Vishay VS-HFA16TA60CSPbF Data Sheet

VS-HFA16TA60CSPbF
Ultrafast Soft Recovery Diode, 2 x 8 A
D2PAK
PRODUCT SUMMARY
V
R
V
at 8 A at 25 °C 1.7 V
F
I
F(AV)
t
(typical) 18 ns
rr
(maximum) 150 °C
T
J
Q
rr
dI
/dt 240 A/μs
(rec)M
Base
common
cathode
2
2
1
Common
Anode Anode
cathode
2 x 8 A
3
600 V
65 nC
HEXFRED
FEATURES
• Ultrafast recovery
• Ultrasoft recovery
• Very low I
• Very low Q
• Specified at operating conditions
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Halogen-free according to IEC 61249-2-21 definition
• Compliant to RoHS directive 2002/95/EC
• AEC-Q101 qualified
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
DESCRIPTION
VS-HFA16TA60CS is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 8 A per leg continuous current, the VS-HFA16TA60CS is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED peak recovery current (I tendency to “snap-off” during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED VS-HFA16TA60CS is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed.
®
RRM
rr
®
product line features extremely low values of
) and does not exhibit any
RRM
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
Maximum continuous forward current
Single pulse forward current I
Maximum repetitive forward current I
Maximum power dissipation P
Operating junction and storage temperature range T
Document Number: 94059 For technical questions, contact: diodestech@vishay.com Revision: 22-Feb-10 1
per leg
per device 16
J
I
F
FSM
FRM
, T
R
TC = 100 °C
D
TC = 25 °C 36
T
= 100 °C 14
C
Stg
600 V
8
60
24
W
- 55 to + 150 °C
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A
VS-HFA16TA60CSPbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 2 x 8 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode breakdown voltage
Maximum forward voltage V
Maximum reverse leakage current
V
BR
FM
I
RM
Junction capacitance C
Series inductance L
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
dI
dI
t
I
RRM1
I
RRM2
Q
Q
(rec)M
(rec)M
t
rr1
rr2
Reverse recovery time See fig. 5, 6 and 16
Peak recovery current See fig. 7 and 8
Reverse recovery charge See fig. 9 and 10
Peak rate of fall of recovery current during t
b
See fig. 11 & 12
IR = 100 μA 600 - -
IF = 8.0 A
I
= 16 A - 1.7 2.1
F
I
= 8.0 A, TJ = 125 °C - 1.4 1.7
F
VR = VR rated
T
= 125 °C, VR = 0.8 x VR rated - 100 500
J
VR = 200 V See fig. 3 - 10 25 pF
T
Measured lead to lead 5 mm from package body - 8.0 - nH
S
rr
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V - 18 -
See fig. 1
See fig. 2
TJ = 25 °C
-1.41.7
-0.35.0
-3755
TJ = 125 °C - 55 90
TJ = 25 °C - 3.5 5.0
TJ = 125 °C - 4.5 8.0
rr1
rr2
TJ = 25 °C - 65 138
TJ = 125 °C - 124 360
I
= 8.0 A
F
dI
/dt = 200 A/μs
F
V
= 200 V
R
/dt1 TJ = 25 °C - 240 -
/dt2 TJ = 125 °C - 210 -
V
μA
nst
A
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
Junction to case, single leg conducting
Junction to case,
both legs conducting
Thermal resistance, junction to ambient
Weight
Mounting torque
Marking device Case style D
www.vishay.com For technical questions, contact: diodestech@vishay.com 2 Revision: 22-Feb-10
0.063" from case (1.6 mm) for 10 s - - 300 °C
lead
--3.5
R
thJC
- - 1.75
R
Typical socket mount - - 80
thJA
-2-g
-0.07- oz.
6.0
(5.0)
2
PAK HFA16TA60CS
-
12
(10)
Document Number: 94059
K/W
kgf · cm
(lbf in)
VS-HFA16TA60CSPbF
100
10
0.1
- Instantaneous Forward Current (A)
F
I
94059_01
HEXFRED
Ultrafast Soft Recovery Diode, 2 x 8 A
TJ = 150 °C
= 125 °C
T
J
= 25 °C
T
J
1
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
VFM - Forward Voltage Drop (V)
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current (Per Leg)
100
®
1000
100
10
0.1
- Reverse Current (μA)
R
0.01
I
0.001
94059_02
TJ = 150 °C
TJ = 125 °C
1
TJ = 25 °C
0 100 200 300 500400 600
VR - Reverse Voltage (V)
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage (Per Leg)
TJ = 25 °C
10
- Junction Capacitance (pF)
T
C
1
1 10 100 1000
94059_03
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
10
1
P
D = 0.50 D = 0.20
0.1
- Thermal Response
thJC
Z
0.01
0.00001 0.0001 0.001 0.01 0.1 1
94059_04
Single pulse
(thermal response)
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance Z
D = 0.10 D = 0.05 D = 0.02 D = 0.01
Characteristics (Per Leg)
thJC
Notes:
1. Duty factor D = t
2. Peak TJ = PDM x Z
DM
t
1
t
2
1/t2
+ T
thJC
C
Document Number: 94059 For technical questions, contact: diodestech@vishay.com
www.vishay.com
Revision: 22-Feb-10 3
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