WAGO 750-370 User Manual
Modular I/O-System
Fieldbus Coupler
PROFINET IO
750-370
Manual
Technical description,
installation and configuration
Version 1.0.0
ii • Table of Contents
Copyright © 2009 by WAGO Kontakttechnik GmbH & Co. KG
All rights reserved..
WAGO Kontakttechnik GmbH & Co. KG
Hansastraße 27
D-32423 Minden
Phone: +49 (0) 571/8 87 – 0
Fax: +49 (0) 571/8 87 – 1 69
E-Mail: info@wago.com
Web: http://www.wago.com
Technical Support
Phone.: +49 (0) 571/8 87 – 5 55
Fax: +49 (0) 571/8 87 – 85 55
E-Mail: support@wago.com
Every conceivable measure has been taken to ensure the correctness and
completeness of this documentation. However, as errors can never be fully
excluded we would appreciate any information or ideas at any time.
E-Mail: documentation@wago.com
We wish to point out that the software and hardware terms as well as the
trademarks of companies used and/or mentioned in the present manual are
generally trademark or patent protected.
WAGO-I/O-SYSTEM 750
PROFINET IO
Table of Contents • iii
Table of Contents
1 Important Notes ..........................................................................................9
1.1 Legal Bases...............................................................................................9
1.1.1 Copyright............................................................................................. 9
1.1.2 Personnel Qualifications......................................................................9
1.1.3 Use of the 750 Series in Compliance with Underlying Provisions ... 10
1.1.4 Technical Condition of Specified Devices ........................................10
1.2 Standards and Guidelines for Operating the 750 Series.........................11
1.3 Symbols.................................................................................................. 12
1.4 Safety Information.................................................................................. 13
1.5 Font Conventions ...................................................................................14
1.6 Number Notation....................................................................................14
1.7 Scope ...................................................................................................... 14
1.8 Abbreviation...........................................................................................15
2 The WAGO-I/O-SYSTEM 750................................................................ 16
2.1 System Description.................................................................................16
2.2 Technical Data........................................................................................ 17
2.3 Manufacturing Number ..........................................................................23
2.4 Component Update.................................................................................24
2.5 Storage, Assembly and Transport .......................................................... 24
2.6 Mechanical Setup ...................................................................................25
2.6.1 Installation Position ........................................................................... 25
2.6.2 Total Expansion.................................................................................25
2.6.3 Assembly onto Carrier Rail ...............................................................26
2.6.3.1 Carrier Rail Properties ..................................................................26
2.6.3.2 WAGO DIN Rail ..........................................................................27
2.6.4 Spacing .............................................................................................. 27
2.6.5 Plugging and Removal of the Components .......................................28
2.6.6 Assembly Sequence........................................................................... 29
2.6.7 Internal Bus/Data Contacts................................................................30
2.6.8 Power Contacts.................................................................................. 31
2.6.9 Wire Connection................................................................................32
2.7 Power Supply .........................................................................................33
2.7.1 Isolation ............................................................................................. 33
2.7.2 System Supply ...................................................................................34
2.7.2.1 Connection .................................................................................... 34
2.7.2.2 Alignment .....................................................................................35
2.7.3 Field Supply....................................................................................... 37
2.7.3.1 Connection .................................................................................... 37
2.7.3.2 Fusing............................................................................................ 38
2.7.4 Supplementary Power Supply Regulations .......................................41
2.7.5 Supply Example................................................................................. 42
2.7.6 Power Supply Unit............................................................................. 43
2.8 Grounding............................................................................................... 44
2.8.1 Grounding the DIN Rail .................................................................... 44
2.8.1.1 Framework Assembly ...................................................................44
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iv • Table of Contents
2.8.1.2 Insulated Assembly.......................................................................44
2.8.2 Grounding Function........................................................................... 45
2.8.3 Grounding Protection ........................................................................46
2.9 Shielding (Screening)............................................................................. 47
2.9.1 General............................................................................................... 47
2.9.2 Bus Conductors.................................................................................. 47
2.9.3 Signal Conductors.............................................................................. 47
2.9.4 WAGO Shield (Screen) Connecting System.....................................48
2.10 Assembly Guidelines/Standards.............................................................48
3 Fieldbus Coupler .......................................................................................49
3.1 PROFINET IO 750-370 ......................................................................... 49
3.1.1 Description......................................................................................... 49
3.1.2 Hardware............................................................................................50
3.1.2.1 View..............................................................................................50
3.1.2.2 Power Supply ................................................................................ 51
3.1.2.3 Fieldbus Connection ..................................................................... 52
3.1.2.4 Display Elements ..........................................................................53
3.1.2.5 Configuration Interface.................................................................54
3.1.3 I/O Device Configuration ..................................................................55
3.1.3.1 GSD File .......................................................................................55
3.1.3.2 Configuration ................................................................................56
3.1.3.2.1 Configuring Digital I/O Modules.............................................56
3.1.3.2.2 Configuring Analog I/O Modules ............................................61
3.1.3.2.3 Configuring Specialty Modules ...............................................63
3.1.3.3 Parameter Setting.......................................................................... 65
3.1.3.3.1 Station Parameters.................................................................... 65
3.1.3.3.2 Standard Module Parameters ...................................................67
3.1.3.3.3 Fault Safe Module Parameters (F-Parameters) ........................68
3.1.3.3.4 Channel Parameters.................................................................. 69
3.1.3.4 Station Naming ............................................................................. 70
3.1.3.4.1 Device Name Assignment via Configuration Tool..................70
3.1.3.4.2 Device Name Assignment via DIP Switch Settings.................70
3.1.4 Initialization Phase of the Fieldbus Coupler......................................71
3.1.5 Process Image .................................................................................... 72
