• Guard ring for enhanced ruggedness and long
term reliability
• Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
DESCRIPTION
The VS-MBRS190TRPbF, VS-MBRS1100TRPbF surface
mount Schottky rectifier has been designed for applications
requiring low forward drop and very small foot prints on PC
boards. Typical applications are in disk drives, switching
power supplies, converters, freewheeling diodes, battery
charging, and reverse battery protection.
Maximum peak one cycle
non-repetitive surge current
Non-repetitive avalanche energyE
Repetitive avalanche currentI
F(AV)
I
FSM
AR
50 % duty cycle at TL = 147 °C, rectangular waveform1.0
5 μs sine or 3 μs rect. pulse
10 ms sine or 6 ms rect. pulse50
TJ = 25 °C, IAS = 0.5 A, L = 8 mH1.0mJ
AS
Current decaying linearly to zero in 1 μs
Frequency limited by T
maximum VA = 1.5 x VR typical
J
Following any rated load
condition and with rated
V
applied
RRM
870
0.5A
A
Document Number: 94315For technical questions within your region, please contact one of the following:www.vishay.com
Revision: 05-Jul-10DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com1
dP
tot
dT
J
-------------
1
R
thJA
--------------<
VS-MBRS190TRPbF, VS-MBRS1100TRPbF
Vishay Semiconductors
Schottky Rectifier, 1.0 A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS
= 25 °C0.78
T
Maximum forward voltage drop
See fig. 1
Maximum reverse leakage current
See fig. 2
Typical junction capacitanceC
Typical series inductanceL
(1)
V
FM
I
RM
S
1 A
TJ = 25 °C
(1)
T
= 125 °C1.0
J
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C42pF
T
Measured lead to lead 5 mm from package body2.0nH
Maximum voltage rate of change dV/dtRated V
R
J
T
= 125 °C0.62
J
V
= Rated V
R
R
0.5
10 000V/μs
Note
(1)
Pulse width < 300 μs, duty cycle < 2 %
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETERSYMBOLTEST CONDITIONSVALUESUNITS
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to lead
Maximum thermal resistance,
junction to ambient
Approximate weight
Marking deviceCase style SMB (similar to DO-214AA)V19/V10
Notes
(1)
thermal runaway condition for a diode on its own heatsink
(1)
T
, T
J
Stg
DC operation
(2)
R
thJL
R
thJA
See fig. 4
DC operation80
- 55 to 175°C
36
0.10g
0.003oz.
V
mA
°C/W
(2)
Mounted 1" square PCB
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Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Peak Reverse Current vs.
Reverse Voltage
100
TJ = 25 °C
- Junction Capacitance (pF)
T
C
10
0
40206080
V
- Reverse Voltage (V)
R
100
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Document Number: 94315For technical questions within your region, please contact one of the following:www.vishay.com
Revision: 05-Jul-10DiodesAmericas@vishay.com
Fig. 4 - Maximum Thermal Impedance Z
Characteristics (Per Leg)
thJC
, DiodesAsia@vishay.com, DiodesEurope@vishay.com3
110
120
130
140
150
160
170
180
Allowable Case Temperature (°C)
I
F(AV)
- Average Forward Current (A)
0.80.41.2
1.6
0
DC
Square wave (D = 0.50)
Rated V
R
applied
See note (1)
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
0
0.2
0.6
0.8
0.4
1.0
Average Power Loss (W)
I
F(AV)
- Average Forward Current (A)
0.3
1.50.60.91.2
0
DC
RMS limit
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
VS-MBRS190TRPbF, VS-MBRS1100TRPbF
Vishay Semiconductors
Fig. 5 - Maximum Average Forward Current vs.
Allowable Lead Temperature
Schottky Rectifier, 1.0 A
Fig. 6 - Maximum Average Forward Dissipation vs.
Average Forward Current
1000
Note
(1)
Formula used: TC = TJ - (Pd + Pd
Pd = Forward power loss = I
Pd
= Inverse power loss = VR1 x IR (1 - D); IR at VR1 = 80 % rated V
REV
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100
At any rated load condition
and with rated V
following surge
- Non-Repetitive Surge Current (A)
10
FSM
I
10
applied
RRM
1001000
tp - Square Wave Pulse Duration (µs)
Fig. 7 - Maximum Peak Surge Forward Current vs. Pulse Duration
Document Number: 94315For technical questions within your region, please contact one of the following:www.vishay.com
Revision: 05-Jul-10DiodesAmericas@vishay.com
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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