Vishay VS-30CTH02SPbF, VS-30CTH02-1PbF Data Sheet

VS-30CTH02SPbF, VS-30CTH02-1PbF
Vishay High Power Products
Hyperfast Rectifier, 2 x 15 A FRED Pt
VS-30CTH02SPbF
Base
Common
Cathode
2
2
Common
Cathode
1
Anode
D
PRODUCT SUMMARY
trr (maximum) 30 ns
I
F(AV)
V
2
PAK
R
3
Anode
VS-30CTH02-1PbF
Base
Common
Cathode
2
2
Common
1
Anode
Cathode
TO-262
Anode
2 x 15 A
200 V
3
®
FEATURES
• Hyperfast recovery time
• Low forward voltage drop
• Low leakage current
• 175 °C operating junction temperature
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Halogen-free according to IEC 61249-2-21 definition
• Compliant to RoHS directive 2002/95/EC
• AEC-Q101 qualified
DESCRIPTION/APPLICATIONS
Vishay HPP’s 200 V series are the state of the art hyperfast recovery rectifiers designed with optimized performance of forward voltage drop and hyperfast recovery time. The planar structure and the platinum doped life time control, guarantee the best overall performance, ruggedness and reliability characteristics. These devices are intended for use in the output rectification stage of SMPS, UPS, dc-to-dc converters as well as freewheeling diode in low voltage inverters and chopper motor drives. Their extremely optimized stored charge and low recovery current minimize the switching losses and reduce over dissipation in the switching element and snubbers.
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Peak repetitive reverse voltage V
Average rectified forward current
Non-repetitive peak surge current I
Operating junction and storage temperatures T
per diode
RRM
I
F(AV)
FSM
, T
J
TC = 159 °C 15
TC = 25 °C 200
Stg
200 V
Aper device 30
- 65 to 175 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Breakdown voltage, blocking voltage
Forward voltage V
Reverse leakage current I
Junction capacitance C
Series inductance L
Document Number: 94015 For technical questions, contact: diodestech@vishay.com Revision: 11-Mar-10 1
,
V
BR
V
R
IR = 100 μA 200 - - V
R
IF = 15 A - 0.92 1.05
F
I
= 15 A, TJ = 125 °C - 0.78 0.85
F
VR = VR rated - - 10
T
= 125 °C, VR = VR rated - 5 300
J
VR = 200 V - 57 - pF
T
Measured lead to lead 5 mm from package body - 8 - nH
S
V
μA
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VS-30CTH02SPbF, VS-30CTH02-1PbF
Vishay High Power Products
Hyperfast Rectifier,
2 x 15 A FRED Pt
®
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V - - 35
= 1 A, dIF/dt = 100 A/μs, VR = 30 V - - 30
I
Reverse recovery time t
Peak recovery current I
Reverse recovery charge Q
rr
RRM
rr
F
T
= 25 °C
J
= 125 °C - 40 -
T
J
TJ = 25 °C - 2.8 -
T
= 125 °C - 6.0 -
J
TJ = 25 °C - 37 -
T
= 125 °C - 120 -
J
I
= 15 A
F
/dt = 200 A/μs
dI
F
V
= 160 V
R
-26-
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL MIN. TYP. MAX. UNITS
Maximum junction and storage temperature range T
Thermal resistance, junction to case per diode R
Weight
Mounting torque
Marking device
J
, T
thJC
Stg
- 65 - 175 °C
--1.1°C/W
-2.0- g
-0.07- oz.
6.0
(5.0)
Case style D
Case style TO-262 30CTH02-1
-
PAK 30CTH02S
12
(10)
kgf · cm
(lbf · in)
ns
A
nC
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Document Number: 94015
VS-30CTH02SPbF, VS-30CTH02-1PbF
100
10
Current (A)
- Instantaneous Forward
F
I
1
0.4 0.6 0.8 1.0 1.2 1.4 1.6
VFM - Forward Voltage Drop (V)
TJ = 175 °C
= 125 °C
T
J
= 25 °C
T
J
Hyperfast Rectifier, 2 x 15 A FRED Pt
®
100
10
0.1
0.01
- Reverse Current (µA)
R
0.001
I
0.0001
Vishay High Power Products
TJ = 175 °C
TJ = 150 °C
TJ = 125 °C
1
0 100 200
50
VR - Reverse Voltage (V)
TJ = 100 °C
TJ = 75 °C
TJ = 50 °C
TJ = 25 °C
150
Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
1000
100
- Junction Capacitance (pF)
T
C
10
0 50 100 150 200
TJ = 25 °C
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
D = 0.50
0.1
- Thermal Impedance (°C/W)
thJC
Z
0.01
0.00001 0.0001 0.001 0.01 0.1
Single pulse
(thermal resistance)
D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance Z
Notes:
1. Duty factor D = t
2. Peak TJ = PDM x Z
Characteristics
thJC
P
DM
t
1
t
2
.