3.1.5.1 Local Process Image .....................................................................72
3.1.5.2 Allocation of the Input and Output Data....................................... 73
3.1.5.2.1 Digital Input Modules ..............................................................74
3.1.5.2.2 Digital Output Modules............................................................75
3.1.5.2.3 Analog Input Modules.............................................................. 78
3.1.5.2.4 Analog Output Modules...........................................................79
3.1.5.2.5 Specialty Modules....................................................................80
3.1.5.2.5.1 Meter and Position Transmitter Interfaces ..........................80
3.1.5.2.5.2 Pulse Width Output Module................................................82
3.1.5.2.5.3 Serial Interfaces and Gateways ...........................................83
3.1.5.2.5.4 PROFIsafe I/O Modules...................................................... 84
3.1.5.2.6 System Modules ....................................................................... 84
3.1.5.2.6.1 Potential Supply Modules....................................................84
3.1.5.3 Example ........................................................................................ 85
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Table of Contents • v
3.1.5.4 Establishing the Connection .........................................................87
3.1.6 Configuration and Parameter Setting of I/O Modules.......................87
3.1.7 Diagnostics ........................................................................................ 88
3.1.7.1 Diagnostics Data Sets ................................................................... 88
3.1.7.2 Structure of the Standardized Diagnosis Data Sets ...................... 88
3.1.7.2.1 Channel Specific Diagnostics ..................................................89
3.1.7.2.1.1 Channel Diagnostics............................................................90
3.1.7.2.1.2 Fault Types of I/O Modules with Diagnostics Capability... 92
3.1.7.2.2 Fault Cases of I/O Modules with Diagnostics Capability........94
3.1.7.2.2.1 Extended Channel Diagnostics............................................97
3.1.7.2.3 Difference between Target and Actual Configuration........... 103
3.1.7.2.4 Data Set for Identification and Servicing Purposes (I&M 0). 105
3.1.8 Acyclic Communication using Record Data Sets............................106
3.1.8.1 Data Set Detail diagnostics for PROFIsafe I/O Modules ...........106
3.1.9 Information about the Web-Based Management System (WBM) .. 108
3.1.10 SNMP configuration........................................................................113
3.1.10.1 Settings via WBM....................................................................... 113
3.1.10.2 MIB II description ......................................................................115
3.1.10.2.1 Standard traps.........................................................................116
3.1.11 LED Indication ................................................................................ 117
3.1.11.1 Blink Code ..................................................................................117
3.1.11.2 Fieldbus Status............................................................................ 118
3.1.11.3 Node Status - 'I/O' LED Blinking Code......................................119
3.1.11.4 'I/O' LED Error Messages........................................................... 121
3.1.11.5 Status Supply voltage.................................................................. 126
3.1.12 Error Response ................................................................................127
3.1.12.1 Fieldbus Failure .......................................................................... 127
3.1.12.2 Internal Bus Failure ....................................................................127
3.1.13 Technical Data.................................................................................128
4 Fieldbus Communication .......................................................................129
4.1 ETHERNET ......................................................................................... 129
4.1.1 General............................................................................................. 129
4.1.2 Network Architecture – Principles and Regulations ....................... 131
4.1.2.1 Transmission Media....................................................................132
4.1.2.2 Network Topologies.................................................................... 134
4.1.2.3 Coupler Modules......................................................................... 137
4.1.2.4 Transmission Mode..................................................................... 138
4.1.2.4.1 Static Configuration of the Transmission Mode .................... 138
4.1.2.4.2 Dynamic Configuration of the Transmission Mode...............138
4.1.2.4.3 Errors Occurring when Configuring the Transmission Mode139
4.1.2.5 Important Terms..........................................................................139
4.1.3 Network Communication.................................................................142
4.1.3.1 Protocol layer model ...................................................................142
4.1.3.2 Communication Protocols........................................................... 144
4.1.3.2.1 ETHERNET ...........................................................................145
4.1.3.2.1.1 Channel access method......................................................146
4.1.3.2.2 IP-Protocol ............................................................................. 146
4.1.3.2.2.1 RAW IP ............................................................................. 150
4.1.3.2.2.2 IP Multicast ....................................................................... 151
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4.1.3.2.3 TCP Protocol.......................................................................... 151
4.1.3.2.4 UDP........................................................................................152
4.1.3.2.5 ARP ........................................................................................152
4.1.3.3 Administration and Diagnosis Protocols ....................................153
4.1.3.3.1 BootP (Bootstrap Protocol).................................................... 153
4.1.3.3.2 HTTP (Hyper Text Transfer Protocol)...................................155
4.1.3.3.3 DHCP (Dynamic Host Configuration Protocol) ....................155
4.1.3.3.4 DNS (Domain Name Systems)...............................................156
4.1.3.3.5 SNTP-Client (Simple Network Time Protocol).....................156
4.1.3.3.6 FTP-Server (File Transfer Protocol) ......................................157
4.1.3.3.7 SMTP (Simple Mail Transfer Protocol)................................. 158
4.1.3.4 Application Protocols..................................................................159
4.2 PROFINET........................................................................................... 160
4.2.1 Description....................................................................................... 160
4.2.2 Cabling............................................................................................. 161
5 I/O Modules .............................................................................................162
5.1 Overview ..............................................................................................162
5.1.1 Digital Input Modules...................................................................... 162
5.1.2 Digital Output Modules................................................................... 164
5.1.3 Analog Input Modules..................................................................... 165
5.1.4 Analog Output Modules ..................................................................167
5.1.5 Special Modules ..............................................................................168
5.1.6 System Modules...............................................................................170
5.2 Structure of the PROFINET IO Process Data......................................171
5.2.1 Digital Input Modules...................................................................... 171
5.2.1.1 2 DI Modules ..............................................................................171
5.2.1.2 2 DI Modules with Diagnostics ..................................................171
5.2.1.3 4 DI Modules ..............................................................................172
5.2.1.4 8 DI Modules ..............................................................................172
5.2.1.5 16 DI Modules ............................................................................172
5.2.2 Digital Output Modules................................................................... 173
5.2.2.1 2 DO Modules............................................................................. 173
