Vizio GV42L Schematic

Service Manual

Model #: VIZIO L42HDTV10A

VIZIO GV42L HDTV

V, Inc

320A Kalmus Drive Costa Mesa, CA 92626

TEL : [phone] FAX :[phone]

Top Confidential

Table of Contents

CONTENTS PAGE

Sections

1. Features 1-1

2. Specifications 2-1

3. On Screen Display

3-1

4. Factory Preset Timings 4-1

5. Pin Assignment 5-1

6. Main Board I/O Connections

6-1

7. Theory of Circuit Operation 7-1

8. Waveforms 8-1

9. Trouble Shooting

9-1

10. Block Diagram 10-1

11. Spare parts list 11-1

12-1. Complete Parts List (L42 HDTV10A _LG) 12-1

12-2. Complete Parts List (GV42L HDTV_LG)

12-2

Appendix

1. Main Board Circuit Diagram

2. Main Board PCB Layout

3. Assembly Explosion Drawing

Block Diagram

VIZIO L42HDTV10A,GV42L HDTV Service Manual

VINC Service Manual

VIZIO L42HDTV10A,GV42L HDTV

COPYRIGHT © 2000 V, INC. ALL RIGHTS RESERVED.

IBM and IBM products are registered trademarks of International Business Machines
Corporation.

Macintosh and Power Macintosh are registered trademarks of Apple Computer, Inc.

VINC and VINC products are registered trademarks of V, Inc.

VESA, EDID, DPMS and DDC are registered trademarks of Video Electronics Standards
Association (VESA).

Energy Star is a registered trademark of the US Environmental Protection Agency (EPA).

No part of this document may be copied, reproduced or transmitted by any means for any
purpose without prior written permission from VINC.

FCC INFORMATION
This equipment has been tested and found to comply with the limits of a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy, and if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that the interference will not occur in a particular installation. If this equipment
does cause unacceptable interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures -- reorient or relocate the receiving
antenna; increase the separation between equipment and receiver; or connect the into an
outlet on a circuit different from that to which the receiver is connected.

FCC WARNING
To assure continued FCC compliance, the user must use a grounded power supply cord and
the provided shielded video interface cable with bonded ferrite cores. Also, any unauthorized
changes or modifications to Amtrak products will void the user’s authority to operate this
device. Thus VINC Will not be held responsible for the product and its safety.

CE CERTIFICATION
This device complies with the requirements of the EEC directive 89/336/EEC with regard to
“Electromagnetic compatibility.”

SAFETY CAUTION
Use a power cable that is properly grounded. Always use the AC cords as follows – USA (UL);
Canada (CSA); Germany (VDE); Switzerland (SEV); Britain (BASEC/BS); Japan (Electric
Appliance Control Act); or an AC cord that meets the local safety standards.

VIZIO L42HDTV10A,GV42L HDTV Service Manual

Chapter 1 Features

1. Built in TV channel selector for TV viewing.

2. Simulatnueous display of PC and TV images.

3. Connectable to PC’s analog RGB port .

4. Built in S-video, HDTV, composite video, HDMI and TV out.

5. Built in auto adjust function for automatic adjument of screen display.

6. Smoothing function enables display of smooth texts and graphics even if

image withresolution lower than 1366x768 is magnified.

7. Picture In Picture (PIP) funtion to show TV or VCR images.

8. Power saving to reduce consumption power too less than 3W.

9. On Screen Display: user can define display mode (i.e. color, brightness,

contrast, sharpness, backlight), sound setting, PIP, TV channel program,

aspect and gamma or reset all setting.

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Chapter 2 Specification

1. LCD CHARACTERISTICS

Type: 42.0 WXGA TFT LCD

Size: 42.02inch

Display Size: 42.02 inches (1067.308mm) diagonal

Outline Dimension: 1006 mm (H) x 610 mm (V) x 56 mm (D) (Typ.)

Pixel Pitch: 0.227mm x 0.681mm x RGB

Pixel Format: 1366 horiz. By 768 vert. Pixels RGB strip arrangement

Contrast ratio: 1.CR : 550(Typ) 2. CR WITH AI : 1100(Typ)

Luminance, White: 500 cd/m
Display Operating Mode: normally Black

Surface Treatment: Hard Coating (3H) ,Anti-glare treatment of the front polarizer.

2. OPTICAL CHARACTERISTICS

Viewing Angle (CR>10)

Left: 89°typ.

Right: 89°typ.

Top: 89°typ.

Bottom: 89°typ.

2 (Typ)

3. SIGNAL (Refer to the Timing Chart)

Sync Signal

1) Type: TMDS

2) Input Voltage Level: 90~240 Vac, 50/ 60 Hz

4.Input Connectors

RJ11, D-SUB15PIN (MINI, 3rows), Headphone, HDMIX2, RCAX3 (component), RCAX2

(AUDIO in), RCAX3 (composite), RCAX2 (AUDIO in), S-Video, Tuner

5. POWER SUPPLY

Power Consumption: 280W MAX

Power OFF: to less than 3W MAX

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6.Speaker

Output 10W (max) X2

7. ENVIRONMENT

5-1. Operating Temperature: 5c~35c (Ambient)

5-2. Operating Humidity: Ta= 35 ¶C, 90%RH (Non-condensing)

5-3. Operating Altitude: 0 - 14,000 feet (4267.2m)(Non-Operating)

8. DIMENSIONS (Physical dimension)

Width: 1066 mm.

Depth: 269.2mm

Height: 765.4mm

9. WEIGHT (Physical weight)

a. Net: 36.0+/-0.5kgs

b. Gross: 43+/-0.5kgs

9-1. MOUNTING PRECAUTIONS

(1) You must mount a module using holes arranged in four corners or four sides.

(2) You should consider the mounting structure so that uneven force (ex. Twisted stress)

is not applied to the module. And the case on which a module is mounted should

have sufficient strength so that external force is not transmitted directly to the

module.

(3) Please attach the surface transparent protective plate to the surface in order to

protect the polarizer. Transparent protective plate should have sufficient strength in

order to the resist external force.

(4) You should adopt radiation structure to satisfy the temperature specification.

(5) Acetic acid type and chlorine type materials for the cover case are not desirable

because the former generates corrosive gas of attacking the polarizer at high

temperature and the latter causes circuit break by electro-chemical reaction.

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(6) Do not touch, push or rub the exposed polarizes with glass, tweezers or anything

harder than HB pencil lead. And please do not rub with dust clothes with chemical

treatment.

Do not touch the surface of polarizer for bare hand or greasy cloth.(Some cosmetics

are detrimental to the polarizer.)

(7) When the surface becomes dusty, please wipe gently with absorbent cotton or other

soft materials like chamois soaks with petroleum benzene. Normal-hexane is

recommended for cleaning the adhesives used to attach front / rear polarizers. Do not

use acetone, toluene and alcohol because they cause chemical damage to the

polarizer.

(8) Wipe off saliva or water drops as soon as possible. Their long time contact with

polarizer causes deformations and color fading.

(9) Do not open the case because inside circuits do not have sufficient strength.

9-2. OPERATING PRECAUTIONS

(1) The spike noise causes the mis-operation of circuits. It should be lower than following

voltage : V=·200mV(Over and under shoot voltage)

(2) Response time depends on the temperature. (In lower temperature, it becomes

longer.)

(3) Brightness depends on the temperature. (In lower temperature, it becomes

lower.)And in lower temperature, response time (required time that brightness is

stable after turned on) becomes longer.

(4) Be careful for condensation at sudden temperature change. Condensation makes

damage to polarizer or electrical contacted parts. And after fading condensation,

smear or spot will occur.

(5) When fixed patterns are displayed for a long time, remnant image is likely to occur.

(6) Module has high frequency circuits. System manufacturers shall do sufficient

suppression to the electromagnetic interference. Grounding and shielding methods

may be important to minimize the interference.

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9-3. HANDLING PRECAUTIONS FOR PROTECTION

(1) The protection film is attached to the bezel with a small masking tape. When the

protection film is peeled off, static electricity is generated between the film and

polarizer. This should be peeled off slowly and carefully by people who are electrically

grounded and with well ion-blown equipment or in such a condition, etc.

(2) When the module with protection film attached is stored for a long time, sometimes

there remains a very small amount of glue still on the bezel after the protection film is

peeled off.

(3) You can remove the glue easily. When the glue remains on the bezel surface or its

vestige is recognized, please wipe them off with absorbent cotton waste or other soft

material like chamois soaked with normal-hexane.

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Chapter 3 On Screen Display

Main unit button

Power

MENU
CH ϧ
CH ϰ

VOL +

VOL -

Input

TV Source

A. Picture Adjustř

a. Picture Mode (Standard/Movie /Game / Custom)

b. Backlight (0~100)

c. Contrast (0~100)

d. Brightness (0~100)

e. Color (saturation)(0~100)

f. Tint (hue) (0~100)

g. Sharpness (0~7)

h. Color Temperature (Cool/Normal/Warm/Custom)

i. Advanced Picture Adjust

B. Audio Adjustř

a. Volume (0~100)

b. Bass (0~100)

c. Treble (0~100)

d. Balance (0~100)

e. Surround (ON/OFF)

f. Speakers (ON/OFF)

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C. Special Featuresř

a. Language (English/Français/EspaĖol)

b. Sleep Timer (OFF/30Min/60Min/90Min/120Min)

c. Analog CC (OFF/CC1~4/TT1~4)

d. Digital CC (OFF/CC1~4/Service1~6)

e. Digital CC Style

f. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR)

g. Rest All Setting

D. TV Tuner Setupř

a. Tuner Mode (Cable/Air)

b. Auto Search

c. Skip Channel

d. Digital Audio Out (PCM/Dolby Digital)

e. Time Zone

(Eastern/Indiana/Central/Mountain/Arizona/Pacific/Alaska/Hawaii)

E. Parental Controlř

a. Parental Lock Enable (ON/OFF)

b. TV Rating

c. Move Rating

d. Block Unrated TV (NO/Yes)

e. Access Code Edit

RGB Mode

A. Picture Adjustř!

a. Auto Adjust

b. Backlight (0~100)

c. Contrast (0~100)

d. Brightness (0~100)

e. Color Temperature (9300/6300/Custom)

f. Tint (0~100)

g. H-Size (0~255)

h. Horizontal Shift (0~63)

i. Fine Tune (0~31)

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B. Audio Adjustř!

a. Volume (0~100)

b. Bass (0~100)

c. Treble (0~100)

d. Balance (0~100)

e. Surround (ON/OFF)

f. Speakers (ON/OFF)

