................................. 344
13.3.2.4
4 Channel Digital Output Modules.............................................. 345
13.3.2.5 4 Channel Digital Output Modules with Diagnostics and Input
Process Data................................................................................. 345
13.3.2.6
8 Channel Digital Output Module ............................................... 346
13.3.2.7 8 Channel Digital Output Modules with Diagnostics and Input
Process Data................................................................................. 346
13.3.2.8 16 Channel Digital Output Modules............................................ 347
13.3.2.9 8 Channel Digital Input/Output Modules .................................... 347
13.3.3 Analog Input Modules...................................................................... 348
13.3.3.1 1 Channel Analog Input Modules................................................ 348
13.3.3.2
13.3.3.3
2 Channel Analog Input Modules................................................ 349
4 Channel Analog Input Modules................................................ 349
13.3.4 Analog Output Modules ................................................................... 350
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13.3.4.1 2 Channel Analog Output Modules ............................................. 350
13.3.4.2 4 Channel Analog Output Modules ............................................. 350
13.3.5 Specialty Modules ............................................................................ 351
13.3.5.1 Counter Modules ......................................................................... 351
13.3.5.2 Pulse Width Modules................................................................... 353
13.3.5.3 Serial Interface Modules with alternative Data Format............... 353
13.3.5.4 Serial Interface Modules with Standard Data Format ................. 354
13.3.5.5 Data Exchange Module................................................................ 355
13.3.5.6 SSI Transmitter Interface Modules.............................................. 355
13.3.5.7 Incremental Encoder Interface Modules...................................... 356
13.3.5.8 DC-Drive Controller.................................................................... 358
13.3.5.9 Steppercontroller.......................................................................... 359
13.3.5.10 RTC Module ................................................................................ 360
13.3.5.11
13.3.5.12
DALI/DSI Master Module........................................................... 361
EnOcean Radio Receiver............................................................. 361
13.3.5.13 MP Bus Master Module............................................................... 362
13.3.5.14 Bluetooth® RF-Transceiver.......................................................... 362
13.3.5.15 Vibration Velocity/Bearing Condition Monitoring VIB I/O....... 363
13.3.5.16 AS-interface Master Module ....................................................... 364
13.3.6 System Modules ............................................................................... 365
13.3.6.1 System Modules with Diagnostics............................................... 365
13.3.6.2 Binary Space Module .................................................................. 365
14 Application Examples.............................................................................. 366
14.1 Test of MODBUS protocol and fieldbus nodes .................................... 366
14.2 Visualization and Control using SCADA Software.............................. 366
15 Use in Hazardous Environments ............................................................ 369
15.1 Identification ......................................................................................... 370
15.1.1 For Europe according to CENELEC and IEC.................................. 370
15.1.2 For America according to NEC 500................................................. 373
15.2 Installation Regulations......................................................................... 374
15.2.1 Special Conditions for Safe Operation of the ATEX and IEC Ex (acc.
DEMKO 08 ATEX 142851X and IECEx PTB 07.0064)................. 375
15.2.2
Special conditions for safe use (ATEX Certificate TÜV 07 ATEX
554086 X)......................................................................................... 376
15.2.3
Special conditions for safe use (IEC-Ex Certificate TUN 09.0001 X)377
15.2.4 ANSI/ISA 12.12.01 .......................................................................... 378
16 Appendix................................................................................................... 379
16.1 MIB II Groups....................................................................................... 379
16.1.1 System
16.1.2 Interface
Group ................................................................................... 379
Group................................................................................. 380
16.1.3 IP Group ........................................................................................... 382
16.1.4 IpRoute Table Group........................................................................ 383
16.1.5 ICMP Group ..................................................................................... 384
16.1.6 TCP Group........................................................................................ 385
16.1.7 UDP Group....................................................................................... 386
16.1.8 SNMP Group.................................................................................... 387
16.2 WAGO MIB Groups............................................................................. 388
16.2.1 Company Group ............................................................................... 388
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16.2.2 Product Group .................................................................................. 388
16.2.3 Versions Group................................................................................. 389
16.2.4 Real-Time Clock Group ................................................................... 390
16.2.5 Ethernet Group ................................................................................. 391
16.2.6 Actual Error Group........................................................................... 391
16.2.7 PLC Project Group ........................................................................... 392
16.2.8 Http Group........................................................................................ 393
16.2.9 Ftp Group.......................................................................................... 393
16.2.10 Sntp Group........................................................................................ 394
16.2.11 Snmp Group...................................................................................... 394
16.2.12 Snmp Trap String Group .................................................................. 396
16.2.13 Snmp User Trap String Group.......................................................... 397
16.2.14 Plc Connection Group ...................................................................... 397
16.2.15 Modbus
16.2.16 Ethernet
Group.................................................................................. 398
IP Group............................................................................. 399
16.2.17 Process Image Group........................................................................ 399
16.2.18 Plc Data Group ................................................................................. 400
List of Figures.................................................................................................... 401
=== Ende der Liste für Textmarke Verzeichnis_vorne ===
List of Tables...................................................................................................... 403
Manual Version 1.0.1
Page 12
12 Notes about this Documentation WAGO-I/O-SYSTEM 750 750-880, 750-880/025-000 ETHERNET Programmable Fieldbus Controller
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1 Notes about this Documentation

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Keep this documentation!
The operating instructions are part of the product and shall be kept for the entire lifetime of the device. They shall be transferred to each subsequent owner or user of the device. Care must also be taken to ensure that any supplement to these instructions are included, if applicable.
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1.1 Validity of this Documentation

This documentation is only applicable to the device: "ETHERNET Programmable Fieldbus Controller" 750-880, 750-880/025-000 of the WAGO-I/O-SYSTEM 750 series.
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The ETHERNET Programmable Fieldbus Controller 750-880, 750-880/025-000 shall only be installed and operated according to the instructions in this manual and the system description for the WAGO-I/O-SYSTEM 750.
Consider power layout of the WAGO-I/O-SYSTEM 750!
In addition to these operating instructions, you will also need the system description for the WAGO-I/O-SYSTEM 750, which can be downloaded at
www.wago.com. There, you can obtain important information including
information on electrical isolation, system power and supply specifications.
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1.2 Copyright

This Manual, including all figures and illustrations, is copyright-protected. Any further use of this Manual by third parties that violate pertinent copyright provisions is prohibited. Reproduction, translation, electronic and phototechnical filing/archiving (e.g., photocopying) as well as any amendments require the written consent of WAGO Kontakttechnik GmbH & Co. KG, Minden, Germany. Non-observance will involve the right to assert damage claims.
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Manual Version 1.0.1
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