5.2.2.2 2 DO Modules with Diagnostics.................................................173
5.2.2.3 4 DO Modules............................................................................. 174
5.2.2.4 4 DO Modules with Diagnostics.................................................174
5.2.2.5 8 DO Modules............................................................................. 174
5.2.2.6 8 DO Modules with Diagnostics.................................................174
5.2.2.7 16 DO Modules........................................................................... 175
5.2.3 Analog Input Modules..................................................................... 176
5.2.3.1 2 AI Modules ..............................................................................176
5.2.3.2 3 AI Modules ..............................................................................177
5.2.3.3 4 AI Modules ..............................................................................178
5.2.4 Analog Output Modules ..................................................................179
5.2.4.1 2 AO Modules............................................................................. 179
5.2.4.2 4 AO Modules............................................................................. 180
5.2.5 Specialty Modules ........................................................................... 181
5.2.5.1 Counter Modules......................................................................... 181
5.2.5.2 PWM Modules............................................................................ 182
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5.2.5.3 Stepper Motor Control ................................................................ 183
5.2.5.4 SSI Transmitter Interface............................................................ 184
5.2.5.5 Incremental Encoder Interface.................................................... 185
5.2.5.6 Digital Impulse Interface ............................................................185
5.2.5.7 Serial Interfaces ..........................................................................186
5.2.5.8 Data Exchange Module............................................................... 187
5.2.5.9 DALI/DSI Master ....................................................................... 188
5.2.5.10 ENOCEAN Receiver Module.....................................................188
5.2.6 Safety I/O Modules PROFIsafe....................................................... 189
5.2.7 System Modules ..............................................................................189
5.2.7.1 Supply Modules .......................................................................... 189
5.3 Configuration and Parameter Setting of the Modules..........................190
5.3.1 Digital I/O Modules.........................................................................190
5.3.1.1 2-Channel Digital Input Modules ...............................................190
5.3.1.2 2-Channel Digital Input Modules with 1 Bit Diagnostics Status per
Channel .......................................................................................191
5.3.1.3 4-Channel Digital Input Modules ...............................................193
5.3.1.4 8-Channel Digital Input Modules ...............................................194
5.3.1.5 16-Channel Digital Input Modules .............................................195
5.3.2 Digital Output Modules................................................................... 196
5.3.2.1 2-Channel Digital Output Modules.............................................196
5.3.2.2 2 (1)-Channel Digital Output Modules with 1 Bit Diagnostics
Status per Channel ......................................................................198
5.3.2.3 2 (1)-Channel Digital Output Modules with 2 Bit Diagnostics
Status per Channel ......................................................................201
5.3.2.4 4-Channel Digital Output Modules.............................................204
5.3.2.5 4-Channel Digital Output Modules with 1 Bit Diagnostics Status
per Channel .................................................................................206
5.3.2.6 8-Channel Digital Output Modules.............................................209
5.3.2.7 8-Channel Digital Output Modules with 1 Bit Diagnostics Status
per Channel .................................................................................211
5.3.2.8 16-Channel Digital Output Modules...........................................214
5.3.2.9 2-Channel Digital Input Modules with 1 Bit Diagnostics Status
and Confirmation per Channel....................................................216
5.3.3 Analog Input Modules..................................................................... 220
5.3.3.1 2-Channel Analog Input Modules...............................................220
5.3.3.2 4-Channel Analog Input Modules...............................................222
5.3.4 Analog Output Modules ..................................................................225
5.3.4.1 2-Channel Analog Output Modules ............................................225
5.3.4.2 4-Channel Analog Output Modules ............................................227
5.3.5 Specialty Modules ........................................................................... 230
5.3.5.1 Counter Modules......................................................................... 230
5.3.5.2 PWM Module.............................................................................. 232
5.3.5.3 SSI Transmitter Interface............................................................ 234
5.3.5.4 Incremental Encoder Interface.................................................... 236
5.3.5.5 Digital Impulse Interface ............................................................237
5.3.5.6 Serial Interfaces and Data Exchange Module............................. 238
5.3.5.7 Data Exchange Module............................................................... 239
5.3.5.8 ENOCEAN Receiver Module..................................................... 241
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viii • Table of Contents
5.3.5.9 DALI/DSI Master ....................................................................... 242
5.3.6 PROFIsafe Safety Modules .............................................................243
5.3.7 System Modules...............................................................................245
5.3.7.1 Supply Modules with 2 Bit Diagnostics Status .......................... 245
6 Use in Hazardous Environments ...........................................................247
6.1 Identification ........................................................................................247
6.1.1 For Europe according to CENELEC and IEC ................................. 247
6.1.2 For America according to NEC 500 ................................................ 248
6.2 Installation Regulations........................................................................249
6.2.1 ANSI/ISA 12.12.01 .........................................................................250
6.2.2 TÜV Nord Ex-i applications........................................................... 251
6.2.3 ATEX and IEC Ex........................................................................... 252
7 Appendix ..................................................................................................253
7.1 MIB-II Groups...................................................................................... 253
7.1.1 System Group .................................................................................. 253
7.1.2 Interface Group................................................................................253
7.1.3 IP Group...........................................................................................255
7.1.4 IpRoute table.................................................................................... 256
7.1.5 ICMP Group .................................................................................... 257
7.1.6 TCP Group.......................................................................................258
7.1.7 UDP Group ......................................................................................259
7.1.8 SNMP Group ...................................................................................259
8 List of Literature.....................................................................................261
9 Index......................................................................................................... 262
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Important Notes • 9 Legal Bases
1 Important Notes
This section includes an overall summary of the most important safety
requirements and notes that are mentioned in each individual section. To
protect your health and prevent damage to devices as well, it is imperative to
read and carefully follow the safety guidelines.
1.1 Legal Bases
1.1.1 Copyright
This Manual, including all figures and illustrations, is copyright-protected.
