• Isolated copper baseplate using DCB (Direct Copper
Bonding) technology
• Compliant to RoHS Directive 2002/95/EC
trench IGBT technology
CE(sat)
with positive temperature coefficient
PRODUCT SUMMARY
V
CES
at TC = 80 °C100 A
I
C
(typical)
V
CE(on)
at I
= 100 A, 25 °C
C
600 V
1.65 V
TYPICAL APPLICATIONS
• UPS (Uninterruptable Power Supply)
• Switching mode power supplies
• Electronic welders
DESCRIPTION
Vishay’s IGBT power module provides ultra low conduction
loss as well as short circuit ruggedness. It is designed for
applications such as UPS and SMPS.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C unless otherwise noted)
PARAMETERSYMBOLTEST CONDITIONSMAX. UNITS
Collector to emitter voltageV
Gate to emitter voltageV
Collector currentI
Pulsed collector currentI
Diode continuous forward currentI
Diode maximum forward currentI
Maximum power dissipationP
RMS isolation voltageV
Note
(1)
Repetitive rating: Pulse width limited by maximum junction temperature.
CM
FM
CES
GES
C
F
ISOL
TC = 25 °C160
T
= 80 °C100
C
(1)
(1)
D
tp = 1 ms200
TC = 80 °C100
tp = 1 ms200
TJ = 175 °C 417W
f = 50 Hz, t = 1 min4000V
600
± 20
V
A
Revision: 13-Dec-11
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 93799
Preliminary
VS-GT100TP060N
www.vishay.com
IGBT ELECTRICAL SPECIFICATIONS (TC = 25 °C unless otherwise noted)
PARAMETERSYMBOLTEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltageV
(BR)CES
TJ = 25 °C600--
VGE = 15 V, IC = 100 A, TJ = 25 °C-1.652.10
Gate to emitter threshold voltageV
Collector cut-off currentI
Gate to emitter leakage currentI
CE(sat)
GE(th)
CES
GES
V
= 15 V, IC = 100 A, TJ = 175 °C-2.00-
GE
VCE = VGE, IC = 1.0 mA, TJ = 25 °C4.04.46.5
VCE = V
VGE = V
, VGE = 0 V, TJ = 25 °C--5.0mA
CES
, VCE = 0 V, TJ = 25 °C--400nA
GES
SWITCHING CHARACTERISTICS
PARAMETERSYMBOLTEST CONDITIONS MIN. TYP. MAX. UNITS
Turn-on delay timet
Rise timet
Turn-off delay timet
Fall timet
Turn-on switching lossE
Turn-off switching lossE
Turn-on delay timet
Rise timet
Turn-off delay timet
Fall timet
Turn-on switching lossE
Turn-off switching lossE
Input capacitanceC
Reverse transfer capacitanceC
SC dataI
Stray inductanceL
Module lead resistance, terminal to chipR
d(on)
r
d(off)
f
on
off
d(on)
r
d(off)
f
on
off
ies
oes
res
SC
CE
CC’+EE’
VCC = 300 V, IC = 100 A, Rg = 2.2 ,
V
= ± 15 V, TJ = 25 °C
GE
VCC = 300 V, IC = 100 A, Rg = 2.2 ,
V
= ± 15 V, TJ = 125 °C
GE
VGE = 0 V, VCE = 30 V, f = 1.0 MHz
tp 5 μs, VGE = 15 V, TJ = 125 °C,
V
= 360 V, V
CC
CEM
1200 V
Vishay Semiconductors
VCollector to emitter saturation voltageV
-106-
-49-
-102-
-85-
-0.46-
-0.95-
-112-
-62-
-126-
-109-
-0.78-
-1.73-
-7.71-
-0.53-
-0.23-
-900-A
--30nH
-0.75- m
ns
mJ
ns
mJ
nFOutput capacitanceC
DIODE ELECTRICAL SPECIFICATIONS (TC = 25 °C unless otherwise noted)
PARAMETERSYMBOLTEST CONDITIONSMIN.TYP.MAX. UNITS
= 25 °C-1.401.80
T
Forward voltageV
Reverse recovery chargeQ
F
rr
IF = 100 A
IF = 100 A, VR = 600 V,
R
Peak reverse recovery currentI
Reverse recovery energyE
rr
rec
Revision: 13-Dec-11
For technical questions within your region: DiodesAmericas@vishay.com
