• Decodes MPEG 1 & 2 audio layer III (CBR
+VBR +ABR); layers I & II optional;
MPEG4/2 AAC-LC-2.0.0.0 (+PNS);
WMA 4.0/4.1/7/8/9allprofiles (5-384 kbps);
WAV (PCM + IMA ADPCM);
General MIDI / SP-MIDI format 0 files
• Encodes IMA ADPCM from microphone
or line input
• Streaming support for MP3 and WAV
• EarSpeaker Spatial Processing
• Bass and treble controls
• Operates with a single clock 12..13 MHz
• Can also be used with 24..26 MHz clocks
• Internal PLL clock multiplier
• Low-power operation
• High-quality on-chip stereo DAC with no
phase error between channels
• Stereo earphone driver capable of driving a
30Ω load
• Quiet power-on and power-off
• I2S interface for external DAC
• Separate operating voltages for analog,
digital and I/O
• 5.5 KiB On-chip RAM for user code / data
• Serial control and data interfaces
• Can be used as a slave co-processor
• SPI flash boot for special applications
• UART for debugging purposes
• New functions may be added with software
and 8 GPIO pins
• Lead-free RoHS-compliantpackage(Green)
Description
VS1033 is a single-chip MP3/AAC/WMA/MIDI
audio decoder and ADPCM encoder. It contains
a high-performance, proprietary low-power DSP
processor core VS DSP4, working data memory,
5 KiB instruction RAM and 0.5 KiB data RAM
for user applications, serial control and input data
interfaces, upto 8 general purpose I/O pins, an
UART, as well as a high-quality variable-samplerate mono ADC and stereo DAC, followed by an
earphone amplifier and a common voltage buffer.
VS1033 receives its input bitstream through a serial input bus, which itlistenstoasasystemslave.
The input stream is decoded and passed through a
digital volume control to an 18-bit oversampling,
multi-bit, sigma-delta DAC. The decoding is controlled via a serial control bus. In addition to the
basic decoding, it is possible to add application
specific features,likeDSP effects, to theuserRAM
memory.
EarSpeaker spatial processing provides more natural sound in headphone listening conditions. It
widens the stereo image and positions the sound
sources outside the listener’s head.
MPEG Layer-3 audio decoding technology licensed from Fraunhofer IIS and Thomson.
Note: if you enable Layer I and Layer II decoding, you are liable for any patent issues that may
arise from using these formats. Joint licensing of MPEG 1.0 / 2.0 Layer III does not cover all patents
pertaining to layers I and II.
VS1033 contains WMA decoding technology from Microsoft.
This product is protected by certain intellectual property rights of Microsoft and cannot be used
or further distributed without a license from Microsoft.
VS1033 contains AAC technology (ISO/IEC 13818-7) which cannot be used without a proper license
from Via Licensing Corporation or individual patent holders.
To the best of our knowledge, if the end product does not play a specific format that otherwise would
require a customer license: MPEG 1.0/2.0 layers I and II, WMA, or AAC, the respective license should
not be required. Decoding of MPEG layers I and II are disabled by default, and WMA and AAC format
exclusion can be easily performed based on the contents of the SCI HDAT1 register.
2Disclaimer
This is a
preliminary
datasheet. All properties and figures are subject to change.
3Definitions
B Byte, 8 bits.
b Bit.
Ki “Kibi” = 210= 1024 (IEC 60027-2).
Mi “Mebi” = 220= 1048576 (IEC 60027-2).
VS DSP VLSI Solution’s DSP core.
W Word. In VS DSP, instruction words are 32-bit and data words are 16-bit wide.
