VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Data Sheet
VSC7937
Single Supply 2.5Gb/s Voltage Driver
G52200-0, Rev 3.0 Page 3
03/05/01
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Table 3: Power Dissip atio n
Table 4: Package Thermal Specifications
Table 5: MUX Select Logic Table
Absolute Maximum Ratings
(1)
Power Supply Voltage (VSS) ............................................................................................................. VCC to -6.0V
Operating Junction Temperature Range (T
J
)............................................................................... -55°C to +125°C
Storage Temperature Range (T
S
)................................................................................................. -65°C to +150°C
NOTE: (1) CAUTION: Stresses listed under “Absolute Maximum Ratings” may be applied to devices one at a time without caus-
ing permanent damage. Functionality at or above the values listed is not implied. Exposure to these values for extended
periods may affect device reliability.
Recommended Operating Conditions
Positive Voltage Rail (GND)..............................................................................................................................0V
Negative Voltage Rail (V
SS
)..........................................................................................................................-5.2V
Operational Case Temperature Rang e (T
C
)
(1)
............................................................................... -40°C to +85°C
NOTE:(1) Lower limit of specification is ambient temperature and upper limit is case temperature
Symbol Parameter Min Typ Max Units Conditions
I
SS
Power Supply Current (VSS) ——-120mA
V
SS
= -5.5V, I
MOD
=
I
BIAS
= 0mA
P
D
Total Power Dissipation ——700 mW
V
SS
= -5.5V, I
MOD
=
I
BIAS
= 0 mA
Symbol Parameter Min Typ Max Units Conditions
θ
JCC
Thermal Resistance from Junction to Case — 25 — °C/W Ceramic Package
θ
JCP
Thermal Resistance from Junction to Case — 15 — °C/W Plastic Package
Symbol Rating
VSS Clocked Data In
GND Non-clocked Data In
NC Non-clocked Data In