VS-HFA16TA60CSPbF
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 8 A
D2PAK
PRODUCT SUMMARY
V
R
V
at 8 A at 25 °C 1.7 V
F
I
F(AV)
t
(typical) 18 ns
rr
(maximum) 150 °C
T
J
Q
rr
dI
/dt 240 A/μs
(rec)M
Base
common
cathode
2
2
1
Common
Anode Anode
cathode
2 x 8 A
3
600 V
65 nC
HEXFRED
FEATURES
• Ultrafast recovery
• Ultrasoft recovery
• Very low I
• Very low Q
• Specified at operating conditions
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
• Halogen-free according to IEC 61249-2-21
definition
• Compliant to RoHS directive 2002/95/EC
• AEC-Q101 qualified
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
DESCRIPTION
VS-HFA16TA60CS is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial
construction and advanced processing techniques it
features a superb combination of characteristics which
result in performance which is unsurpassed by any rectifier
previously available. With basic ratings of 600 V and 8 A per
leg continuous current, the VS-HFA16TA60CS is especially
well suited for use as the companion diode for IGBTs and
MOSFETs. In addition to ultrafast recovery time, the
HEXFRED
peak recovery current (I
tendency to “snap-off” during the tb portion of recovery. The
HEXFRED features combine to offer designers a rectifier
with lower noise and significantly lower switching losses in
both the diode and the switching transistor. These
HEXFRED advantages can help to significantly reduce
snubbing, component count and heatsink sizes. The
HEXFRED VS-HFA16TA60CS is ideally suited for
applications in power supplies and power conversion
systems (such as inverters), motor drives, and many other
similar applications where high speed, high efficiency is
needed.
®
RRM
rr
®
product line features extremely low values of
) and does not exhibit any
RRM
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
Maximum continuous forward current
Single pulse forward current I
Maximum repetitive forward current I
Maximum power dissipation P
Operating junction and storage temperature range T
Document Number: 94059 For technical questions, contact: diodestech@vishay.com
Revision: 22-Feb-10 1
per leg
per device 16
J
I
F
FSM
FRM
, T
R
TC = 100 °C
D
TC = 25 °C 36
T
= 100 °C 14
C
Stg
600 V
8
60
24
W
- 55 to + 150 °C
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A
VS-HFA16TA60CSPbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 2 x 8 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
Maximum forward voltage V
Maximum reverse
leakage current
V
BR
FM
I
RM
Junction capacitance C
Series inductance L
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
dI
dI
t
I
RRM1
I
RRM2
Q
Q
(rec)M
(rec)M
t
rr1
rr2
Reverse recovery time
See fig. 5, 6 and 16
Peak recovery current
See fig. 7 and 8
Reverse recovery charge
See fig. 9 and 10
Peak rate of fall of recovery
current during t
b
See fig. 11 & 12
IR = 100 μA 600 - -
IF = 8.0 A
I
= 16 A - 1.7 2.1
F
I
= 8.0 A, TJ = 125 °C - 1.4 1.7
F
VR = VR rated
T
= 125 °C, VR = 0.8 x VR rated - 100 500
J
VR = 200 V See fig. 3 - 10 25 pF
T
Measured lead to lead 5 mm from package body - 8.0 - nH
S
rr
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V - 18 -
See fig. 1
See fig. 2
TJ = 25 °C
-1.41.7
-0.35.0
-3755
TJ = 125 °C - 55 90
TJ = 25 °C - 3.5 5.0
TJ = 125 °C - 4.5 8.0
rr1
rr2
TJ = 25 °C - 65 138
TJ = 125 °C - 124 360
I
= 8.0 A
F
dI
/dt = 200 A/μs
F
V
= 200 V
R
/dt1 TJ = 25 °C - 240 -
/dt2 TJ = 125 °C - 210 -
V
μA
nst
A
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
Junction to case,
single leg conducting
Junction to case,
both legs conducting
Thermal resistance,
junction to ambient
Weight
Mounting torque
Marking device Case style D
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2 Revision: 22-Feb-10
0.063" from case (1.6 mm) for 10 s - - 300 °C
lead
--3.5
R
thJC
- - 1.75
R
Typical socket mount - - 80
thJA
-2-g
-0.07- oz.
6.0
(5.0)
2
PAK HFA16TA60CS
-
12
(10)
Document Number: 94059
K/W
kgf · cm
(lbf ⋅ in)
VS-HFA16TA60CSPbF
100
10
0.1
- Instantaneous Forward Current (A)
F
I
94059_01
HEXFRED
Ultrafast Soft Recovery Diode, 2 x 8 A
TJ = 150 °C
= 125 °C
T
J
= 25 °C
T
J
1
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
VFM - Forward Voltage Drop (V)
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current (Per Leg)
100
®
1000
100
10
0.1
- Reverse Current (μA)
R
0.01
I
0.001
94059_02
Vishay High Power Products
TJ = 150 °C
TJ = 125 °C
1
TJ = 25 °C
0 100 200 300 500400 600
VR - Reverse Voltage (V)
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage (Per Leg)
TJ = 25 °C
10
- Junction Capacitance (pF)
T
C
1
1 10 100 1000
94059_03
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
10
1
P
D = 0.50
D = 0.20
0.1
- Thermal Response
thJC
Z
0.01
0.00001 0.0001 0.001 0.01 0.1 1
94059_04
Single pulse
(thermal response)
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance Z
D = 0.10
D = 0.05
D = 0.02
D = 0.01
Characteristics (Per Leg)
thJC
Notes:
1. Duty factor D = t
2. Peak TJ = PDM x Z
DM
t
1
t
2
1/t2
+ T
thJC
C
Document Number: 94059 For technical questions, contact: diodestech@vishay.com
www.vishay.com
Revision: 22-Feb-10 3