WAGO 750-370 User Manual

Page 1
Modular I/O-System
Fieldbus Coupler PROFINET IO 750-370
Manual
Technical description, installation and configuration
Version 1.0.0
Page 2
ii • Table of Contents
Copyright © 2009 by WAGO Kontakttechnik GmbH & Co. KG All rights reserved..
WAGO Kontakttechnik GmbH & Co. KG
Hansastraße 27 D-32423 Minden
Phone: +49 (0) 571/8 87 – 0 Fax: +49 (0) 571/8 87 – 1 69
E-Mail: info@wago.com Web: http://www.wago.com
Technical Support
Phone.: +49 (0) 571/8 87 – 5 55 Fax: +49 (0) 571/8 87 – 85 55
E-Mail: support@wago.com
Every conceivable measure has been taken to ensure the correctness and completeness of this documentation. However, as errors can never be fully excluded we would appreciate any information or ideas at any time.
E-Mail: documentation@wago.com
We wish to point out that the software and hardware terms as well as the trademarks of companies used and/or mentioned in the present manual are generally trademark or patent protected.
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Table of Contents • iii
Table of Contents
1 Important Notes ..........................................................................................9
1.1 Legal Bases...............................................................................................9
1.1.1 Copyright............................................................................................. 9
1.1.2 Personnel Qualifications......................................................................9
1.1.3 Use of the 750 Series in Compliance with Underlying Provisions ... 10
1.1.4 Technical Condition of Specified Devices ........................................10
1.2 Standards and Guidelines for Operating the 750 Series.........................11
1.3 Symbols.................................................................................................. 12
1.4 Safety Information.................................................................................. 13
1.5 Font Conventions ...................................................................................14
1.6 Number Notation....................................................................................14
1.7 Scope ...................................................................................................... 14
1.8 Abbreviation...........................................................................................15
2 The WAGO-I/O-SYSTEM 750................................................................ 16
2.1 System Description.................................................................................16
2.2 Technical Data........................................................................................ 17
2.3 Manufacturing Number ..........................................................................23
2.4 Component Update.................................................................................24
2.5 Storage, Assembly and Transport .......................................................... 24
2.6 Mechanical Setup ...................................................................................25
2.6.1 Installation Position ........................................................................... 25
2.6.2 Total Expansion.................................................................................25
2.6.3 Assembly onto Carrier Rail ...............................................................26
2.6.3.1 Carrier Rail Properties ..................................................................26
2.6.3.2 WAGO DIN Rail ..........................................................................27
2.6.4 Spacing .............................................................................................. 27
2.6.5 Plugging and Removal of the Components .......................................28
2.6.6 Assembly Sequence........................................................................... 29
2.6.7 Internal Bus/Data Contacts................................................................30
2.6.8 Power Contacts.................................................................................. 31
2.6.9 Wire Connection................................................................................32
2.7 Power Supply .........................................................................................33
2.7.1 Isolation ............................................................................................. 33
2.7.2 System Supply ...................................................................................34
2.7.2.1 Connection .................................................................................... 34
2.7.2.2 Alignment .....................................................................................35
2.7.3 Field Supply....................................................................................... 37
2.7.3.1 Connection .................................................................................... 37
2.7.3.2 Fusing............................................................................................ 38
2.7.4 Supplementary Power Supply Regulations .......................................41
2.7.5 Supply Example................................................................................. 42
2.7.6 Power Supply Unit............................................................................. 43
2.8 Grounding............................................................................................... 44
2.8.1 Grounding the DIN Rail .................................................................... 44
2.8.1.1 Framework Assembly ...................................................................44
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2.8.1.2 Insulated Assembly.......................................................................44
2.8.2 Grounding Function........................................................................... 45
2.8.3 Grounding Protection ........................................................................46
2.9 Shielding (Screening)............................................................................. 47
2.9.1 General............................................................................................... 47
2.9.2 Bus Conductors.................................................................................. 47
2.9.3 Signal Conductors.............................................................................. 47
2.9.4 WAGO Shield (Screen) Connecting System.....................................48
2.10 Assembly Guidelines/Standards.............................................................48
3 Fieldbus Coupler .......................................................................................49
3.1 PROFINET IO 750-370 ......................................................................... 49
3.1.1 Description......................................................................................... 49
3.1.2 Hardware............................................................................................50
3.1.2.1 View..............................................................................................50
3.1.2.2 Power Supply ................................................................................ 51
3.1.2.3 Fieldbus Connection ..................................................................... 52
3.1.2.4 Display Elements ..........................................................................53
3.1.2.5 Configuration Interface.................................................................54
3.1.3 I/O Device Configuration ..................................................................55
3.1.3.1 GSD File .......................................................................................55
3.1.3.2 Configuration ................................................................................56
3.1.3.2.1 Configuring Digital I/O Modules.............................................56
3.1.3.2.2 Configuring Analog I/O Modules ............................................61
3.1.3.2.3 Configuring Specialty Modules ...............................................63
3.1.3.3 Parameter Setting.......................................................................... 65
3.1.3.3.1 Station Parameters.................................................................... 65
3.1.3.3.2 Standard Module Parameters ...................................................67
3.1.3.3.3 Fault Safe Module Parameters (F-Parameters) ........................68
3.1.3.3.4 Channel Parameters.................................................................. 69
3.1.3.4 Station Naming ............................................................................. 70
3.1.3.4.1 Device Name Assignment via Configuration Tool..................70
3.1.3.4.2 Device Name Assignment via DIP Switch Settings.................70
3.1.4 Initialization Phase of the Fieldbus Coupler......................................71
3.1.5 Process Image .................................................................................... 72
3.1.5.1 Local Process Image .....................................................................72
3.1.5.2 Allocation of the Input and Output Data....................................... 73
3.1.5.2.1 Digital Input Modules ..............................................................74
3.1.5.2.2 Digital Output Modules............................................................75
3.1.5.2.3 Analog Input Modules.............................................................. 78
3.1.5.2.4 Analog Output Modules...........................................................79
3.1.5.2.5 Specialty Modules....................................................................80
3.1.5.2.5.1 Meter and Position Transmitter Interfaces ..........................80
3.1.5.2.5.2 Pulse Width Output Module................................................82
3.1.5.2.5.3 Serial Interfaces and Gateways ...........................................83
3.1.5.2.5.4 PROFIsafe I/O Modules...................................................... 84
3.1.5.2.6 System Modules ....................................................................... 84
3.1.5.2.6.1 Potential Supply Modules....................................................84
3.1.5.3 Example ........................................................................................ 85
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3.1.5.4 Establishing the Connection .........................................................87
3.1.6 Configuration and Parameter Setting of I/O Modules.......................87
3.1.7 Diagnostics ........................................................................................ 88
3.1.7.1 Diagnostics Data Sets ................................................................... 88
3.1.7.2 Structure of the Standardized Diagnosis Data Sets ...................... 88
3.1.7.2.1 Channel Specific Diagnostics ..................................................89
3.1.7.2.1.1 Channel Diagnostics............................................................90
3.1.7.2.1.2 Fault Types of I/O Modules with Diagnostics Capability... 92
3.1.7.2.2 Fault Cases of I/O Modules with Diagnostics Capability........94
3.1.7.2.2.1 Extended Channel Diagnostics............................................97
3.1.7.2.3 Difference between Target and Actual Configuration........... 103
3.1.7.2.4 Data Set for Identification and Servicing Purposes (I&M 0). 105
3.1.8 Acyclic Communication using Record Data Sets............................106
3.1.8.1 Data Set Detail diagnostics for PROFIsafe I/O Modules ...........106
3.1.9 Information about the Web-Based Management System (WBM) .. 108
3.1.10 SNMP configuration........................................................................113
3.1.10.1 Settings via WBM....................................................................... 113
3.1.10.2 MIB II description ......................................................................115
3.1.10.2.1 Standard traps.........................................................................116
3.1.11 LED Indication ................................................................................ 117
3.1.11.1 Blink Code ..................................................................................117
3.1.11.2 Fieldbus Status............................................................................ 118
3.1.11.3 Node Status - 'I/O' LED Blinking Code......................................119
3.1.11.4 'I/O' LED Error Messages........................................................... 121
3.1.11.5 Status Supply voltage.................................................................. 126
3.1.12 Error Response ................................................................................127
3.1.12.1 Fieldbus Failure .......................................................................... 127
3.1.12.2 Internal Bus Failure ....................................................................127
3.1.13 Technical Data.................................................................................128
4 Fieldbus Communication .......................................................................129
4.1 ETHERNET ......................................................................................... 129
4.1.1 General............................................................................................. 129
4.1.2 Network Architecture – Principles and Regulations ....................... 131
4.1.2.1 Transmission Media....................................................................132
4.1.2.2 Network Topologies.................................................................... 134
4.1.2.3 Coupler Modules......................................................................... 137
4.1.2.4 Transmission Mode..................................................................... 138
4.1.2.4.1 Static Configuration of the Transmission Mode .................... 138
4.1.2.4.2 Dynamic Configuration of the Transmission Mode...............138
4.1.2.4.3 Errors Occurring when Configuring the Transmission Mode139
4.1.2.5 Important Terms..........................................................................139
4.1.3 Network Communication.................................................................142
4.1.3.1 Protocol layer model ...................................................................142
4.1.3.2 Communication Protocols........................................................... 144
4.1.3.2.1 ETHERNET ...........................................................................145
4.1.3.2.1.1 Channel access method......................................................146
4.1.3.2.2 IP-Protocol ............................................................................. 146
4.1.3.2.2.1 RAW IP ............................................................................. 150
4.1.3.2.2.2 IP Multicast ....................................................................... 151
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4.1.3.2.3 TCP Protocol.......................................................................... 151
4.1.3.2.4 UDP........................................................................................152
4.1.3.2.5 ARP ........................................................................................152
4.1.3.3 Administration and Diagnosis Protocols ....................................153
4.1.3.3.1 BootP (Bootstrap Protocol).................................................... 153
4.1.3.3.2 HTTP (Hyper Text Transfer Protocol)...................................155
4.1.3.3.3 DHCP (Dynamic Host Configuration Protocol) ....................155
4.1.3.3.4 DNS (Domain Name Systems)...............................................156
4.1.3.3.5 SNTP-Client (Simple Network Time Protocol).....................156
4.1.3.3.6 FTP-Server (File Transfer Protocol) ......................................157
4.1.3.3.7 SMTP (Simple Mail Transfer Protocol)................................. 158
4.1.3.4 Application Protocols..................................................................159
4.2 PROFINET........................................................................................... 160
4.2.1 Description....................................................................................... 160
4.2.2 Cabling............................................................................................. 161
5 I/O Modules .............................................................................................162
5.1 Overview ..............................................................................................162
5.1.1 Digital Input Modules...................................................................... 162
5.1.2 Digital Output Modules................................................................... 164
5.1.3 Analog Input Modules..................................................................... 165
5.1.4 Analog Output Modules ..................................................................167
5.1.5 Special Modules ..............................................................................168
5.1.6 System Modules...............................................................................170
5.2 Structure of the PROFINET IO Process Data......................................171
5.2.1 Digital Input Modules...................................................................... 171
5.2.1.1 2 DI Modules ..............................................................................171
5.2.1.2 2 DI Modules with Diagnostics ..................................................171
5.2.1.3 4 DI Modules ..............................................................................172
5.2.1.4 8 DI Modules ..............................................................................172
5.2.1.5 16 DI Modules ............................................................................172
5.2.2 Digital Output Modules................................................................... 173
5.2.2.1 2 DO Modules............................................................................. 173
5.2.2.2 2 DO Modules with Diagnostics.................................................173
5.2.2.3 4 DO Modules............................................................................. 174
5.2.2.4 4 DO Modules with Diagnostics.................................................174
5.2.2.5 8 DO Modules............................................................................. 174
5.2.2.6 8 DO Modules with Diagnostics.................................................174
5.2.2.7 16 DO Modules........................................................................... 175
5.2.3 Analog Input Modules..................................................................... 176
5.2.3.1 2 AI Modules ..............................................................................176
5.2.3.2 3 AI Modules ..............................................................................177
5.2.3.3 4 AI Modules ..............................................................................178
5.2.4 Analog Output Modules ..................................................................179
5.2.4.1 2 AO Modules............................................................................. 179
5.2.4.2 4 AO Modules............................................................................. 180
5.2.5 Specialty Modules ........................................................................... 181
5.2.5.1 Counter Modules......................................................................... 181
5.2.5.2 PWM Modules............................................................................ 182
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5.2.5.3 Stepper Motor Control ................................................................ 183
5.2.5.4 SSI Transmitter Interface............................................................ 184
5.2.5.5 Incremental Encoder Interface.................................................... 185
5.2.5.6 Digital Impulse Interface ............................................................185
5.2.5.7 Serial Interfaces ..........................................................................186
5.2.5.8 Data Exchange Module............................................................... 187
5.2.5.9 DALI/DSI Master ....................................................................... 188
5.2.5.10 ENOCEAN Receiver Module.....................................................188
5.2.6 Safety I/O Modules PROFIsafe....................................................... 189
5.2.7 System Modules ..............................................................................189
5.2.7.1 Supply Modules .......................................................................... 189
5.3 Configuration and Parameter Setting of the Modules..........................190
5.3.1 Digital I/O Modules.........................................................................190
5.3.1.1 2-Channel Digital Input Modules ...............................................190
5.3.1.2 2-Channel Digital Input Modules with 1 Bit Diagnostics Status per
Channel .......................................................................................191
5.3.1.3 4-Channel Digital Input Modules ...............................................193
5.3.1.4 8-Channel Digital Input Modules ...............................................194
5.3.1.5 16-Channel Digital Input Modules .............................................195
5.3.2 Digital Output Modules................................................................... 196
5.3.2.1 2-Channel Digital Output Modules.............................................196
5.3.2.2 2 (1)-Channel Digital Output Modules with 1 Bit Diagnostics
Status per Channel ......................................................................198
5.3.2.3 2 (1)-Channel Digital Output Modules with 2 Bit Diagnostics
Status per Channel ......................................................................201
5.3.2.4 4-Channel Digital Output Modules.............................................204
5.3.2.5 4-Channel Digital Output Modules with 1 Bit Diagnostics Status
per Channel .................................................................................206
5.3.2.6 8-Channel Digital Output Modules.............................................209
5.3.2.7 8-Channel Digital Output Modules with 1 Bit Diagnostics Status
per Channel .................................................................................211
5.3.2.8 16-Channel Digital Output Modules...........................................214
5.3.2.9 2-Channel Digital Input Modules with 1 Bit Diagnostics Status
and Confirmation per Channel....................................................216
5.3.3 Analog Input Modules..................................................................... 220
5.3.3.1 2-Channel Analog Input Modules...............................................220
5.3.3.2 4-Channel Analog Input Modules...............................................222
5.3.4 Analog Output Modules ..................................................................225
5.3.4.1 2-Channel Analog Output Modules ............................................225
5.3.4.2 4-Channel Analog Output Modules ............................................227
5.3.5 Specialty Modules ........................................................................... 230
5.3.5.1 Counter Modules......................................................................... 230
5.3.5.2 PWM Module.............................................................................. 232
5.3.5.3 SSI Transmitter Interface............................................................ 234
5.3.5.4 Incremental Encoder Interface.................................................... 236
5.3.5.5 Digital Impulse Interface ............................................................237
5.3.5.6 Serial Interfaces and Data Exchange Module............................. 238
5.3.5.7 Data Exchange Module............................................................... 239
5.3.5.8 ENOCEAN Receiver Module..................................................... 241
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5.3.5.9 DALI/DSI Master ....................................................................... 242
5.3.6 PROFIsafe Safety Modules .............................................................243
5.3.7 System Modules...............................................................................245
5.3.7.1 Supply Modules with 2 Bit Diagnostics Status .......................... 245
6 Use in Hazardous Environments ...........................................................247
6.1 Identification ........................................................................................247
6.1.1 For Europe according to CENELEC and IEC ................................. 247
6.1.2 For America according to NEC 500 ................................................ 248
6.2 Installation Regulations........................................................................249
6.2.1 ANSI/ISA 12.12.01 .........................................................................250
6.2.2 TÜV Nord Ex-i applications........................................................... 251
6.2.3 ATEX and IEC Ex........................................................................... 252
7 Appendix ..................................................................................................253
7.1 MIB-II Groups...................................................................................... 253
7.1.1 System Group .................................................................................. 253
7.1.2 Interface Group................................................................................253
7.1.3 IP Group...........................................................................................255
7.1.4 IpRoute table.................................................................................... 256
7.1.5 ICMP Group .................................................................................... 257
7.1.6 TCP Group.......................................................................................258
7.1.7 UDP Group ......................................................................................259
7.1.8 SNMP Group ...................................................................................259
8 List of Literature.....................................................................................261
9 Index......................................................................................................... 262
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Important Notes 9 Legal Bases