Any further use of this Manual by third parties that violate pertinent copyright
provisions is prohibited. Reproduction, translation, electronic and
phototechnical filing/archiving (e.g., photocopying) as well as any
amendments require the written consent of WAGO Kontakttechnik GmbH &
Co. KG, Minden, Germany. Non-observance will involve the right to assert
damage claims.
WAGO Kontakttechnik GmbH & Co. KG reserves the right to provide for any
alterations or modifications that serve to increase the efficiency of technical
progress. WAGO Kontakttechnik GmbH & Co. KG owns all rights arising
from the granting of patents or from the legal protection of utility patents.
Third-party products are always mentioned without any reference to patent
rights. Thus, the existence of such rights cannot be excluded.
1.1.2 Personnel Qualifications
The use of the product described in this Manual requires special personnel
qualifications, as shown in the following table:
Activity Electrical specialist
Assembly
Commissioning
Programming
Maintenance
Troubleshooting
X X
X X
X
X X
X
Instructed
personnel*)
Specialists**) having
qualifications in PLC
programming
Disassembly
*) Instructed persons have been trained by qualified personnel or electrical specialists.
**) A specialist is a person, who – thanks to technical training – has the qualification, know ledge and expertise to meet the required specifications of this work and to identify any po tential hazardous situation in the above listed fields of activity.
WAGO-I/O-SYSTEM 750
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X X
10 • Important Notes
Legal Bases
All responsible persons have to familiarize themselves with the underlying
legal standards to be applied. WAGO Kontakttechnik GmbH & Co. KG does
not assume any liability whatsoever resulting from improper handling and
damage incurred to both WAGO´s own and third-party products by
disregarding detailed information in this Manual.
1.1.3 Use of the 750 Series in Compliance with Underlying
Provisions
Couplers, controllers and I/O modules found in the modular WAGO-I/OSYSTEM 750 receive digital and analog signals from sensors and transmit
them to the actuators or higher-level control systems. Using programmable
controllers, the signals can also be (pre-)processed.
The components have been developed for use in an environment that meets
the IP20 protection class criteria. Protection against finger injury and solid
impurities up to 12.5 mm diameter is assured; protection against water damage
is not ensured. Unless otherwise specified, operation of the components in wet
and dusty environments is prohibited.
1.1.4 Technical Condition of Specified Devices
The components to be supplied Ex Works, are equipped with hardware and
software configurations, which meet the individual application requirements.
Changes in hardware, software and firmware are permitted exclusively within
the framework of the various alternatives that are documented in the specific
manuals. WAGO Kontakttechnik GmbH & Co. KG will be exempted from
any liability in case of changes in hardware or software as well as to noncompliant usage of components.
Please send your request for modified and new hardware or software
configurations directly to WAGO Kontakttechnik GmbH & Co. KG.
WAGO-I/O-SYSTEM 750
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Important Notes • 11 Standards and Guidelines for Operating the 750 Series
1.2 Standards and Guidelines for Operating the 750 Series
Please adhere to the standards and guidelines required for the use of your
system:
• The data and power lines shall be connected and installed in compliance
with the standards required to avoid failures on your system and to
substantially minimize any imminently hazardous situations resulting in
personal injury.
• For assembly, start-up, maintenance and troubleshooting, adhere to the
specific accident prevention provisions which apply to your system (e.g.
BGV A 3, "Electrical Installations and Equipment").
• Emergency stop functions and equipment shall not be made ineffective.
See relevant standards (e.g. DIN EN 418).
• The equipment of your system shall be conform to EMC guidelines so that
any electromagnetic interferences will be eliminated.
• Operating 750 Series components in home applications without further
measures is permitted only if they meet the emission limits (emissions of
interference) in compliance with EN 61000-6-3. You will find the detailed
information in section "WAGO-I/O-SYSTEM 750" ! "System
Description" ! "Technical Data".
• Please observe the safety precautions against electrostatic discharge in
accordance with DIN EN 61340-5-1/-3. When handling the modules,
please ensure that environmental factors (persons, working place and
packaging) are well grounded.
• The valid standards and guidelines applicable for the installation of switch
cabinets shall be adhered to.
WAGO-I/O-SYSTEM 750
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12 • Important Notes Symbols
1.3 Symbols
Danger
Always observe this information to protect persons from injury.
Warning
Always observe this information to prevent damage to the device.
Attention
Marginal conditions that must always be observed to ensure smooth and
efficient operation.
ESD (Electrostatic Discharge)
Warning of damage to the components through electrostatic discharge.
Observe the precautionary measure for handling components at risk of
electrostatic discharge.
Note
Make important notes that are to be complied with so that a trouble-free and
efficient device operation can be guaranteed.
Additional Information
References to additional literature, manuals, data sheets and internet pages.
WAGO-I/O-SYSTEM 750
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Important Notes • 13
Safety Information
1.4 Safety Information
When connecting the device to your installation and during operation, the
following safety notes must be observed:
Danger
The WAGO-I/O-SYSTEM 750 and its components are an open system. It
must only be assembled in housings, cabinets or in electrical operation
rooms. Access is only permitted via a key or tool to authorized qualified
personnel.
Danger
All power sources to the device must always be switched off before carrying
out any installation, repair or maintenance work.
Warning
Replace defective or damaged device/module (e.g. in the event of deformed
contacts), as the functionality of field bus station in question can no longer be
ensured on a long-term basis.
Warning
The components are not resistant against materials having seeping and
insulating properties. Belonging to this group of materials is: e.g. aerosols,
silicones, triglycerides (found in some hand creams). If it cannot be ruled out
that these materials appear in the component environment, then the
components must be installed in an enclosure that is resistant against the
above mentioned materials. Clean tools and materials are generally required
to operate the device/module.
Warning
Soiled contacts must be cleaned using oil-free compressed air or with ethyl
alcohol and leather cloths.
