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PRODUCT SUMMARY
Package TO-200AC (B-PUK)
Diode variation Single SCR
I
T(AV)
V
DRM/VRRM
V
TM
I
GT
T
J
2000 V, 2200 V, 2400 V
VS-ST650C..L Series
Phase Control Thyristors
(Hockey PUK Version), 790 A
FEATURES
• Center amplifying gate
• Metal case with ceramic insulator
• International standard case TO-200AC (B-PUK)
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
• DC motor control
• Controlled DC power supplies
• AC controllers
790 A
2.07 V
100 mA
-40 °C to 125 °C
Vishay Semiconductors
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER TEST CONDITIONS VALUES UNITS
I
T(AV)
I
T(RMS)
I
TSM
2
t
I
V
DRM/VRRM
t
q
T
J
T
hs
T
hs
50 Hz 10 100
60 Hz 10 700
50 Hz 510
60 Hz 475
Typical 200 μs
790 A
55 °C
1557 A
25 °C
2000 to 2400 V
-40 to 125 °C
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VS-ST650C..L
V
VOLTAGE
CODE
20 2000 2100
24 2400 2500
DRM/VRRM
PEAK AND OFF-STATE VOLTAGE
, MAXIMUM REPETITIVE
NON-REPETITIVE PEAK VOLTAGE
V
V
RSM
, MAXIMUM
V
I
DRM/IRRM
AT T
= TJ MAXIMUM
J
A
kA2s
MAXIMUM
mA
80 22 2200 2300
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VS-ST650C..L Series
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ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average on-state current
at heatsink temperature
Maximum RMS on-state current I
T(RMS)
Maximum peak, one-cycle
non-repetitive surge current
Maximum I
Maximum I
2
t for fusing I2t
2
√ t for fusing I 2√ t t = 0.1 to 10 ms, no voltage reapplied 5100 kA 2√ s
Low level value of threshold voltage V
High level value of threshold voltage V
Low level value of on-state slope
resistance
High level value of on-state
slope resistance
Maximum on-state voltage V
Maximum holding current I
Typical latching current I
I
T(AV)
I
TSM
T(TO)1
T(TO)2
r
t1
r
t2
TM
H
L
180° conduction, half sine wave
Double side (single side) cooled
DC at 25 °C heatsink temperature double side cooled 1857
t = 10 ms
t = 8.3 ms 10 700
t = 10 ms
t = 8.3 ms 9150
t = 10 ms
t = 8.3 ms 475
t = 10 ms
t = 8.3 ms 347
(16.7 % x π x I
(I > π x I
(16.7 % x π x I
(I > π x I
No voltage
reapplied
100 % V
reapplied
No voltage
RRM
Sinusoidal half wave,
initial T
reapplied
100 % V
reapplied
), TJ = TJ maximum 1.13
T(AV)
), TJ = TJ maximum 0.35
T(AV)
T(AV)
T(AV)
RRM
< I < π x I
< I < π x I
T(AV)
T(AV)
Ipk = 1700 A, TJ = TJ maximum, tp = 10 ms sine pulse 2.07 V
TJ = 25 °C, anode supply 12 V resistive load
Vishay Semiconductors
790 (324) A
55 (85) °C
10 100
8600
= TJ maximum
J
), TJ = TJ maximum 1.04
), TJ = TJ maximum 0.61
510
370
600
1000
kA
mΩ
mA
A
2
V
s
SWITCHING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum non-repetitive rate of
rise of turned-on current
Typical delay time t
Maximum turn-off time t
dI/dt
d
q
Gate drive 20 V, 20 Ω, t
T
= TJ maximum, anode voltage ≤ 80 % V
J
Gate current 1 A, dIg/dt = 1 A/μs
V
= 0.67 % V
d
DRM
ITM = 750 A, TJ = TJ maximum, dI/dt = 60 A/μs
V
= 50, dV/dt = 20 V/μs, Gate 0 V 100 Ω, t p = 500 μs
R
≤ 1 μs
r
, TJ = 25 °C
DRM
1000 A/μs
1.0
200
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum critical rate of rise of off-state voltage dV/dt T
Maximum peak reverse and off-state leakage
current
I
RRM
I
DRM
,
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= TJ maximum linear to 80 % rated V
J
TJ = TJ maximum, rated V
DRM/VRRM
2
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DRM
applied 80 mA
500 V/μs
Document Number: 93738
μs
VS-ST650C..L Series
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TRIGGERING
PARAMETER SYMBOL TEST CONDITIONS
Maximum peak gate power P
Maximum average gate power P
Maximum peak positive gate current I
Maximum peak positive gate voltage + V
Maximum peak negative gate voltage - V
DC gate current required to trigger I
DC gate voltage required to trigger V
DC gate current not to trigger I
DC gate voltage not to trigger V
GM
G(AV)
GM
GT
GD
GD
GT
TJ = TJ maximum, tp ≤ 5 ms 10.0
TJ = TJ maximum, f = 50 Hz, d% = 50 2.0
TJ = TJ maximum, tp ≤ 5 ms
GM
GM
TJ = -40 °C
= 25 °C 100 200
J
= 125 °C 50 -
T
J
TJ = -40 °C 2.5 -
= 25 °C 1.8 3.0
J
T
= 125 °C 1.1 -
J
Maximum required gate trigger/
current/voltage are the lowest
value which will trigger all units
12 V anode to cathode applied
Maximum gate current/voltage
not to trigger is the maximum
TJ = TJ maximum
value which will not trigger any
unit with rated V
cathode applied
Vishay Semiconductors
DRM
anode to
VALUES
typ. max.