C. Special Featuresř!

a. Language (English/Français/EspaĖol)

b. Sleep Timer (OFF/30Min/60Min/90Min/120Min)

c. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR)

d. Rest All Setting

AV COMPONENT MODE

A. Picture Adjustř!

a. Picture Mode (Standard/Movie /Game / Custom)

b. Backlight (0~100)

c. Contrast (0~100)

d. Brightness (0~100)

e. Color (saturation)(0~100)

f. Tint (hue) (0~100)

g. Sharpness (0~7)

h. Color Temperature (Cool/Normal/Warm/Custom)

i. Advanced Picture Adjust

B. Audio Adjustř!

a. Volume (0~100)

b. Bass (0~100)

c. Treble (0~100)

d. Balance (0~100)

e. Surround (ON/OFF)

f. Speakers (ON/OFF)

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C. Special Featuresř!

a. Language (English/Français/EspaĖol)

b. Sleep Timer (OFF/30Min/60Min/90Min/120Min)

c. Analog CC (OFF/CC1~4/TT1~4)

d. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR)

e. Rest All Setting

D. Parental Controlř!

a. Parental Lock Enable (ON/OFF)

b. TV Rating

c. Move Rating

d. Block Unrated TV (NO/Yes)

e. Access Code Edit

HDMI MODEř

A. Picture Adjustř!

a. Picture Mode (Standard/Movie /Game / Custom)

b. Backlight (0~100)

c. Contrast (0~100)

d. Brightness (0~100)

e. Color (saturation)(0~100)

f. Tint (hue) (0~100)

g. Sharpness (0~7)

h. Color Temperature (Cool/Normal/Warm/Custom)

i. Advanced Picture Adjust

B. Audio Adjustř!

a. Volume (0~100)

b. Bass (0~100)

c. Treble (0~100)

d. Balance (0~100)

e. Surround (ON/OFF)

f. Speakers (ON/OFF)

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C. Special Featuresř!

a. Language (English/Français/EspaĖol)

b. Sleep Timer (OFF/30Min/60Min/90Min/120Min)

c. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR)

d. Rest All Setting

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Chapter4 Factory preset timings

This timing chart is already preset for the TFT LCD analog & digital display
monitors.

Resolution

Refresh

rate

640x480 60Hz 31.5kHz 59.94Hz N N 25.175

640x480 75Hz 37.5kHz 75.00Hz N N 31.500

800X600 60Hz 37.9kHz 60.317Hz P P 40.000

800x600 75Hz 46.9kHz 75.00Hz P P 49.500

800X600 85Hz 53.7kHz 85.06Hz P P 56.250

1024x768 60Hz 48.4kHz 60.01Hz N N 65.000

1024X768 75Hz 60.0kHz 75.03Hz P P 78.750

720x400 70Hz 31.46kHz 70.08Hz N P 28.320

1366X768 60 47.7KHZ 60.00HZ P N 85.500

Remark: P: positive N: negative

Horizontal

Frequency

Vertical

Frequency

Horizontal

Polarity

Vertical

Polarity

Pixel

Rate

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Chapter 5 Pin Assignment

The TFT LCD analog display monitors use a 15 Pin Mini D-Sub connector as

video input source.

Pin Description

1 Red

2 Green

3 Blue

4 Ground

5 Ground

6 R-Ground

7 G-Ground

8 B-Ground

9 +5V for DDC

10 Ground

11 No Connection

12 (SDA)

13 H-Sync (Composite

Sync)

14 V-Sync

15 (SCL)

˄

˄˄

ˈ

˄˃ˉ

˄ˈ

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HDMI CONNECT PIN ASSIGNMENT

PIN SIGNAL ASSIGNMENT

1 TMDS Data2+

2 TMDS Data2 Shield

3 TMDS Data2-

4 TMDS Data1+

5 TMDS Data1 Shield

6 TMDS Data1-

7 TMDS Data0+

8 TMDS Data0 Shield

9 TMDS Data0-

10 TMDS Clock+

11 TMDS Clock Shield

12 TMDS Clock-

13 CEC

14 Reserved (N.C on device)

15 SCL

16 SDA

17 DDC/CEC Ground

18 +5V Power

19 Hot Plug Detect

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Four-Pin mini DIN S-Video Connector

Pin Assignment

a.

b. Signal Level Video (Y): Analog 0.1Vp-p/75Ө!

Video (C): Analog 0.286p-p/75!

Sync (H+V): 0.3V below Video (Y)

c. Frequency H: 15.734KHz V: 60Hz (NTSC)

Signal Level Video (Y) : Analog 0.1Vp-p/75Ө

Video (C) : Analog 0.286p-p/75Ө

Sync (H+V): 0.3V below Video (Y)

Frequency H: 15.734Khz V: 60HZ (NTSC)

F-Type TV RF connector

a. Signal Level 60dBμV typical

b. System NTSC

c. Frequency 55~801MHz (NTSC)

PC connector 15 pin male D-sub connector

a. Pin Assignment Refer to Section 2.3.10

b. Signal Level Video (R, G, B): Analog 0.7Vp-p/75

Sync (H, V): TTL level

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Ө!

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RGB Signal:

a. Sync Type TTL (Separate / Composite) or Sync. On Green

b. Sync polarity Positive or Negative

c. Video Amplitude RGB: 0.7Vp-p

d. Frequency H: support to 30K~70KHz

V: support to 50~85Hz

Pixel Clock: support to 110MHz

HDMI Signal (HDMI):

a. Pin Assignment Refer to HDNI Pin Assignment

b. Type A

c. Polarity Positive or Negative

d. Frequency

H: 15.734KHz V: 60Hz (NTSC-480i)

H: 31KHz V: 60Hz (NTSC-480p)

H: 45KHz V: 60Hz (NTSC-720p)

H: 33KHz V: 60Hz (NTSC-1080i)

Component signal (Component 1 and Component 2)

Component

1

a. Frequency H: 15.734KHz V: 60Hz (NTSC-480i)

H: 31KHz V: 60Hz (NTSC-480p)

H: 45KHz V: 60Hz (NTSC-720p)

H: 33KHz V: 60Hz (NTSC-1080i)

b. Signal level Y: 1Vp-p Pb: Ć0.350Vp-p Pr: Ć0.350Vp-p

c. Impedance 75

Component 2

a. Frequency H: 15.734KHz V: 60Hz (NTSC-480i)

H: 31KHz V: 60Hz (NTSC-480p)

H: 45KHz V: 60Hz (NTSC-720p)

H: 33KHz V: 60Hz (NTSC-1080i)

b. Signal level Y: 1Vp-p Pb: Ć0.350Vp-p Pr: Ć0.350Vp-p

c. Impedance 75

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Chapter 6 Main Board I/o Connections

J6 CONNECTION (TOPШBOTTOM)

Pin Description

1 “+5V”

2 “+3.3V”

3 “ADCKEY”

4 “LED”

5 “PWR KEY”

6 “GND”

7 “GND”

8 “IR”

J7 CONNECTION (TOPШBOTTOM)

Pin Description

1 “POWRSW”

2 “+12V”

3 “+12V”

4 “+12V”

5 “GND”

6 “GND”

7 “GND”

8 “GND”

9 “GND”

10 “+5V”

11 “+5V”

12 +5V

13 “PWM”

14 “BL ON/OFF”

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Chapter 7 Theory of Circuit Operation

The operation of D-SUB 15pin route

The D-SUB 15pin is input analog signal to the MTK8202 transfer A/D converter then generates the

vertical and horizontal timing signals for display device.

The operation of HDMII CON route

The HDMI 1&2 CON is input digital signal to the PI3HDMI412FT switch output signal is process to

the MT8293. Then transfer to the MTK8202, the MTK8202 generates the vertical and horizontal

timing signals for display device.

The operation of HDTV & Component route

HDTV & Component signal is input to the MTK8202 then MTK8202 generates the vertical and

horizontal timing signals for display device.

The operation of Video 1,2,3 & S-Video route

The Video 1,2 and S-Video signal is transmission signal to the MTK8202 then MTK8202 generates

the vertical and horizontal timing signals for display device.

The operation of TV route

TV signal is processes to the tuner and output to MTK8202 then MTK8202 generates the vertical

and horizontal timing signals for display device. Audio is processes to the tuner output to SIF circuit

and output to MTK8202.Then MTK8202 process to wm8776 and output to TDA8946J transfer to

speaker

The operation of DTV route

DTV signal is processes to the tuner and transmission to MT5112 and output signal to MT5351

then MT5351 output to MT8202 generates the vertical and horizontal timing signals for display

device.

The operation of keypad

There are 7 keys to control and select the function of L42 and also has one LED to indicate the

status of operation. They are “Power, źŸ, + -, Input, OSD”.

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MT8202 Application

MT8202 is a highly integrated video and audio single chip processor for emerging

HDTV-Ready LCD TV. It includes one 3D/2D TV Decoder recovering the best image from

CVBS, and in addition, its analog input also support popular S-Video, Component, VGA

video source. On-chip advanced motion adaptive de-interlacer (MDDitm) converts

accordingly the interlace video into smooth non-flicking progressive motion pictures. With

on-chip advanced 2D Graphic processor,MT8202 provides customers with high quality UI

adding significant end product value. Flexible scalar provides wide adoption to various LCD

panel for different video sources. Its on-chip audio processor decodes whole world standard

audio signals from tuner with lip sync control, delivering high quality post-processed sound

effect to customers. On-chip microprocessor and reference FW reduces the system BOM

and shortens the schedule of UI design by high-level C program. With truly SOC design,

MT8202 offers our customers the real cost-effective high performance HDTV-ready solution.

BOLOCK DIAGRAM

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1. Video input

a. Input Multiplexing

1.component X2

2.composite X2

3.s-videoX1

4.HDMI X2

5.VGA X1

6.RF&DTV X1

b. Input formats:

1.support HDTV 480i/480p/720p/1080p

2.support Y/C signal 1VP-P/75Ө

3.support Y/C signal 1VP-P/75Өʳ

4.support 480i/408p/720p/1080i/1080p

5.support VGA input up to 1366x168@60HZ

6.support RF NTSC system Frequency 55~801MHZ;DTV 480i/480p/720p/1080p

2. Decoder

TVD

1.Single 2nd generation TV decoder

2.Automatic TV standard detection supporting NTSC, NTSC-4.43, PAL (B, G, D, H, M, N, I, Nc),

PAL (Nc), PAL, SECAM

3.Enhanced 2nd generation NTSC/PAL Motion Adaptive 3D comb filter

4.Motion Adaptive 3D Noise Reduction

5.Embedded VBI decoder for Closed-Caption/XDS/ Teletext/WSS/VPS

6.Supporting Macro vision detection

YPbPr/Scart/D-connector

1.Supporting HDTV 480i/480p/576i/576p/720p/1080i input

2.Smart detection on Scart function for European region

3.Smart detection on D-connector for Japan region

4.Supporting SCART RGB inputs mixed with composite signal by adjustable horizontal delay

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VGA

1.Supporting various VGA input timings up to SXGA (1280x1024@75Hz).