Warning
Do not use contact sprays, which could possibly impair the functioning of the
contact area.
Warning
Avoid reverse polarity of data and power lines, as this may damage the
devices.
ESD (Electrostatic Discharge)
The devices are equipped with electronic components that may be destroyed
by electrostatic discharge when touched.
WAGO-I/O-SYSTEM 750
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14 • Important Notes
Font Conventions
Warning
For components with ETHERNET/RJ-45 connectors:
Only for use in LAN, not for connection to telecommunication circuits.
1.5 Font Conventions
italic
Names of paths and data files are marked in italic-type.
e.g.: C:\Programs\WAGO-IO-CHECK
italic
Menu items are marked in italic-type, bold letters.
e.g.: Save
\
A backslash between two names characterizes the selection of a
menu point from a menu.
e.g.: File \ New
END
Pushbuttons are marked as bold with small capitals
e.g.: ENTER
< >
Keys are marked bold within angle brackets
e.g.: <F5>
Courier
The print font for program codes is Courier.
e.g.: END_VAR
1.6 Number Notation
Number code Example Note
Decimal 100 Normal notation
Hexadecimal 0x64 C notation
Binary '100'
'0110.0100'
In quotation marks,
nibble separated with dots (.)
1.7 Scope
This manual describes the field bus independent WAGO-I/O-SYSTEM 750
with the fieldbus coupler for PROFINET IO.
Item-No. Description
750-370 Fieldbus Coupler PROFINET IO
WAGO-I/O-SYSTEM 750
PROFINET IO
Important Notes • 15 Abbreviation
1.8 Abbreviation
AI
AO
CPU
DI
DO
I/O
ID
HB
LB
PLC
SW
Analog Input
Analog Input Module
Analog Output
Analog Input Module
In this case the Run Time System for the eradication of the user
program in the PFC
Digital Input
Digital Input Module
Digital Output
Digital Output Module
Input/Output
Identifier
High Byte
Low Byte
Programmable Logic Controller
Software Version
WAGO-I/O-SYSTEM 750
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16 • The WAGO-I/O-SYSTEM 750
System Description
2 The WAGO-I/O-SYSTEM 750
2.1 System Description
The WAGO-I/O-SYSTEM 750 is a modular, field bus independent I/O
system. It is comprised of a field bus coupler/controller (1) and connected
field bus modules (2) for any type of signal. Together, these make up the field
bus node. The end module (3) completes the node.
Fig. 2-1: Field bus node g0xxx00x
Couplers/controllers for field bus systems such as PROFIBUS, INTERBUS,
ETHERNET TCP/IP, CAN (CANopen, DeviceNet, CAL), MODBUS, LON
and others are available.
The coupler/controller contains the field bus interface, electronics and a power
supply terminal. The field bus interface forms the physical interface to the
relevant field bus. The electronics process the data of the bus modules and
make it available for the field bus communication. The 24 V system supply
and the 24 V field supply are fed in via the integrated power supply terminal.
The field bus coupler communicates via the relevant field bus. The
programmable field bus controller (PFC) enables the implementation of
additional PLC functions. Programming is done with the WAGO I/O PRO
CAA in accordance with IEC 61131-3.
Bus modules for diverse digital and analog I/O functions as well as special
functions can be connected to the coupler/controller. The communication
between the coupler/controller and the bus modules is carried out via an
internal bus.
The WAGO-I/O-SYSTEM 750 has a clear port level with LEDs for status
indication, insertable mini WSB markers and pullout group marker carriers.
The 3-wire technology supplemented by a ground wire connection allows for
direct sensor/actuator wiring.
WAGO-I/O-SYSTEM 750
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The WAGO-I/O-SYSTEM 750 • 17 Technical Data
2.2 Technical Data
Mechanic
Material Polycarbonate, Polyamide 6.6
Dimensions W x H* x L
* from upper edge of DIN 35 rail
- Coupler/Controller (Standard)
- Coupler/Controller (ECO)
- Coupler/Controller (FireWire)
- I/O module, single
- I/O module, double
- I/O module, fourfold
- 51 mm x 65 mm x 100 mm
- 50 mm x 65 mm x 100 mm
- 62 mm x 65 mm x 100 mm
- 12 mm x 64 mm x 100 mm
- 24 mm x 64 mm x 100 mm
- 48 mm x 64 mm x 100 mm
Installation on DIN 35 with interlock
Modular by double feather key dovetail
Mounting position any position
Marking standard marking label type
group marking label 8 x 47 mm
Connection
Connection type CAGE CLAMP®
Wire range 0.08 mm² ... 2.5 mm², AWG 28-14
Stripped length 8 … 9 mm,
9 … 10 mm for components with pluggable wiring
(753-xxx)
Contacts
Power jumpers contacts blade/spring contact
self-cleaning
Current via power contacts
Voltage drop at I
< 1 V/64 modules
max
10 A
max
Data contacts slide contact, hard gold plated
1.5 µm, self-cleaning
Climatic environmental conditions
Operating temperature 0 °C ... 55 °C,
-20 °C … +60 °C for components with extended
temperature range (750-xxx/025-xxx)
Storage temperature -20 °C ... +85 °C
Relative humidity 5 % … 95 % without condensation
Resistance to harmful substances acc. to IEC 60068-2-42 and IEC 60068-2-43
Maximum pollutant concentration at
relative humidity < 75%