1 Important Notes
This section includes an overall summary of the most important safety requirements and notes that are mentioned in each individual section. To protect your health and prevent damage to devices as well, it is imperative to read and carefully follow the safety guidelines.
1.1 Legal Bases
1.1.1 Copyright
This Manual, including all figures and illustrations, is copyright-protected. Any further use of this Manual by third parties that violate pertinent copyright provisions is prohibited. Reproduction, translation, electronic and phototechnical filing/archiving (e.g., photocopying) as well as any amendments require the written consent of WAGO Kontakttechnik GmbH & Co. KG, Minden, Germany. Non-observance will involve the right to assert damage claims.
WAGO Kontakttechnik GmbH & Co. KG reserves the right to provide for any alterations or modifications that serve to increase the efficiency of technical progress. WAGO Kontakttechnik GmbH & Co. KG owns all rights arising from the granting of patents or from the legal protection of utility patents. Third-party products are always mentioned without any reference to patent rights. Thus, the existence of such rights cannot be excluded.
1.1.2 Personnel Qualifications
The use of the product described in this Manual requires special personnel qualifications, as shown in the following table:
Activity Electrical specialist
Assembly
Commissioning
Programming
Maintenance
Troubleshooting
X X
X X
X
X X
X
Instructed personnel*)
Specialists**) having qualifications in PLC programming
Disassembly
*) Instructed persons have been trained by qualified personnel or electrical specialists.
**) A specialist is a person, who – thanks to technical training – has the qualification, know­ ledge and expertise to meet the required specifications of this work and to identify any po­ tential hazardous situation in the above listed fields of activity.
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X X
Page 10
10 • Important Notes Legal Bases
All responsible persons have to familiarize themselves with the underlying legal standards to be applied. WAGO Kontakttechnik GmbH & Co. KG does not assume any liability whatsoever resulting from improper handling and damage incurred to both WAGO´s own and third-party products by disregarding detailed information in this Manual.
1.1.3 Use of the 750 Series in Compliance with Underlying Provisions
Couplers, controllers and I/O modules found in the modular WAGO-I/O­SYSTEM 750 receive digital and analog signals from sensors and transmit them to the actuators or higher-level control systems. Using programmable controllers, the signals can also be (pre-)processed.
The components have been developed for use in an environment that meets the IP20 protection class criteria. Protection against finger injury and solid impurities up to 12.5 mm diameter is assured; protection against water damage is not ensured. Unless otherwise specified, operation of the components in wet and dusty environments is prohibited.

1.1.4 Technical Condition of Specified Devices

The components to be supplied Ex Works, are equipped with hardware and software configurations, which meet the individual application requirements. Changes in hardware, software and firmware are permitted exclusively within the framework of the various alternatives that are documented in the specific manuals. WAGO Kontakttechnik GmbH & Co. KG will be exempted from any liability in case of changes in hardware or software as well as to non­compliant usage of components.
Please send your request for modified and new hardware or software configurations directly to WAGO Kontakttechnik GmbH & Co. KG.
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Important Notes 11 Standards and Guidelines for Operating the 750 Series

1.2 Standards and Guidelines for Operating the 750 Series
Please adhere to the standards and guidelines required for the use of your system:
The data and power lines shall be connected and installed in compliance with the standards required to avoid failures on your system and to substantially minimize any imminently hazardous situations resulting in personal injury.
For assembly, start-up, maintenance and troubleshooting, adhere to the specific accident prevention provisions which apply to your system (e.g. BGV A 3, "Electrical Installations and Equipment").
Emergency stop functions and equipment shall not be made ineffective. See relevant standards (e.g. DIN EN 418).
The equipment of your system shall be conform to EMC guidelines so that any electromagnetic interferences will be eliminated.
Operating 750 Series components in home applications without further measures is permitted only if they meet the emission limits (emissions of interference) in compliance with EN 61000-6-3. You will find the detailed information in section "WAGO-I/O-SYSTEM 750" ! "System Description" ! "Technical Data".
Please observe the safety precautions against electrostatic discharge in accordance with DIN EN 61340-5-1/-3. When handling the modules, please ensure that environmental factors (persons, working place and packaging) are well grounded.
The valid standards and guidelines applicable for the installation of switch cabinets shall be adhered to.
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12 • Important Notes Symbols

1.3 Symbols
Danger Always observe this information to protect persons from injury.
Warning Always observe this information to prevent damage to the device.
Attention
Marginal conditions that must always be observed to ensure smooth and efficient operation.
ESD (Electrostatic Discharge) Warning of damage to the components through electrostatic discharge. Observe the precautionary measure for handling components at risk of electrostatic discharge.
Note Make important notes that are to be complied with so that a trouble-free and efficient device operation can be guaranteed.
Additional Information
References to additional literature, manuals, data sheets and internet pages.
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Important Notes 13 Safety Information
1.4 Safety Information
When connecting the device to your installation and during operation, the following safety notes must be observed:
Danger The WAGO-I/O-SYSTEM 750 and its components are an open system. It must only be assembled in housings, cabinets or in electrical operation rooms. Access is only permitted via a key or tool to authorized qualified personnel.
Danger All power sources to the device must always be switched off before carrying out any installation, repair or maintenance work.
Warning
Replace defective or damaged device/module (e.g. in the event of deformed contacts), as the functionality of field bus station in question can no longer be ensured on a long-term basis.
Warning
The components are not resistant against materials having seeping and insulating properties. Belonging to this group of materials is: e.g. aerosols, silicones, triglycerides (found in some hand creams). If it cannot be ruled out that these materials appear in the component environment, then the components must be installed in an enclosure that is resistant against the above mentioned materials. Clean tools and materials are generally required to operate the device/module.
Warning Soiled contacts must be cleaned using oil-free compressed air or with ethyl alcohol and leather cloths.
Warning Do not use contact sprays, which could possibly impair the functioning of the contact area.
Warning
Avoid reverse polarity of data and power lines, as this may damage the devices.
ESD (Electrostatic Discharge)
The devices are equipped with electronic components that may be destroyed by electrostatic discharge when touched.
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14 • Important Notes Font Conventions
Warning
For components with ETHERNET/RJ-45 connectors: Only for use in LAN, not for connection to telecommunication circuits.
1.5 Font Conventions
italic
Names of paths and data files are marked in italic-type. e.g.: C:\Programs\WAGO-IO-CHECK
italic
Menu items are marked in italic-type, bold letters. e.g.: Save
\
A backslash between two names characterizes the selection of a menu point from a menu. e.g.: File \ New
END
Pushbuttons are marked as bold with small capitals e.g.: ENTER
< >
Keys are marked bold within angle brackets e.g.: <F5>
Courier
The print font for program codes is Courier. e.g.: END_VAR
1.6 Number Notation
Number code Example Note
Decimal 100 Normal notation
Hexadecimal 0x64 C notation
Binary '100'
'0110.0100'
In quotation marks, nibble separated with dots (.)
1.7 Scope
This manual describes the field bus independent WAGO-I/O-SYSTEM 750 with the fieldbus coupler for PROFINET IO.
Item-No. Description
750-370 Fieldbus Coupler PROFINET IO
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Important Notes 15 Abbreviation

1.8 Abbreviation
AI
AO
CPU
DI
DO
I/O ID HB LB PLC SW
Analog Input Analog Input Module
Analog Output Analog Input Module
In this case the Run Time System for the eradication of the user program in the PFC
Digital Input Digital Input Module
Digital Output Digital Output Module
Input/Output
Identifier
High Byte
Low Byte
Programmable Logic Controller
Software Version
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16 • The WAGO-I/O-SYSTEM 750 System Description
2 The WAGO-I/O-SYSTEM 750
2.1 System Description
The WAGO-I/O-SYSTEM 750 is a modular, field bus independent I/O system. It is comprised of a field bus coupler/controller (1) and connected field bus modules (2) for any type of signal. Together, these make up the field bus node. The end module (3) completes the node.
Fig. 2-1: Field bus node g0xxx00x
Couplers/controllers for field bus systems such as PROFIBUS, INTERBUS, ETHERNET TCP/IP, CAN (CANopen, DeviceNet, CAL), MODBUS, LON and others are available.
The coupler/controller contains the field bus interface, electronics and a power supply terminal. The field bus interface forms the physical interface to the relevant field bus. The electronics process the data of the bus modules and make it available for the field bus communication. The 24 V system supply and the 24 V field supply are fed in via the integrated power supply terminal. The field bus coupler communicates via the relevant field bus. The programmable field bus controller (PFC) enables the implementation of additional PLC functions. Programming is done with the WAGO I/O PRO CAA in accordance with IEC 61131-3.
Bus modules for diverse digital and analog I/O functions as well as special functions can be connected to the coupler/controller. The communication between the coupler/controller and the bus modules is carried out via an internal bus.
The WAGO-I/O-SYSTEM 750 has a clear port level with LEDs for status indication, insertable mini WSB markers and pullout group marker carriers. The 3-wire technology supplemented by a ground wire connection allows for direct sensor/actuator wiring.
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The WAGO-I/O-SYSTEM 750 17 Technical Data

2.2 Technical Data
Mechanic
Material Polycarbonate, Polyamide 6.6
Dimensions W x H* x L * from upper edge of DIN 35 rail
- Coupler/Controller (Standard)
- Coupler/Controller (ECO)
- Coupler/Controller (FireWire)
- I/O module, single
- I/O module, double
- I/O module, fourfold
- 51 mm x 65 mm x 100 mm
- 50 mm x 65 mm x 100 mm
- 62 mm x 65 mm x 100 mm
- 12 mm x 64 mm x 100 mm
- 24 mm x 64 mm x 100 mm
- 48 mm x 64 mm x 100 mm
Installation on DIN 35 with interlock
Modular by double feather key dovetail
Mounting position any position
Marking standard marking label type
group marking label 8 x 47 mm
Connection
Connection type CAGE CLAMP®
Wire range 0.08 mm² ... 2.5 mm², AWG 28-14
Stripped length 8 … 9 mm,
9 … 10 mm for components with pluggable wiring (753-xxx)
Contacts
Power jumpers contacts blade/spring contact
self-cleaning
Current via power contacts
Voltage drop at I
< 1 V/64 modules
max
10 A
max
Data contacts slide contact, hard gold plated
1.5 µm, self-cleaning
Climatic environmental conditions
Operating temperature 0 °C ... 55 °C,
-20 °C … +60 °C for components with extended temperature range (750-xxx/025-xxx)
Storage temperature -20 °C ... +85 °C
Relative humidity 5 % … 95 % without condensation
Resistance to harmful substances acc. to IEC 60068-2-42 and IEC 60068-2-43
Maximum pollutant concentration at relative humidity < 75%
25 ppm
SO
2
H
S 10 ppm
2
Special conditions Ensure that additional measures for components are
taken, which are used in an environment involving: – dust, caustic vapors or gases – ionization radiation
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Page 18
18 • The WAGO-I/O-SYSTEM 750 Technical Data
Safe electrical isolation
Air and creepage distance acc. to IEC 60664-1
Degree of pollution
2
acc. To IEC 61131-2
Degree of protection
Degree of protection IP 20
Electromagnetic compatibility
Immunity to interference for industrial areas acc. to EN 61000-6-2 (2001)
Test specification Test values Strength
class
Evaluation criteria
EN 61000-4-2 ESD 4 kV/8 kV (contact/air) 2/3 B
EN 61000-4-3
10 V/m 80 MHz ... 1 GHz 3 A
electromagnetic fields
EN 61000-4-4 burst 1 kV/2 kV (data/supply) 2/3 B
EN 61000-4-5 surge
-/- (line/line) Data:
B
1 kV (line/earth) 2
supply:
AC supply:
0.5 kV (line/line) 1 DC
0.5 kV (line/earth) 1
1 kV (line/line) 2
2 kV (line/earth) 3
B
B
EN 61000-4-6 RF disturbances
10 V/m 80 % AM (0.15 ... 80 MHz)
3 A
Emission of interference for industrial areas acc. to EN 61000-6-4 (2001)
Test specification Limit values/[QP]*) Frequency range Distance
79 dB (µV) 150 kHz ... 500 kHz EN 55011 (AC supply,
conducted)
73 dB (µV) 500 kHz ... 30 MHz
40 dB (µV/m) 30 MHz ... 230 MHz 10 m EN 55011 (radiated)
47 dB (µV/m) 230 MHz ... 1 GHz 10 m
Emission of interference for residential areas acc. to EN 61000-6-3 (2001)
Test specification Limit values/[QP]*) Frequency range Distance
EN 55022 (AC supply, conducted)
66 ... 56 dB (µV) 150 kHz ... 500 kHz
56 dB (µV) 500 kHz ... 5 MHz
60 dB (µV) 5 MHz ... 30 MHz
40 ... 30 dB (µA) 150 kHz ... 500 kHz EN 55022 (DC supply/data,
conducted)
30 dB (µA) 500 kHz ... 30 MHz
30 dB (µV/m) 30 MHz ... 230 MHz 10 m EN 55022 (radiated)
37 dB (µV/m) 230 MHz ... 1 GHz 10 m
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The WAGO-I/O-SYSTEM 750 19 Technical Data
Mechanical strength acc. to IEC 61131-2
Test specification Frequency range Limit value
IEC 60068-2-6 vibration
IEC 60068-2-32 free fall 1 m
*) QP: Quasi Peak
5 Hz f < 9 Hz
9 Hz f < 150 Hz
Note on vibration test: a) Frequency change: max. 1 octave/minute b) Vibration direction: 3 axes
15 g IEC 60068-2-27 shock
Note on shock test: a) Type of shock: half sine b) Shock duration: 11 ms c) Shock direction: 3x in positive and 3x in negative direction for each of the three mutually perpendicular axes of the test specimen
1.75 mm amplitude (permanent)
3.5 mm amplitude (short term)
0.5 g (permanent) 1 g (short term)
(module in original packing)
Note If the technical data of components differ from the values described here, the technical data shown in the manuals of the respective components shall be valid.
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20 • The WAGO-I/O-SYSTEM 750 Technical Data
For Products of the WAGO-I/O-SYSTEM 750 with ship specific approvals supplementary guidelines are valid:
Electromagnetic compatibility
Immunity to interference acc. to Germanischer Lloyd (2003)
Test specification Test values Strength
class
IEC 61000-4-2 ESD 6 kV/8 kV (contact/air) 3/3 B
IEC 61000-4-3 electromagnetic fields
IEC 61000-4-4 burst 1 kV/2 kV (data/supply) 2/3 A
IEC 61000-4-6 RF disturbances
Type test AF disturbances (harmonic waves)
Type test high voltage 755 V DC
Emission of interference acc. to Germanischer Lloyd (2003)
Test specification Limit values Frequency range Distance
Type test (EMC1, conducted) allows for ship bridge control applications
10 V/m 80 MHz ... 2 GHz 3 A
0.5 kV (line/line) 1 IEC 61000-4-5 surge AC/DC
Supply:
10 V/m 80 % AM (0.15 ... 80 MHz)
3 V, 2 W - A
1500 V AC
96 ... 50 dB (µV) 10 kHz ... 150 kHz
60 ... 50 dB (µV) 150 kHz ... 350 kHz
50 dB (µV) 350 kHz ... 30 MHz
1 kV (line/earth) 2
3 A
- -
Evaluation criteria
A
Type test (EMC1, radiated) allows for ship bridge control applications
except: 24 dB (µV/m) 156 MHz ... 165 MHz 3 m
Mechanical strength acc. to Germanischer Lloyd (2003)
Test specification Frequency range Limit value
IEC 60068-2-6 vibration (category A – D)
80 ... 52 dB (µV/m) 150 kHz ... 300 kHz 3 m
52 ... 34 dB (µV/m) 300 kHz ... 30 MHz 3 m
54 dB (µV/m) 30 MHz ... 2 GHz 3 m
2 Hz ≤ f < 25 Hz
25 Hz f < 100 Hz
Note on vibration test: a) Frequency change: max. 1 octave/minute b) Vibration direction: 3 axes
± 1.6 mm amplitude (permanent)
4 g (permanent)
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Page 21
The WAGO-I/O-SYSTEM 750 21 Technical Data
Range of application
Industrial areas EN 61000-6-4 (2001) EN 61000-6-2 (2001)
Residential areas EN 61000-6-3 (2001)*) EN 61000-6-1 (2001)
*)
The system meets the requirements on emission of interference in residential areas with the field bus coupler/controller for:
ETHERNET
LonWorks
CANopen
DeviceNet
MODBUS
KNX
BACnet
With a special permit, the system can also be implemented with other field bus couplers/controllers in residential areas (housing, commercial and business areas, small­scale enterprises). The special permit can be obtained from an authority or inspection office. In Germany, the Federal Office for Post and Telecommunications and its branch offices issues the permit.
It is possible to use other field bus couplers/controllers under certain boundary conditions. Please contact WAGO Kontakttechnik GmbH & Co. KG.
Required specification emission of interference
750-342/-841/-842/-860
750-319/-819
750-337/-837
750-306/-806
750-312/-314/ -315/ -316 750-812/-814/ -815/ -816
750-849
750-830
Required specification immunity to interference
Maximum power dissipation of the components
Bus modules 0.8 W / bus terminal (total power dissipation,
system/field)
Field bus coupler/controller 2.0 W / coupler/controller
Warning
The power dissipation of all installed components must not exceed the maximum conductible power of the housing (cabinet).
When dimensioning the housing, care is to be taken that even under high external temperatures, the temperature inside the housing does not exceed the permissible ambient temperature of 55 °C.
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22 • The WAGO-I/O-SYSTEM 750 Technical Data
Dimensions
02
01
35
A
B
24V 0V
+
-
A
C
B
D
+
A
C
D
A
C
B
B
D
A
C
D
C
B
D
100
-
51
65
Side view
12
24
Dimensions in mm
64
Fig. 2-2: Dimensions g01xx05e
Note The illustration shows a standard coupler. For detailed dimensions, please refer to the technical data of the respective coupler/controller.
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The WAGO-I/O-SYSTEM 750 23 Manufacturing Number
2.3 Manufacturing Number
The manufacturing number indicates the delivery status directly after production. This number is part of the lateral marking on the component. In addition, starting from calendar week 43/2000 the manufacturing number is also printed on the cover of the configuration and programming interface of the field bus coupler or controller.
PROFIBUS
ITEM-NO.:750-333
ITEM-NO.:750-333
PROFIBUS DP 12 MBd /DPV1
PROFIBUS DP 12 MBd /DPV1
-
Power Supply Field
24 V
+
0V
0V
Power Supply
Power Supply Electronic
Electronic
PATENTS PENDING
PATENTS PENDING
750-333
Hansastr. 27
Hansastr. 27
GL
D-32423 Minden
D-32423 Minden
24V DC
24V DC
AWG 28-14
AWG 28-14
55°C max ambient
55°C max ambient
72072
72072
DS
NO
SW
HW
FWL
II3GD
LISTED 22ZA AND 22XM
LISTED 22ZA AND 22XM
0103000203-B000000
0103000203-B060606
II3GD DEMKO 02 ATEX132273 X
DEMKO 02 ATEX132273 X EEx nA II T4
EEx nA II T4
WAGO - I/O - SYSTEM