2.Supporting Separate/Composite/SOG sync types

Digital port

1.1 digital port supporting DVI 24-bit RGB or CCIR-656/601 digital video input format

2.1 additional 8 bit digital port for ITU656 video format

VBI

1.Dual VBI decoders for the application of V-Chip/Closed-Caption/XDS/ Teletext/WSS/VPS

2.Supporting external VBI decoder by YPrPb input

3.VBI decoder up to 1000 pages Teletext.

3. Support Formats:

Support NTSC, NTSC-4.43

Automatic Luma / Chroma gain control

Automatic TV standard detection

NTSC Motion Adaptive 3D comb filter

Motion adaptive 3D Noise Reduction

VBI decoder for closed-caption/XDS/Teletext/WSS/VPS

Macro vision detection

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BOLOCK DIAGRAM

4. 2D-Graphic/OSD processor

Embedded two backend RGB domain OSD planes and one YUV domain OSD plane. to support

Main/PIP Teletext/Close-caption functions together with setup menu

1.Supporting alpha blending among these two planes and video

2.Supporting Text/Bitmap decoder

3.Supporting line/rectangle/gradient fill

4.Supporting bitblt

5.Supporting color Key function

6.Supporting Clip Mask

7.65535/256/16/4/2-color bitmap format OSD,

8.Automatic vertical scrolling of OSD image

9.Supporting OSD mirror and upside down

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5. Microprocessor interface

When power is supplied and power key is pressed then the rest circuit lets Reset to low state that

will reset the MTK8202 to initial state. After that the Reset will transits to high state and the

MTK8202 start to work that microprocessor executes the programs and configures the internal

registers. The execution speed of CPU is 162 MHz.

1. The I/O ports are configured as followsΚ

Pin name Function Type Description

AD17 PWM Output Backlight Adjust

R3 GPIO2 Output Panel on/off

V1 GPIO7 Output System power

Y2 GPIO16 Output LVDS on/off

R4 GPIO3 Output ATSC POW on/off

AD22 IOSCL Input / Output SDA

AV22 IOSDA Input / Output SCL

W3 GPIO13 Output HDMI Switch Select

Y4 GPIO_18 Output MT8293 Reset

W4 GPIO_14 Output MT8293 acknowledge to player

B19 ADC_IN0 Input Key ADC detection

L4 IR Input IR Receiver

Y1 GPIO_15 Output SYSTEM EEPROM Read / Write

T2 GPIO_23 Output LED Backlight

L2 RESETn Input MT8202 RESET

R2 GPIO_1 Output DTV & HDMI Select PIN

T4 GPIO_4 Output DTV & ATV Select PIN

2. PIP/POP HARDWARE LIMITION:

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6. Video processor

1.Color Management

Fully 10-bit processing to enhance the video quality

Advanced flesh tone and multiple-color enhancement. (For skin, sky, and grass…)

Gamma/anti-Gamma correction

Advanced Color Transient Improvement (CTI)

Saturation/hue adjustment

2.Contrast/Brightness/Sharpness Management

Sharpness and DLTI/DCTI

Brightness and contrast adjustment

Black level extender

White peak level limiter

Adaptive Luma/Chroma management

3.De-interlacing

2nd generation advanced Motion adaptive de-interlacing

Automatic detect film or video source

3:2/2:2 pull down source detection

Main/PIP 2 independent de-interlacing processor

4.Scaling

2nd generation high resolution arbitrary ratio vertical/horizontal scaling of video,

from 1/32X to 32X

Advanced linear and non-linear Panorama scaling

Programmable Zoom viewer

Picture-in-Picture (PIP)

Picture-Out-Picture (POP)

5.Display

Advanced dithering processing for LCD display with 6/8/10 bit output

10bit gamma correction

Supporting alpha blending for Video and two OSD planes

Frame rate conversion

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6.Seamless performance comparing demonstration function

Support Left/Right video processing comparing function without additional resources (DRAM…)

for customers’ demonstration

All the video functions (De-interlace/3D comb/NR/Flesh tone/CTI) can be included

7. DRAM Usage

1.For features of 8202, Dual for enhance features support, and single 8x16 DDR for

simple function support Lists are the comparison chart between function support lists

of (2xDDR) and (1xDDR)

2.For single DDR, 8202 only support 1080i bob mode de-interlacing. (Non-3D de interlace)

3.With single DDR, it is suggested not to support PIP/POP features. Due to DDR Bandwidth

limitation on PIP/POP when single DDR.

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8.DDR SDRAM (V58C2128164SBI5) Application

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Pin description

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Command Truth Table

1. Power-Up Functional Description

The following sequence is required for POWER UP.

1. Apply power and attempt to maintain CKE at a low state (all other inputs may be undefined.)

- Apply VDD before or at the same time as VDDQ.

- Apply VDDQ before or at the same time as VTT & Vref.

2. Start clock and maintain stable condition for a minimum of 200us.

3. The minimum of 200us after stable power and clock (CLK, CLK), apply NOP & take CKE high.

4. Precharge all banks.

5. Issue EMRS to enable DLL.(To issue “DLL Enable” command, provide “Low” to A0, “High” to BA0

and “Low” to all of the rest address pins, A1~A11 and BA1)

6. Issue a mode register set command for “DLL reset”. The additional 200 cycles of clock input is

required to lock the DLL. (To issue DLL reset command, provide “High” to A8 and “Low” to BA0)

7. Issue precharge commands for all banks of the device.

8. Issue 2 or more auto-refresh commands.

9. Issue a mode register set command to initialize device operation

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2. Mode Register Set (MRS)

The mode register stores the data for controlling the various operating modes of DDR SDRAM. It

programs CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor

specific options to make DDR SDRAM useful for a variety of different applications. The default value

of the mode register is not defined, therefore the mode register must be written after EMRS setting

for proper DDR SDRAM operation.

The mode register is written by asserting low on CS, RAS, CAS, WE and BA0 (The DDR SDRAM

should be in all bank precharge with CKE already high prior to writing into the mode register). The

state of address pins A0 ~ A11 in the same cycle as CS, RAS, CAS, WE and BA0 low is written in

the mode register. Two clock cycles are required to meet tMRD spec. The mode register contents

can be changed using the same command and clock cycle requirements during operation as long as

all banks are in the idle state. The mode register is divided into various fields depending on

functionality. The burst length uses A0 ~ A2, addressing mode uses A3, CAS latency (read latency

from column address) uses A4 ~ A6. A7 is a ProMOS specific test mode during production test. A8 is

used for DLL reset. A7 must be set to low for normal MRS operation. Refer to the table for specific

codes for various burst length, addressing modes and CAS latencies.

1. MRS can be issued only at all banks precharge state.

2. Minimum tRP is required to issue MRS command.

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3. Precharge

The Auto Precharge operation can be issued by having column address A10 high when a

Read or Write command is issued. If A10 is low when a Read or Write command is issued,

then normal Read or Write burst operation is executed and the bank remains active at the

completion of the burst sequence. When the Auto Precharge command is activated, the

active bank automatically begins to precharge at the earliest possible moment during the

Read or Write cycle once tRAS(min) is satisfied.

Read with Auto Precharge

If a Read with Auto Precharge command is initiated, the DDR SDRAM will enter the precharge

operation N-clock cycles measured from the last data of the burst read cycle where N is equal to the

CAS latency programmed into the device. Once the autoprecharge operation has begun, the bank

cannot be reactivated until the minimum precharge time (tRP) has been satisfied.

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4. Bank Activate Command

The Bank Activate command is issued by holding CAS and WE high with CS and RAS low at the

rising edge of the clock. The DDR SDRAM has four independent banks, so two Bank Select

addresses (BA0 and BA1) are supported. The Bank Activate command must be applied before any

Read or Write operation can be executed. The delay from the Bank Activate command to the first

Read or Write command must meet or exceed the minimum RAS to CAS delay time (tRCD min).

Once a bank has been activated, it must be precharged before another Bank Activate command can

be applied to the same bank. The minimum time interval between interleaved Bank Activate

commands (Bank A to Bank B and vice versa) is the Bank to Bank delay time (tRRD min).

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5. Read Operation

With the DLL enabled, all devices operating at the same frequency within a system are ensured to

have the same timing relationship between DQ and DQS relative to the CK input regardless of

device density, process variation, or technology generation. The data strobe signal (DQS) is driven

off chip simultaneously with the output data (DQ) during each read cycle. The same internal clock

phase is used to drive both the output data and data strobe signal off chip to minimize skew between

data strobe and output data. This internal clock phase is nominally aligned to the input differential

clock (CK, CK) by the on-chip DLL. Therefore, when the DLL is enabled and the clock frequency is

within the specified range for proper DLL operation, the data strobe (DQS), output data (DQ), and

the system clock (CK) are all nominally aligned. Since the data strobe and output data are tightly

coupled in the system, the data strobe signal may be delayed and used to latch the output data into

the receiving device. The tolerance for skew between DQS and DQ (tDQSQ) is tighter than that

possible for CK to DQ (tAC) or DQS to CK (tDQSCK).

6. Precharge Timing During Read Operation

For the earliest possible Precharge command without interrupting a Read burst, the Precharge

command may be issued on the rising clock edge, which is CAS latency (CL) clock cycles before the

end of the Read burst. A new Bank Activate (BA) command may be issued to the same bank after

the RAS precharge time (tRP). A Precharge command can not be issued until tRAS(min) is satisfied.

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7.Precharge Timing During Write Operation

Precharge timing for Write operations in DRAMs requires enough time to satisfy the write recovery

requirement. This is the time required by a DRAM sense amp to fully store the voltage level. For

DDR SDRAMs, a timing parameter (tWR) is used to indicate the required amount of time between

the last valid write operation and a Precharge command to the same bank. The “write recovery”

operation begins on the rising clock edge after the last DQS edge that is used to strobe in the last

valid write data. “Write recovery” is complete on the next 2nd rising clock edge that is used to strobe

in the Precharge command.

8. Burst Stop Command

The Burst Stop command is valid only during burst read cycles and is initiated by having RAS and

CAS high with CS and WE low at the rising edge of the clock. When the Burst Stop command is

issued during a burst Read cycle, both the output data (DQ) and data strobe (DQS) go to a high

impedance state after a delay (LBST) equal to the CAS latency programmed into the device. If the

Burst Stop command is issued during a burst Write cycle, the command will be treated as a NOP

command.