1/t2
+ T
thJC
C
.
110
Document Number: 94015 For technical questions, contact: diodestech@vishay.com
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Revision: 11-Mar-10 3
VS-30CTH02SPbF, VS-30CTH02-1PbF
Vishay High Power Products
180
170
DC
160
Square wave (D = 0.50)
150
Rated V
applied
R
Allowable Case Temperature (°C)
See note (1)
140
05 25201510
I
- Average Forward Current (A)
F(AV)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
25
20
RMS limit
Hyperfast Rectifier,
2 x 15 A FRED Pt
®
100
(ns)
rr
t
10
100 1000
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
1000
VR = 160 V
= 125 °C
T
J
= 25 °C
T
J
IF = 15 A
dIF/dt (A/µs)
IF = 15 A
15
10
5
Average Power Loss (W)
0
0 5 10 15 20 25
I
F(AV)
DC
- Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
Note
(1)
Formula used: TC = TJ - (Pd + Pd Pd = Forward power loss = I Pd
= Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated V
REV
x VFM at (I
F(AV)
REV
) x R
D = 0.01 D = 0.02 D = 0.05 D = 0.1 D = 0.2 D = 0.5
;
thJC
F(AV)
/D) (see fig. 6);
100
(nC)
rr
Q
VR = 160 V
= 125 °C
T
J
= 25 °C
T
10
100 1000
J
dIF/dt (A/µs)
Fig. 8 - Typical Stored Charge vs. dI
R
/dt
F
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Document Number: 94015
4 Revision: 11-Mar-10
VS-30CTH02SPbF, VS-30CTH02-1PbF
Hyperfast Rectifier, 2 x 15 A FRED Pt
L = 70 μH
dIF/dt
adjust
Fig. 9 - Reverse Recovery Parameter Test Circuit
I
F
0
(1)
(1) dI
/dt - rate of change of current
F
through zero crossing
- peak reverse recovery current
(2) I
RRM
- reverse recovery time measured
(3) t
rr
from zero crossing point of negative going I through 0.75 I extrapolated to zero current.
to point where a line passing
F
and 0.50 I
RRM
Fig. 10 - Reverse Recovery Waveform and Definitions
dIF/dt
RRM
G
®
Vishay High Power Products
= 200 V
V
R
0.01 Ω
D.U.T.
D
IRFP250
S
(3)
t
rr
t
a
(2)
I
RRM
t
b
(4)
Q
rr
0.5 I
RRM
dI
/dt
(rec)M
0.75 I
RRM
(4) Q
- area under curve dened by t
rr
and I
RRM
trr x I
(5) dI current during t
=
Q
rr
/dt - peak rate of change of
(rec)M
portion of t
b
(5)
rr
RRM
2
rr
Document Number: 94015 For technical questions, contact: diodestech@vishay.com
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Revision: 11-Mar-10 5
VS-30CTH02SPbF, VS-30CTH02-1PbF
Vishay High Power Products
ORDERING INFORMATION TABLE
Device code
VS- 30 C T H 02 S TRL PbF
1 - HPP product suffix
- Current rating (30 A)
2
- C = Common cathode
3
4 - T = TO-220, D2PAK
- H = Hyperfast rectifier
5
- Voltage rating (02 = 200 V)
6
7
-
S = D2PAK
-1 = TO-262
-
8
9
None = Tube (50 pieces)
TRL = Tape and reel (left oriented, for D
TRR = Tape and reel (right oriented, for D
- PbF = Lead (Pb)-free
Hyperfast Rectifier,
2 x 15 A FRED Pt
324
51
®
6789
2
PAK package)
2
PAK package)
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95014
Part marking information www.vishay.com/doc?95008
Packaging information www.vishay.com/doc?95032
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Document Number: 94015
D2PAK
Part Marking Information
Vishay High Power Products
D2PAK, TO-262
TO-262
Assembly lot code
Assembly lot code
xxxxxxxx
V PYWWX
AC
xxxxxxx-x
V PYWWX
AC
Part number
Product version (optional): P = Lead (Pb)-free None = Standard Date code: Year 1 = 2001 Week 19 Line X
Part number
Product version (optional): P = Lead (Pb)-free None = Standard Date code: Year 1 = 2001 Week 19 Line X
Example: This is a xxxxxxxx with assembly lot code AC, assembled on WW 19, 2001 in the assembly line “X”
Example: This is a xxxxxxx-x with assembly lot code AC, assembled on WW 19, 2001 in the assembly line “X”
Document Number: 95008 For technical questions concerning discrete products, contact: diodes-tech@vishay.com Revision: 30-Oct-08 For technical questions concerning module products, contact: ind-modules@vishay.com
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1
D2PAK, TO-262
DIMENSIONS FOR D2PAK in millimeters and inches
Outline Dimensions
Vishay High Power Products
Conforms to JEDEC outline D
(2)(3)
E
(3)
L1
D
L2
2 x
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
4
132
BB
e
2
H
2 x b2
2 x b
0.010
PAK (SMD-220)
A
Detail A
(2)
C
MM
A
Lead tip
B
A
c2
AA
A
c
M
± 0.004
B
Gauge
0° to 8°
plane
L3
B
L
L4
Detail “A”
Rotated 90 °CW
Scale: 8:1
(E)
E1
View A - A
A1
(3)
(D1)
17.90 (0.70)
15.00 (0.625)
2.32
(0.08)
Plating
Seating
plane
2.64 (0.103)
2.41 (0.096)
(3)
