Vishay VS-HFA15TB60PbF Data Sheet

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Anode
1
3
Cathode
Base
cathode
2
TO-220AC
Ultrafast Soft Recovery Diode, 15 A
PRODUCT SUMMARY
Package TO-220AC
I
F(AV)
V
R
V
at I
F
F
(typ.) 23 ns
t
rr
T
max. 150 °C
J
Diode variation Single die
15 A
600 V
1.7 V
HEXFRED®,
FEATURES
• Ultrafast and ultrasoft recovery
• Very low I
• Compliant to RoHS Directive 2002/95/EC
• Designed and qualified for industrial level
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
DESCRIPTION
VS-HFA15TB60PbF is a state of the art ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 15 A continuous current, the VS-HFA15TB60PbF is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED extremely low values of peak recovery current (I does not exhibit any tendency to “snap-off” during the t portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED VS-HFA15TB60PbF is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed.
RRM
VS-HFA15TB60PbF
Vishay Semiconductors
and Q
rr
®
product line features
RRM
) and
b
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
Maximum continuous forward current I
Maximum repetitive forward current I
Maximum power dissipation P
Operating junction and storage temperature range T
Revision: 06-Jun-11
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
J
F
FSM
FRM
, T
R
TC = 100 °C 15
D
TC = 25 °C 74
T
= 100 °C 29
C
Stg
1
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600 V
150
60
- 55 to + 150 °C
Document Number: 94053
ASingle pulse forward current I
W
VS-HFA15TB60PbF
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode breakdown voltage
V
BR
IR = 100 μA 600 - -
IF = 15 A
Maximum forward voltage V
Maximum reverse leakage current
Junction capacitance C
Series inductance L
FM
I
RM
T
S
= 30 A - 1.5 2.0
I
F
I
= 15 A, TJ = 125 °C - 1.2 1.6
F
VR = VR rated
= 125 °C, VR = 0.8 x VR rated
T
J
See fig. 1
See fig. 2
VR = 200 V See fig. 3 - 25 50 pF
Measured lead to lead 5 mm from package body
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time See fig. 5
Peak recovery current See fig. 6
Reverse recovery charge See fig. 7
Peak rate of fall of recovery current during t
b
See fig. 8
dI
dI
t
I
RRM1
I
RRM2
Q
Q
(rec)M
(rec)M
t
rr
rr1
rr2
rr1
rr2
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V - 19 -
TJ = 25 °C
TJ = 125 °C - 74 120
TJ = 25 °C - 4.0 6.0
TJ = 125 °C - 6.5 10
TJ = 25 °C - 84 180
TJ = 125 °C - 241 600
I
= 15 A
F
/dt = 200 A/μs
dI
F
V
= 200 V
R
/dt1 TJ = 25 °C - 188 -
/dt2 TJ = 125 °C - 160 -
Vishay Semiconductors
-1.31.7
-1.010
- 400 1000
-8.0-nH
-4260
V
μA
nst
A
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
Thermal resistance, junction to case
Thermal resistance, junction to ambient
lead
R
thJC
R
thJA
Weight
Mounting torque
Marking device Case style TO-220AC HFA15TB60
Revision: 06-Jun-11
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
0.063" from case (1.6 mm) for 10 s - - 300 °C
--1.7
Typical socket mount - - 80
-2.0- g
-0.07- oz.
6.0
(5.0)
2
-
Document Number: 94053
12
kgf · cm
(10)
(lbf · in)
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K/W
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1
10
TJ = 150 °C T
J
= 125 °C
T
J
= 25 °C
1.0 2.41.2 1.4
VFM - Forward Voltage Drop (V)
I
F
- Instantaneous Forward Current (A)
100
1.8 2.2
2.01.6
0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1
1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Response
Single pulse
(thermal response)
P
DM
t
1
t
2
Notes:
1. Duty factor D = t
1/t2
2. Peak TJ = PDM x Z
thJC
+ T
C
10
D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01
VS-HFA15TB60PbF
Vishay Semiconductors
10 000
1000
TJ = 150 °C
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
100
- Junction Capacitance (pF)
T
C
10
10 100 1000
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
- Reverse Current (µA)
R
I
TJ = 25 °C
VR - Reverse Voltage (V)
100
10
0.1
0.01
1
100 600500
0
TJ = 125 °C
TJ = 25 °C
300
400200
VR - Reverse Voltage (V)
Fig. 2 - Typical Reverse Current vs. Reverse Voltage
Fig. 4 - Maximum Thermal Impedance Z
Revision: 06-Jun-11
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
thJC
3
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Characteristics
Document Number: 94053
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