Manufacturing Number

0
1
3
01030002 03-B 060606 72072
Calendar
week
Fig. 2-3: Example: Manufacturing Number of a PROFIBUS field bus coupler 750-333
0
Year Software
version
2
0
0
0
0
3
-B060606
Hardware
Firmware Loader
version
version
Internal
Number
g01xx15e
The manufacturing number consists of the production week and year, the software version (if available), the hardware version of the component, the firmware loader (if available) and further internal information for WAGO Kontakttechnik GmbH & Co. KG.
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24 • The WAGO-I/O-SYSTEM 750 Component Update
2.4 Component Update
For the case of an Update of one component, the lateral marking on each component contains a prepared matrix.
This matrix makes columns available for altogether three updates to the entry of the current update data, like production order number (NO; starting from calendar week 13/2004), update date (DS), software version (SW), hardware version (HW) and the firmware loader version (FWL, if available).
Update Matrix
Current Version data for: 1. Update 2. Update 3. Update
Production Order Number
Datestamp Software index Hardware index Firmware loader
index
NO
DS SW HW FWL
" only starting from calendar
" only for coupler/controller
If the update of a component took place, the current version data are registered into the columns of the matrix.
Additionally with the update of a field bus coupler or controller also the cover of the configuration and programming interface of the coupler or controller is printed on with the current manufacturing and production order number.
The original manufacturing data on the housing of the component remain thereby.
2.5 Storage, Assembly and Transport
Wherever possible, the components are to be stored in their original packaging. Likewise, the original packaging provides optimal protection during transport.
week 13/2004
When assembling or repacking the components, the contacts must not be soiled or damaged. The components must be stored and transported in appropriate containers/packaging. Thereby, the ESD information is to be regarded.
Statically shielded transport bags with metal coatings are to be used for the transport of open components for which soiling with amine, amide and silicone has been ruled out, e.g. 3M 1900E.
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The WAGO-I/O-SYSTEM 750 25 Mechanical Setup
2.6 Mechanical Setup
2.6.1 Installation Position
Along with horizontal and vertical installation, all other installation positions are allowed.
Attention
2.6.2 Total Expansion
In the case of vertical assembly, an end stop has to be mounted as an additional safeguard against slipping. WAGO item 249-116 End stop for DIN 35 rail, 6 mm wide WAGO item 249-117 End stop for DIN 35 rail, 10 mm wide
The length of the module assembly (including one end module of 12mm width) that can be connected to the coupler/controller is 780 mm. When assembled, the I/O modules have a maximum length of 768 mm.
Examples:
64 I/O modules of 12 mm width can be connected to one coupler/controller.
32 I/O modules of 24 mm width can be connected to one coupler/controller.
Exception:
The number of connected I/O modules also depends on which type of coupler/controller is used. For example, the maximum number of I/O modules that can be connected to a PROFIBUS coupler/controller is 63 without end module. The maximum total expansion of a node is calculated as follows:
Warning The maximum total length of a node without coupler/controller must not exceed 780 mm. Furthermore, restrictions made on certain types of couplers/controllers must be observed (e.g. for PROFIBUS).
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26 • The WAGO-I/O-SYSTEM 750 Mechanical Setup

2.6.3 Assembly onto Carrier Rail

2.6.3.1 Carrier Rail Properties
All system components can be snapped directly onto a carrier rail in accordance with the European standard EN 50022 (DIN 35).
Warning WAGO Kontakttechnik GmbH & Co. KG supplies standardized carrier rails that are optimal for use with the I/O system. If other carrier rails are used, then a technical inspection and approval of the rail by WAGO Kontakttechnik GmbH & Co. KG should take place.
Carrier rails have different mechanical and electrical properties. For the optimal system setup on a carrier rail, certain guidelines must be observed:
The material must be non-corrosive.
Most components have a contact to the carrier rail to ground electro-
magnetic disturbances. In order to avoid corrosion, this tin-plated carrier rail contact must not form a galvanic cell with the material of the carrier rail which generates a differential voltage above 0.5 V (saline solution of
0.3% at 20°C) .
The carrier rail must optimally support the EMC measures integrated into the system and the shielding of the bus module connections.
A sufficiently stable carrier rail should be selected and, if necessary, several mounting points (every 20 cm) should be used in order to prevent bending and twisting (torsion).
The geometry of the carrier rail must not be altered in order to secure the safe hold of the components. In particular, when shortening or mounting the carrier rail, it must not be crushed or bent.
The base of the I/O components extends into the profile of the carrier rail. For carrier rails with a height of 7.5 mm, mounting points are to be riveted under the node in the carrier rail (slotted head captive screws or blind rivets).
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The WAGO-I/O-SYSTEM 750 27 Mechanical Setup
2.6.3.2 WAGO DIN Rail
WAGO carrier rails meet the electrical and mechanical requirements.
Item Number Description
210-113 /-112 35 x 7.5; 1 mm; steel yellow chromated; slotted/unslotted
210-114 /-197 35 x 15; 1.5 mm; steel yellow chromated; slotted/unslotted
210-118 35 x 15; 2.3 mm; steel yellow chromated; unslotted
210-198 35 x 15; 2.3 mm; copper; unslotted
210-196 35 x 7.5; 1 mm; aluminum; unslotted
2.6.4 Spacing
The spacing between adjacent components, cable conduits, casing and frame sides must be maintained for the complete field bus node.
Fig. 2-4: Spacing g01xx13x
The spacing creates room for heat transfer, installation or wiring. The spacing to cable conduits also prevents conducted electromagnetic interferences from influencing the operation.
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28 • The WAGO-I/O-SYSTEM 750 Mechanical Setup

2.6.5 Plugging and Removal of the Components

Warning Before work is done on the components, the voltage supply must be turned off.
In order to safeguard the coupler/controller from jamming, it should be fixed onto the carrier rail with the locking disc To do so, push on the upper groove of the locking disc using a screwdriver.
To pull out the field bus coupler/controller, release the locking disc by pressing on the bottom groove with a screwdriver and then pulling the orange colored unlocking lug .
Fig. 2-5: Coupler/Controller and unlocking lug g01xx12e
It is also possible to release an individual I/O module from the unit by pulling an unlocking lug.
Fig. 2-6: removing bus terminal p0xxx01x
Danger Ensure that an interruption of the PE will not result in a condition which could endanger a person or equipment! For planning the ring feeding of the ground wire, please see chapter 2.6.3.
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The WAGO-I/O-SYSTEM 750 29 Mechanical Setup
2.6.6 Assembly Sequence
All system components can be snapped directly on a carrier rail in accordance with the European standard EN 50022 (DIN 35).
The reliable positioning and connection is made using a tongue and groove system. Due to the automatic locking, the individual components are securely seated on the rail after installing.
Starting with the coupler/controller, the bus modules are assembled adjacent to each other according to the project planning. Errors in the planning of the node in terms of the potential groups (connection via the power contacts) are recognized, as the bus modules with power contacts (male contacts) cannot be linked to bus modules with fewer power contacts.
Attention Always link the bus modules with the coupler/controller, and always plug from above.
Warning Never plug bus modules from the direction of the end terminal. A ground wire power contact, which is inserted into a terminal without contacts, e.g. a 4-channel digital input module, has a decreased air and creepage distance to the neighboring contact in the example DI4.
Always terminate the field bus node with an end module (750-600).
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30 • The WAGO-I/O-SYSTEM 750 Mechanical Setup

2.6.7 Internal Bus/Data Contacts

Communication between the coupler/controller and the bus modules as well as the system supply of the bus modules is carried out via the internal bus. It is comprised of 6 data contacts, which are available as self-cleaning gold spring contacts.
Fig. 2-7: Data contacts p0xxx07x
Warning Do not touch the gold spring contacts on the I/O modules in order to avoid soiling or scratching!
ESD (Electrostatic Discharge) The modules are equipped with electronic components that may be destroyed by electrostatic discharge. When handling the modules, ensure that the environment (persons, workplace and packing) is well grounded. Avoid touching conductive components, e.g. data contacts.
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The WAGO-I/O-SYSTEM 750 31 Mechanical Setup
2.6.8 Power Contacts
Self-cleaning power contacts , are situated on the side of the components which further conduct the supply voltage for the field side. These contacts come as touchproof spring contacts on the right side of the coupler/controller and the bus module. As fitting counterparts the module has male contacts on the left side.
Danger The male contacts are sharp-edged. Handle the module carefully to prevent injury.
Attention Please take into consideration that some bus modules have no or only a few power jumper contacts. The design of some modules does not allow them to be physically assembled in rows, as the grooves for the male contacts are closed at the top.
Fig. 2-8: Example for the arrangement of power contacts g0xxx05e
Recommendation With the WAGO ProServe® Software smartDESIGNER, the structure of a field bus node can be configured. The configuration can be tested via the integrated accuracy check.
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32 • The WAGO-I/O-SYSTEM 750 Mechanical Setup
2.6.9 Wire Connection
All components have CAGE CLAMP® connections.
The WAGO CAGE CLAMP® connection is appropriate for solid, stranded and finely stranded conductors. Each clamping unit accommodates one conductor.
Fig. 2-9: CAGE CLAMP® Connection g0xxx08x
The operating tool is inserted into the opening above the connection. This opens the CAGE CLAMP®. Subsequently the conductor can be inserted into the opening. After removing the operating tool, the conductor is safely clamped.
More than one conductor per connection is not permissible. If several conductors have to be made at one connection point, then they should be made away from the connection point using WAGO Terminal Blocks. The terminal blocks may be jumpered together and a single wire brought back to the I/O module connection point.
Attention If it is unavoidable to jointly connect 2 conductors, then a ferrule must be used to join the wires together. Ferrule: Length 8 mm Nominal cross section
1 mm2 for 2 conductors with 0.5 mm2 each
max.
WAGO Product 216-103 or products with comparable properties
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The WAGO-I/O-SYSTEM 750 33 Power Supply

2.7 Power Supply
2.7.1 Isolation
Within the field bus node, there are three electrically isolated potentials.
Operational voltage for the field bus interface.
Electronics of the couplers/controllers and the bus modules (internal bus).
All bus modules have an electrical isolation between the electronics
(internal bus, logic) and the field electronics. Some digital and analog input modules have each channel electrically isolated, please see catalog.
Fig. 2-10: Isolation g0xxx01e
Attention The ground wire connection must be present in each group. In order that all protective conductor functions are maintained under all circumstances, it is recommended that a ground wire be connected at the beginning and end of a potential group. (ring format, please see chapter 2.8.3). Thus, if a bus module comes loose from a composite during servicing, then the protective conductor connection is still guaranteed for all connected field devices.
When using a joint power supply unit for the 24 V system supply and the 24 V field supply, the electrical isolation between the internal bus and the field level is eliminated for the potential group.
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34 • The WAGO-I/O-SYSTEM 750 Power Supply
2.7.2 System Supply
2.7.2.1 Connection
The WAGO-I/O-SYSTEM 750 requires a 24 V direct current system supply (-15 % or +20 %). The power supply is provided via the coupler/controller and, if necessary, in addition via the internal system supply modules (750-613). The voltage supply is reverse voltage protected.
Attention
The use of an incorrect supply voltage or frequency can cause severe damage to the component.
Fig. 2-11: System Supply g0xxx02e
The direct current supplies all internal system components, e.g. coupler/controller electronics, field bus interface and bus modules via the
internal bus (5 V system voltage). The 5 V system voltage is electrically connected to the 24 V system supply.
Fig. 2-12: System Voltage g0xxx06e
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The WAGO-I/O-SYSTEM 750 35
f
Power Supply
Attention Resetting the system by switching on and off the system supply, must take place simultaneously for all supply modules (coupler/controller and 750-613).
2.7.2.2 Alignment
Recommendation A stable network supply cannot be taken for granted always and everywhere. Therefore, regulated power supply units should be used in order to guarantee the quality of the supply voltage.
The supply capacity of the coupler/controller or the internal system supply module (750-613) can be taken from the technical data of the components.
Internal current consumption*)
Residual current for bus terminals*)
*)
cf. catalogue W4 Volume 3, manuals or internet
Example Coupler 750-301:
Current consumption via system voltage: 5 V for electronics of the bus modules and coupler/controller
Available current for the bus modules. Provided by the bus power supply unit. See coupler/controller and internal system supply module (750-613)
internal current consumption:350 mA at 5 V residual current for bus modules : 1650 mA at 5 V sum I
: 2000 mA at 5 V
(5V) total
The internal current consumption is indicated in the technical data for each bus terminal. In order to determine the overall requirement, add together the values of all bus modules in the node.
Attention If the sum of the internal current consumption exceeds the residual current
or bus modules, then an internal system supply module (750-613) must be placed before the module where the permissible residual current was exceeded.
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36 • The WAGO-I/O-SYSTEM 750 Power Supply
Example:
A node with a PROFIBUS Coupler 750-333 consists of 20 relay modules (750-517) and 10 digital input modules (750-405).
Current consumption: 20* 90 mA = 1800 mA 10* 2 mA = 20 mA Sum 1820 mA
The coupler can provide 1650 mA for the bus modules. Consequently, an internal system supply module (750-613), e.g. in the middle of the node, should be added.
Recommendation With the WAGO ProServe® Software smartDESIGNER, the assembly of a field bus node can be configured. The configuration can be tested via the integrated accuracy check.
The maximum input current of the 24 V system supply is 500 mA. The exact electrical consumption (I
Coupler/Controller
I
= Sum of all the internal current consumption of the connected
(5 V) total
) can be determined with the following formulas:
(24 V)
bus modules + internal current consumption coupler/controller
750-613
I
= Sum of all the internal current consumption of the connected
(5 V) total
bus modules
Input current I
(24 V)
=
5 V / 24 V * I
η
= 0.87 (at nominal load)
(5 V) total
/ η
Attention If the electrical consumption of the power supply point for the 24 V-system supply exceeds 500 mA, then the cause may be an improperly aligned node or a defect.
During the test, all outputs, in particular those of the relay modules, must be active.
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The WAGO-I/O-SYSTEM 750 37 Power Supply
2.7.3 Field Supply
2.7.3.1 Connection
Sensors and actuators can be directly connected to the relevant channel of the bus module in 1/4 conductor connection technology. The bus module supplies power to the sensors and actuators. The input and output drivers of some bus modules require the field side supply voltage.
The coupler/controller provides field side power (DC 24V). In this case it is a passive power supply without protection equipment. Power supply modules are available for other potentials, e. g. AC 230 V. Likewise, with the aid of the power supply modules, various potentials can be set up. The connections are linked in pairs with a power contact.
Fig. 2-13: Field Supply (Sensor/Actuator) g0xxx03e
The supply voltage for the field side is automatically passed to the next module via the power jumper contacts when assembling the bus modules .
The current load of the power contacts must not exceed 10 A on a continual basis. The current load capacity between two connection terminals is identical to the load capacity of the connection wires.
By inserting an additional power supply module, the field supply via the power contacts is disrupted. From there a new power supply occurs which may also contain a new voltage potential.
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38 • The WAGO-I/O-SYSTEM 750 Power Supply
Attention Some bus modules have no or very few power contacts (depending on the I/O function). Due to this, the passing through of the relevant potential is disrupted. If a field supply is required for subsequent bus modules, then a power supply module must be used. Note the data sheets of the bus modules.
In the case of a node setup with different potentials, e.g. the alteration from DC 24 V to AC 230V, a spacer module should be used. The optical separation of the potentials acts as a warning to heed caution in the case of wiring and maintenance works. Thus, the results of wiring errors can be prevented.
2.7.3.2 Fusing
Internal fusing of the field supply is possible for various field voltages via an appropriate power supply module.
750-601 24 V DC, Supply/Fuse
750-609 230 V AC, Supply/Fuse
750-615 120 V AC, Supply/Fuse
750-610 24 V DC, Supply/Fuse/Diagnosis
750-611 230 V AC, Supply/Fuse/Diagnosis
Fig. 2-14: Supply module with fuse carrier (Example 750-610) g0xxx09x
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The WAGO-I/O-SYSTEM 750 39 Power Supply
Warning In the case of power supply modules with fuse holders, only fuses with a maximum dissipation of 1.6 W (IEC 127) must be used. For UL approved systems only use UL approved fuses.
In order to insert or change a fuse, or to switch off the voltage in succeeding bus modules, the fuse holder may be pulled out. In order to do this, use a screwdriver for example, to reach into one of the slits (one on both sides) and pull out the holder.
Fig. 2-15: Removing the fuse carrier p0xxx05x
Lifting the cover to the side opens the fuse carrier.
Fig. 2-16: Opening the fuse carrier p0xxx03x
Fig. 2-17: Change fuse p0xxx04x
After changing the fuse, the fuse carrier is pushed back into its original position.
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40 • The WAGO-I/O-SYSTEM 750 Power Supply
Alternatively, fusing can be done externally. The fuse modules of the WAGO series 281 and 282 are suitable for this purpose.
Fig. 2-18: Fuse modules for automotive fuses, series 282 pf66800x
Abb. 2-19: Fuse modules for automotive fuses, series 2006 p0xxx13x
Fig. 2-20: Fuse modules with pivotable fuse carrier, series 281 pe61100x
Abb. 2-21: Fuse modules with pivotable fuse carrier, series 2002 p0xxx12x
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The WAGO-I/O-SYSTEM 750 41 Power Supply