3.0 A
20
5.0
200 -
10 mA
0.25 V
UNITS
W
V
mA T
V T
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum operating temperature range T
Maximum storage temperature range T
Maximum thermal resistance, junction to heatsink R
Maximum thermal resistance, case to heatsink R
J
Stg
thJ-hs
thC-hs
DC operation single side cooled 0.073
DC operation double side cooled 0.031
DC operation single side cooled 0.011
DC operation double side cooled 0.006
Mounting force, ± 10 %
Approximate weight 255 g
Case style See dimensions - link at the end of datasheet TO-200AC (B-PUK)
Δ R
CONDUCTION
thJ-hs
CONDUCTION ANGLE
SINUSOIDAL CONDUCTION RECTANGULAR CONDUCTION
Single Side Double Side Single Side Double Side
TEST CONDITIONS UNITS
180° 0.009 0.009 0.006 0.006
120° 0.011 0.011 0.011 0.011
90° 0.014 0.014 0.015 0.015
T
J
60° 0.020 0.020 0.021 0.021
30° 0.036 0.036 0.036 0.036
Note
• The table above shows the increment of thermal resistance R
when devices operate at different conduction angles than DC
thJ-hs
-40 to 125
-40 to 150
14 700
(1500)
= TJ maximum K/W
°C
K/W
N
(kg)
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20
30
40
50
60
70
80
90
100
110
120
130
0 100 200 300 400 500 600 700 800
30°
60°
90°
120°
180°
Av era g e O n- sta te C u rre nt (A )
Conduction Angle
Maximum Allowable Heatsink Temperature (°C)
ST 6 50C ..L Se ries
(Double Side Cooled)
R (D C ) = 0.031 K /W
thJ-h s
20
30
40
50
60
70
80
90
100
110
120
130
0 100 200 300 400 500 600 700 800
30°
60°
90°
120°
180°
Av era g e O n- sta te C u rre nt (A )
Conduction Angle
Maximum Allowable Heatsink Temperature (°C)
ST 6 50C ..L Se ries
(Double Side Cooled)
R (D C ) = 0.031 K /W
thJ-h s
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
0 200 400 600 800 1000 1200 1400
DC
180°
120°
90°
60°
30°
RMS Lim it
Conduction Period
M axim um Average O n-state Power Loss (W)
A ve ra g e O n -st a te C urre nt (A )
ST650C ..L Series
T = 125°C
J
VS-ST650C..L Series
Vishay Semiconductors
130
120
110
100
90
80
70
60
0 50 100 150 200 250 300 350 400
Maxim um Allow able Heatsink Temperature (°C)
Av erag e O n-s ta te C urren t (A )
ST 6 50C ..L Se ries
(Single Side C ooled)
R (D C) = 0 .073 K/W
th J-hs
Conduction Angle
30°
60°
90°
120°
180°
Fig. 1 - Current Ratings Characteristics
130
120
110
100
90
80
70
60
50
40
30
20
0 200 400 600 800 1000 1200 1400
Maxim um Allowable Heatsink Tem pera ture (°C )
ST650C..L Series
(D ouble S ide C ooled )
R (DC ) = 0.031 K/W
th J-hs
Cond uc tion Period
90°
60°
30°
Averag e O n-state C urrent (A)
120°
180°
DC
Fig. 4 - Current Ratings Characteristics
2000
1750
1500
1250
1000
750
500
250
Maximum Average On-state Power Loss (W)
180°
120°
90°
60°
30°
RMS Lim it
Conduction Angle
ST650C..L Series
T = 125°C
J
0
0 100 200 300 400 500 600 700 800
Average On-state Current (A)
Fig. 2 - Current Ratings Characteristics
Fig. 3 - Current Ratings Characteristics
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Fig. 5 - On-State Power Loss Characteristics
Fig. 6 - On-State Power Loss Characteristics
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4000
5000
6000
7000
8000
9000
10000
001 01 1
Num ber Of Equ al Amp litud e H alf Cycle Current Pulses (N)
Peak Half Sine Wave On-state Current (A)
A t Any Rat e d Lo a d C ond ition A n d W ith
R a t e d V A p p l ie d Fo l lo w in g Su r g e .