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9. Burst Write Operation

The Burst Write command is issued by having CS, CAS, and WE low while holding RAS high at the

rising edge of the clock. The address inputs determine the starting column address. The memory

controller is required to provide an input data strobe (DQS) to the DDR SDRAM to strobe or latch the

input data (DQ) and data mask (DM) into the device. During Write cycles, the data strobe applied to

the DDR SDRAM is required to be nominally centered within the data (DQ) and data mask (DM)

valid windows. The data strobe must be driven high nominally one clock after the write command

has been registered. Timing parameters tDQSS(min) and tDQSS(max) define the allowable window

when the data strobe must be driven high. Input data for the first Burst Write cycle must be applied

one clock cycle after the Write command is registered into the device (WL=1). The input data valid

window is nominally centered around the midpoint of the data strobe signal. The data window is

defined by DQ to DQS setup time (tQDQSS) and DQ to DQS hold time (tQDQSH). All data inputs

must be supplied on each rising and falling edge of the data strobe until the burst length is completed.

When the burst has finished, any additional data supplied to the DQ pins will be ignored.

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MX29LV160BTTC (Flash) Application

The MX29LV800T/B & MX29LV800AT/AB is a 8-mega bit Flash memory organized as 1M bytes of 8

bits or 512K words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable

read/write non-volatile random access memory. The MX29LV800T/B & MX29LV800AT/AB is

packaged in 44-pin SOP, 48-pin TSOP, and 48-ball CSP. It is designed to be reprogrammed and

erased in system or in standard EPROM programmers.

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BLOCK DIAGRAM

1. COMMAND DEFINITIONS

Device operations are selected by writing specific address and data sequences into the

command register. Writing incorrect address and data values or writing them in the

improper sequence will reset the device to the read mode. Table 5 defines the valid

register command sequences. Note that the Erase Suspend (B0H) and Erase Resume

(30H) commands are valid only while the Sector Erase operation is in progress.

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2. WRITE COMMANDS/COMMAND SEQUENCES

To program data to the device or erase sectors of memory, the system must drive WE and CE to

VIL, and OE to VIH. The device features an Unlock Bypass mode to facilitate faster programming.

Once the device enters the Unlock Bypass mode, only two write cycles are required to program a

byte, instead of four. The "byte Program Command Sequence" section has details on

programming data to the device using both standard and Unlock Bypass command sequences. An

erase operation can erase one sector, multiple sectors, or the entire device. Table indicates the

address space that each sector occupies. A "sector address" consists of the address bits required

to uniquely select a sector. The "Writing specific address and data commands or sequences into

the command register initiates device operations. Figure 1 defines the valid register command

sequences. Writing incorrect address and data values or writing them in the improper sequence

resets the device to reading array data. Section has details on erasing a sector or the entire chip,

or suspending/resuming the erase operation.

After the system writes the auto select command sequence, the device enters the auto select

mode. The system can then read auto select codes from the internal register (which is separate

from the memory array) on Q7-Q0. Standard read cycle timings apply in this mode. Refer to the

Auto select Mode and Auto select Command Sequence section for more information. ICC2 in the

DC Characteristics table represents the active current specification for the write mode. The "AC

Characteristics" section contains timing specification table and timing diagrams for write

operations.

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Figure 1

3. READ/RESET COMMAND

The read or reset operation is initiated by writing the read/reset command sequence into the

command register. Microprocessor read cycles retrieve array data. The device remains enabled

for reads until the command register contents are altered. If program-fail or erase-fail happen, the

write of F0H will reset the device to abort the operation. A valid command must then be written to

place the device in the desired state.

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4. READING ARRAY DATA

The device is automatically set to reading array data after device power-up. No commands are

required to retrieve data. The device is also ready to read array data after completing an

Automatic Program or Automatic Erase algorithm. After the device accepts an Erase Suspend

command, the device enters the Erase Suspend mode. The system can read array data using the

standard read timings, except that if it reads at an address within erase suspended sectors, the

device outputs status data. After completing a programming operation in the Erase Suspend mode,

the system may once again read array data with the same exception. See Erase Suspend/Erase

Resume Commands” for more information on this mode. The system must issue the reset

command to re-enable the device for reading array data if Q5 goes high, or while in the auto select

mode. See the "Reset Command" section, next.

5. RESET COMMAND

Writing the reset command to the device resets the device to reading array data. Addresses bits

are don't care for this command. The reset command may be written between the sequence

cycles in an erase command sequence before erasing begins. This resets the device to reading

array data. Once erasure begins, however, the device ignores reset commands until the operation

is complete. The reset command may be written between the sequence cycles in a program

command sequence before programming begins. This resets the device to reading array data

(also applies to programming in Erase Suspend mode). Once programming begins, however, the

device ignores reset commands until the operation is complete. The reset command may be

written between the sequence cycles in an SILICON ID READ command sequence. Once in the

SILICON ID READ mode, the reset command must be written to return to reading array data (also

applies to SILICON ID READ during Erase Suspend). If Q5 goes high during a program or erase

operation, writing the reset command returns the device to reading array data (also applies during

Erase Suspend).

WM8776 Application

The WM8776 is a high performance, stereo audio codec with five channel input selector. The
WM8776 is ideal for surround sound processing applications for home hi-fi, DVD-RW and other
audiovisual equipment. Etch ADC channel has programmable gain control with automatic level
control. Digital audio output word lengths from 16-32 bits and sampling rates from 32kHZ to 96KHZ
are supported. The DAC has an input mixer allowing an external analogue signal to be mixed with
the DAC signal. There are also Headphone and line outputs, with control for the headphone

The WM8776 supports fully independent sample rates for the ADC and DAC. The audio data

interface supports I2S, left justified, right justified and DSP formats.

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BLOCK DIAGRAM

1. Audio sample rate

The master clock forWM8776 supports DAC and ADC audio sampling rates 256fs to 768fs, where

fs is the audio sample frequency (DACLRC or ADCLRC) typically 32KHZ, 44.1KHZ, 48KHZ or

96KHZ (the DAC also supports operation at 128fs and 192fs and 192KHZ sample rate). The

master clock is used to operate the digital filters and the noise shaping circuits.

In slave mode the WM8776 has a master detection circuit that automatically determines the

relationship between the master clock frequency and the sampling rate (to within +/- 32 system

clocks) If there is a greater than 32 clocks error the interface is disabled and ADCLRC/DACLRC

for optical performance, although the WM8776 is tolerant of phase variations or jitter on this clock.

Table shows the typical master clock frequency inputs for the WM8776

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2. DIGITAL AUDIO INTERFACE

1. Slave mode

The audio interfaces operations in either slave mode selectable using the MS control bit. In slave

mode DIN is always an input to the WM8776 and DOUT is always an output. The default is Slave

mode. In slave mode (ms=0) ADCLRC, DACLRC, ADCBCLK, DACBCLK are input to the WM8776

DIN and DACLRC are sampled by the WM8776 on the rising edge of DACBCLK; ADCLRC is

sampled on the rising edge of ADCBCLK. ADC data is output on DOUT and changes on the falling

edge of ADCBCLK. By setting control bit BCLKINV the polarity of ADCBCLK and DACBCLK may

be reversed so that DIN and DACLRC are sample on the falling edge of DACBCLK, ADCLRC is

sampled on the falling edge of ADCBCLK and DOUT changes on the rising of ADCBCLK

Slave mode

as shown in the following figure.

2. 2 Wire serial control mode

The wm8776 supports software control via a 2-wire serial bus. Many devices can be controlled by

the same bus, and each device has a unique 7-bit address (this is not the same as the 7-bit

address of each register in the wm8776). The wm8776 operates as a slave device only.

2-wire serial interface as shown in the following figure.

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The wm8776 has two possible device addresses, which can be selected using the CE pin

In the L32 LCD TV CE pin is LOW (device address is 34h)

In the L32 wm8776 has 2-wire interface

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MT8293 Application

The MT8293 provides a complete solution for receiving HDMI compliant digital audio and video.

Specialized audio and video processing is available within the MT8293 to easily and cost effectively

adds HDMI capability to consumer electronics devices such as digital TVs, plasma displays, LCD

TVs and projectors.

BLOCK DIAGRAM

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1. TMDS Digital Core

The core performs 10-to-8-bit TMDS decoding on the audio and video received from the three

TMDS differential data lines along with a TMDS differential clock. The TMDS core supports link

clock rates to 165MHZ, including CE modes to 720P/1080I/1080P.

2. Active port detection

The Pane Link core detects an active TMDS clock and actively toggling DE signal. These states

are accessible in register bits, useful for monitoring the status of the HDMI input or for

automatically powering down the receiver. The 5V supply from the HDMI connector is used as a

cable detect indicator. The MT8293 can monitor the presence of this+5V supply and, if and when

necessary, provide a fast audio mute without pops when it senses the HDMI cable pulled. The

microcontroller can also poll registers in the MT8293 to check whether an HDMI cable is

connected.

3. HDCP Decryption

The MT8293 external EEPROM for encrypt HDCP keys. HDCP decryption contains all

necessary logic to decrypt the incoming audio and video data. The decryption process is

entirely controlled by the host microprocessor through a set sequence of register reads

and wires through the DDC channel. Pre-programmed HDCP keys and key Selection

Vector are used in the decryption process. A resulting calculated to an XOR mask during

each clock cycle to decrypt the audio/video data in sync with the host.

4. Video Data Conversion and Video Output

The MT8293 can output video in many different formats as shown in the following figure.

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The receiver can also process the video data before it is output as show below figure

5. I2c Interface to Display Controller

The Controller I2c interface (CSDA, CSCL) on the MT8293 is a slave interface capable of running

up to 400KHZ. This bus is used to configure the MT8293 by reading/writing to the appropriate

registers. The MT8293 is accessible on the local I

the CI2CA pin is latched on the rising edge of REST# providing a choice of two pairs of device

address.

Control of local I

2

c address with CI2CA pin

2

c bits at two-device address. The logic state of

TDA8946 Application

In L32 TV the TDA8946AJ is a dual-channel audio power amplifier with DC gain control. It has an

output power of 2 u10 W at an 8 :load and a 12 V supply.

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Block diagram

1. Input configuration

The TDA8946AJ inputs can be driven symmetrical (floating) as well as asymmetrical. In the

asymmetrical mode one input pin is connected via a capacitor to the signal source and the other

input is connected to the signal ground. The signal ground should be as close as possible to the

SVR (electrolytic) capacitor ground. Note that the DC level of the input pins is half of the supply

voltage VCC, so coupling capacitors for both pins are necessary

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2. Output power measurement

The output power as a function of the supply voltage is measured on the output pins at THD =

10%,in the L32 LCD TV Vcc=12V so we can see as shown in the following figure output about 7W

.