2.7.4 Supplementary Power Supply Regulations

The WAGO-I/O-SYSTEM 750 can also be used in shipbuilding or offshore and onshore areas of work (e. g. working platforms, loading plants). This is demonstrated by complying with the standards of influential classification companies such as Germanischer Lloyd and Lloyds Register.
Filter modules for 24-volt supply are required for the certified operation of the system.
Item No. Name Description
750-626 Supply filter Filter module for system supply and field supply (24 V, 0 V), i.e.
for field bus coupler/controller and bus power supply (750-613)
750-624 Supply filter Filter module for the 24 V- field supply
(750-602, 750-601, 750-610)
Therefore, the following power supply concept must be absolutely complied with.
Fig. 2-22: Power supply concept g01xx11e
Note Another potential power terminal 750-601/602/610 must only be used behind the filter terminal 750-626 if the protective earth conductor is needed on the lower power contact or if a fuse protection is required.
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42 • The WAGO-I/O-SYSTEM 750 Power Supply
2.7.5 Supply Example
Attention The system supply and the field supply should be separated in order to ensure bus operation in the event of a short-circuit on the actuator side.
L1 L2 L3 N PE
a)
1)
b)
c)
1) d)
System Supply
Field Supply
Field Supply
230V
230V
24V
24V
10 A
750-613
2) 2)
10 A
750-512 750-512750-616 750-513 750-610 750-552 750-600750-612 750-616
750-630750-400 750-410 750-401
Shield (screen) bus
Main ground bus
1) Separation module recommended
2) Ring-feeding recommended
a) Power Supply
on coupler / controller via external Supply Module
b) Internal System
Supply Module
c) Supply Module
passive
d)
Supply Module
with fuse carrier/
iagnostics
d
Fig. 2-23: Supply example g0xxx04e
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Page 43
The WAGO-I/O-SYSTEM 750 43 Power Supply
2.7.6 Power Supply Unit
The WAGO-I/O-SYSTEM 750 requires a 24 V direct current system supply with a maximum deviation of -15 % or +20 %.
Recommendation A stable network supply cannot be taken for granted always and everywhere. Therefore, regulated power supply units should be used in order to guarantee the quality of the supply voltage.
A buffer (200 µF per 1 A current load) should be provided for brief voltage dips. The I/O system buffers for approx 1 ms.
The electrical requirement for the field supply is to be determined individually for each power supply point. Thereby all loads through the field devices and bus modules should be considered. The field supply as well influences the bus modules, as the inputs and outputs of some bus modules require the voltage of the field supply.
Attention The system supply and the field supply should be isolated from the power supplies in order to ensure bus operation in the event of short circuits on the actuator side.
WAGO products Item No.
Description
787-612 Primary switched mode; DC 24 V; 2,5 A
Input nominal voltage AC 230 V
787-622 Primary switched mode; DC 24 V; 5 A
Input nominal voltage AC 230 V
787-632 Primary switched mode; DC 24 V; 10 A
Input nominal voltage AC 230/115 V
288-809 288-810 288-812 288-813
Rail-mounted modules with universal mounting carrier
AC 115 V / DC 24 V; 0,5 A AC 230 V / DC 24 V; 0,5 A AC 230 V / DC 24 V; 2 A AC 115 V / DC 24 V; 2 A
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44 • The WAGO-I/O-SYSTEM 750 Grounding

2.8 Grounding
2.8.1 Grounding the DIN Rail
2.8.1.1 Framework Assembly
When setting up the framework, the carrier rail must be screwed together with the electrically conducting cabinet or housing frame. The framework or the housing must be grounded. The electronic connection is established via the screw. Thus, the carrier rail is grounded.
Attention Care must be taken to ensure the flawless electrical connection between the
2.8.1.2 Insulated Assembly
carrier rail and the frame or housing in order to guarantee sufficient grounding.
Insulated assembly has been achieved when there is constructively no direct conduction connection between the cabinet frame or machine parts and the carrier rail. Here the earth must be set up via an electrical conductor.
The connected grounding conductor should have a cross section of at least 4 mm2.
Recommendation The optimal insulated setup is a metallic assembly plate with grounding connection with an electrical conductive link with the carrier rail.
The separate grounding of the carrier rail can be easily set up with the aid of the WAGO ground wire terminals.
Item No. Description
283-609 1-conductor ground (earth) terminal block make an automatic contact to
the carrier rail; conductor cross section: 0.2 -16 mm Note: Also order the end and intermediate plate (283-320).
2
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Page 45
The WAGO-I/O-SYSTEM 750 45 Grounding
2.8.2 Grounding Function
The grounding function increases the resistance against disturbances from electro-magnetic interferences. Some components in the I/O system have a carrier rail contact that dissipates electro-magnetic disturbances to the carrier rail.
Fig. 2-24: Carrier rail contact g0xxx10e
Attention Care must be taken to ensure the direct electrical connection between the carrier rail contact and the carrier rail.
The carrier rail must be grounded.
For information on carrier rail properties, please see chapter 2.6.3.1.
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46 • The WAGO-I/O-SYSTEM 750 Grounding
2.8.3 Grounding Protection
For the field side, the ground wire is connected to the lowest connection terminals of the power supply module. The ground connection is then connected to the next module via the Power Jumper Contact (PJC). If the bus module has the lower power jumper contact, then the ground wire connection of the field devices can be directly connected to the lower connection terminals of the bus module.
Attention Should the ground conductor connection of the power jumper contacts within the node become disrupted, e. g. due to a 4-channel bus terminal, the ground connection will need to be re-established.
The ring feeding of the grounding potential will increase the system safety. When one bus module is removed from the group, the grounding connection will remain intact.
The ring feeding method has the grounding conductor connected to the beginning and end of each potential group.
Fig. 2-25: Ring-feeding g0 xxx07e
Attention The regulations relating to the place of assembly as well as the national regulations for maintenance and inspection of the grounding protection must be observed.
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The WAGO-I/O-SYSTEM 750 47 Shielding (Screening)
2.9 Shielding (Screening)
2.9.1 General
The shielding of the data and signal conductors reduces electromagnetic interferences thereby increasing the signal quality. Measurement errors, data transmission errors and even disturbances caused by overvoltage can be avoided.
Attention Constant shielding is absolutely required in order to ensure the technical specifications in terms of the measurement accuracy.
The data and signal conductors should be separated from all high-voltage cables.
The cable shield should be potential. With this, incoming disturbances can be easily diverted.
The shielding should be placed over the entrance of the cabinet or housing in order to already repel disturbances at the entrance.
2.9.2 Bus Conductors
The shielding of the bus conductor is described in the relevant assembly guidelines and standards of the bus system.
2.9.3 Signal Conductors
Bus modules for most analog signals along with many of the interface bus modules include a connection for the shield.
Note For a better shield performance, the shield should have previously been placed over a large area. The WAGO shield connection system is suggested for such an application. This suggestion is especially applicable if the equipment can have even current or high impulse formed currents running through (for example initiated by atmospheric discharge).
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48 • The WAGO-I/O-SYSTEM 750 Assembly Guidelines/Standards
2.9.4 WAGO Shield (Screen) Connecting System
The WAGO Shield Connecting system includes a shield clamping saddle, a collection of rails and a variety of mounting feet. Together these allow many different possibilities. See catalog W4 volume 3 chapter 10.
Fig. 2-26: WAGO Shield (Screen) Connecting System p0xxx08 x, p0xxx09x, and p0xxx10x
Fig. 2-27: Application of the WAGO Shield (Screen) Connecting System p0xxx11x
2.10 Assembly Guidelines/Standards
DIN 60204, Electrical equipping of machines
DIN EN 50178 Equipping of high-voltage systems with electronic
components (replacement for VDE 0160)
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PROFINET IO 750-370 49 Description

3 Fieldbus Coupler
3.1 PROFINET IO 750-370
3.1.1 Description
The fieldbus coupler 750-370 maps the peripheral data of almost all I/O modules in the WAGO-I/O-SYSTEM 750/753 on PROFINET IO.
In the initialization phase, the fieldbus coupler determines the physical structure of the node and creates a local process image with all inputs and outputs. I/O modules with a bit width smaller than 8 can be combined to form one byte in order to optimize the address space.
The diagnostics concept is based on channel specific diagnostic messages that are mapped to the respective alarms. Coding is done according to IEC 61158 (PROFINET IO).
The bus coupler has the following features:
Process data length max. 320 byte input data including all user data qualifiers (max. 2 byte process data qualifiers (IOXS) for each input module) max. 320 byte output data including all user data qualifiers (max. 2 byte process data qualifiers (IOXS) for each output module)
Transfer speed of up to 100 Mbit/s full-duplex, also with autonegotiation (factory settings)
Support of all WAGO-I/O-SYSTEM 750/753 I/O modules excepting RTC module 75x-640, MP-Bus (Multi Point Bus) master module 75x-643, 2-channel vibration velocity/bearing condition monitoring VIB I/O 75x-645, AS-Interface Master module 75x-655, Stepper controllers 75x-670 and 75x-671 as well as PROFIsafe modules 75x-660, 75x-665 and 75x-666.
Configurable data format for each signal channel of complex I/O modules.
Configurable substitute value behavior for each output module in the event
of failure.
Configurable substitute values for each output channel in the event of
1 x RJ-45 bus connection
WAGO-I/O-SYSTEM 750 PROFINET IO
failure
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50 • PROFINET IO 750-370 Hardware

3.1.2 Hardware
3.1.2.1 View
status voltage supply
-power jumper contacts
-system data contacts supply
24V 0V
supply via power jumper contacts 24V
0V
power jumper contacts
fieldbus connection 1 RJ-45
fieldbus connection 2 RJ-45
DIP switch
configuration interface
PROFINET IO
LINK ACT 1
LINK ACT 2
BF
DIA
I/O
12345678
ON
750-370
01 02
A
B
24V 0V
++
--
C
D
Fig. 3.1.2-1: View g037000e
The fieldbus coupler consists of:
Power supply for the system supply as well as power jumper contacts for the field side supply via I/O modules.
Fieldbus connection via two RJ-45 sockets (2-Port Switch)
DIP switch option for device name assignment
Display elements (LEDs) for status display of the operation, the fieldbus
communication, the operating voltages as well as for fault messages and diagnostics.
Configurations interface
Electronics for communication with the I/O modules (internal bus) and the
fieldbus interface.
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PROFINET IO 750-370 51 Hardware
3.1.2.2 Power Supply
The power is supplied via terminals with CAGE CLAMP® connection. The power supply provides power to both the system and the field side.
24 V
0V
24 V
0V
10 nF
10 nF
DC
DC
ELECTRONIC
FiELDBUS
INTERFACE
I/O
MODULES
FiELDBUS INTERFACE
750-370
1
2
3
ELECTRONIC
4
5
24V/0V
6
24 V
7
0V
8
Fig. 3.1.2-2: Power supply g037001e
The integrated power supply unit provides the required power to the electronics and to the I/O modules.
The electrical isolation between the RJ-45 Ethernet connector and the electronics is provided by a transformer.
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52 • PROFINET IO 750-370 Hardware
3.1.2.3 Fieldbus Connection
The PROFINET IO interface is designed as a RJ-45 connection and complies with 100BaseTX standards.
Pin Signal Description
1 TD + Send data +
8
7
6
5
4
3
2
1
2 TD - Send data -
3 RD + Receiving data +
4 - Not assigned
Fig. 3.1.2-3: Bus connection RJ-45, plug
g0xxx20x
5 - Not assigned
6 RD - Receiving data -
7 - Not assigned
8 - Not assigned
The connection point of the coupler is lowered to fit in an 80 mm high switch box once connected to the PROFINET connector.
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PROFINET IO 750-370 53 Hardware
3.1.2.4 Display Elements
The operating status of the fieldbus coupler or of the fieldbus node is indicated via light diodes (LEDs).
LED Color Significance
PROFINET IO
LINK
A
ACT1 LINK
B
ACT2 BF
DIA
I/O
Fig. 3.1.2-4: Display elements
C
D
g037002x
LNK ACT 1
green
The “LNK/ACT” LEDs indicates that a physical connection to the Ethernet port 1 or 2 are etablished. They flashes with a frequency of 2 Hz for a period of 3 seconds when the fieldbus coupler is
LNK ACT 2
green
requested to the participant flash test by the DCP protocol (Discovery and basic Configuration Protocol).
A
BF red The “BF” LED provides information on
B
the current status of the PROFINET IO data exchange.
DIA red The “DIA” LED indicates the upcoming
of diagnostics events. The message from the diagnostics is not supported by all I/O modules or must be explicitly released for each channel.
I/O red/green/
orange
The “I/O” LED indicates both the internal bus communication and occurring errors.
A green Status of the operating voltage – system
B green Status of the operating voltage – power
contacts
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54 • PROFINET IO 750-370 Hardware
3.1.2.5 Configuration Interface
The configuration interface is located behind the cover flap. It is used for communicating with WAGO-I/O-CHECK 2 and optionally for updating the device software (firmware).
open
flap
Configuration interface
Fig. 3.1.2-5: Configuration interface g01xx06e
Fitting the 4-pole male connector to the RS-232 DSub9 connector is done using the WAGO configuration cable 750-920.
Caution
The communication cable 750-920 must not be connected or removed when energized, i.e. the coupler/controller must be voltage free!
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PROFINET IO 750-370 55 I/O Device Configuration