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VS1033c PRELIMINARY
4. CHARACTERISTICS&SPECIFICATIONS
4Characteristics & Specifications
4.1Absolute Maximum Ratings
ParameterSymbolMinMaxUnit
Analog Positive SupplyAVDD-0.33.6V
Digital Positive SupplyCVDD-0.32.7V
I/O Positive SupplyIOVDD-0.33.6V
Current at Any Digital Output±50mA
Voltage at Any Digital Input-0.3IOVDD+0.31V
Operating Temperature-40+85
Storage Temperature-65+150
1
Must not exceed 3.6 V
◦
◦
VS1033C
C
C
4.2Recommended Operating Conditions
ParameterSymbolMinTypMaxUnit
Ambient Operating Temperature-40+85◦C
Analog and Digital Ground
Positive AnalogAVDD2.52.83.6V
Positive DigitalCVDD2.42.52.7V
I/O VoltageIOVDDCVDD-0.6V2.83.6V
Input Clock Frequency
Internal Clock FrequencyCLKI1236.86455.3MHz
Internal Clock Multiplier
Master Clock Duty Cycle405060%
1
Must be connected together as close the device as possible for latch-up immunity.
2
The maximum sample rate that can be played with correct speed is XTALI/256.
Thus, XTALI must be at least 12.288 MHz to be able to play 48 kHz at correct speed.
3
Reset value is 1.0×. Recommended SC MULT=3.0×, SC ADD=1.0× (SCI CLOCKF=0x9000).
1
2
3
AGND DGND0.0V
XTALI1212.28813MHz
1.0×3.0×4.5×
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VS1033C
VS1033c PRELIMINARY
4. CHARACTERISTICS&SPECIFICATIONS
4.3Analog Characteristics
Unless otherwisenoted: AVDD=2.5..2.85V, CVDD=2.4..2.7V, IOVDD=CVDD-0.6V..3.6V,TA=-40..+85◦C,
XTALI=12..13MHz, Internal Clock Multiplier 3.5×. DAC tested with 1307.894 Hz full-scale output
sinewave, measurement bandwidth 20..20000 Hz, analog output load: LEFT to GBUF 30Ω, RIGHT to
GBUF 30Ω. Microphone test amplitude 50 mVpp, fs=1 kHz, Line input test amplitude 1.1 V, fs=1 kHz.
ParameterSymbolMinTypMaxUnit
DAC Resolution18bits
Total Harmonic DistortionTHD0.10.3%
Dynamic Range (DAC unmuted, A-weighted)IDR90dB
S/N Ratio (full scale signal)SNR70dB
Interchannel Isolation (Cross Talk)5075dB
Interchannel Isolation (Cross Talk), with GBUF40dB
Interchannel Gain Mismatch-0.50.5dB
Frequency Response-0.10.1dB
Full Scale Output Voltage (Peak-to-peak)1.31.5
Deviation from Linear Phase5
Analog Output Load ResistanceAOLR1630
Analog Output Load Capacitance100pF
Microphone input amplifier gainMICG26dB
Microphone input amplitude501403mVpp AC
Microphone Total Harmonic DistortionMTHD0.020.10%
Microphone S/N RatioMSNR5062dB
Line input amplitude220028003mVpp AC
Line input Total Harmonic DistortionLTHD0.060.10%
Line input S/N RatioLSNR6068dB
Line and Microphone input impedances100kΩ
1
2
1.7Vpp
◦
Ω
1
3.0 volts can be achieved with +-to-+ wiring for mono difference sound.
2
AOLR may be much lower, but below Typical distortion performance may be compromised.
3
Above typical amplitude the Harmonic Distortion increases.
4.4Power Consumption
Tested with an MPEG 1.0 Layer-3 128 kbps sample and generated sine. Output at full volume. Internal
clock multiplier 3.0×.
ParameterMinTypMaxUnit
Power Supply Consumption AVDD, Reset0.65.0µA
Power Supply Consumption CVDD = 2.5V, Reset3.750.0µA
Power Supply Consumption AVDD, sine test, 30Ω + GBUF36.9mA
Power Supply Consumption CVDD = 2.5V, sine test8.2mA
Power Supply Consumption AVDD, no load7.0mA
Power Supply Consumption AVDD, output load 30Ω10.9mA
Power Supply Consumption AVDD, 30Ω + GBUF16.1mA
Power Supply Consumption CVDD = 2.5V14mA
Version 0.91, 2007-02-1211
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VS1033C
VS1033c PRELIMINARY
4. CHARACTERISTICS&SPECIFICATIONS
4.5Digital Characteristics
ParameterSymbolMinTypMaxUnit
High-Level Input Voltage0.7×IOVDDIOVDD+0.31V
Low-Level Input Voltage-0.20.3×IOVDDV
High-Level Output Voltage at IO= -2.0 mA0.7×IOVDDV
Low-Level Output Voltage at IO= 2.0 mA0.3×IOVDDV
Input Leakage Current-1.01.0µA
SPI Input Clock Frequency
XRESET active time2XTALI
XRESET inactive to software ready20000500001XTALI
Power on reset, rise time to CVDD10V/s
1
DREQ rises when initialization is complete. You should not send any data or commands before that.
