Vishay VSKDU162-12PbF User Manual
VSKDU162/12PbF
Vishay High Power Products
HEXFRED® Ultrafast Diodes, 100 A
(New INT-A-PAK
TM
Power Modules)
FEATURES
• Electrically isolated: DBC base plate
• 3500 V
isolating voltage
RMS
• Standard JEDEC package
• Simplified mechanical designs, rapid assembly
• High surge capability
• Large creepage distances
New INT-A-PAK
TM
• UL E78996 approved
• Case style New INT-A-PAK
PRODUCT SUMMARY
I
F(AV)
100 A
• Totally lead (Pb)-free
• Designed and qualified for industrial level
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
I
F(AV) rect
t
rr
V
RRM
T
, T
J
Stg
T
C
100 A
88 °C
200 ns
1200 V
- 40 to 150 °C
RoHS
COMPLIANT
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
V
, MAXIMUM REPETITIVE PEAK
TYPE NUMBER
VSKDU162/12PbF 12 1200 1250
VOLTAGE
CODE
RRM
REVERSE VOLTAGE
V
V
, MAXIMUM NON-REPETITIVE
RSM
PEAK REVERSE VOLTAGE
V
FORWARD CONDUCTION
PARAMETER SYMBOL TEST CONDITIONS TYP. MAX. UNITS
Maximum average forward current
at case temperature
Forward voltage drop V
Reverse recovery time t
Reverse recovery charge Q
Reverse recovery current I
Maximum forward voltage drop dI
Document Number: 94512 For technical questions, contact: ind-modules@vishay.com
Revision: 25-Apr-08 1
I
F(AV)
REC
(rec)M
Rectangular conduction, 50 % duty cycle
IF = 100 A, TJ = 25 °C, tp = 400 µs square wave 2.5 3.2
FM
I
= 160 A, TJ = 25 °C, tp = 400 µs square wave 2.9 3.9
F
rr
rr
IF = 160 A, TJ = 25 °C, - dI/dt = 200 A/µs, VR = 200 V
/dt - 300 A/µs
- 100 A
-88°C
V
150 200 ns
2000 2400 nC
20 22 A
www.vishay.com
VSKDU162/12PbF
Vishay High Power Products
HEXFRED® Ultrafast Diodes, 100 A
(New INT-A-PAK
TM
Power Modules)
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum peak reverse
leakage current
RMS insulation voltage V
I
RRM
INS
TJ = 150 °C 30 mA
50 Hz, circuit to base, all terminals shorted, t = 1 s 3500 V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction operating and
storage temperature range
Maximum thermal resistance,
junction to case per junction
Typical thermal resistance,
case to heatsink
Mounting
torque ± 10 %
Approximate weight
Case style New INT-A-PAK
to heatsink
busbar
, T
T
J
Stg
R
thJC
R
thCS
DC operation 0.18
Mounting surface, flat, smooth and greased 0.05
A mounting compound is recommended and the
torque should be rechecked after a period of 3 hours
to allow the spread of the compound.
- 40 to 150 °C
4 to 6 Nm
200 g
7.1 oz.
K/W
www.vishay.com For technical questions, contact: ind-modules@vishay.com
2 Revision: 25-Apr-08
Document Number: 94512
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