3.1.3 I/O Device Configuration
The fieldbus coupler takes over the task of the I/O device in PROFINET IO. This way, an I/O controller can access the process data of the I/O module periphery after the cyclic exchange of productive data has been successfully established. Selecting the I/O modules for the process data exchange and defining the time grid is done when configuring the I/O controller. The configuration and parameter setting of the fieldbus coupler and I/O modules is based on the device's GSD file.
3.1.3.1 GSD File
Under PROFIBUS IO, the features of the devices are described by the manufacturer in form of a GSD file and made available to the user. The file is provided in XML format.
Structure, content and coding of the device specifications are standardized, so that any I/O devices can be configured using manufacturer-independent tools.
Further Information The PNO provides information about the GSD files of all listed manufacturers.
GSD and symbol files for configuring the WAGO I/O devices can be obtained on CD under the item number 750-916 or on the WAGO INTERNET site.
http://www.wago.com
GSD file for I/O device 750-370 gsdml-V2.1-wago-series750_753-20071130.xml
The GSD file is read by the configuration software and the corresponding settings are transferred. For the necessary entries and handling steps, please refer to the software user manuals.
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56 • PROFINET IO 750-370 I/O Device Configuration
3.1.3.2 Configuration
The I/O device is configured in accordance with the physical arrangement of the node (slot oriented).
Module slot 0 contains the fieldbus coupler in its function as station substitute. It does not deliver any process data itself, but provides the parameters required to perform overall settings of the I/O device.
Slots 1 to max. 128 reflect the physical arrangement of the I/O modules that deliver a part of the process and/or diagnostics data. Supply modules without diagnostics, internal system supply module, field side connection module as well as separation and end modules are not considered during configuration as they do not provide any process data and/or diagnostics data.
For each I/O module, up to 8 configuration modules are available in the hardware catalog. The modules are designated by their item number followed by the number of signal channels, e.g. 75x-467 2AE. Additional information is included in the module description as different configuration possibilities are available (see below).
3.1.3.2.1 Configuring Digital I/O Modules
Four digital I/O modules with a granularity smaller or equal to 8 bits are listed in the I/O device hardware catalog. Three modules reserve 1, 2 or 4 bytes in the respective area, one of them is used to fill the reserved areas. The 2- and 4­byte modules can be found in the hardware catalog under the sub-category “Word / double word module”. With configuration modules that require more process image memory than the level of existing information of the respective I/O modules, the amount of bit information, which is still available in the allocated area, is indicated in brackets with a positive sign.
The item numbers of the modules, that do not provide a process image memory but are used to fill previously excessively reserved bit information, are marked with a star (*). Furthermore, the module names, that are represented with a negative sign in brackets, contain the amount of information that has been previously allocated in the area of the process image by the I/O module.
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PROFINET IO 750-370 57 I/O Device Configuration
Module Description Name example
DI_32
DI_16
Configuration module for 32 digital inputs, 4 bytes are reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the input data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown with a positive sign in brackets) can be allocated to the signal states of the following I/O modules having the same type of signal. This is done by configuring the DI_0 modules of the relevant I/O modules.
Configuration module for 16 digital inputs, 2 bytes are reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the input data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown with a positive sign in brackets) can be allocated to the signal states of the following I/O modules having the same type of signal. This is done by configuring the DI_0 modules of the relevant I/O modules.
75x-400 2DE(+30 BIT E)
75x-400 2DE(+14 BIT E)
DI_8
DI_0
Configuration module for 8 digital inputs, 1 byte is reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the input data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown with a positive signal in brackets) can be allocated to the signal states of the following I/O modules having the same type of signal. This is done by configuring the DI_0 modules of the relevant I/O modules.
Configuration module for filling input information previously reserved by modules DI_32, DI _16 or DI _8. Care must be taken that the number of previously reserved input bits are sufficient to receive the existing input information of the configured I/O module (shown with a negative sign in brackets).
75x-400 2DE(+6 BIT E)
75x-400* 2DE(-2 BIT E)
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58 • PROFINET IO 750-370 I/O Device Configuration
Module Description Name example
DO_32
DO_16
Configuration module for 32 digital outputs, 4 bytes are reserved in the output process image of the I/O controller. The bit information in the first byte is allocated to the output data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (carried with a positive signal in brackets) can be allocated to the signal conditions of the following digital I/O module using the same type of signal. This is carried out using the projection of DI_0 modules for the relevant I/O modules.
Configuration module for 16 digital outputs, 2 bytes are reserved in the output process image of the I/O controller. The bit information in the first byte is allocated to the output data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown with a positive signal in brackets) can be allocated to the signal states of the following digital output I/O modules having the same type of signal. This is done by configuring the DO_0 modules of the relevant I/O modules.
75x-504 4DA(+28 BIT A)
75x-504 4DA(+12 BIT A)
DO_8
DO_0
Configuration module for 8 digital outputs, 1 byte is reserved in the output process image of the I/O controller. The bit information in the first byte is allocated to the output data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown with a positive signal in brackets) can be allocated to the signal states of the following digital output I/O modules having the same type of signal. This is done by configuring the DO_0 modules of the relevant I/O modules.
Configuration module for filling input information previously reserved by modules DI_32, DI _16 or DI _8. Care must be taken that the number of previously reserved output bits is sufficient to receive the existing output information of the configured I/O module (represented in brackets with a negative sign).
75x-504 4DA(+4 BIT A)
75x-504* 4DA(-4 BIT A)
Digital I/O modules can deliver both process data as well as additional diagnostic information. Furthermore, they store the raw diagnostic data in the input process image via 4 additional configuration modules. Three modules of the respective input modules allocate 1, 2 or 4 bytes in the input image, 3
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PROFINET IO 750-370 59 I/O Device Configuration
modules of the respective output modules reserve 1, 2 or 4 bytes in the input and output image. Respectively, 1 module of the I/O modules is used to fill previously reserved input and/or output areas. The 2 and 4 byte modules can be found in the hardware catalog under the sub-category “Word / double word module”.
Module Description Name example
DI_DIA_32
DI_DIA_16
Configuration module for 32 digital inputs, 4 bytes are reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the input and diagnostics data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown in brackets with a positive sign) can be allocated to the signal states of the following I/O modules having the same type of signal. This is done by configuring the DI_0- DI_DIA_0 or DO_DIA_0 modules of the relevant I/O modules.
Configuration module for 16 digital inputs, 2 bytes are reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the input and diagnostics data of the configured I/O module according to the number of existing signal channels. Remaining bit locations (shown in brackets with a positive sign) can be allocated to the signal states of the following I/O modules having the same type of signal. This is done by configuring the DI_0- DI_DIA_0 or DO_DIA_0 modules of the relevant I/O modules.
75x-425 2DE(+28 BIT E), DIA in E-PA
75x-425 2DE(+12 BIT E), DIA in E-PA
DI_DIA_8
WAGO-I/O-SYSTEM 750 PROFINET IO
Configuration module for 8 digital inputs, 1 byte is reserved in the input process image of the I/O controller. The existing bit information in the first byte is allocated to the input and diagnostics data of the configured I/O module according to the respective number of existing signal channels. Remaining bit locations (shown in brackets with a positive sign) can be allocated to the signal states of the following I/O modules having the same type of signal. This is done by configuring the DI_0- DI_DIA_0 or DO_DIA_0 modules of the relevant I/O modules.
75x-425 2DE(+4 BIT E), DIA in E-PA
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60 • PROFINET IO 750-370 I/O Device Configuration
Module Description Name example
DI_DIA_0
DO_DIA_32
Configuration module for filling input information previously reserved by modules DI_32, DI_DIA_32 DI_16, DI_DIA_16, DI _8 or DI _8. Care must be taken that the number of previously reserved input bits is sufficient to receive the existing input and diagnostic information of the configured I/O module (represented in brackets with a negative sign).
Configuration module for 32 digital input and outputs, 4 bytes are reserved in the output and output process image of the I/O controller. The bit information in the first byte of the output area is allocated to the output data of the configured I/O module according to the number of existing signal channels. The bit information in the first byte of the input area is allocated to the raw diagnostics data of the individual signal channels. Remaining bit locations of the reserved input and output area (indicated in brackets with a positive sign) can be allocated to the signal conditions of the following digital I/O modules having the same type of signal. This is done by configuring the Dx0 or Dx_DIA_0 modules of the relevant I/O modules.
75x-425* 2DE(-4 BIT E), DIA in E-PA
75x-507 2DA(+30 BIT E/A), DIA in E-PA
DO_DIA_16
Configuration module for 16 digital input and outputs, 2 bytes are reserved in the output and output process image of the I/O controller. The bit information in the first byte of the output area is allocated to the output data of the configured I/O module according to the number of existing signal channels. The bit information in the first byte of the input area is allocated to the raw diagnostics data of the individual signal channels. Remaining bit locations of the reserved input and output area (indicated in brackets with a positive sign) can be allocated to the signal conditions of the following digital I/O modules having the same type of signal. This is done by configuring the Dx0 or Dx_DIA_0 modules of the relevant I/O modules.
75x-507 2DA(+12 BIT A), DIA in E-PA
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PROFINET IO 750-370 61 I/O Device Configuration
Module Description Name example
DO_DIA_8
DO_DIA_0
Configuration module for 8 digital input and outputs, 1 byte is reserved in the output and output process image of the I/O controller. The bit information of the output area is allocated to the output data of the configured I/O module according to the number of existing signal channels. The bit information of the input area is allocated to the raw diagnostics data of the individual signal channels. Remaining bit locations of the reserved input and output area (indicated in brackets with a positive sign) can be allocated to the signal conditions of the following digital I/O modules having the same type of signal. This is done by configuring the Dx0 or Dx_DIA_0 modules of the relevant I/O modules.
Configuration module for filling input and output information previously reserved by modules Dx_32, Dx_DIA_32, Dx_16, Dx_DIA_16, Dx_8 or Dx_DIA_8. Care must be taken that the number of previously reserved input and output bits are sufficient to receive the existing output and diagnostic information of the configured I/O module (represented in brackets with negative sign).
75x-507 2DA(+4 BIT A), DIA in E-PA
75x-507* 2DA(-4 BIT A), DIA in E-PA
3.1.3.2.2 Configuring Analog I/O Modules
Two configuration modules are available for configuring analog input and output modules. The first module supplies the user data in the respective input or output process image. The second module, that is provided with EM (Extended Mapping) as module description extension, supplies all existing data including control and status information in the input and output areas. These modules make it possible to access the register structure of the I/O module in productive data exchange, so that, e.g., the operating parameters can be modified.
Module Description Exemplary Marking
AI
Configuration module for analog input modules. Each channel provides 1 word (2 bytes) of data in the input process image of the I/O controller.
75x-467 2AE, 0-10 V
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62 • PROFINET IO 750-370 I/O Device Configuration
Module Description Exemplary Marking
AI_EM
AO
AO_EM
Configuration module for analog input modules. Each signal channel provides a structure of 1 byte status and 1 word (2 bytes) of data in the input process image of the I/O controller. Each signal channel provides a structure of 1 byte control and 1 word (2 bytes) of data in the output process image if the I/O controller. This information does not have any significance in the output area of the I/O module during normal operation.
Configuration module for analog output modules. Each channel provides 1 word (2 bytes) of data in the output process image of the I/O controller.
Configuration module for analog output modules. Each signal channel provides a structure of 1 byte control and 1 word (2 bytes) of data in the output process image of the I/O controller. Each signal channel provides a structure of 1 byte status and 1 word (2 bytes) of data in the input process image. During standard operation, the status byte diagnostics fault provides the I/O module with information of the upcoming fault. The data in the input area of the I/O module does not have any significance with this type of operation.
75x-467 2AE, 0-10 V, EM
75x-550 2AA, 0-10 V
75x-550 2AA, 0-10 V, EM
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PROFINET IO 750-370 63 I/O Device Configuration
3.1.3.2.3 Configuring Specialty Modules
A configuration module is available for configuring all speciality modules such as counter, PWM, encoder and serial interfaces that provides all information of the respective I/O module in the input and output process images. This module makes it possible to access the register structure of the I/O module in the productive data exchange so that, e.g., the operating parameters can be modified. The structure of the process image is specific to the module and can be obtained from the respective I/O module documentation. The I/O modules 750-511 and 750-630 are an exception as they have two configuration modules.
Module Description Marking
PWM
PWM_EM
SSI
SSI_EM
Configuration module for pulse width output module. Each channel provides 1 word (2 bytes) of data in the output process image of the I/O controller.
Configuration module for pulse width output module. Each signal channel provides a structure of 1 byte status and 1 word (2 bytes) of data in the input process image if the I/O controller. Each signal channel provides a structure of 1 byte control and 1 word (2 bytes) of data in the output process image if the I/O controller. Depending on the operating mode selected, process information is also carried by the input data in productive data exchange.
Configuration module for SSI interface. 1 double word (4 bytes) of data are provided in the input process image of the I/O controller.
Configuration module the SSI interface. A structure of 1 byte control and 1 double word (4 bytes) of data are provided in the output process image of the I/O controller. A structure of 1 byte status and 1 double word (4 bytes) of data are provided in the input process image of the I/O controller. The status byte supplies the information for the upcoming faults in the productive data exchange. The productive dada exchange does not have any significance in the output area of the I/O module.
75x-511 2PWM
75x-511 2PWM, EM
75x-630 1SSI
75x-630 1SSI, EM
Five configuration modules are available for the diagnostic capable field side supply modules. Four of these modules provide the diagnostics information in the input process image.
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64 • PROFINET IO 750-370 I/O Device Configuration
Module Description Exemplary name
PE_DIA_32
PE_DIA_16
Configuration module for 32 digital inputs, 4 bytes are reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the 2 bit diagnostics data of the configured supply module. Remaining bit locations (indicated in brackets with a positive sign) can be allocated to the signal states of the following I/O module having the appropriate type of signal or the diagnostics information of diagnostic capable I/O modules. This is done by configuring the
DI_0, - DI_DIA_0 DO_DIA_0 or PE_DIA_0 modules for the relevant I/O
modules.
Configuration module for 16 digital inputs, 2 bytes are reserved in the input process image of the I/O controller. The bit information in the first byte is allocated to the 2 bit diagnostics data of the configured supply module. Remaining bit locations (indicated in brackets with a positive sign) can be allocated to the signal states of the following I/O module having the appropriate type of signal or the diagnostics information of diagnostic capable I/O modules. This is done by configuring the
DI_0, - DI_DIA_0 DO_DIA_0 or PE_DIA_0 modules for the relevant I/O
modules.
750-610 P-Supply, 2DIA(+30 BIT E), DIA in E-PA
750-610 P- Supply, 2DIA(+14 BIT E), DIA in E-PA
PE_DIA_8
PE_DIA_0
Configuration module for 8 digital inputs, 1 byte is reserved in the input process image of the I/O controller. 2 bit are allocated to the diagnostics data of the configured supply module. Remaining bit locations (indicated in brackets with a positive sign) can be allocated to the signal states of the following I/O module having the appropriate type of signal or the diagnostics information of diagnostic capable I/O modules. This is done by configuring the
DI_0, - DI_DIA_0 DO_DIA_0 or PE_DIA_0 modules for the relevant I/O
modules.
Configuration module for filling input information previously reserved by modules DI_32, PE_DIA_32,
Dx_DIA_32, DI_16, PE_DIA_16, Dx_DIA_16, DI _8, PE_DIA_8 or Dx_DIA_8. Care must be taken that the
number of previously reserved input and output bits are sufficient to receive 2 bit diagnostic information of the configured I/O module (represented in brackets with a negative sign).
750-610 P- Supply, 2DIA(+6 BIT E), DIA in E-PA
750-610* P- Supply, 2DIA(-2 BIT E), DIA in E-PA
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Module Description Exemplary name
DIA_0
The 2 bit diagnostics information are not available in the input process image of the I/O controller.
3.1.3.3 Parameter Setting
3.1.3.3.1 Station Parameters
The parameters of the station substitute are used to set the overall settings of the PROFINET IO node. Some of the settings are used in the modules as default settings and can be optionally overwritten within the module configuration.
Parameter Setting Description
Restart the internal bus after a fault
POWER ON RESET*)
AUTORESET
750-610 P- Supply, DIA
Restart of the internal data bus following a fault, such as, for example, no end module following:
after an interruption of the buscoupler supply
immediately after overcoming the internal bus fault
Internal Data Bus Extension
Message external module / channel fault
Process value display
EEPROM setting*)
not used
used
locked
released*)
INTEL (LSB-MSB)
MOTOROLA (MSB­LSB)*)
Use of the internal data bus extension.
Based upon the settings made in EEPROM that are made using the “WAGO Extension Settings” tool.
is excluded
is possible
The external diagnostics information of all diagnostics capable I/O modules are:
not transferred to the PROFINET I/O Controller
transferred to the PROFINET I/O Controller
Word or double word orientated process data are transfered to the PROFINET I/O Controller in:
“Little Endian” format
“Big Endian” format
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66 • PROFINET IO 750-370 I/O Device Configuration
Parameter Setting Description
Behavior in case of a PROFINET I/O fault
Reaction to an internal bus fault
Stop internal bus transmission
Set output image to zero
Freeze output image
Switch Default value*)
PROFINET I/O stop data exchange*)
In the case of a malfunction of the PROFINET IO communication, the status of the connected output periphery can be influenced in various ways.
The process data exchange on the internal bus is stopped, all outputs drop out after a module specific monitoring time of 100 ms.
All outputs are immediately reset.
All outputs maintain the last status before the malfunction.
All outputs switch the substitute value configured when designing the module.
In the event of a malfunction of an internal communication between fieldbus controller and I/O modules, such as, for example no end module.
Separates the cyclic connection to the PROFINET IO controller.
Set input image to zero
Freeze input image
*) Default settings
The input information of the respective periphery module is set to zero.
The input information of the periphery module prevailing before the fault is maintained.
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PROFINET IO 750-370 67 I/O Device Configuration
3.1.3.3.2 Standard Module Parameters
Certain characteristics of some I/O modules can be parameterized during the configuration. At present, this only applies to the output modules whose substitute value behavior can be set independent of the modules used.
Parameter Setting Description
Substitute value behavior of the outputs
according to the device settings*)
In case the I/O controller does not supply valid output data for the module or the group of modules then
the set strategy on the side of the station substitute applies (I/O device).
the set strategy on the side of the referenced digital module by which
according to the referenced module settings*)
2
)
the output data has been reserved. These settings apply to digital output modules without process data. These are characterized using a * behind the item number.
Output values are set to 0
Outputs maintain the last valid value
outputs take on their default value
*) Presetting
2) Digital modules whose process data has been allocated to their previous slots implicitly take over the default value strategy of the module on the slot allocated.
all outputs are immediately reset
all outputs maintain the last valid value
all outputs switch to their configured substitute value
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68 • PROFINET IO 750-370 I/O Device Configuration
3.1.3.3.3 Fault Safe Module Parameters (F-Parameters)
Fault safe I/O modules require the standardized PROFIsafe configuration to ensure a safe exchange of productive data.
Parameter Setting Description
There are no individual parameters contained in the F-parameters that have to be checked.
The module complies with the safety catagory 3.
The productive data transfer is safeguarded using a 3 byte CRC in
F_Check_iPar
F_SIL
F_CRC_Length
*1)
*1)
NoCheck
SIL3
3-Byte-CRC
*1)
case of PROFINET IO.
F_Par_Version
F_Source_Add
F_Dest_Add
F_WD_Time
*1)
1
1 ... 65534
1 ... 1022
*2)
100
1 ... 10000
all outputs maintain the last valid value
The F-Source address addresses the F-Host.
The F-Target address addresses the F-Device.
The F-Watchdog monitors the data exchange between the F-Host and F­Device. The settings are carried out in milliseconds.
*1) Fixed settings
*2) Presettings
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PROFINET IO 750-370 69 I/O Device Configuration
3.1.3.3.4 Channel Parameters
Individual settings of the channel characteristics can be performed when designing several I/O modules. The following channel specific settings can be made depending on the I/O module:
Parameter Setting Description
Asynch. diagnostic message channel x
Process data format channel x
Default data output channel x
Default output status channel x
locked*)
released
according to the device settings*)
INTEL (LSB-MSB)
MOTOROLA (MSB­LSB)
I/O module specific 0x0000*) ... 0xFFFF
0*) ... 1
With external faults, channel diagnostics and the respective alarms are
not transferred to the I/O controller
transferred to the I/O controller
Word or double word orientated process data of the signal channel are transferred to the PROFINET IO Controller in:
format that is set on the side of the station substitute.
“Little Endian” format
“Big Endian” format
When configuring the substitute value behavior on the side of the I/O module, these values are transmitted to the complex signal channel with invalid output data of the I/O controller.
When configuring the substitute value behavior on the side of the I/O module, these values are transmitted to the binary signal channel with invalid output states of the I/O controller.
*) Default settings
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70 • PROFINET IO 750-370 I/O Device Configuration
3.1.3.4 Station Naming
3.1.3.4.1 Device Name Assignment via Configuration Tool
The fieldbus coupler (I/O Device) can be clearly identified using its device name within a PROFINET IO network. The device name enables the I/O controller to allocate the device with an IP address for establishing the productive data exchange when starting the system. The I/O device receives the device name during configuration (station naming) and saves it permanently. The device name is transferred using Discovery and basic Configuration-Protocol (DCP). The device is activated using the Ethernet address (MAC address).
3.1.3.4.2 Device Name Assignment via DIP Switch Settings
In addition to assigning a name via a configuration tool, a device name instance based on the "wago 750 370" or "wago io device" specified strings can be allocated to the device via the DIP switch setting. This kind of station naming is enabled by setting switch 8 to "ON". Selecting the desired string is performed via switch 7. The device name instance is constructed using the following rule:
Station
Switch/Value
naming method
ON
12345678
E2PRO
M
OFF OFF OFF OFF OFF OFF
OFF OFF OFF OFF OFF OFF ON
OFF OFF OFF OFF OFF ON
ON
12345678
Switch
OFF ON ON ON ON ON
7 6 5 4 3 2 1
26 25 24 23 22 21 20
Not relevant
OFF
OFF
. . . . . .
ON
ON OFF OFF OFF OFF OFF
ON OFF OFF OFF OFF OFF
ON OFF OFF OFF OFF ON
OFF
ON
OFF
. . . . . .
ON ON ON ON ON ON ON
Resulting device name
The name assigned via DCP is recorded from E2PROM. When re­assigning a name, the name is saved in E2PROM (condition upon delivery)
„wago-750-370“
„wago-750-370-1“ „wago-750-370-2“
„wago-750-370-63“ „wago-io-device“
„wago-io-device-1“ „wago-io-device-2“
„wago-io-device-63“
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PROFINET IO 750-370 71 Initialization Phase of the Fieldbus Coupler