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3. Mode selection

In the L32 LCD TV TDA8946AJ has two functional modes, which can be selected by applying the

proper DC voltage to pin MODE.

1. Mute — In this mode the amplifier is DC-biased but not operational (no audio output).

This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute

mode when 3.5 V < VMODE < (VCC 1.5 V).

2. Operating — In this mode the amplifier is operating normally. The operating mode is activated at

VMODE<1.0V.

MT5351 Application :

MediaTek MT5351 is a DTV Backend Decoder SOC which support flexible transport demux , HD

MPEG-2 video decoder , JPEG decoder , MPEG1,2,MP3,AC3 audio decoder , HDTV encoder . The

MT5351 enables consumer electronics manufactures to build high quality , feature-rich DTV , STB or

other home entertainment audio/video device.World-Leading Technology : HW support worldwide

major broadcast network and CA standards , include ATSC , DVB , OpenCable , DirectTV ,

MHP.Rich Feature for high value product : To enrich the feature of DTV , the MT5351 support

1394-5C component to external DVHS . Dual display , PIP/POP and quad pictures provide user a

whole new viewing experience.Credible Audio/Video Quality : The MT5351 use advanced

motion-adaptive de-interlace algorithm to achieve the best movie/video playback , The embedded

4X over-sample video DAC could generate very fine display quality . Also , the audio 3D surround

and equalizer provide professional entertainment.

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General Feature List :

1 . Host CPU:

1. ARM 926EJ

2.16K I-Cache and 16K D-Cache

3. 8K Data TCM and 8K instruction

4. JTAG ICE interface

5. Watch Dog timers

2 . Transport Demuxer :

1. Support 3 independent transport stream inputs

2. Support serial/parallel interface for each transport stream input

3. Support ATSC , DVB , and MPEG2 transport stream inputs.

4. Programmable sync detection.

5. Support DES/3-DES De-scramble.

6. 96 PID filter and 128 section filters.

7. Support TS recording via IEEE1394 interface.

3 . MPEG2 Decoder :

1. Support dual MPEG-2 HD decoder or up to 8 SD decoder.

2. Complaint to MP@ML

, MP@HL and MPEG-1 video standards.

4 . JPEG Decoder :

1. Decode Base-line or progressive JPEG file.

5 . 2D Graphics :

1. Support multiple color modes.

2. Point , horizontal/vertical line primitive drawing.

3. Rectangle fill and gradient fill functions.

4. Bitblt with transparent , alpha blending , alpha composition and stretch.

5. Font rendering by color expansion.

6. Support clip masks.

7. YCrCb to RGB color space transfer.

6 . OSD Display :

1. 3 linking list OSDs with multiple color mode.

2. OSD scaling with arbitary ratio from 1/2x to 2x.

3. Square size , 32x32 or 64x64 pixel , hardware cursor.

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7 . Video Processing :

1. Advanced Motion adaptive de-interlace on SDTV resolution.

2. Support clip

3. 3:2/2:2 pull down source detection.

4. Arbitrary ratio vertical/horizontal scaling of video , from 1/15X to 16X.

5. Support Edge preserve.

6. Support horizontal edge enhancement.

7. Support Quad-Picture.

8 . Main Display :

1. Mixing two video and three OSD and hardware cursor.

2. Contrast/Brightness adjustment.

3. Gamma correction.

4. Picture-in-Picture( PIP ).

5. Picture-Out-Picture( POP ).

6. 480i/576i/480p/576p/720p/1080i output

9 . Auxiliary Display :

1. Mixing one video and one OSD.

2. 480i/576i output.

10 . TV Encoder :

1. Support NTSC M/N , PAL M/N/B/D/G/H/I

2. Macrovision Rev 7.1.L1

3. CGMS/WSS.

4. Closed Captioning.

5. Six 12-bit video DACs for CVBS , S-video or RGB/YPbPr output.

11 . Digital Video Interface :

1. Support SAV/EAV.

2. Support 8/16 for SD/HD digital video input.

3. Support 8/16/24 bits digital output for main display.

4. Support 8 bits digital output for aux display.

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12 . DRAM Controller :

1. Support 64Mb to 1Gb DDR DRAM devices.

2. Configurable 32/64 bit data bus interface.

3. Support DDR266 , DDR333 , DDR400 , JEDEC specification compliant SDRAM.

13 . Peripheral Bus Interface :

1. Support NOR/NAND flash.

2. Support CableCard host control bus.

14 . Audio :

1. Support Dolby Digital AC-3 decoding.

2. MPEG-1 layer I/II , MP3 decoding.

3. Dolby prologic II.

4. Main audio output : 5.1ch + 2ch ( down mix )

5. Auxiliary audio output : 2ch.

6. Pink noise and white noise generator.

7. Equalizer.

8. Bass management.

9. 3D surround processing include virtual surround.

10. Audio and video lip synchronization.

11. Support reverberation.

12. SPDIF out.

13. I2S I/F.

15 . Peripherals :

1. Three UARTs with Tx and Rx FIFO , two of them have hardware flow control.

2. Two serial interfaces , one is master only the other can be set to master mode or slave mode.

3. Two PWMs.

4. IR blaster and receiver.

5. IEEE1394 link controller.

6. IDE bus : ATA/ATAPI7 UDMA mode 5 , 100MB/s.

7. Real-time clock and watchdog controller.

8. Memory card I/F : MS/MS-pro ,SD ,CF ,and MMC

9. PCMCIA/POD/CI interface

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16 . IC Outline :

1. 471 Pin BGA Package.

2. 3.3V/1.2V dual Voltage.

MX29LV320BTTC (Flash) Application :

The MX29LV320AT/B is a 32-mega bit Flash memory organized as 4M bytes of 8 bits and 2M words

of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile

random access memory.

The MX29LV320AT/B is packaged in 48-pin TSOP and 48-ball CSP. It is designed to be

reprogrammed and erased in system or in standard EPROM programmers. The standard

MX29LV320AT/B offers access time as fast as 70ns, allowing operation of high-speed

microprocessors without wait states. To eliminate bus contention, the MX29LV320AT/B has

separate chip enable (CE) and output enable (OE) controls.

MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and

programming. The MX29LV320AT/B uses a command register to manage this functionality. MXIC

Flash technology reliably stores memory contents even after 100,000 erase and program cycles.

The MXIC cell is designed to optimize the erase and program mechanisms. In addition, the

combination of advanced tunnel oxide processing and low internal electric fields for erase and

programming operations produces reliable cycling.

The MX29LV320AT/B uses a 2.7V to 3.6V VCC supply to perform the High Reliability Erase and

auto Program/Erase algorithms.

The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process.

Latch-up protection is proved for stresses up to 100 milliamperes on address and data pin from -1V

to VCC + 1V.

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BLOCK DIAGRAM

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BUS OPERATION--1

Legend:

L=Logic LOW=VIL, H=Logic High=VIH, VID=12.0 0.5V, VΓ HH=11.5-12.5V, X=Don't Care,

AIN=Address IN, DIN=Data IN,DOUT=Data OUT

Notes:

1. When the WP/ACC pin is at VHH, the device enters the accelerated program mode. See

"Accelerated Program Operations" for more information.

2.The sector group protect and chip unprotect functions may also be implemented via programming

equipment. See the "Sector Group Protection and Chip Unprotection" section.

3.If WP/ACC=VIL, the two outermost boot sectors remain protected. If WP/ACC=VIH, the two

outermost boot sector protection depends on whether they were last protected or unprotected

using the method described in "Sector/Sector Block Protection and Unprotection". If

WP/ACC=VHH, all sectors will be unprotected.

4.DIN or Dout as required by command sequence, data polling, or sector protection algorithm.

5.Address are A20:A0 in word mode (BYTE=VIH), A20:A-1 in byte mode (BYTE=VIL).

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BUS OPERATION--2

Notes:

1.Code=00h means unprotected, or code=01h protected.

2.Code=99 means factory locked, or code=19h not factory locked.

WRITE COMMANDS/COMMAND SEQUENCES

To program data to the device or erase sectors of memory , the system must drive WE and CE to

VIL, and OE to VIH.An erase operation can erase one sector, multiple sectors , or the entire device.

A "sector address" consists of the address bits required to uniquely select a sector. Writing specific

address and data commands or sequences into the command register initiates device operations.

Table A defines the valid register command sequences. Writing incorrect address and data values or

writing them in the improper sequence resets the device to reading array data. Section has details

on erasing a sector or the entire chip, or suspending/resuming the erase operation.

After the system writes the Automatic Select command sequence, the device enters the Automatic

Select mode. The system can then read Automatic Select codes from the internal register (which is

separate from the memory array) on Q7-Q0. Standard read cycle timings apply in this mode. Refer

to the Automatic Select Mode and Automatic Select Command Sequence section for more

information.ICC2 in the DC Characteristics table represents the active current specification for the

write mode. The "AC Characteristics" section contains timing specification table and timing diagrams

for write operations.

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TABLE A. MX29LV320AT/B COMMAND DEFINITIONS

Legend:

X=Don't care
RA=Address of the memory location to be read.
RD=Data read from location RA during read operation.
PA=Address of the memory location to be programmed.
Addresses are latched on the falling edge of the WE or CE pulse.
PD=Data to be programmed at location PA. Data is latched on the rising edge of WE or CE pulse.
SA=Address of the sector to be erased or verified. Address bits A20-A12 uniquely select any sector.
ID=22A7h(Top), 22A8h(Bottom)

Notes:

1.All values are in hexadecimal.

2.Except when reading array or Automatic Select data, all bus cycles are write operation.

3.The Reset command is required to return to the read mode when the device is in the Automatic
Select mode or if Q5 goes high.

4.The fourth cycle of the Automatic Select command sequence is a read cycle.

5.The data is 99h for factory locked and 19h for not factory locked.

6.The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block.
In the third cycle of the command sequence, address bit A20=0 to verify sectors 0~31, A20=1 to
verify sectors 32~70 for Top Boot device.

7.Command is valid when device is ready to read array data or when device is in Automatic Select
mode.

8.The system may read and program functions in non-erasing sectors, or enter the Automatic Select
mode, when in the erase Suspend mode. The Erase Suspend command is valid only during a
sector erase operation.

9.The Erase Resume command is valid only during the Erase Suspend mode.

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STANDBY MODE

MX29LV320AT/B can be set into Standby mode with two different approaches. One is using both CE

and RESET pins and the other one is using RESET pin only.