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VS1033C
1
48
A
B
C
D
E
F
G
1 2
3
4 5
6 7
TOP VIEW
0.80 TYP
4.80
7.00
1.10 REF
0.80 TYP
1.10 REF
4.80
7.00
A1 BALL PAD CORNER
VS1033c PRELIMINARY
5. PACKAGES AND PIN DESCRIPTIONS
5Packages and Pin Descriptions
5.1Packages
Both LPQFP-48 and BGA-49 are lead (Pb) free and also RoHS compliant packages. RoHS is a short
name of Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electricaland electronic equipment.
5.1.1LQFP-48
Figure 1: Pin Configuration, LQFP-48.
LQFP-48 package dimensions are at http://www.vlsi.fi/ .
5.1.2BGA-49
BGA-49 package dimensions are at http://www.vlsi.fi/ .
XDCS / BSYNC
IOVDD114F3IOPWRI/O power supply
VCO15G2DOFor testing only (Clock VCO output)
DGND116F4DGNDCore & I/O ground
XTALO17G3AOCrystal output
XTALI18E4AICrystal input
IOVDD219G4IOPWRI/O power supply
IOVDD3F5IOPWRI/O power supply
DGND220DGNDCore & I/O ground
DGND321G5DGNDCore & I/O ground
DGND422F6DGNDCore & I/O ground
XCS23G6DIChip select input (active low)
CVDD224G7CPWRCore power supply
GPIO5 / I2S MCLK
RX26E6DIUART receive, connect to IOVDD if not used
TX27F7DOUART transmit
SCLK28D6DIClock for serial bus
SI29E7DISerial input
SO30D5DO3Serial output
CVDD331D7CPWRCore power supply
TEST32C6DIReserved for test, connect to IOVDD
GPIO0 / I2S SCLK
GPIO4 / I2S LROUT336A7DIOGeneral purpose IO 4 / I2S LROUT
AGND037C5APWRAnalog ground, low-noise reference
AVDD038B5APWRAnalog power supply
RIGHT39A6AORight channel output
AGND140B4APWRAnalog ground
AGND241A5APWRAnalog ground
GBUF42C4AOCommon buffer for headphones, do NOT connect to
AVDD143A4APWRAnalog power supply
RCAP44B3AIOFiltering capacitance for reference
AVDD245A3APWRAnalog power supply
LEFT46B2AOLeft channel output
AGND347A2APWRAnalog ground
LINEIN48A1AILine input
1
1
1
9E1DIOGeneral purpose IO 2 / serial input data bus clock
10F2DIOGeneral purpose IO 3 / serial data input
13E3DIData chip select / byte sync
3
25E5DIOGeneral purpose IO 5 / I2S MCLK
3
33C7DIOGeneral purpose IO 0 (SPIBOOT) / I2S SCLK
BGA
Ball
Pin
Type
Function
use 100 kΩ pull-down resistor
ground!
2
Version 0.91, 2007-02-1214
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VS1033c PRELIMINARY
1
First pin function is active in New Mode, latter in Compatibility Mode.
2
Unless pull-down resistor is used, SPI Boot is tried. See Chapter 9.5 for details.
3
If I2S CF ENA is ’0’ the pins are used for GPIO. See Chapter 10.13 for details.
5. PACKAGES AND PIN DESCRIPTIONS
Pin types:
VS1033C
TypeDescription
DIDigital input, CMOS Input Pad
DODigital output, CMOS Input Pad
DIODigital input/output
DO3Digital output, CMOS Tri-stated OutputPad
AIAnalog input
In BGA-49, D4 is a no-connect ball.