3.1.4 Initialization Phase of the Fieldbus Coupler
The communication system can be commissioned after the PROFINET IO system has been configured, the I/O devices have been installed and a name has been given to the station.
After the power supply has been switched on, the fieldbus coupler initializes the internal communication system. In the phase where the I/O LED flashes red with 10 Hz, the arranged I/O modules are determined and are allocated to the PROFINET IO process image according to the standard defaults of the bus coupler. After a trouble free start that is displayed using a green lit “I/O” LED, the coupler changes to the condition “Fieldbus start” where it then waits for the connection build-up of the I/O controller. If the coupler upload procedure was not carried out with success then the red I/O LED signals the cause of failure through a flashing cycle. The cause of failures can be obtained in chapter 3.1.11.1.
Fig. 3.1.4-6: Initialization phase g012113e
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3.1.5 Process Image
3.1.5.1 Local Process Image
After being switched on, the coupler identifies all I/O modules connected that supply or receive process data (data width or bit width > 0).
Note For the number of input and output bits or bytes of the individual I/O modules please refer to the corresponding description of the I/O modules.
The fieldbus coupler allocates the user data of the connected I/O modules according to specified rules to the local input and output image. The allocation is carried out according to the slots. Digital I/O modules with a data width less than 8 bits are always opened with one bit in the respective process image area.
After a successful configuration test while establishing the connection, if there is any difference between the user configuration and the process image generated during start up, a new process image is created according to the user configuration. One of the reasons for this may be the packing of digital I/O modules or the lack of configuration modules for the connected I/O modules during configuration.
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3.1.5.2 Allocation of the Input and Output Data
The process data is exchanged via the PROFINET IO using the higher ranking controls. A maximum of 320 bytes of output data (including all IOPS and IOCS) can be transferred from the I/O controller to the bus coupler. The bus coupler sends a maximum of 320 byte of input data (including all IOPS and IOCS) to the I/O controller.
When configuring a node, the individual modules are configured in accordance with their physical arrangement (slot orientated). These modules can be taken over from a hardware catalog of the configuration tool. All specific information on the relevant modules is contained in the associated GSD file.
Master, e. g. PLC
CPU
CPU
750-370
1234 5 6789
DI
AI
AI
DOAOAO
DO
Fieldbus Interface
452
504 504
550 550
600
Master
Addresses
I
O
I
O
byte-oriented allocation,
generated ona PC
I
O
PROFINET
PROFINET
402DI402 452
Allocation listAllocation list
II
OO
slot-oriented
allocation,
generated automatically
by the Coupler
Fig. 3.1.5-7: Allocation of the input and output data g037003e
In productive data exchange, one or two byte IOXS process data qualifiers are available for each configuration module providing information of the validity of the module data. The process data qualifiers are an integral part of the maximum length of the telegram of 320 bytes and must therefore be considered when mounting the modules.
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74 • PROFINET IO 750-370 Process Image
3.1.5.2.1 Digital Input Modules
The group of digital input I/O modules is divided into 8 types of modules:
Type of module Description Substitute I/O modules
75x-400, 75x-401, 75x-405,
2DI 2-channel digital input module
2DI_2DIA
2DI_2DIA_PI
2DI_2DIA_2ACK
2DI_2DIA_2ACK_PI
4DI 4-channel digital input module
8DI 8-channel digital input module
16DI
2-channel digital input module 1 Bit diagnostic per channel
2-channel digital input module 1 Bit diagnostic per channel, additional diagnostic in the input image
2-channel digital input module 1 Bit diagnostic and 1 bit diagnostic confirmation per channel
2-channel digital input module 1 Bit diagnostic and 1 bit diagnostic confirmation per channel, with additional diagnostics in the input image
16-channel digital input modul
75x-406, 75x-407, 75x-410, 75x-411, 75x-412, 75x-413, 75x-416, 75x-427, 75x-435
75x-419, 75x-421, 75x-425
75x-418
75x-402, 75x-403, 75x-408, 75x-409, 75x-414, 75x-415, 75x-422, 75x-423, 75x-424, 75x-428, 75x-432, 75x-433
75x-430, 75x-431, 75x-436, 75x-437
75x-4xx
e
Digital input modules receive the consumer status (IOCS) from the I/O controller and supply it with the provider status (IOPS) of the existing input and optional existing diagnostic information. The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PI) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
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PROFINET IO 750-370 75 Process Image
Module
Data length / [Byte] Data type Data length / [Byte] Data type
Type
2DI
2DI_2DIA
2DI_2DIA_2ACK
4DI
8DI
16DI
PA TLG PA TLG
E A Tx Rx
1 0 2 1 UINT8 ­2 0 3 1 UINT16 ­4 0 5 1 UINT32 ­1 0 2 1 UINT8 ­2 0 3 1 UINT16 ­4 0 5 1 UINT32 ­1 1 3 3 UINT8 UINT8 1 1 2 2 UINT16 UINT16 1 1 2 2 UINT32 UINT32 1 0 2 1 UINT8 ­2 0 3 1 UINT16 ­4 0 5 1 UINT32 ­1 0 2 1 UINT8 - 2 0 3 1 UINT8 ­4 0 5 1 UINT8 ­2 0 3 1 UINT16 - 4 0 5 1 UINT32 - 0 0 1 1 - -
3.1.5.2.2 Digital Output Modules
The group of digital output I/O modules is divided into 12 types of module types:
750-4xx ... 750-4xx* ...
E A
E A Tx Rx
0 0 1 1 - -
0 0 1 1 - -
0 0 2 2 - -
0 0 1 1 - -
0 0 1 1 - -
E A
Type of module Description Substitute I/O modules
75x-501, 75x-502, 75x-405,
2DO 2-channel digital output modules
2DI_2DIA
2DI_2DIA_PI
2DI_4DIA
2DI_4DIA_PI
4DO 4-channel digital output modules
4DO_4DIA
4DO_4DIA_PI
8DI
8DO_8DIA
2-channel digital output modules 1 Bit diagnostics per signal channel
2-channel digital output module 1 Bit diagnostic per signal channel, additional diagnostic in the input image
2-channel digital output modules 2 Bit diagnostics per signal channel
2-channel digital output module 2 Bit diagnostic per signal channel, additional diagnostic in the input image
4-channel digital output modules 1 Bit diagnostics per signal channel
4-channel digital output module 1 Bit diagnostic per signal channel, additional diagnostic in the input image
8-channel digital input module 75x-530, 75x-536
8-channel digital output modules 1 Bit diagnostics per signal channel
75x-406, 75x-407, 75x-410, 75x-411, 75x-412, 75x-413, 75x-416, 75x-427, 75x-435
75x-507, 75x-522, 75x-523
75x-507, 75x-522, 75x-523
75x-506
75x-506
75x-504, 75x-403, 75x-408, 75x-409, 75x-414, 75x-415, 75x-422, 75x-423, 75x-424, 75x-428, 75x-432, 75x-433
75x-532
75x-532
75x-537
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8-channel digital output module
8DO_8DIA_PI
16DO
1 Bit diagnostic per signal channel, additional diagnostic in the input image
16-channel digital output module 75x-5xx
75x-537
Digital output modules without diagnostics information in the input process image receive the provider status (IOPS) from the I/O controller and supplies it with the consumer status (IOCS) of existing output information. The accompanying process data is additionally transmitted in the opposite direction in case the corresponding diagnostics module appears in the input image of the I/O controller.
The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
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Typ
2DO
2DO_2DIA
2DO_2DIA_PI
2DO_4DIA
2DO_4DIA_PI
4DO
4DO_4DIA
4DO_4DIA_PI
8DO
8DO_8DIA
8DO_8DIA_PI
16DO
Module
75x-5xx ... 75x-5xx* ...
Data length / [Byte] Data type Data length / [Byte] Datea type
PA TLG PA TLG E A
E A Tx Rx
0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 5 - UINT32 0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 5 - UINT32 1 1 3 3 UINT8 UINT8 2 2 4 4 UINT16 UINT16 4 4 6 6 UINT32 UINT32 0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 5 - UINT32 1 1 3 3 UINT8 UINT8 2 2 4 4 UINT16 UINT16 4 4 6 6 UINT32 UINT32 0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 5 - UINT32 0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 5 - UINT32 1 1 3 3 UINT8 UINT8 2 2 4 4 UINT16 UINT16 4 4 6 6 UINT32 UINT32 0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 4 - UINT32 0 1 1 2 - UINT8 0 2 1 3 - UINT16 0 4 1 5 - UINT32 1 1 3 3 UINT8 UINT8 2 2 4 4 UINT16 UINT16 4 4 6 6 UINT32 UINT32 0 1 1 3 - UINT16 0 2 1 5 - UINT32 0 0 1 1 - -
E A
E A Tx Rx
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
0 0 1 1 - -
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78 • PROFINET IO 750-370 Process Image
3.1.5.2.3 Analog Input Modules
The group of analog input modules is divided into 5 types of modules:
Type of module Description Substitute I/O modules
AI
2AI_EM
3AI_EM
4AI
4AI_EM
2-channel analog input module, 16 Bit input data per signal channel
2-channel analog input module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
3-channel analog input module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
4-Channel analog input module, 16-Bit signed process value per signal channel
4-channel analog input module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
75x-452, 75x-454, 75x-456, 75x-461, 75x-462, 75x-465, 75x-466, 75x-467, 75x-469, 75x-472, 75x-474, 75x-475, 75x-476, 75x-477, 75x-478, 75x-479, 75x-480, 75x-481, 75x-483, 75x-485, 75x-491, 75x-492
75x-493
75x-453, 75x-455, 75x-457, 75x-459, 75x-460, 75x-463, 75x-468
Analog input modules receive the consumer status (IOCS) from the I/O controller and supply it with the provider status (IOPS) of the existing input information in case only the actual user data is replaced. If all existing information in the input and output image is made available then the process data qualifier is additionally transmitted in the opposite direction. The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
Module
Data length [Byte] Data object
Type
2AI 4 - 5 1 INT16 2 - - 4AI 8 - 9 1 INT16 4 - -
PA TLG
E A Tx Rx
75x-4xx nAE, …
E INST A INST
Module
Data length [Byte] Data object
Type
2AI_EM 6 6 7 7 INT16 2 INT16 2
3AI_EM 12 12 13 13
4AI_EM 12 12 12 12 UINT8,UINT16 4 UINT8,UINT16 4
PA TLG
E A Tx Rx
75x-4xx nAE, …, EM
Input INST Output INST
UINT8,UINT8,
INT16
UINT8,UINT8,
3
INT16
3
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3.1.5.2.4 Analog Output Modules
The group of analog output modules is divided into 4 types of modules:
Type of module Description Substitute I/O modules
2AO
2AO_EM
4AO
4AO_EM
2-channel analog output module, 16 Bit output data per signal channel
2-channel analog output module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
4-Channel analog output module, 16-Bit signed process value per signal channel
4-channel analog output module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
75x-550, 75x-552, 75x-554, 75x-556, 75x-560, 75x-585
75x-551, 75x-553, 75x-555, 75x-557, 75x-559
Analog output modules receive the consumer status (IOCS) from the I/O controller and supply it with the provider status (IOPS) of the existing output information in case only the actual user data is replaced. If all existing information in the input and output image is made available then the process data qualifier is additionally transmitted in the opposite directions. The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
Module
Data lenght [Byte] Data object
Type
2AO 4 - 5 1 - - I16 2 4AO 8 - 9 1 - - I16 4
PA TLG
E A Tx Rx
75x-5xx nAA, …
E INST A INST
Module
Data lenght [Byte] Data object
Type
2AO_EM 6 6 7 7 U8,I16 2 U8,I16 2 4AO_EM 12 12 12 12 U8,I16 4 U8,I16 4
PA TLG
E A Tx Rx
75x-5xx nAA, …
E INST A INST
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3.1.5.2.5 Specialty Modules
3.1.5.2.5.1 Meter and Position Transmitter Interfaces
The group of meter and position transmitter interfaces is divided into 5 types of modules:
Type of module Description Substitute I/O modules
1CNT
2CNT
SSI
SSI_EM
DII
ENC
1 (2)-channel meter module, 32 (16) Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
2-channel analog output module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
SSI Interface, 32 Bit input data
SSI Interface, 32 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
Digital impulse interface, 24 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
Encoder Interface, 32 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
75x-404
75x-638
75x-630
75x-635
75x-631, 75x-634, 75x-637
The provider and consumer status (IOPS) of the input or output information are exchanged between the I/O controller and I/O device in both directions with meter and position transmitter interfaces. With the SSI Interface 75x-630, there is also an additional possibility for exclusively transmitting the input data of the transmitter. In this case, the I/O device only receives the consumer status (IOCS) from the I/O controller and supplies it with the provider status (IOPS). The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
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PROFINET IO 750-370 81 Process Image
Module
Data length [Byte] Data object
Type
SSI 4 0 5 1 U32 1 - -
PA TLG
E A Tx Rx
75x-630 1SSI
E INST A INST
Module
Type
1CNT 6 6 8 8 U8,U8,U32 1 U8,U8,U32 1 2CNT 6 6 8 8 U8,U16 2 U8,I16 2
SSI_EM 6 6 8 8 U8,U8,U32 1 U8,U8,U32 1
DII 4 4 6 6 U8[4] 1 U8[4] 1 ENC 6 6 8 8 U8,U16 2 U8,U16 2
75x-404 1CNT / 75x-630 1SSI, EM / 75x-6xx …
Data length [Byte] Data object
PA TLG
E A Tx Rx
E INST A INST
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3.1.5.2.5.2 Pulse Width Output Module
Two module types exist for the PWM output module:
Type of module Description Substitute I/O modules
PWM
PWM_EM
2-Channel PWM output module, 16-Bit signed process value per signal channel
2-channel PWM output module, 16 Bit input and output data plus control and status byte per signal channel, access to the register structure using cyclic data exchange
75x-511
PWM output modules receive the consumer status (IOCS) from the I/O controller and supply it with the provider status (IOPS) of the existing output information in case only the actual user data is replaced. If all existing information in the input and output image is made available then the process data qualifier is additionally transmitted in the opposite direction.
The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
Module
Data length [Byte] Data object
Type
PWM 4 - 5 1 - - I16 2
PA TLG
E A Tx Rx
75x-511 2PWM
E INST A INST
Module
Data length [Byte] Data object
Type
PWM_EM 6 6 7 7 U8,I16 2 U8,I16 2