RRM
Initia l T = 12 5°C
@ 60 H z 0.0083 s
@ 50 H z 0.0100 s
J
ST650 C..L S e ries
100
1000
10000
0.5 1 1.5 2 2 .5 3
Instantaneous On -state Current (A)
Insta n tan eous O n -stat e V oltage (V)
ST650C..L Series
T = 25°C
J
T = 125°C
J
0.001
0.01
0.1
01 1 1.0 10.0 100.0
Square Wave Pulse Duration (s)
thJ-h s
Stead y St a te V a lue
R = 0.073 K/W
(Sin gle Side Coo led)
R = 0.031 K/W
(Do uble Side Coo led)
(DC O p era tion)
thJ-h s
thJ-h s
Tra nsien t Th erm a l Im pe d ance Z (K /W )
ST6 50C ..L Se ries
VS-ST650C..L Series
Vishay Semiconductors
12000
M a x im u m N on R e p etitive S u rg e C urre nt
11000
10000
9000
8000
7000
6000
5000
Pe ak Ha lf Sine W ave O n-state C urrent (A)
4000
Ve rsu s P u lse Tra in D u ra tion . C on trol
O f C ondu ctio n M ay N ot Be M aintained.
N o Vo l t a g e R e a p p l ie d
Ra te d V Re applied
ST650C..L Series
Pulse Train Duration (s)
In i t ia l T = 1 2 5 ° C
J
RRM
1 1.0 10.0
Fig. 7 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
Fig. 9 - On-State Voltage Drop Characteristics
Fig. 8 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
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Fig. 10 - Thermal Impedance Z
5
Characteristics
thJ-hs
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0.1
1
10
100
0.001 0.01 0.1 1 10 100
VG D
IG D
(b)
(a)
Tj = 25 ° C
Tj=125 °C
Tj=-40 °C
(2) (3)
Insta n tan eo us G ate C u rren t (A)
Inst a nt ane o us G a te V o lta g e (V )
a) Recommended load line for
b ) R e c o m m e n d e d lo a d li n e f o r
<=30% rated di/dt : 10V, 10ohms
Frequency Limited by PG(AV)
rated di/dt : 20V, 10ohm s; tr<=1 µs
tr<=1 µs
(1)
(1) PG M = 10W , tp = 4m s
(2) PG M = 20W , tp = 2m s
(3) PG M = 40W , tp = 1m s
(4) PG M = 60W , tp = 0.66ms
Rectangular gate pulse
ST6 50C ..L Se rie s
(4)
- Thyristor
2
- Essential part number
3
- 0 = Converter grade
4
- C = Ceramic PUK
9 - Critical dV/dt:
5
- Voltage code x 100 = V
RRM
(see Voltage Ratings table)
6
- L = PUK case TO-200AC (B-PUK)
7
8
- 0 = Eyelet terminals (gate and auxiliary cathode unsoldered leads)
1 = Fast-on terminals (gate and auxiliary cathode unsoldered leads)
2 = Eyelet terminals (gate and auxiliary cathode soldered leads)
3 = Fast-on terminals (gate and auxiliary cathode soldered leads)
None = 500 V/µs (standard selection)
L = 1000 V/µs (special selection)
Device code
5 1 3 2 4 6 7 8 9
ST VS- 65 0 C 24 L 1 -
1
- Vishay Semiconductors product
ORDERING INFORMATION TABLE
VS-ST650C..L Series
Vishay Semiconductors
Fig. 11 - Gate Characteristics
Dimensions www.vishay.com/doc?95076
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LINKS TO RELATED DOCUMENTS
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DIMENSIONS in millimeters (inches)
Pin receptacle
AMP. 60598-1
0.7 (0.03) MIN.
34 (1.34) DIA. MAX.
2 places
53 (2.09) DIA. MAX.
58.5 (2.3) DIA. MAX.
2 holes DIA. 3.5 (0.14) x 2.5 (0.1) deep
4.7 (0.18)
27 (1.06) MAX.
0.7 (0.03) MIN.
6.2 (0.24) MIN.
36.5 (1.44)
Creepage distance: 36.33 (1.430) minimum
Strike distance: 17.43 (0.686) minimum
Quote between upper and lower pole pieces has to be considered after
application of mounting force (see thermal and mechanical specification)
20° ± 5°
Outline Dimensions
Vishay Semiconductors
TO-200AC (B-PUK)
Document Number: 95076 For technical questions, contact: indmodules@vishay.com
Revision: 01-Aug-07 1
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
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contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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