≤ 25 ppm
SO
2
H
S ≤ 10 ppm
2
Special conditions Ensure that additional measures for components are
taken, which are used in an environment involving:
– dust, caustic vapors or gases
– ionization radiation
WAGO-I/O-SYSTEM 750
PROFINET IO
18 • The WAGO-I/O-SYSTEM 750
Technical Data
Safe electrical isolation
Air and creepage distance acc. to IEC 60664-1
Degree of pollution
2
acc. To IEC 61131-2
Degree of protection
Degree of protection IP 20
Electromagnetic compatibility
Immunity to interference for industrial areas acc. to EN 61000-6-2 (2001)
Test specification Test values Strength
class
Evaluation
criteria
EN 61000-4-2 ESD 4 kV/8 kV (contact/air) 2/3 B
EN 61000-4-3
10 V/m 80 MHz ... 1 GHz 3 A
electromagnetic fields
EN 61000-4-4 burst 1 kV/2 kV (data/supply) 2/3 B
EN 61000-4-5 surge
-/- (line/line) Data:
B
1 kV (line/earth) 2
supply:
AC
supply:
0.5 kV (line/line) 1 DC
0.5 kV (line/earth) 1
1 kV (line/line) 2
2 kV (line/earth) 3
B
B
EN 61000-4-6
RF disturbances
10 V/m 80 % AM
(0.15 ... 80 MHz)
3 A
Emission of interference for industrial areas acc. to EN 61000-6-4 (2001)
Test specification Limit values/[QP]*) Frequency range Distance
79 dB (µV) 150 kHz ... 500 kHz EN 55011 (AC supply,
conducted)
73 dB (µV) 500 kHz ... 30 MHz
40 dB (µV/m) 30 MHz ... 230 MHz 10 m EN 55011 (radiated)
47 dB (µV/m) 230 MHz ... 1 GHz 10 m
Emission of interference for residential areas acc. to EN 61000-6-3 (2001)
Test specification Limit values/[QP]*) Frequency range Distance
EN 55022 (AC supply,
conducted)
66 ... 56 dB (µV) 150 kHz ... 500 kHz
56 dB (µV) 500 kHz ... 5 MHz
60 dB (µV) 5 MHz ... 30 MHz
40 ... 30 dB (µA) 150 kHz ... 500 kHz EN 55022 (DC supply/data,
conducted)
30 dB (µA) 500 kHz ... 30 MHz
30 dB (µV/m) 30 MHz ... 230 MHz 10 m EN 55022 (radiated)
37 dB (µV/m) 230 MHz ... 1 GHz 10 m
WAGO-I/O-SYSTEM 750
PROFINET IO
The WAGO-I/O-SYSTEM 750 • 19
Technical Data
Mechanical strength acc. to IEC 61131-2
Test specification Frequency range Limit value
IEC 60068-2-6 vibration
IEC 60068-2-32 free fall 1 m
*) QP: Quasi Peak
5 Hz ≤ f < 9 Hz
9 Hz ≤ f < 150 Hz
Note on vibration test:
a) Frequency change: max. 1 octave/minute
b) Vibration direction: 3 axes
15 g IEC 60068-2-27 shock
Note on shock test:
a) Type of shock: half sine
b) Shock duration: 11 ms
c) Shock direction: 3x in positive and 3x in negative
direction for each of the three mutually perpendicular axes
of the test specimen
1.75 mm amplitude (permanent)
3.5 mm amplitude (short term)
0.5 g (permanent)
1 g (short term)
(module in original packing)
Note
If the technical data of components differ from the values described here, the
technical data shown in the manuals of the respective components shall be
valid.
WAGO-I/O-SYSTEM 750
PROFINET IO
20 • The WAGO-I/O-SYSTEM 750
Technical Data
For Products of the WAGO-I/O-SYSTEM 750 with ship specific approvals
supplementary guidelines are valid:
Electromagnetic compatibility
Immunity to interference acc. to Germanischer Lloyd (2003)
Test specification Test values Strength
class
IEC 61000-4-2 ESD 6 kV/8 kV (contact/air) 3/3 B
IEC 61000-4-3
electromagnetic fields
IEC 61000-4-4 burst 1 kV/2 kV (data/supply) 2/3 A
IEC 61000-4-6
RF disturbances
Type test AF disturbances
(harmonic waves)
Type test high voltage 755 V DC
Emission of interference acc. to Germanischer Lloyd (2003)
Test specification Limit values Frequency range Distance
Type test
(EMC1, conducted)
allows for ship bridge control
applications
10 V/m 80 MHz ... 2 GHz 3 A
0.5 kV (line/line) 1 IEC 61000-4-5 surge AC/DC
Supply:
10 V/m 80 % AM
(0.15 ... 80 MHz)
3 V, 2 W - A
1500 V AC
96 ... 50 dB (µV) 10 kHz ... 150 kHz
60 ... 50 dB (µV) 150 kHz ... 350 kHz
50 dB (µV) 350 kHz ... 30 MHz
1 kV (line/earth) 2
3 A
- -
Evaluation
criteria
A
Type test
(EMC1, radiated)
allows for ship bridge control
applications
except: 24 dB (µV/m) 156 MHz ... 165 MHz 3 m
Mechanical strength acc. to Germanischer Lloyd (2003)
Test specification Frequency range Limit value
IEC 60068-2-6 vibration
(category A – D)
80 ... 52 dB (µV/m) 150 kHz ... 300 kHz 3 m
52 ... 34 dB (µV/m) 300 kHz ... 30 MHz 3 m
54 dB (µV/m) 30 MHz ... 2 GHz 3 m
2 Hz ≤ f < 25 Hz
25 Hz ≤ f < 100 Hz
Note on vibration test:
a) Frequency change: max. 1 octave/minute
b) Vibration direction: 3 axes
± 1.6 mm amplitude (permanent)
4 g (permanent)
WAGO-I/O-SYSTEM 750
PROFINET IO
The WAGO-I/O-SYSTEM 750 • 21
Technical Data
Range of
application
Industrial areas EN 61000-6-4 (2001) EN 61000-6-2 (2001)
Residential areas EN 61000-6-3 (2001)*) EN 61000-6-1 (2001)
*)
The system meets the requirements on emission of interference in residential areas with
the field bus coupler/controller for:
ETHERNET
LonWorks
CANopen
DeviceNet
MODBUS
KNX
BACnet
With a special permit, the system can also be implemented with other field bus
couplers/controllers in residential areas (housing, commercial and business areas, smallscale enterprises). The special permit can be obtained from an authority or inspection
office. In Germany, the Federal Office for Post and Telecommunications and its branch
offices issues the permit.