PA TLG
E A Tx Rx
75x-511 2PWM, EM
E INST A INST
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3.1.5.2.5.3 Serial Interfaces and Gateways
The group of serial interfaces and their gateways is divided into 5 types of modules:
Type of module Description Substitute I/O modules
SER
DXH
DXH_EM
DALI
ENOC
Serial interface 75x-650, 75x-651, 75x-653
Data exchange module 75x-654
Data exchange module, Access to the register structure via cyclic data exchange
DALI/DSI Master 75x-635
ENOCEAN RF-Module 75x-631, 75x-634, 75x-637
75x-654
The provider and consumer status (IOPS) of the input or output information are exchanged between the I/O controller and I/O device in both directions with serial interfaces and their gateways. The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
Module
Type
SER 6 6 8 8 U8[6] 1 U8[6] 1 DXH 4 4 6 6 U8[4] 1 U8[4] 1
DXH_EM 6 6 8 8 U8[6] 1 U8[6] 1
DALI 6 6 8 8 U8[6] 1 U8[6] 1 ENOC 4 4 6 6 U8[4] 1 U8[4] 1
75x-650 RS 232 C / 75x-651 RS 485 / 75x-653 TTY /
75x-641 DALI/DSI / 75x-642 RF-RCV EnOcean
Data length [Byte] Data object
PA TLG
E A Tx Rx
75x-654 DXCH
E INST A INST
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3.1.5.2.5.4 PROFIsafe I/O Modules
The consumer status (IOPS) of the input or output information is exchanged between the I/O controller and I/O device in both directions with PROFIsafe I/O modules. The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
Module
Data length [Byte] Data object
Type
PROFIsafe 5 5 7 7 U8[5] 1 U8[5] 1
PA TLG
E A Tx Rx
3.1.5.2.6 System Modules
3.1.5.2.6.1 Potential Supply Modules
The group of potential supply modules is divided into 2 types of modules:
Type of module Description Substitute I/O modules
2DIA
2DIA_PI
Supply module with 2 Bit diagnostics
Supply module with 2 Bit diagnostics, and additional diagnostics with input image
753-661/000-002 4F-DE 753-662/000-002 8F-DE
75x-667/000-002 4F-DE/DA
E INST A INST
750-610, 750-611
750-610, 750-611
In case there is no diagnostics data prepared in the input image, potential supply modules supply a provider status (IOPS) to the I/O controller. If the input data is available in the input process image then the consumer status (IOCS) is received from the I/O controller.
The following table shows a list of the number of bytes for the individual modules that are allocated in the respective process image (PA) and the telegrams (TLG) in the direction of transmission and reception (Tx, Rx).
Module
Data length / [Byte] Data type Data length / [Byte] Data type
Type
2DIA 0 0 1 0 -
2DIA_PI
PA TLG PA TLG
E A Tx Rx
1 0 2 1 UINT8 ­2 0 3 1 UINT16 ­4 0 5 1 UINT32 -
750-6xx ... 750-6xx* ...
E A
E A Tx Rx
-
0 0 1 1 - -
E A
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3.1.5.3 Example
The allocation should become clear by way of a fieldbus node with a coupler and 17 I/O modules.
1234 5 67891011121314151617
DI DI
DI DI
DI DI
750-370
AI AI
402
402 402
452
DO DODO DO
602 504
DO DO DO DODO DO
504 530
DO DO
530
AI AI
AO AO
602
AO AO AI AI DO DO
452
452
504
602
600550 550
PROFINET
Fig. 3.1.5-8: Application example g037004x
No. I/O module Module PA I/O Controller *
Identifier Inputs Outputs
1
Digital input E 12.0 ---
Digital input E 12.1 ---
Digital input E 12.2 ---
Digital input
2
Digital input E 12.4 ---
Digital input E 12.5 ---
Digital input E 12.6 ---
Digital input
3
Digital input E 13.0 ---
Digital input E 13.1 ---
Digital input E 13.2 ---
Digital input
Analog input EW 256 --- 4
Analog input
5 Supply
6
Digital output --- A 8.0
Digital output --- A 8.1
Digital output --- A 8.2
Digital output
7
Digital output --- A 8.4
Digital output --- A 8.5
Digital output --- A 8.6
Digital output
75x-402 4DE(+4 BIT E)
(UINT8 IN)
75x-402* 4DE(-4 BIT E)
(-)
75x-402 4DE(+12 BIT E)
(UINT16 IN)
750-452 2AE, 0-20 mA
(INT16[2] IN)
750-610 Supply, DIA
(-)
75x-504 4DA(+28 BIT A)
(UINT32 OUT)
75x-504* 4DA(-4 BIT A)
(-)
E 12.3 ---
E 12.7 ---
E 13.3 ---
EW 258 ---
--- ---
--- A 8.3
--- A 8.7
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No. I/O module Module PA I/O Controller *
Identifier Inputs Outputs
8
9
10 Power supply
15 Power supply
16
17 End module End module --- ---
Digital output --- A 9.0
Digital output --- A 9.1
Digital output --- A 9.2
Digital output --- A 9.3
Digital output --- A 9.4
Digital output --- A 9.5
Digital output --- A 9.6
Digital output
Digital output --- A 10.0
Digital output --- A 10.1
Digital output --- A 10.2
Digital output --- A 10.3
Digital output --- A 10.4
Digital output --- A 10.5
Digital output --- A 10.6
Digital output
Analog output --- AW 256 11
Analog output
Analog input EW 260 --- 12
Analog input
Analog output EB264, EW265 AB264, AW265 13
Analog output
Analog input EB270, EW271 AB270, AW271 14
Analog input
Digital output --- A 11.0
Digital output --- A 11.1
Digital output --- A 11.2
Digital output
75x-530* 8DA(-8 BIT A)
(-)
75x-530* 8DA(-8 BIT A)
(-)
750-610 P-Supply, DIA
(-)
750-550 2AA, 0-10 V
(INT16[2] OUT)
750-452 2AE, 0-20 mA
(INT16[2] IN)
750-550 2AA, 0-10 V, EM
({UINT8, INT16}[2] IN/OUT)
750-452 2AE, 0-20 mA, EM
{UINT8, INT16}[2] IN/OUT
750-610 P-Supply.
2DIA(+6 BIT E),
DIA in E-PA
(UINT8)
75x-504 4DA(+4 BIT A)
(UINT8 OUT)
--- A 9.7
--- A 10.7
--- ---
--- AW 258
EW 262 ---
EB267, EW268 AB267, AW268
EB273, EW274 AB273, AW274
E 14.0
...
E 14.1
--- A 11.3
---
* The addresses stated in the table correspond with the process data allocation given in the hardware configuration.
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3.1.5.4 Establishing the Connection
Before starting the productive data exchange between the I/O controller and the I/O device, individual communication instances are created within the PROFINET IO context management and the I/O configuration (target configuration) of the modules is notified. After the connection structure has been checked and once the actual configuration has been adjusted (optional), the I/O device receives all necessary operating settings (parameters) so that the cyclic data exchange via “record data” sets can be established. Both the buscoupler and the connected I/O modules are supplied with parameters. Once all settings have been made, the I/O device signals that it is ready to send and receive cyclic productive data.
3.1.6 Configuration and Parameter Setting of I/O Modules
Setting the parameters of I/O modules is performed via “record data” sets. Modules with diagnostics capability allow the diagnostics message to be locked or released for each channel. Digital outputs provide the possibility of switching a configurable substitute value for each channel in the case of invalid output information.
Possible configuration and parameter values can be found in chapter 5.3, „Configuration and Parameter Setting of the Modules“.
Note For simplification, only the item numbers are shown as module designation in the table. Therefore, the module “75x-400” corresponds to module “750-400 2 DI/24 V DC/3.0 ms” or “753-400 2 DI/24 V DC/3.0ms”.
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3.1.7 Diagnostics
3.1.7.1 Diagnostics Data Sets
The diagnostics information of the buscoupler (I/O device) can be read out acyclically using standard diagnostics data sets (records). The structure of the data sets is defined in the PROFINET IO specification (see IODReadReq or IODReadRes). The data set number (index) allows to distinguish between the diagnostics level and the diagnostics structures.
The following diagnostics data sets can be requested in case of an upcoming diagnostics message:
Data set number Description Available on
slot
0x800A 32778
0x800B 32779
0x800C 32780
0xAFF0 45040 Data sets for identification and servicing purposes 0
0xC00A 49162
0xC00B 49163
0xC00C 49164
0xE002 57346
0xE00A 57354
0xE00B 57355
0xE00C 57356
0xF00A 61450
0xF00B 61451
0xF00C 61452
*1)
Several connections (AR´s) can be established to an API. The buscoupler only enables
one connection (AR) of the API 0 to an I/O controller in the firmware versions 01 and 02.
Standardized channel diagnostics of a sub-module slot (sub-slot specific)
Channel diagnostics of a slot (slot specific); currently identical with the data set number 800AH, as only one sub-module can exist for each module.
Deviations in the set and actual configuration of the sub-modules allocated to the I/O controller (I/O-AR).
Channel diagnostics of all signal channels allocated to a connection (AR), contains all channel diagnostics structures of the sub-module slots.
Channel diagnostics of all signal channels allocated to the application profile 0 (API 0) channel diagnostics structures of the individual sub­module slots.
*1)
*1)
, contains all
0 ... 128
0 ... 128
0
0
0
3.1.7.2 Structure of the Standardized Diagnosis Data Sets
The diagnosis data sets comprise of several structure elements. The first element in the data set is the head of the structure. It describes the version and the length of the following data. An identifier (BlockType)specifies the structure of the diagnosis data. The following identifiers are currently used by the buscoupler:
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Identifier Description
0x0010 Channel Diagnostics
0x8104 Deviating set / actual configuration
The version enables you to see if the process type (Application Process
Identifier – API) follows immediately after the head structure or not.
Version Description
1.0 Data set does not contain the API
1.1 Data set contains the API
The head of the structure has a length of 6 bytes and is composed of as follows:
Byte offset
Data type Description
0 / 1 WORD
0x0010 Channel Diagnostics 0x8104 Deviating set / actual configuration
2 / 3 WORD
4/5
0 Diagnostics data will follow at the end 1 API will follow at the end
6 / 7 DWORD 0x00 0x00
8 / 9 0x00 0x00
Length of the version in bytes including
BYTE 0x01
BYTE
Database contents
Length of the data sets in bytes
Version (major) = 1
Version (minor)
API = 0
Only available in version 1,1
The process type API has a data length of 4 bytes. Depending on the version of the data set, the diagnostics data follow with Byteoffset 6 (Version 1.0) or Byteoffset 10 (Version 1.1). However, the description of the diagnostics data in the sub-chapters - depending on the BlockType - begins back with Byteoffset 0.
3.1.7.2.1 Channel Specific Diagnostics
Errors occurring when configuring and setting the parameters of the station (I/O device) and the connected I/O modules as well as external errors from the connected periphery are reported by the coupler via channel specific diagnostics. External errors reported by the subassemblies (e.g. short circuits, line interruptions) are only transmitted to the I/O controller after release when setting the module's parameters.
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The BlockType in the head structure of the data set corresponds to the value for the channel diagnostics (0x0010). The length defines the following diagnostics data for faulty sub-modules or channels.
The data for the channel diagnostics is triggered using a general structure (see ChannelDiagnosis or ExtChannelDiagnosis), which is followed by the fault indication of the respective channels. The general structure has a length of 10 bytes and is composed of as follows:
Byte­offset
Data type
0 / 1 WORD
2 / 3 WORD 0x00 0x01
4 / 5 WORD 0x80 0x00
6 / 7
8 / 9 WORD
Range
BYTE 0x08
BYTE 0x00
0x8000 Channel Diagnostics
0x8002 Extended channel diagnostics
Description
Module slot for the alarm source
0 ... 128
Sub-module slot for the alarm source = 1
ID of the alarm source = sub module (0x8000)
Fault type = upcoming fault (0x08)
Reserved (0x00)
Fault type = diagnostics for the sub module
As already mentioned, special data sets of faulty sub-modules or channels are following the general structure. This information may be repeated depending on how many different fault messages exist for the channels of a sub-module. The number of existing channel diagnostics data sets can be determined using the length indicated in the head structure.
The following sub-chapters describe the standardized and extended channel diagnostics information that is supported by the coupler.
3.1.7.2.1.1 Channel Diagnostics
The channel diagnostics is set by the coupler when external channel faults occur (e.g. short circuits or overvoltage). These types of faults are defined in the PROFINET IO specification.
The fault type (SubStructureDefined) contains the value for channel diagnostics (0x8000).
Each fault of a signal channel or sub-module is described in a data set (see ChannelDiagnosisData). The structure of the data set has 6 bytes and is composed of as follows:
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Byte offset
Data type
0 / 1 WORD
BYTE
2 / 3
BYTE
4 / 5 WORD
2
'000' reserved '001' Input channel '010' Output channel '011' Input / Output channel
0x00 User defined data format 0x01 Bit 0x02 2 Bit 0x03 4 Bit 0x04 Byte 0x05 Word 0x06 Double word 0x07 2 double words
0x08
0x0000 Reserved, not specified 0x0001 Short circuit 0x0002 Low voltage 0x0003 High voltage 0x0004 Overload 0x0005 Over temperature 0x0006 Wire Break 0x0007 Upper limit value exceeded 0x0008 Lower limit value exceeded 0x0009 Fault
0x000A
0x0010 Faulty parameter setting 0x0011 Faulty voltage supply 0x0012 Fuse fault 0x0013 Receiver buffer overflow 0x0014 Ground fault 0x0015 Reference point is no longer available 0x0016 Sampling fault 0x0017 Threshold value undershot / overshot 0x0018 Output deactivated 0x0019 Safety relevant fault 0x001A External fault 0x001B Frame fault
0x001D
0x001F Module fault
Description
Alarm source
Channel 0 … 7
0x0000 ... 0x0
Fault- / Channel type
2
0
2
... 2
4
, 23 Fault type = upcoming fault = 1
7
5
2
... 2
007
0x8000
Sub-module
reserved
Channel type
'100'
reserved
reserved
Reserved
Cycle time fault
Manufacturer specific
Data format
Fault type
0xFF
0x000F
0x00
0x001E
...
'111'
...
...
1C
...
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D
Diagnostics
Byte offset
Data type
0x0020
0x0040 Wrong F Address of the PROFIsafe I/O
0x0041 Invalid F Address of the PROFIsafe
0x0042 Wrong F Address of the I/O Controller
0x0043 Invalid F Address of the I/O Controller
0x0044 SIL class is not supported 0x0045 Wrong F-CRC length 0x0046 Wrong version of the F parameter set. 0x0047 Invalid CRC of the F parameter set
0x0048
0x0100
0x8000
Description
...
0x003F
...
0x00FF
...
0x7FFF
...
0xFFFF
Reserved
module (F-Slave)
I/O module (F-Slave)
(F-Host)
(F-Host)
Reserved
Manufacturer specific
Reserved
3.1.7.2.1.2 Fault Types of I/O Modules with Diagnostics Capability