H
B
Pad layout
11.00 MIN.
(0.43)
MIN.
(4)
b1, b3
(c)
(b, b2)
Section B - B and C - C
Scale: None
9.65
(0.38)
3.81
(0.15)
c1
MIN.
MIN.
Base Metal
(4)
SYMBOL
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
NOTES SYMBOL
MILLIMETERS INCHES
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5 M-1994
(2)
Dimension D and E do not include mold flash. Mold flash shall not
(7)
Outline conforms to JEDEC outline TO-263AB
exceed 0.127 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body
(3)
Thermal pad contour optional within dimension E, L1, D1 and E1
(4)
Dimension b1 and c1 apply to base metal only
(5)
Datum A and B to be determined at datum plane H
(6)
Controlling dimension: inch
Document Number: 95014 For technical questions concerning discrete products, contact: diodes-tech@vishay.com Revision: 31-Mar-09 For technical questions concerning module products, contact: ind-modules@vishay.com
NOTES
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1
Outline Dimensions
Vishay High Power Products
D2PAK, TO-262
DIMENSIONS FOR TO-262 in millimeters and inches
Modified JEDEC outline TO-262
(Datum A)
(3)
L1
D
(2) (3)
E
1
L2
B
B
2 x e
MM
0.010 A B
Lead tip
A
2
3
C
C
L
(2)
3 x b2
3 x b
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
c
A
c2
A1
B
A
Seating
plane
A
E
E1
Section A - A
Plating
(4)
b1, b3
c
(b, b2)
Section B - B and C - C
Scale: None
(3)
Base metal
c1
(3)D1
(4)
SYMBOL
MILLIMETERS INCHES
MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190
A1 2.03 3.02 0.080 0.119
b 0.51 0.99 0.020 0.039
b1 0.51 0.89 0.020 0.035 4
b2 1.14 1.78 0.045 0.070
b3 1.14 1.73 0.045 0.068 4
c 0.38 0.74 0.015 0.029
c1 0.38 0.58 0.015 0.023 4
c2 1.14 1.65 0.045 0.065
D 8.51 9.65 0.335 0.380 2
D1 6.86 8.00 0.270 0.315 3
E 9.65 10.67 0.380 0.420 2, 3
E1 7.90 8.80 0.311 0.346 3
e 2.54 BSC 0.100 BSC
L 13.46 14.10 0.530 0.555
L1 - 1.65 - 0.065 3
L2 3.56 3.71 0.140 0.146
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body
(3)
Thermal pad contour optional within dimension E, L1, D1 and E1
(4)
Dimension b1 and c1 apply to base metal only
(5)
Controlling dimension: inches
(6)
Outline conform to JEDEC TO-262 except A1 (maximum), b (minimum) and D1 (minimum) where dimensions derived the actual package outline
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NOTES
Document Number: 95014
Revision: 31-Mar-09
D2PAK
CARRIER TAPE FOR TAPE AND REEL LEFT in millimeters
Carrier tape (130 meter long per reel)