When using both pins of CE and RESET, a CMOS Standby mode is achieved with both pins held at

Vcc ±0.3V. Under this condition, the current consumed is less than 0.2uA (typ.). If both of the CE and

RESET are held at VIH, but not within the range of VCC ± 0.3V, the device will still be in the standby

mode, but the standby current will be larger. During Auto Algorithm operation, Vcc active current

(ICC2) is required even CE = "H" until the operation is completed. The device can be read with

standard access time (tCE) from either of these standby modes.

When using only RESET, a CMOS standby mode is achieved with RESET input held at Vss r0.3V,

Under this condition the current is consumed less than 1uA (typ.). Once the RESET pin is taken high,

the device is back to active without recovery delay.In the standby mode the outputs are in the high

impedance state, independent of the OE input.MX29LV320AT/B is capable to provide the Automatic

Standby Mode to restrain power consumption during readout of data. This mode can be used

effectively with an application requested low power consumption such as handy terminals.

To active this mode, MX29LV320AT/B automatically switch themselves to low power mode when

MX29LV320AT/B addresses remain stable during access time of tACC+30ns. It is not necessary to

control CE, WE, and OE on the mode. Under the mode, the current consumed is typically 0.2uA

(CMOS level).

RESET OPERATION

01The RESET pin provides a hardware method of resetting the device to reading array data. When

the RESET pin is driven low for at least a period of tRP, the device immediately terminates any

operation in progress, tristates all output pins, and ignores all read/write commands for the duration

of the RESET pulse. The device also resets the internal state machine to reading array data. The

operation that was interrupted should be reinitiated once the device is ready to accept another

command sequence, to ensure data integrity.

Current is reduced for the duration of the RESET pulse. When RESET is held at VSS 0.3V, the Γ

device draws CMOS standby current (ICC4). If RESET is held at VIL but not within VSS 0.3V, the Γ

standby current will be greater.The RESET pin may be tied to system reset circuitry. A system reset

would that also reset the Flash memory, enabling the system to read the boot-up firm-ware from the

Flash memory.

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If RESET is asserted during a program or erase operation, the RY/BY pin remains a "0" (busy) until

the internal reset operation is complete, which requires a time of tREADY (during Embedded

Algorithms). The system can thus monitor RY/BY to determine whether the reset operation is

complete. If RESET is asserted when a program or erase operation is not executing (RY/BY pin is

"1"), the reset operation is completed within a time of tREADY (not during Embedded Algorithms).

The system can read data tRH after the RESET pin returns to VIH. Refer to the AC Characteristics

tables for RESET parameters and to Figure 14 for the timing diagram.

WRITE PROTECT (WP)

The write protect function provides a hardware method to protect boot sectors without using VID.

If the system asserts VIL on the WP/ACC pin, the device disables program and erase functions in

the two "outermost" 8 Kbyte boot sectors independently of whether those sectors were protected or

unprotected using the method described in Sector/Sector Group Protection and Chip Unprotection".

The two outermost 8 Kbyte boot sectors are the two sectors containing the lowest addresses in a

bottom-boot-configured device, or the two sectors containing the highest addresses in a

top-boot-configured device.

If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two outermost 8K

Byte boot sectors were last set to be protected or unprotected. That is, sector protection or

unprotection for these two sectors depends on whether they were last protected or unprotected

using the method described in "Sector/Sector Group Protection and Chip Unprotection".

Note that the WP/ACC pin must not be left floating or unconnected; inconsistent behavior of the

device may result.

SOFTWARE COMMAND DEFINITIONS :

Device operations are selected by writing specific address and data sequences into the command

register. Writing incorrect address and data values or writing them in the improper sequence will

reset the device to the read mode. Table 3 defines the valid register command sequences. Note that

the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector

Erase operation is in progress. Either of the two reset command sequences will reset the device

(whenapplicable).

All addresses are latched on the falling edge of WE or CE, whichever happens later. All data are

latched on rising edge of WE or CE, whichever happens first.

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WRITE OPERATION STATUS

The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7,

and RY/BY.Table B and the following subsections describe the functions of these bits. Q7, RY/BY,

and Q6 each offer a method for determining whether a program or erase operation is complete or in

progress. These three bits are discussed first.

Table B. Write Operation Status

Notes:

1.Performing successive read operations from the erase-suspended sector will cause Q2 to toggle.

2.Performing successive read operations from any address will cause Q6 to toggle.

3.Reading the byte/word address being programmed while in the erase-suspend program mode will
indicate logic "1" at the Q2 bit.

However, successive reads from the erase-suspended sector will cause Q2 to toggle.

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Fig C. COMMAND WRITE OPERATION

Fig D. READ TIMING WAVEFORMS

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Fig E. RESET TIMING WAVEFORM

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DDR SDRAM (NT5DS16M16CS-5T) Application:

Functional Description

The 256Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 268,
435, 456 bits. The 256Mb DDR SDRAM is internally configured as a quad-bank DRAM. The 256Mb
DDR SDRAM uses a double-data-rate architecture to achieve high-speed operation. The
double-data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to
transfer two data words per clock cycle at the I/O pins. A single read or write access for the 256Mb
DDR SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM
core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and
write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and
continue for a programmed number of locations in a programmed sequence. Accesses begin with
the registration of an Active command, which is then followed by a Read or Write command. The
address bits registered coincident with the Active command are used to select the bank and row to
be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered
coincident with the Read or Write command are used to select the starting column location for the
burst access.Prior to normal operation, the DDR SDRAM must be initialized. The following sections
provide detailed information covering device initialization, register definition, command descriptions
and device operation.

Block Diagram (16Mb x 16)

Note: This Functional Block Diagram is intended to facilitate user understanding of the operation of

the device; it does not represent an actual circuit implementation.

Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the

bidirectional DQ and DQS signals.

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Pin Configuration - 400mil TSOP II (x4 / x8 / x16)

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Mode Register Operation

Operating Mode

The normal operating mode is selected by issuing a Mode Register Set Command with bits A7-A12

to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a Mode Register

Set command with bits A7 and A9-A12 each set to zero, bit A8 set to one, and bits A0-A6 set to the

desired values. A Mode Register Set command issued to reset the DLL should always be followed

by a Mode Register Set command to select normal operating mode.

All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test

modes and reserved states should not be used as unknown operation or incompatibility with future

versions may result.

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Extended Mode Register

The Extended Mode Register controls functions beyond those controlled by the Mode Register;

these additional functions include DLL enable/disable, bit A0; output drive strength selection, bit A1;

and QFC output enable/disable, bit A2 (NTC optional). These functions are controlled via the bit

settings shown in the Extended Mode Register Definition. The Extended Mode Register is

programmed via the Mode Register Set command (with BA0 = 1 and BA1 = 0) and retains the stored

information until it is programmed again or the device loses power. The Extended Mode Register

must be loaded when all banks are idle, and the controller must wait the specified time before

initiating any subsequent operation. Violating either of these requirements result in unspecified

operation.

Extended Mode Register Definition

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Truth Table a: Commands

1. CKE is high for all commands shown except Self Refresh.

2. BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode

Register; BA0 = 1, BA1 = 0 selects ,Extended Mode Register; other combinations of BA0-BA1 are
reserved; A0-A12 provide the op-code to be written to the selected Mode Register.)

3. BA0-BA1 provide bank address and A0-A12 provide row address.

4. BA0, BA1 provide bank address; A0-Ai provide column address (where i = 9 for x8 and 9, 11 for

x4); A10 high enables the Auto Precharge feature (non-persistent), A10 low disables the Auto
Precharge feature.

5. A10 LOW: BA0, BA1 determine which bank is precharged.A10 HIGH: all banks are precharged

and BA0, BA1 are “Don’t Care.”

6. This command is auto refresh if CKE is high; Self Refresh if CKE is low.

7. Internal refresh counter controls row and bank addressing; all inputs and I/Os are “Don’t Care”

except for CKE.

8. Applies only to read bursts with Auto Precharge disabled; this command is undefined (and should

not be used) for read bursts with Auto Precharge enabled or for write bursts

9. Deselect and NOP are functionally interchangeable.

Active

The Active command is used to open (or activate) a row in a particular bank for a subsequent access.

The value on the BA0,BA1 inputs selects the bank, and the address provided on inputs A0-A12

selects the row. This row remains active (or open) for accesses until a Precharge (or Read or Write

with Auto Precharge) is issued to that bank. A Precharge (or Read or Write with Auto Precharge)

command must be issued and completed before opening a different row in the same ba

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Read

The Read command is used to initiate a burst read access to an active (open) row. The value on the

BA0, BA1 inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9, j =

don’t care] for x8; where [i = 9, j = 11] for x4) selects the starting column location. The value on input

A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being

accessed is precharged at the end of the Read burst; if Auto Precharge is not selected, the row

remains open for subsequent accesses.

Write

The Write command is used to initiate a burst write access to an active (open) row. The value on the

BA0, BA1 inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9, j =

don’t care] for x8; where [i = 9, j = 11] for x4) selects the starting column location. The value on input

A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being

accessed is precharged at the end of the

remains open for subsequent accesses. Input data appearing on the DQs is written to the memory

array subject to the DM input logic level appearing coincident with the data. If a given DM signal is

registered low, the corresponding data is written to memory; if the DM signal is registered high, the

corresponding data inputs are ignored, and a Write is not executed to that byte/column location.

Write burst; if Auto Precharge is not selected, the row

Auto Refresh

Auto Refresh is used during normal operation of the DDR SDRAM and is analogous to CAS Before

RAS (CBR) Refresh in previous DRAM types. This command is nonpersistent, so it must be issued

each time a refresh is required.The refresh addressing is generated by the internal refresh controller.

This makes the address bits “Don’t Care” during an Auto Refresh command. The 256Mb DDR

SDRAM requires Auto Refresh cycles at an average periodic interval of 7.8Ӵs (maximum).

Self Refresh

The Self Refresh command can be used to retain data in the DDR SDRAM, even if the rest of the

system is powered down.When in the self refresh mode, the DDR SDRAM retains data without

external clocking. The Self Refresh command is initiated as an Auto Refresh command coincident

with CKE transitioning low. The DLL is automatically disabled upon entering Self Refresh, and is

automatically enabled upon exiting Self Refresh (200 clock cycles must then occur before a Read

command can be issued). Input signals except CKE (low) are “Don’t Care” during Self Refresh

operation.

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The procedure for exiting self refresh requires a sequence of commands. CK (and CK) must be

stable prior to CKE returning high. Once CKE is high, the SDRAM must have NOP commands

issued for tXSNR because time is required for the completion of any internal refresh in progress. A

simple algorithm for meeting both refresh and DLL requirements is to apply NOPs for 200 clock

cycles before applying any other command.