The fault numbers 0x0000 / 0 to 0x000F / 15 contain standard messages. The allocated meaning of fault numbers 0x001B / 27 to 0x001F / 31 are recommended in the specification. Starting with fault number 0x0020 / 32, the associated fault messages are reserved or can be used according to the manufacturer specifications.
Fault number Significance
0x0000 / 0 Reserved, not specified 0x0001 / 1 Short circuit 0x0002 / 2 Low voltage 0x0003 / 3 High voltage 0x0004 / 4 Overload 0x0005 / 5 Over temperature 0x0006 / 6 Wire Break 0x0007 / 7 Upper limit value exceeded 0x0008 / 8 Lower limit value undershot 0x0009 / 9 Fault
S T A N D A R D I Z E D
0x000A / 10
...
0x000F / 15 0x0010 / 16 Configuration fault 0x0011 / 17 Transmitter or load voltage missing 0x0012 / 18 Fuse fault 0x0013 / 19 free 0x0014 / 20 Ground fault
Q U A S I S T A
N D A R D I Z E
0x0015 / 21 Reference channel fault
reserved
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Fault number Significance
R E S E R
0x0016 / 22 Sampling fault 0x0017 / 23 Threshold value undershot / overshot 0x0018 / 24 Output deactivated
0x0019 / 25 Safety relevant fault 0x001A / 26 External fault 0x001B / 27 Free 0x001C / 28 Fault PROFIsafe I/O module 0x001D / 29
...
0x001E / 30
0x001F / 31 Missing configuration
0x0020 / 32
V E D
...
0x003F / 64
0x0040 Wrong F-device address 0x0041 Invalid F-device address 0x0042 Wrong F-Host address 0x0043 Invalid F-Host address
0x0044 SIL class not supported
free
Reserved
0x0045 Wrong F CRC length
0x0046 Wrong version of the F_parameter set.
S T A N D A R D I Z E D
R E S E R
0x0100 / 256 Internal bus fault
R E S E R V E D
0x0047 Invalid CRC of the F-parameter set
0x0048 / 72
V E D
...
0x00FF / 255
0x0101 / 257
...
0x7FFF /
32767
0x8000 / 32768
...
0xFFFF /
65535
Reserved
Manufacturer specific
Reserved
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3.1.7.2.2 Fault Cases of I/O Modules with Diagnostics Capability
Article number
75x-418, 75x-419, 75x-421
75x-425
750-506
750-507, 750-532, 750-537
750-522, 750-523
750-460, 750-461, 750-469
750-452, 750-465, 750-467, 750-468, 750-472, 750-475, 750-477
750-453, 750-454, 750-455, 750-456, 750-457, 750-459, 750-466, 750-474, 750-476, 750-478, 750-479, 750-480, 750-483, 750-485, 750-492
750-491
Data
format
BIT
BIT
BIT
BIT
BIT
WORD
WORD
WORD
WORD
Fault type Significance
0x1A / 26 External fault Short circuit of the transmitter power supply
0x1A / 26 External fault Signal line to transmitter interrupted or short
circuited
0x01 / 1 0x02 / 2 0x06 / 6
Short circuit Overvoltage Line break fault
Signal output short circuited Field voltage to the signal output inadequate Signal line to the actuator interrupted or not connected
0x1A / 26 External fault Short circuit of the signal output against
+24 V or GND, signal line to the actuator is interrupted or not connected or excess temperature through overloading.
0x1A / 26 External fault External fault (broken wire, overload or short
circuit, manual operation)
0x06 / 6 0x08 / 8
0x09 / 9
0x07 / 7
0x09 / 9
0x07 / 7
0x08 / 8
0x09 / 9
0x03 / 3 0x07 / 7
0x09 / 9
Broken wire Lower limit value undershot Fault
Upper limit value exceeded Fault
Upper limit value exceeded Lower limit value undershot Fault
Overvoltage Upper limit value exceeded Fault
Signal line to transmitter interrupted Measurement range shortfall or signal line to the transmitter has a short circuit Internal fault (e.g. hardware)
Measurement range overflow Internal fault (e.g. hardware fault)
Measurement range overflow of the input signal Measurement range shortfall of the input signal Internal fault (e.g. hardware fault)
Measurement range overflow of the input signal Internal fault (e.g. hardware fault)
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Article number
750-553, 750-555, 750-557, 750-559, 750-560
750-610, 750-611
750-630
750-635
750-637
750-641
750-642, 750-650, 750-651, 750-653
Data
format
WORD
BIT
DWORD
OTHER
OTHER
OTHER
OTHER
Fault type Significance
0x09 / 9 Fault Output short circuit
Internal fault (e.g. hardware fault)
0x11 / 17
0x12 / 18
0x16 / 22
0x1A / 26
Transmitter or load voltage missing Fuse defective
Sampling fault
External fault
Field voltage too low or not present Fuse defective or not present
An incorrect data frame exists, i.e. the data frame is not terminated with zero (possible wire break of clock lines). SSI has no power supply or data line break, or D+ and D- have been inverted.
0x09 / 9 Fault Wave speed has not been set
or inadequate stop impulse or the maximum wave speed has been exceeded or timeout, no measurement values exist, measurement value is invalid or fault when setting the wave speed or zero point has occurred or invalid transmitter selection, the selected transmitter address is invalid because of the missing initialization
0x09 / 9 Fault
0x09 / 9
0x1A / 26
Fault External fault
General module faults such as POST of the internal flash memory, DALI bus faults (continuous short circuit or open circuit), however, no faulty electronic ballasts.
0x07 / 7 Upper limit value
exceeded
The receiver buffer is completely full, there is a danger of loss of data
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Article number
750-661, 750-662, 750-667
Data
format
BIT
OTHER
Fault type Significance
0x18 / 24 Fault PROFIsafe
I/O module
0x40 / 64
0x41 / 65 Invalid
0x42 / 66 Wrong
0x43 / 67 Invalid
Wrong F-Host address
F-device address
F-Host address
F-Host address
There is an external fault on and input or output channel. The detailed cause of fault can be determined using the record data set of the module (see also documentation on PROFIsafe I/O modules).
There is a module fault, e.g. program sequence fault. The detailed cause of a fault can be determined using the record data set of the module (see also documention on PROFIsafe I/O modules).
The F-device address set by the I/O module differs from the addresses set during configuration.
The F-device address has been configured with 0 or 65535.
The F-Host address set during projection differs.
The F-Host address has been configured with 0 or 65535.
0x44 / 68 SIL class
not supported
0x45 / 69 Wrong
F-CRC length
0x46 / 70 Wrong
version of the F-parameter set.
0x47 / 71 Invalid CRC of the
F-parameter set
0x01 / 1 Short curcuit
0x19 / 25 Safety shutdown
0x1B / 27 Short circuit after
VCC
0x1C / 28 Short circuit after
GND
0x1E / 30 Discrepancy time
exceeded
One SIL class has been configured that is not supported by the F-device.
An F-CRC length unequal to 2 bytes has been configured.
An F-parameter set version unequal to PROFIsafe V2 has been configured.
The F-parameter set is inconsistant.
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3.1.7.2.2.1 Extended Channel Diagnostics
The buscoupler uses the extended channel diagnostics to signal internal bus, configuration and parameter setting faults. According to the PROFINET IO standard, extended fault information must be expressed according to the manufacturer specifications.
The fault type (UserstructureIdentifier) has the value for the extended channel diagnostics (0x8002).
The structure for the data set (see ExtChannelDiagnosisData) has 12 bytes and is composed of as follows:
Byte offset
10 / 11
Data type
WORD
0 / 1
BYTE
2 / 3
4 / 5 WORD
6 / 7 WORD
8 / 9 DWORD
BYTE
2 2 2 '000' reserved '001' Input channel '010' Output channel '011' Input / Output channel
'100'
0x00 User defined data format 0x01 Bit 0x02 2 Bit 0x03 4 Bit 0x04 Byte 0x05 Word 0x06 Double word 0x07 2 double words
0x08
0x0000 reserved, not spesified 0x0010 Faulty parameter setting 0x001F Missing configuration 0x0100 Internal data bus fault
Description
Alarm source
0x0000 ... 0x0007
Fault- / Channel type
2
... 20 reserved
4
, 23 Fault type = upcoming fault = 1
7
... 25 Channel type
Data format
Fault type
Extended fault type
Additional value
0x8000
0x0000
0xFFFF
Channel 0 … 7 Sub-module
...
'111'
...
reserved
0xFF
Extended fault description
...
Additional fault description
reserved
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The following tables describe the possible fault messages that are based on the combination of fault type, extended fault type and additional value. The “xx” symbols used for some additional values represent the signal channel (0x0000 ... 0x0007) where the fault has been detected.
The faults described in the following table are faults occurring when configuring both the station substitute (buscoupler) and the modules (I/O modules). Configuration faults are coded using fault type 0x0010 in accordance with the PROFINET IO standard.
Fault type “Configuration fault” (0x0010)“
Extended fault type
0x0001 0xC0018001 The module type (Identifier) is not recognized.
0x0002 0xC0018002 The module type (Identifier) is invalid.
0x0003 0xC0018003 The status of the module is not allowed during configuration.
0x0004 0xC0018004 The length of the configuration data for the module is smaller
0x0005 0xC0018005 The length of the configuration data for the module is larger
0x0006 0xC0018006 The received configuration data for the module is not
0x0007 0xC0018007 The characteristics (Property) for the module are not
0x0008 0xC0018008 The reserved module parameter have an invalid value.
0x000A 0xC001800A Parameters are not permissible.
0x000B 0xC001800B Index of dataset is not allowed.
0x000C 0xC001800C Error when accessing module registers
0x000D 0xC001800D Data length is invalid when accessing module registers.
Additional value
Description
than expected.
than expected.
supported.
supported.
0x0010 0xC0018010 The substitute value behavior for the inputs of the module are
not supported.
0x0011 0xC0018011 The substitute value behavior for the inputs of the module is
not allowed.
0x0014 0xC0018014 The reserved input parameters of the module have an invalid
value.
0x0020 0xC0018020 The substitute value behavior for the outputs of the module
are not supported
0x0021 0xC0018021 The substitute value behavior for the output of the module is
not allowed.
0x0024 0xC0018024 The reserved output parameters of the module have an
invalid value.
0x0030 0xC0018030 The combination of input and diagnostics is not supported in
the process image.
0x0031 0xC0018031 The combination of input and diagnostics is not allowed in
the process image.
WAGO-I/O-SYSTEM 750 PROFINET IO
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PROFINET IO 750-370 99 Diagnostics
Fault type “Configuration fault” (0x0010)“
Extended fault type
Additional value
Description
0x0032 0xC0018032 The bit offset for the output of the module is not allowed.
0x0033 0xC0018033 The bit offset for the diagnostics of the module exceeds the
maximum offset.
0x0034 0xC0018034 The reserved diagnostics parameters of the module have an
invalid value.
0x0035 0xC0018035 The diagnostics connection of the module is aborted.
0x0051 0xC001xx51 The reserved channel parameter of the module has an invalid
value.
0x0060 0xC001xx60 The substitute value for the input channel of the module is
not allowed.
0x0061 0xC001xx61 The substitute value for the input channel of the module
exceeds its maximum.
0x0062 0xC001xx62 The substitute value for the input channel of the module falls
below its minimum.
0x0070 0xC001xx70 The substitute value for the output channel of the module is
not allowed.
0x0071 0xC001xx71 The substitute value for the output channel of the module
exceeds its maximum.
0x0072 0xC001xx72 The substitute value for the output channel of the module
falls below its minimum.
0x0080 0xC001xx80 The substitute value for the output channel of the module is
not allowed.
0x0081 0xC001xx81 The connection of the channel diagnostics of the module is
not allowed.
0x0090 0xC0018090 The status of the station during the configuration is not
allowed.
0x0091 0xC0018091 The length of the configuration data for the station is smaller
than expected.
0x0092 0xC0018092 The length of the configuration data for the station is larger
than expected.
0x0093 0xC0018093 The reserved station parameters (Table 0, register 0) have
invalid values.
0x0094 0xC0018094 The reserved station parameters (Table 0, register 1) have
invalid values.
0x0095 0xC0018095 The register access (Table 0, register 1) is not allowed.
0x0096 0xC0018096 The setting of the diagnostics channel (Table 0, register 1) is
not allowed.
0x0097 0xC0018097 The reserved station parameters (Table 0, register 2) have
invalid values.
0x0098 0xC0018098 The settings for the internal data bus extension (Table 0,
WAGO-I/O-SYSTEM 750 PROFINET IO
register 2) is not allowed.
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100 • PROFINET IO 750-370 Diagnostics
Fault type “Configuration fault” (0x0010)“
Extended fault type
Additional value
Description
0x0099 0xC0018099 The reserved station parameters (Table 0, register 3) have
invalid values.
0x009A 0xC001809A The connection for creating the process image (Table 0,
register 3) is deactivated.
0x009B 0xC001809B The algorithm for creating the process image (Table 0,
register 3) is not allowed.
0x009C 0xC001809C The integration of control and status data of complex
modules (Table 0, register 3) is activated.
0x009D 0xC001809D Formatting of complex module data (Table 0, register 3) is
not allowed.
0x009E 0xC001809E Formatting of digital module data (Table 0, register 3) is not
allowed.
0x009F 0xC001809F The data allocation (Table 0, register 3) is not allowed (neither
bytes nor words).
0x00A0 0xC00180A0 The setting for updating the input data (Table 0, register 3) is
not allowed (not asynchronous).
0x00A1 0xC00180A1 The setting for updating the output data (Table 0, register 3)
is not allowed (not asynchronous).
0x00A2 0xC00180A2 The settings for the behavior of fieldbus faults (Table 0,
register 3) is not allowed.
0x00A3 0xC00180A3 The settings for the behavior of internal data bus faults
(Table 0, register 3) is not allowed.
0x00A4 0xC00180A4 The settings for activating the diagnostics (Table 0, register
3) is not allowed.
0x00A5 0xC00180A5 The linking of the diagnostics data to the process image
(Table 0, register 3) is activated.
0x00A6 0xC00180A6 The reserved station parameters (Table 0, register 4) have
invalid values.
... ...
...
0x00B2 0xC00180B2 The reserved station parameters (Table 0, register 4) have
invalid values.
0x00B3 0xC00180B3 The reserved station parameter (Table 100, register 75) have
invalid values.
0x00B4 0xC00180B4 The module setting (Table 100, register 75) is not allowed.
0x00B5 0xC00180B5 The reserved station parameter (Table 100, register 76) have
invalid values.
0x00B6 0xC00180B6 The reserved station parameter (Table 100, register 77) have
invalid values.
0x00B7 0xC00180B9 The setting for the behavior of PROFINET IO faults (stop
internal data bus) when using PROFIsafe modules is not allowed.
WAGO-I/O-SYSTEM 750 PROFINET IO
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