= 5.6
G
V
GE
2
= - 15 V
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
J
T
= 125 °C-1.40-
J
= 25 °C-5.5-
T
J
T
= 125 °C-7.3-
J
TJ = 25 °C-68-
T
= 125 °C-88-
J
TJ = 25 °C-0.89-
T
= 125 °C-1.71-
J
Document Number: 93799
V
μC
A
mJ
Preliminary
I
C
(A)
VCE (V)
0
25
50
75
100
125
150
175
200
00.511.522.533.5
175 °C
25 °C
VGE = 15 V
0
25
50
75
100
125
150
175
200
45678910
25 °C
175 °C
VCE = 50 V
VGE (V)
I
C
(A)
E (mJ)
Rg (Ω)
E
on
E
off
0
1
2
3
4
5
6
7
0 1020304050
V
CC = 300 V
I
C
= 100 A
V
GE
= ± 15 V
T
J
= 125 °C
VS-GT100TP060N
www.vishay.com
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETERSYMBOLTEST CONDITIONSMIN.TYP.MAX. UNITS
Maximum junction temperature T
Storage temperature rangeT
Junction to case
IGBT
Case to sink (Conductive grease applied)R
Mounting torque
Weight-150-g
R
J
Stg
thJC
thCS
Power terminal screw: M52.5 to 5.0
Mounting screw: M63.0 to 5.0
5
V
CC = 300 V
4.5
R
= 2.2 Ω
G
4
V
GE
= 125 °C
T
3.5
J
3
2.5
E (mJ)
2
1.5
1
0.5
0
050100150200
Vishay Semiconductors
--175
- 40 -125
--0.36
-0.05-
= ± 15 V
E
ON
E
OFF
IC (A)
°C
K/WDiode--0.57
Nm
Fig. 1 - IGBT Typical Output Characteristics
Revision: 13-Dec-11
Fig. 2 - IGBT Transfer Characteristics
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 3 - IGBT Switching Loss vs. I
Fig. 4 - IGBT Switching Loss vs. R
3
Document Number: 93799
C
G
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
www.vishay.com
0.01
0.1
1
0.0010.010.1110
t (s)
Z
thJC
(K/W)
IGBT
(A)
C
I
Preliminary
250
200
150
100
RG = 2.2 Ω
= ± 15 V
V
50
GE
= 125 °C
T
J
0
0100300200400500700600
VCE (V)
Fig. 5 - RBSOA
Module
VS-GT100TP060N
Vishay Semiconductors
Fig. 6 - IGBT Transient Thermal Impedance
200
175
150
125
100
(A)
F
I
75
50
25
0
00.511.52
125 °C
25 °C
2.5
1.5
E (mJ)
0.5
VF (V)
Fig. 7 - Diode Forward Characteristics Fig. 8 - Diode Switching Loss vs. I
Revision: 13-Dec-11
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
V
CC = 300 V
= 2.2 Ω
R
G
2
1
0
= - 15 V
V
GE
= 125 °C
T
J
E
REC
050100150200
IF (A)
Document Number: 93799
F
www.vishay.com
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0 1020304050
E (mJ)
R
G
(Ω)
E
REC
VCC = 300 V
I
F
= 100 A
V
GE
= - 15 V
T
J
= 125 °C
1
6
7
3
2
5
4
Preliminary
VS-GT100TP060N
Vishay Semiconductors
1
(K/W)
0.1
thJC
Z
0.01
0.0010.010.1110
CIRCUIT CONFIGURATION
Fig. 9 - Diode Switching Loss vs. R
Diode
G
t (s)
Fig. 10 - Forward Characteristics of Diode
Revision: 13-Dec-11
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5
Document Number: 93799
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
www.vishay.com
DIMENSIONS in millimeters
40
4.5
17
2323
Preliminary
VS-GT100TP060N
Vishay Semiconductors
3 - M5.0
12.5
754
6
4.517
18.9718.98
6.92
23.5
13.641313.64
80
94.1
123
34
2 - Ø 6.4
22.2
30.58
7.2
31.4
Revision: 13-Dec-11
For technical questions within your region: DiodesAmericas@vishay.com
6
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 93799
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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