Operations:

Reads

Subsequent to programming the mode register with CAS latency, burst type, and burst length, Read

bursts are initiated with a Read command.

The starting column and bank addresses are provided with the Read command and Auto Precharge

is either enabled or disabled for that burst access. If Auto Precharge is enabled, the row that is

accessed starts precharge at the completion of the burst, provided tRAS has been satisfied. For the

generic Read commands used in the following illustrations, Auto Precharge is disabled.

During Read bursts, the valid data-out element from the starting column address is available

following the CAS latency after the Read command. Each subsequent data-out element is valid

nominally at the next positive or negative clock edge (i.e. at the next crossing of CK and CK). The

following timing figure entitled “Read Burst: CAS Latencies (Burst Length=4)” illustrates the general

timing for each supported CAS latency setting. DQS is driven by the DDR SDRAM along with output

data. The initial low state on DQS is known as the read preamble; the low state coincident with the

last data-out element is known as the read postamble . Upon completion of a burst, assuming no

other commands have been initiated, the DQs and DQS goes High-Z. Data from any Read burst

may be concatenated with or truncated with data from a subsequent Read command. In either case,

a continuous flow of data can be maintained. The first data element from the new burst follows either

the last element of a completed burst or the last desired data element of a longer burst which is

being truncated. The new Read command should be issued x cycles after the first Read command,

where x equals the number of desired data element pairs (pairs are required by the 2n prefetch

architecture). This is shown in timing figure entitled “Consecutive Read Bursts: CAS Latencies (Burst

Length =4 or 8)”.A Read command can be initiated on any positive clock cycle following a previous

Read command. Nonconsecutive Read data is shown in timing figure entitled “Non-Consecutive

Read Bursts: CAS Latencies (Burst Length = 4)”. Full-speed Random Read Accesses: CAS

Latencies (Burst Length = 2, 4 or 8) within a page (or pages) can be performed as shown on

following:

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Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8)

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Read Command

Writes

Write bursts are initiated with a Write command, as shown in timing figure Write Command on

following: The starting column and bank addresses are provided with the Write command, and Auto

Precharge is either enabled or disabled for that access. If Auto Precharge is enabled, the row being

accessed is precharged at the completion of the burst. For the generic Write commands used in the

following illustrations, Auto Precharge is disabled.

During Write bursts, the first valid data-in element is registered on the first rising edge of DQS

following the write command, and subsequent data elements are registered on successive edges of

DQS. The Low state on DQS between the Write command and the first rising edge is known as the

write preamble; the Low state on DQS following the last data-in element is known as the write

postamble.

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The time between the Write command and the first corresponding rising edge of DQS (tDQSS) is

specified with a relatively wide range (from 75% to 125% of one clock cycle), so most of the Write

diagrams that follow are drawn for the two extreme cases (i.e. tDQSS(min) and tDQSS(max)).

Timing figure Write Burst (Burst Length = 4) on page 33 shows the two extremes of tDQSS for a

burst of four. Upon completion of a burst, assuming no other commands have been initiated, the

DQs and DQS enters High-Z and any additional input data is ignored.Data for any Write burst may

be concatenated with or truncated with a subsequent Write command. In either case, a continuous

flow of input data can be maintained. The new Write command can be issued on any positive edge

of clock following the previous Write command. The first data element from the new burst is applied

after either the last element of a completed burst or the last desired data element of a longer burst

which is being truncated. The new Write command should be issued x cycles after the first Write

command, where x equals the number of desired data element pairs (pairs are required by the 2n

prefetch architecture).

Write Command

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Data Input (Write)

Data Output (Read)

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Chapter8 Waveforms

PC MODE(1366X768 60HZ)

CH1 H-sync (L21); CH2 V-sync (L22)

CH1 GREEN (FB27)

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CH1 GREEN+(C294)

CH1 GREEN # (FB27); CH2 VGAVSYNC (L22)

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CH1 VGAL (R193); CH2 AVOL (R194)

CH1 PC_L (CE70+) ; PC_L (CE70-)

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AV&TV MODE (AV1/AV2/TV) VIDEO

CH1 CVBS2 (R169); CH2 AV2CVBS (C255)

CH1 AV2L (R237); CH2 AV2L (U22 PIN14)

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CH1 AV_L (U22 PIN13) ; CH2 AV_L (CE71-)

CH1 AUSPL (R302);CH2 OUT2+5(J4 PIN4)

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CH1 DACBCLK (U23 PIN4);

CH1 DACMCLK (U23 PIN5);

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CH1 DACLRCK (U23 PIN7)

COMPONENT MODE (COMPONENT 1/2)

CH1 COM_Y2 (L16); CH2 AVY1P (C269)

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CH1YCBCR_L2(L19) CH2 2A33 (U22 PIN11)

CH1 AV_L (CE71+);CH2 AUSPL (R304)

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HDMI 1&2

CH1 RX1_2 (P11 PIN 1); CH2 DATA2+ (U31 PIN3)

CH1 HDMIMCLK (U19 PIN 79) ;CH2 HDMIBCLK (U19 PIN 76)

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CH1 SOG_IN (U19 PIN4)

CH1 HDMILRCK (U19 PIN75) CH2 HDMISDO (U19 PIN74)

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CH1 DDC_SDA (Q14 PIN3);CH2 DDC_SCL (Q13 PIN3)

DTV HD

CH1 VOB0 (RP35)

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CH1 AO1MCLK (DU9 PIN J1 ) CH2 AO1BCK (DU9 PIN J2)

CH1 VOHSYNC (DU9 PIN V4)

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CH1 VOVSYNC (DU9 PIN W1)

CH1 VODE (DU9 PIN W2)

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CH1 VOPCLK (DU9 PIN V3)

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Chapter 9 Trouble shooting

MONITOR DISPLAY NOTHING (PC MODE)

Start

LED is lighted

Yes

LED is lighting?

Yes

Is backlight on?

Yes
Yes

U11 no data out?

N0

1. Is Power board output
+5V?

2. Is J7 connector good?

3. Is DC-DC OK?

4. Is U6&U4 (3.3V) working ok?

N0

N0

It is in power saving

1. Check video cable

2. Is the timing supported?

3. Check sync input

4. Check VGASOG rout if analog

(SOG)

N0

1.Check J7 PIN 14

2.Is inverter ok?

3.Is Power Board ok?

N0

It means data to LVDS

1.Is J5 connecting OK?

2.Check J7 +5V&+12V

3.Is panel ok?

4.

Check P3 D-sub Input correct

5. Check analog input route

Yes

END

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(TV, COMPOSITE VIDEO1, 2, S-VIDEO) IS NOT DISPLAY CORRECTLY

Star t

N0

Input signal good?

1.Check video

2.Check DVD player

Yes

U11 input correct?

Yes

U11 output correct?

Yes

LVDS output correct?

Yes

1.Chcak J5 Connect is good?

2.Is panel working ok?

END

N0

N0

N0

1.Check P2&P12 signal

2.Check signal between P2 and
U11 (IF AV1/AV2 mode)

3.Check Tuner &U11 (IF TV mode)

4.Check P12 (IF S-Video)

5.Check U11 POWER +3.3V

6.Check Y1 is OK?

1.Check signal between U20 and
U9

1.Check LVDS LINE

2.Check U11 clock (27MHz)

3.Check U11 power

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(COMPONENT1, 2) IS NOT DISPLAY CORRECTLY

Star t

N0

Input signal good?

1.Check video

2.Check host’s setting

Yes

P4 input correct?

Yes

U11 input correct?

Yes

LVDS output correct ?

Yes

1.Is J5 connected good?

2.Is panel working ok?

END

N0

1.Check signal between P4

2.Check power 12V& 5v

N0

1.Check signal between U11&P4

2.Check U11 Clock (27MHZ)

N0

1.Check U11

2.Check U11 power 3.3V&1.25v&1.8v

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(HDMI) IS NOT DISPLAY CORRECTLY

Star t

Input signal good?

Yes

U31 input correct?

Yes

N0

1.Check video

2.Check host’s setting

N0

1.Check p10&p11 connect

2.Check signal between U31
and U19

U11 no data out ?

Yes

1.Is J6 connected good?

2.Is panel working ok?

END

N0

1.Check U11 power

2.Check between signal U19
and U11

3.Check U19 clock 27MHZ

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TROUBLE OF DC-DC CONVERTER

Star t

J7 PIN10,11,12

J7 PIN 2,3,4

U1 pin 5 6 7 8

U4 pin2

U6 pin 2

Yes

Yes

Yes

Yes

N0

N0

N0

N0

N0

The voltage is about + 5V

1.Check power board

2.Check power cable
connection J7

The voltage is about + 12V while
power switch on

1.J7 connection good

2.Check J7 Pin1 is up to 3V?

3.Check power board

The voltage is about +5V while
power switch on

1.J1 connection good

2. Check U11 GPIO_7 Pin

The voltage is about +3.3V

1.J1 to connection good?

2.Check U4

The voltage is about +3.3V

1.J1 to connection good?

2.Check U6

U5 pin2

U8 pin2

U7&U8&U10 pin2

END

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Yes

Yes

N0

The voltage is about +1.8V while
power switch on

1.Check U5

N0

The voltage is about +3.3V
while power switch on

1.Check J1 Connect

2.Check U8

The voltage is about +1.8V
while power switch on

1.Check J1 Connect

2.Check

U7&U8&U10

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TROUBLE OF DDC READING

Star t

Analog DDC OK?

Yes

HDMIDDC OK?

Yes

END

N0

N0

Support DDC1/2B

1.Analog cable ok?

2.Check signal (U20 to P3)

3.Check U20 Voltage

4.Is compliant protocol?

Support DDC1/2B

1.Analog cable ok?

2.Check signal (U32 to P10)

3. Check signal (U34 to P11)

4.Is compliant protocol?

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File No. SG-0198

Chapter 10 Block Diagram

System Block Diagram

42” WXGA panel

Digital

Video bus AC IN

Speakers

J6 j5 J7 J4

Power Board

DTU1 DP1 P8 P11 P10 P9 P3 P6 P4 P5 P12 P2 P13

Main Board

ϭϭϭϭϭ

Keypad/IR

Board

RF SPDIF RJ11 HDMI1 HDMI2 RCAX2 VGA PHONE YPbPr RCA S-video AV RCA OUT

The TV system block diagram is powered by power board that transforms AC source

of 100V~240V AC +/- 10% @ 50/60 HZ into DC 5V & 12V& 24Vsource. The main

board receives different types of video signal into the MTK8202 Ic. Afterward, the

MTK8202 Ic process the signals control the various functions of the monitor and

outputs control signal, video signal and power to the 42” WXGA panel to be

displayed.