TypeDescription
AOAnalog output
AIOAnalog input/output
APWRAnalog power supply pin
DGNDCore or I/O ground pin
CPWRCore power supply pin
IOPWRI/O power supply pin
Version 0.91, 2007-02-1215
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VS1033c PRELIMINARY
6Connection Diagram, LQFP-48
VS1033C
6. CONNECTION DIAGRAM, LQFP-48
Figure 3: Typical Connection Diagram Using LQFP-48.
The common buffer GBUF can be used for common voltage (1.24 V) for earphones. This will eliminate
the need for large isolation capacitors on line outputs, and thus the audio output pins from VS1033 may
be connected directly to the earphone connector.
GBUF must NOT be connected to ground in any circumstance. If GBUF is not used, LEFT and RIGHT
must be provided with coupling capacitors. See application notes for details.
Unused GPIO pins should have a pull-down resistor.
If UART is not used, RX should be connected to IOVDD and TX be unconnected.
Do not connect any external load to XTALO.
Note: This connection assumes SM SDINEW is active (see Chapter 8.7.1). If also SM SDISHARE is
used, xDCS should be tied low or high (see Chapter 7.2.1).
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VS1033C
VS1033c PRELIMINARY
7. SPI BUSES
7SPI Buses
7.1General
The SPI Bus - that was originally used in some Motorola devices - has been used for both VS1033’s
Serial Data Interface SDI (Chapters 7.4 and 8.5) and Serial Control Interface SCI (Chapters 7.5 and 8.6).
7.2SPI Bus Pin Descriptions
7.2.1VS1002 Native Modes (New Mode)
These modes are active on VS1033 when SM SDINEW is set to 1 (default at startup). DCLK and
SDATA are not used for data transfer and they can be used as general-purpose I/O pins (GPIO2 and
GPIO3). BSYNC function changes to data interface chip select (XDCS).
SDI PinSCI PinDescription
XDCSXCSActive low chip select input. A high level forces the serial interface into
standby mode, ending the current operation. A high level also forces serial
output (SO) to high impedance state. If SM SDISHARE is 1, pin
XDCS is not used, but the signal is generated internally by inverting
XCS.
SCKSerial clock input. The serial clock is also used internally as the master
clock for the register interface.
SCK can be gated or continuous. In either case, the first rising clock edge
after XCS has gone low marks the first bit to be written.
SISerial input. If a chip select is active, SI is sampled on the rising CLK edge.
-SOSerial output. In reads, data is shifted out on the falling SCK edge.
In writes SO is at a high impedance state.
7.2.2VS1001 Compatibility Mode
This mode is active when SM SDINEW is set to 0. In this mode, DCLK, SDATA and BSYNC are active.
SDI PinSCI PinDescription
-XCSActive low chip select input. A high level forces the serial interface into
standby mode, ending the current operation. A high level also forces serial
output (SO) to high impedance state.
BSYNC-SDI data is synchronized with a rising edge of BSYNC.
DCLKSCKSerial clock input. The serial clock is also used internally as the master
SDATASISerial input. SI is sampled on the rising SCK edge, if XCS is low.
-SOSerial output. In reads, data is shifted out on the falling SCK edge.
clock for the register interface.
SCK can be gated or continuous. In either case, the first rising clock edge
after XCS has gone low marks the first bit to be written.
In writes SO is at a high impedance state.
Version 0.91, 2007-02-1217
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VS1033C
VS1033c PRELIMINARY
7. SPI BUSES
7.3Data Request Pin DREQ
The DREQ pin/signal is used to signal if VS1033’s 2048-byte FIFO is capable of receiving data. If
DREQ is high, VS1033 can take at least 32 bytes of SDI data or one SCI command. DREQ is turned low
when the stream buffer is too full and for the duration of a SCI command.
Because of the 32-byte safety area, the sender may send upto 32 bytes of SDI data at a time without
checking the status of DREQ, making controlling VS1033 easier for low-speed microcontrollers.