It is possible to use other field bus couplers/controllers under certain boundary
conditions. Please contact WAGO Kontakttechnik GmbH & Co. KG.
Required specification
emission of interference
750-342/-841/-842/-860
750-319/-819
750-337/-837
750-306/-806
750-312/-314/ -315/ -316
750-812/-814/ -815/ -816
750-849
750-830
Required specification
immunity to interference
Maximum power dissipation of the components
Bus modules 0.8 W / bus terminal (total power dissipation,
system/field)
Field bus coupler/controller 2.0 W / coupler/controller
Warning
The power dissipation of all installed components must not exceed the
maximum conductible power of the housing (cabinet).
When dimensioning the housing, care is to be taken that even under high
external temperatures, the temperature inside the housing does not exceed the
permissible ambient temperature of 55 °C.
WAGO-I/O-SYSTEM 750
PROFINET IO
22 • The WAGO-I/O-SYSTEM 750
Technical Data
Dimensions
02
01
35
A
B
24V 0V
+
-
A
C
B
D
+
A
C
D
A
C
B
B
D
A
C
D
C
B
D
100
-
51
65
Side view
12
24
Dimensions in mm
64
Fig. 2-2: Dimensions g01xx05e
Note
The illustration shows a standard coupler. For detailed dimensions, please
refer to the technical data of the respective coupler/controller.
WAGO-I/O-SYSTEM 750
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The WAGO-I/O-SYSTEM 750 • 23
Manufacturing Number
2.3 Manufacturing Number
The manufacturing number indicates the delivery status directly after
production.
This number is part of the lateral marking on the component.
In addition, starting from calendar week 43/2000 the manufacturing number is
also printed on the cover of the configuration and programming interface of
the field bus coupler or controller.
PROFIBUS
ITEM-NO.:750-333
ITEM-NO.:750-333
PROFIBUS DP 12 MBd /DPV1
PROFIBUS DP 12 MBd /DPV1
-
Power Supply
Field
24 V
+
0V
0V
Power Supply
Power Supply
Electronic
Electronic
PATENTS PENDING
PATENTS PENDING
750-333
Hansastr. 27
Hansastr. 27
GL
D-32423 Minden
D-32423 Minden
24V DC
24V DC
AWG 28-14
AWG 28-14
55°C max ambient
55°C max ambient
72072
72072
DS
NO
SW
HW
FWL
II3GD
LISTED 22ZA AND 22XM
LISTED 22ZA AND 22XM
0103000203-B000000
0103000203-B060606
II3GD
DEMKO 02 ATEX132273 X
DEMKO 02 ATEX132273 X
EEx nA II T4
EEx nA II T4
WAGO - I/O - SYSTEM
Manufacturing Number
0
1
3
01030002
03-B
060606
72072
Calendar
week
Fig. 2-3: Example: Manufacturing Number of a PROFIBUS field bus coupler 750-333
0
Year Software
version
2
0
0
0
0
3
-B060606
Hardware
Firmware Loader
version
version
Internal
Number
g01xx15e
The manufacturing number consists of the production week and year, the
software version (if available), the hardware version of the component, the
firmware loader (if available) and further internal information for
WAGO Kontakttechnik GmbH & Co. KG.
WAGO-I/O-SYSTEM 750
PROFINET IO
24 • The WAGO-I/O-SYSTEM 750
Component Update
2.4 Component Update
For the case of an Update of one component, the lateral marking on each
component contains a prepared matrix.
This matrix makes columns available for altogether three updates to the entry
of the current update data, like production order number (NO; starting from
calendar week 13/2004), update date (DS), software version (SW), hardware
version (HW) and the firmware loader version (FWL, if available).
Update Matrix
Current Version data for: 1. Update 2. Update 3. Update
Production Order
Number
Datestamp
Software index
Hardware index
Firmware loader
index
NO
DS
SW
HW
FWL
" only starting from calendar
" only for coupler/controller
If the update of a component took place, the current version data are registered
into the columns of the matrix.
Additionally with the update of a field bus coupler or controller also the cover
of the configuration and programming interface of the coupler or controller is
printed on with the current manufacturing and production order number.
The original manufacturing data on the housing of the component remain
thereby.
2.5 Storage, Assembly and Transport
Wherever possible, the components are to be stored in their original
packaging. Likewise, the original packaging provides optimal protection
during transport.
week 13/2004
When assembling or repacking the components, the contacts must not be
soiled or damaged. The components must be stored and transported in
appropriate containers/packaging. Thereby, the ESD information is to be
regarded.
Statically shielded transport bags with metal coatings are to be used for the
transport of open components for which soiling with amine, amide and
silicone has been ruled out, e.g. 3M 1900E.
WAGO-I/O-SYSTEM 750
PROFINET IO
The WAGO-I/O-SYSTEM 750 • 25
Mechanical Setup
2.6 Mechanical Setup
2.6.1 Installation Position
Along with horizontal and vertical installation, all other installation positions
are allowed.
Attention
2.6.2 Total Expansion
In the case of vertical assembly, an end stop has to be mounted as an
additional safeguard against slipping.
WAGO item 249-116 End stop for DIN 35 rail, 6 mm wide
WAGO item 249-117 End stop for DIN 35 rail, 10 mm wide
The length of the module assembly (including one end module of 12mm
width) that can be connected to the coupler/controller is 780 mm. When
assembled, the I/O modules have a maximum length of 768 mm.
Examples:
• 64 I/O modules of 12 mm width can be connected to one
coupler/controller.
• 32 I/O modules of 24 mm width can be connected to one
coupler/controller.