The power send to the panel is first processed by the inverter. The function of the

inverter is to step up the voltage supplied by the main board to the power that is

needed to light up the lamps in the panel. Simultaneously, the digital video signals are

processed in the panel and the outcome determines the brightness, pixel on/off and

the color displayed on the panel. The analog video signals of S-video, YPbPr, TV, PC

and A/V all video signals are translated from analog signals into MTK8202 generates

the vertical and horizontal timing signals for display device. The analog audio of

s-video, YpbPr, TV, PC and A/V is transmitting to the WM877 processed.

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File No. SG-0198

The purpose is process the input audio signal to control volume, bass, treble,

surround, and balance. The HDMI video and audio is must transmitting to MT8293

processed then TMDS signal to the MTK8202 generates the vertical and horizontal

timing signals for display device. All functions are controllable by the main board.

Plus, all functions in the IC boards are programmable using I2C Bus.

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Main Board Block Diagram

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Chapter 11 Spare Parts List

VIZIO L42HDTV10A_LG

PART NO DESCRIPTION LOC QTY REMARK

0185-1302-0073 FUSE 125V/3A SMD (R451003) LF

0185-1502-0073 FUSE 125V/5A SMD (R45105) L-F

0320-4000-0142 POWER CORD 110V UL/CSA 1800mm BLK N.M. (VINC)

0321-0000-0411 AV CABLE RCA(Y/W/R) 1800mm BLK (VINC)

0360-1000-0420 POWER INDUCTOR L:10uH 1.44A 5.8x5.2mm SMD LF

0361-2022-0030 COIL CHOKE 22UH 2.9A 11*12 DIP TSL1112RA-220K2R9-PF

0420-1005-4601 POWER MOS IRF7316TRPBF SMD 8PIN LF

0430-4013-3109 IC TDA8946AJ 17PIN DIP LF

0430-6005-5079 IC AP1117E18LA LF SOT-223

0430-6007-5079 IC AP1117E33LA LF SOT-223

0430-6009-1051 IC AMC1117SKF-ADJ SMD 3PIN SOT-223 LF

0430-6011-3210 IC MC7805CTG 3PIN TO-220 LF

0430-6015-5079 IC STEP DOWN CONVERTER AP1513SA SOP 8PIN LF

0430-6015-6099 IC RESET STL8110GCL438 4.38V SOT-23 3PIN LF

0430-6015-8079 IC DC/DC CONVERTER AP1522WA SOT23-5 5PIN LF

0430-7043-5092 IC SWITCH PI5C3257QE QSOP 16PIN LF

0980-0200-2130 MODULE. IR RECEIVER (FM-6038LM-5AN)

1801-0122-9010 FRONT BEZEL (L42 HDTV10A)(ABS, BLACK) ASS'Y

1925-1000-3390 EPS T_R (L42 HDTV10A)

1925-1000-3400 EPS T_L (L42 HDTV10A)

1925-1000-3410 EPS B_R (L42 HDTV10A)

1925-1000-3420 EPS B_L (L42 HDTV10A)

1925-1100-0230 PE BAG 320*230*0.04T

1925-1100-0280 PE BAG (180W*290L*0.04t)(PE-LD)(ACC.-1)

1925-1100-2300 LD-PE BAG (1280*1050*0.07)

1925-1200-7080 ACCESSARY BOX (330W*230D*50H)

1925-1200-8871 CARTON BOTTOM (L42HDTV10A)

1925-1200-8901 CARTON VIZIO(L42HDTV10A)

1925-1300-7080 Brochure VIZIO Series

1925-1300-7691 MANUAL VIZIO L42 HDTV10A

1925-1300-7760 Quick Setup Guide VIZIO(L42HDTV10A)

1925-1400-2710 Register CARD/VIZIO L15

1925-1900-0640 CARTON JOINT (L42 HDTV10A)

1925-2000-0030 Polishing Cloth VIZIO P42 HDTV10A

1936-1100-8550 B/C LBL VIZIO(L42HDTV10A)

1947-1200-0310

1947-1200-0400

1947-1200-1560 FILAMENT TAPE (TIBON 25wide)

1947-1200-3420 Masking Mylar (13*25mm, t=0.25mm)

1947-1200-3480 Non Woven (160*7mm , t=0.35mm)

1947-1500-2890 SPONGE (146*7mm)

1947-1500-2900 SPONGE (80*7mm)

1947-1700-0020 SHIELDING AL. TAPE (45.0*25.0)

1947-1800-0490 GASKET BLOCK (12L*10W*2.5Hmm) HOLE 6 ij

1947-1900-0160 HEAT PATH (25*14mm , t=1 mm)

3642-0012-0312 PACKING ASS'Y L42 HDTV10A

3642-0012-0331 PANEL ASS'Y L42 HDTV10A (LG)

3842-0042-0301 PDP BASE ASS'Y PD-42L

ACETATE CLOTH TAPE ( ᔩᎨؒᓄ൅ ) 27*75mm
ACETATE CLOTH TAPE ( ᔩᎨؒᓄ൅ ) 20*45mm

F2

F1

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DL16

DL7,DL8

U1,U2,U3

U24

U10,U7,U9

DU2,U4,U6,U8

DU4,U5

DU1

DU5,DU6

U27

DU18

DU7,U33

UR1

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4 ʳ

14 ʳ

0.7 ʳ
1 ʳ
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4 ʳ
4 ʳ
1 ʳ
1 ʳ
1 ʳ
1 ʳ
1 ʳ
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VIZIO GV42L HDTV_LG

PART NO DESCRIPTION LOC QTY REMARK

0000-0000-0002 ʳ

0043-0704-3509 IC SWITCH PI5C3257QE QSOP 16PIN LF

0185-1152-0073 FUSE 125V/1.5A SMD (R45101.5) L-F

0185-1152-0073 FUSE 125V/1.5A SMD (R45101.5) L-F

0185-1302-0073 FUSE 125V/3A SMD (R451003) LF

0280-2500-0012 X'TAL 25MHZ 49/US 30PPM 20PF LF

0280-2700-0012 X'TAL 27MHZ 49/US 30PPM 20PF 40ohm

0286-2700-0024 OSC 27MHz 25ppm 3.3V SMD VCXO

0410-5000-5610 TRANSISTOR MMBT3904LT1G SOT-23 L-F

0410-5000-5610 TRANSISTOR MMBT3904LT1G SOT-23 L-F

0410-5000-5710 TRANSISTOR MMBT3906LT1G SOT-23 L-F

0420-1004-9621 MOSFET N-CH 2N7002E-T1-E3 SMD (SOT-23) L-F

0420-1005-4601 POWER MOS IRF7316TRPBF SMD 8PIN LF

0420-1006-2622 MOSFET N-CH 11A 30V FDS6690A SOP-8 LF

0430-0001-8015 IC CD4052BNSR 16PIN SOP16 L-F

0430-1010-8615 IC TTL LOGIC CD74HC157M96 SOIC 16PIN LF

0430-1010-9088 IC DUAL OP AMP NJM4558M-TE3_PB SO8(DMP8) L-F

0430-3004-3011 IC AT24C16AN-10SU-2.7 SO-8 L-F

0430-3006-9011 IC AT24C04N-10SU-2.7 SO-8 L-F

0430-3039-3645 IC MX29LV160CTTC-70G 48PIN TSOP LF

0430-3039-4645 IC MX29LV320CTTC-70G 48PIN TSOP LF

0430-3039-6011 IC AT24C02BN-10SU-1.8 8Pin SOIC L-F

0430-4013-3109 IC TDA8946AJ 17PIN DIP LF

0430-6002-8079 IC AP1117E25LA SOT-223 L-F

0430-6005-5079 IC AP1117E18LA LF SOT-223

0430-6007-5079 IC AP1117E33LA LF SOT-223

0430-6007-7072 IC N2576SG-5 SMD 5PIN (TO-263) L-F

0430-6009-1051 IC AMC1117SKF-ADJ SMD 3PIN SOT-223 LF

0430-6010-9028 IC G2996F1Uf 8PIN SOP-8(FD) LF

0430-6011-1072 IC N2576SG-ADJ TO-263 5PIN LF

0430-6011-3210 IC MC7805CTG 3PIN TO-220 LF

0430-6015-5079 IC STEP DOWN CONVERTER AP1513SA SOP 8PIN LF

0430-6015-8079 IC DC/DC CONVERTER AP1522WA SOT23-5 5PIN LF

0430-6016-7099 IC RESET STL8110GCL300 3V SOT-23 3PIN LF

0430-7027-3699 IC WM8776SEFT 48PIN TQFP L-F

0430-7031-9603 IC DDR 16Mx16 NT5DS16M16CS-5T 66PIN TSOPII LF

0430-7035-1999 IC MT5351AG 471PIN BGA LF

0430-7037-4629 IC DDR 8Mx16 V58C2128164SBI5 66PIN TSOP-II LF

0430-7041-6999 IC HDMI CINEMA RECEIVER MT8293AE-L 128Pin QFP LF

0430-7042-8999 IC SCALER MT8202AG/BD-L BGA 388PIN LF

0430-7043-1999 IC DEMODULATOR MT5112BD LQFP 100PIN LF

0430-7044-1092 IC SWITCH PI3HDMI412FTZHE TQFN 42PIN LF

0460-1005-0560 WH A2001H02-5P/A2001H02-4P 1007#24 220mm

0460-1008-0501 WH A2001H02-8P/A2001H02-4P+5P UL20276#28 795/700mm

0460-1015-0130 WH A2001-15P/5P+A2512H00-13P 1007#24 160/320+CORE

0460-1110-0070 WH A2512H00-10P/A2501H02-8P 1007#22 410mm +CORE

0460-4131-0040 WH FI-W31S/P240430 UL20276#30 340mm Core*2

0980-0103-3060 MODULE TUNER DTVS205CH201A L-F

ʳ

DU7 U33

F1 F4 F6

F1 F2 F3

F4

DY1

Y1

DX1

Q2 Q38
Q1 Q10 Q11

Q12 Q15 Q18 Q19
Q20 Q21 Q23 Q24
Q25 Q27 Q28 Q29
Q3 Q31 Q32 Q33
Q39 Q4 Q5 Q9

Q22

Q13 Q14 Q34

U1

U25

U22 U29

U30

U21

U28

U17

U12

DU14

U20 U32 U34

U24

DU3 U16

U10 U5 U7 U9

DU2 U4 U6 U8

U4

DU4 U18

DU17 U15

U1

DU1

DU5 DU6

DU18

U27

U23

DU15 DU16

DU9

U13 U14

U19

U11

DU8

U31

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ʳʳ
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1 ʳ

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