Note: DREQ may turn low or high at any time, even during a byte transmission. Thus, DREQ should
only be used to decide whether to send more bytes. It does not need to abort a transmission that has
already started.
Note: In VS10XX products upto VS1002, DREQ was only used for SDI. In VS1003 and VS1033 DREQ
is also used to tell the status of SCI.
There are cases when you still want to send SCI commands when DREQ is low. Because DREQ is
shared between SDI and SCI, you can not determine if a SCI command has been executed if SDI is not
ready to receive. In this case you need a long enough delay after every SCI command to make certain
none of them is missed. The SCI Registers table in section 8.7 gives the worst-case handling time for
each SCI register write.
7.4Serial Protocol for Serial Data Interface (SDI)
7.4.1General
The serial data interface operates in slavemodesoDCLK signal must be generated by an externalcircuit.
Data (SDATA signal) can be clocked in at either the rising or falling edge of DCLK (Chapter 8.7).
VS1033 assumes its data input to be byte-sychronized. SDI bytes may be transmitted either MSb or LSb
first, depending of contents of SCI MODE (Chapter 8.7.1).
The firmware is able to accept the maximum bitrate the SDI supports.
7.4.2SDI in VS1002 Native Modes (New Mode)
In VS1002native modes(SM NEWMODE is 1), byte synchronizationisachieved by XDCS.Thestateof
XDCS may not change while a data byte transfer is in progress. To always maintain data synchronization
even if there may be glitches in the boards using VS1033, it is recommended to turn XDCS every now
and then, for instance once after every flash data block or a few kilobytes, just to keep sure the host and
VS1033 are in sync.
If SM SDISHARE is 1, the XDCS signal is internally generated by inverting the XCS input.
For new designs, using VS1002 native modes are recommended.
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VS1033C
BSYNC
SDATA
DCLK
D7D6D5D4D3D2D1D0
BSYNC
SDATA
DCLK
D7 D6D5 D4D3 D2 D1D0
D7 D6D5 D4D3 D2 D1D0
VS1033c PRELIMINARY
7. SPI BUSES
7.4.3SDI in VS1001 Compatibility Mode
Figure 4: BSYNC Signal - one byte transfer.
When VS1033 is running in VS1001 compatibility mode, a BSYNC signal must be generated to ensure
correct bit-alignment of the input bitstream. The first DCLK sampling edge (rising or falling, depending
on selected polarity), during which the BSYNC is high, marks the first bit of a byte (LSB, if LSB-first
order is used, MSB, if MSB-first orderisused). If BSYNC is ’1’ when the last bit is received,thereceiver
stays active and next 8 bits are also received.
7.4.4Passive SDI Mode
If SM NEWMODE is 0 and SM SDISHARE is 1, the operation is otherwise like the VS1001 compatibility mode, but bits are only received while the BSYNC signal is ’1’. Rising edge of BSYNC is still
used for synchronization.
7.5Serial Protocol for Serial Command Interface (SCI)
7.5.1General
The serial bus protocol for the Serial Command Interface SCI (Chapter 8.6) consists of an instruction
byte, address byte and one 16-bit data word. Each read or write operation can read or write a single
register. Data bits are read at the rising edge, so the user should update data at the falling edge. Bytes
are always send MSb first. XCS should be low for the full duration of the operation, but you can have
pauses between bits if needed.
The operation is specified by an 8-bit instruction opcode. The supported instructions are read and write.
See table below.
Figure 5: BSYNC Signal - two byte transfer.
Instruction
NameOpcodeOperation
READ0b0000 0011Read data
WRITE0b0000 0010Write data
Note: VS1033 sets DREQ low after each SCI operation. The duration depends on the operation. It is not
allowed to start a new SCI/SDI operation before DREQ is high again.