Exception:
The number of connected I/O modules also depends on which type of
coupler/controller is used. For example, the maximum number of I/O modules
that can be connected to a PROFIBUS coupler/controller is 63 without end
module. The maximum total expansion of a node is calculated as follows:
Warning
The maximum total length of a node without coupler/controller must not
exceed 780 mm. Furthermore, restrictions made on certain types of
couplers/controllers must be observed (e.g. for PROFIBUS).
WAGO-I/O-SYSTEM 750
PROFINET IO
26 • The WAGO-I/O-SYSTEM 750
Mechanical Setup
2.6.3 Assembly onto Carrier Rail
2.6.3.1 Carrier Rail Properties
All system components can be snapped directly onto a carrier rail in
accordance with the European standard EN 50022 (DIN 35).
Warning
WAGO Kontakttechnik GmbH & Co. KG supplies standardized carrier rails
that are optimal for use with the I/O system. If other carrier rails are used,
then a technical inspection and approval of the rail by WAGO
Kontakttechnik GmbH & Co. KG should take place.
Carrier rails have different mechanical and electrical properties. For the
optimal system setup on a carrier rail, certain guidelines must be observed:
• The material must be non-corrosive.
• Most components have a contact to the carrier rail to ground electro-
magnetic disturbances. In order to avoid corrosion, this tin-plated carrier
rail contact must not form a galvanic cell with the material of the carrier
rail which generates a differential voltage above 0.5 V (saline solution of
0.3% at 20°C) .
• The carrier rail must optimally support the EMC measures integrated into
the system and the shielding of the bus module connections.
• A sufficiently stable carrier rail should be selected and, if necessary,
several mounting points (every 20 cm) should be used in order to prevent
bending and twisting (torsion).
• The geometry of the carrier rail must not be altered in order to secure the
safe hold of the components. In particular, when shortening or mounting
the carrier rail, it must not be crushed or bent.
• The base of the I/O components extends into the profile of the carrier rail.
For carrier rails with a height of 7.5 mm, mounting points are to be riveted
under the node in the carrier rail (slotted head captive screws or blind
rivets).
WAGO-I/O-SYSTEM 750
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The WAGO-I/O-SYSTEM 750 • 27
Mechanical Setup
2.6.3.2 WAGO DIN Rail
WAGO carrier rails meet the electrical and mechanical requirements.
Item Number Description
210-113 /-112 35 x 7.5; 1 mm; steel yellow chromated; slotted/unslotted
210-114 /-197 35 x 15; 1.5 mm; steel yellow chromated; slotted/unslotted
210-118 35 x 15; 2.3 mm; steel yellow chromated; unslotted
210-198 35 x 15; 2.3 mm; copper; unslotted
210-196 35 x 7.5; 1 mm; aluminum; unslotted
2.6.4 Spacing
The spacing between adjacent components, cable conduits, casing and frame
sides must be maintained for the complete field bus node.
Fig. 2-4: Spacing g01xx13x
The spacing creates room for heat transfer, installation or wiring. The spacing
to cable conduits also prevents conducted electromagnetic interferences from
influencing the operation.
WAGO-I/O-SYSTEM 750
PROFINET IO
28 • The WAGO-I/O-SYSTEM 750
Mechanical Setup
2.6.5 Plugging and Removal of the Components
Warning
Before work is done on the components, the voltage supply must be turned off.
In order to safeguard the coupler/controller from jamming, it should be fixed
onto the carrier rail with the locking disc To do so, push on the upper groove
of the locking disc using a screwdriver.
To pull out the field bus coupler/controller, release the locking disc by
pressing on the bottom groove with a screwdriver and then pulling the orange
colored unlocking lug .
Fig. 2-5: Coupler/Controller and unlocking lug g01xx12e
It is also possible to release an individual I/O module from the unit by pulling
an unlocking lug.
Fig. 2-6: removing bus terminal p0xxx01x
Danger
Ensure that an interruption of the PE will not result in a condition which
could endanger a person or equipment!
For planning the ring feeding of the ground wire, please see chapter 2.6.3.
WAGO-I/O-SYSTEM 750
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The WAGO-I/O-SYSTEM 750 • 29
Mechanical Setup
2.6.6 Assembly Sequence
All system components can be snapped directly on a carrier rail in accordance
with the European standard EN 50022 (DIN 35).
The reliable positioning and connection is made using a tongue and groove
system. Due to the automatic locking, the individual components are securely
seated on the rail after installing.
Starting with the coupler/controller, the bus modules are assembled adjacent
to each other according to the project planning. Errors in the planning of the
node in terms of the potential groups (connection via the power contacts) are
recognized, as the bus modules with power contacts (male contacts) cannot be
linked to bus modules with fewer power contacts.
Attention
Always link the bus modules with the coupler/controller, and always plug
from above.
Warning
Never plug bus modules from the direction of the end terminal. A ground
wire power contact, which is inserted into a terminal without contacts, e.g. a
4-channel digital input module, has a decreased air and creepage distance to
the neighboring contact in the example DI4.
Always terminate the field bus node with an end module (750-600).
WAGO-I/O-SYSTEM 750
PROFINET IO
30 • The WAGO-I/O-SYSTEM 750
Mechanical Setup
2.6.7 Internal Bus/Data Contacts
Communication between the coupler/controller and the bus modules as well as
the system supply of the bus modules is carried out via the internal bus. It is
comprised of 6 data contacts, which are available as self-cleaning gold spring
contacts.
Fig. 2-7: Data contacts p0xxx07x
Warning
Do not touch the gold spring contacts on the I/O modules in order to avoid
soiling or scratching!
ESD (Electrostatic Discharge)
The modules are equipped with electronic components that may be destroyed
by electrostatic discharge. When handling the modules, ensure that the
environment (persons, workplace and packing) is well grounded. Avoid
touching conductive components, e.g. data contacts.
WAGO-I/O-SYSTEM 750
PROFINET IO
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