Version 0.91, 2007-02-1219
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7.5.2SCI Read
0 1 2 3 4 5 6 7 8 9 10 11 12 1330 3114 15 16 17
0 0 0 0 0 0 1 1 0 0 0 0
3 2 1 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
15 141 0
X
instruction (read)address
data out
XCS
SCK
SI
SO
don’t caredon’t care
DREQ
execution
0 1 2 3 4 5 6 7 8 9 10 11 12 1330 3114 15 16 17
0 0 0 0 0 0 10 0 0 0
3 2 1 0
1 0
X
address
XCS
SCK
SI
15 14
data out
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0SO
0 00 0
X
0
instruction (write)
DREQ
execution
VS1033c PRELIMINARY
Figure 6: SCI Word Read
VS1033C
7. SPI BUSES
VS1033 registers are read from using the following sequence, as shown in Figure 6. First, XCS line is
pulled low to select the device. Then the READ opcode (0x3) is transmitted via the SI line followed by
an 8-bit word address. After the address has been read in, any further data on SI is ignored by the chip.
The 16-bit data corresponding to the received address will be shifted out onto the SO line.
XCS should be driven high after data has been shifted out.
DREQ is driven low for a short while when in a read operation by the chip. This is a very short time and
doesn’t require special user attention.
7.5.3SCI Write
Version 0.91, 2007-02-1220
Figure 7: SCI Word Write
VS1033 registers are written from using the following sequence, as shown in Figure 7. First, XCS line
is pulled low to select the device. Then the WRITE opcode (0x2) is transmitted via the SI line followed
by an 8-bit word address.
VLSI
Solution
y
VS1033C
XCS
SCK
SI
SO
01151416
tXCSS
tXCSH
tWL tWH
tH
tSU
tV
tZ
tDIS
tXCS
30
31
VS1033c PRELIMINARY
7. SPI BUSES
After the word has been shifted in and the last clock has been sent, XCS should be pulled high to end the
WRITE sequence.
After the last bit has been sent, DREQ is driven low for the duration of the register update, marked “execution” in the figure. The time varies depending on the register and its contents (see table in Chapter 8.7
for details). If the maximum time is longer than what it takes from the microcontroller to feed the next
SCI command or SDI byte, it is not allowed to finish a new SCI/SDI operation before DREQ has risen
up again.
25ns is when pin loaded with 100pF capacitance. The time is shorter with lower capacitance.
Note: As tWL and tWH, as well as tH require at least 2 clock cycles, the maximum speed for the SPI
bus that can easily be used is 1/6 of VS1033’s internal clock speed CLKI. Slightly higher speed can be
achieved with very careful timing tuning. For details, see Application Notes for VS10XX.
Note: Although the timing is derived from the internal clock CLKI, the system always starts up in 1.0×
mode, thus CLKI=XTALI.
Note: Negative numbers mean that the signal can change in different order from what is shown in the
diagram.
Version 0.91, 2007-02-1221
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Solution
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VS1033c PRELIMINARY
0
1233031
1010
000000
XX
XCS
SCK
SI
2
3233616263
SCI Write 1
SCI Write 2
DREQ
DREQ up before finishing next SCI write
123
XCS
SCK
SI
7654310765210
X
SDI Byte 1
SDI Byte 2
06789131415
DREQ
7.7SPI Examples with SM SDINEW and SM SDISHARED set
7.7.1Two SCI Writes
VS1033C
7. SPI BUSES
Figure 9: Two SCI Operations.
Figure 9 shows two consecutive SCI operations. Note that xCS must be raised to inactive state between
the writes. Also DREQ must be respected as shown in the figure.
7.7.2Two SDI Bytes
Figure 10: Two SDI Bytes.
SDI data is synchronized with a raising edge of xCS as shown in Figure 10. However, every byte doesn’t
need separate synchronization.
Version 0.91, 2007-02-1222
VLSI
Solution
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VS1033C
0
1
XCS
SCK
SI
7
7651
00
076510
SDI Byte
SCI Operation
SDI Byte
893940414647
X
DREQ high before end of next transfer
VS1033c PRELIMINARY
7. SPI BUSES
7.7.3SCI Operation in Middle of Two SDI Bytes
Figure 11: Two SDI Bytes Separated By an SCI Operation.
Figure 11 shows how an SCI operation is embedded in between SDI operations. xCS edges are used to
synchronize both SDI and SCI. Remember to respect DREQ as shown in the figure.
Version 0.91, 2007-02-1223
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