C
7
Ø 1.55 ± 0.05
Ø 1.6 ± 0.1
R 0.3
typical
P
2
Y
2.0 ± 0.1
2.17 ± 0.1
P
0
4.0 ± 0.1
1.57 ± 0.1
Packaging Information
Vishay High Power Products
C
L
0.40 ± 0.05
B
2
± 0.1
C
6
1.75 ± 0.1
C
4
F ± 0.1
C
5
W ± 0.3
0.12 MAX.
C
B
2
± 0.1
0
Ø 72
Ø 560
1.20
Section Y - Y
K
0
Y
P1 ± 0.1 A0 ± 0.1
NUMBER PACKAGE A
93-0194-01 D
PAK 10.80 16.00 10.35 4.90 11.50 16.00 24.00 330 800
C
1
Reel
30
Single
winded
B
winded
B
Level
K
114
FP1W REEL DIAMETER QUANTITY PER REEL
Notes
MATERIAL
1. General
: Statistical, C
ST
1.33
pk
10 sprocket hole pitch cumulative tolerance ± 0.02 mm
Camber not to exceed 1 mm in 250 mm
A
and B0 measured on a plane 0.3 mm above the bottom of
the pocket
K
measured from a plane on the inside bottom of the pocket to
the top surface of the carrier
Pocket position relative to sprocket hole measured as true
PACKAGING
1. General
Each box must be identified with Vishay part number 93-0194-x
Box should be free of foreign particles
Product must be stored at room temperature and clean
environment
Certificate of analysis is required per every lot number
2. Material
Conductive black styrenic alloy
position of pocket, not pocket hole
Measured from centerline of sprocket hole to centerline of
pocket
Must also meet requirements of EIA standard #EIA-481A
taping of surface mount components for automatic placement
2. Specification
Poliestyrene
Surface resistivity of molded material must measure
6
10
Ω/SQ measured in accordance to procedure given in
ASTM D-257 and ASTM D-991
Free of heat marks
No sharp edges allowed
No deformities allowed in wall cavity
Holes, edges and cavities must be free of burrs ≤ 0.060 mm
(burrs shall not come off the tape)
Document Number: 95032 For technical questions concerning discrete products, contact: diodes-tech@vishay.com Revision: 18-May-09 For technical questions concerning module products, contact: ind-modules@vishay.com
± 0.1
C
3
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1
Packaging Information
Vishay High Power Products
D2PA K
CARRIER TAPE FOR TAPE AND REEL RIGHT in millimeters
Carrier tape (130 meter long per reel)
C
Ø 1.55 ± 0.05
Ø 1.6 ± 0.1
R 0.3
typical
6
P
2
Y
Y
2.0 ± 0.1
2.17 ± 0.1
P1 ± 0.1
30
A0 ± 0.1
P
0
4.0 ± 0.1
C
1.57 ± 0.1
1
Reel
114
C
7
1.75 ± 0.1
C
4
F ± 0.1
C
5
W ± 0.3
Ø 72
1.20
0.12 MAX.
± 0.1
K
0
C
L
0.40 ± 0.05
Section Y - Y
B
C
3
± 0.1
2
B
C
± 0.1
0
2
Single
winded
NUMBER PACKAGE A
93-0195-01 D
PAK 10.80 16.00 10.35 4.90 11.50 16.00 24.00 330 800
B
B
Notes
MATERIAL
1. General
: Statistical, C
ST
1.33
pk
10 sprocket hole pitch cumulative tolerance ± 0.02 mm
Camber not to exceed 1 mm in 250 mm
A
and B0 measured on a plane 0.3 mm above the bottom of
the pocket
K
measured from a plane on the inside bottom of the pocket to
the top surface of the carrier
Pocket position relative to sprocket hole measured as true
position of pocket, not pocket hole
Measured from centerline of sprocket hole to centerline of
pocket
Must also meet requirements of EIA standard #EIA-481A
taping of surface mount components for automatic placement
2. Specification
Poliestyrene
Surface resistivity of molded material must measure
6
10
Ω/SQ measured in accordance to procedure given in
ASTM D-257 and ASTM D-991
Free of heat marks
No sharp edges allowed
No deformities allowed in wall cavity
Holes, edges and cavities must be free of burrs ≤ 0.060 mm
(burrs shall not come off the tape)
Level
winded
K
Ø 560
FP1W REEL DIAMETER QUANTITY PER REEL
PACKAGING
1. General
Each box must be identified with Vishay part number 93-0195-x
Box should be free of foreign particles
Product must be stored at room temperature and clean
environment
Certificate of analysis is required per every lot number
2. Material
Conductive black styrenic alloy
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Document Number: 95032
Revision: 18-May-09
Packaging Information
D2PA K
COVER TAPE FOR CARRIER TAPE in millimeters
Y
Y
X
X
Antistatic layer
Pet layer
Olefin layer
Vishay High Power Products
W
ST
Ø 76.5 ± 1.0
Section X - X
0.055 ± 0.005
ST
Sealant layer
Section Y - Y
VERSION NUMBER APPLICATION W CARRIER TAPE WIDTH MATERIAL
01 92-5210-14 D
Notes
MATERIAL
1. General
: C
2. Specification
ST
1.33
pk
PAK 21.3 ± 0.1 24 Antistatic/treated/transparent/polyester
PACKAGING
1. General
Each box must be identified with Vishay part number 92-5210-x
Box should be free of foreign particles
Thickness: 0.052 ± 0.005
Length: 500 m
Tensile strength: 6.00 kg/mm SQ
Elongation: > 100 %
Surface resistivity: 10E11 Ω/SQ max. both sides (antistatic)
Peel strength conforms to IRMX specification P01-0074
POS test range not to exceed 35 grf.
Data included on C of C of every lot
Curl 4.5 mm max.
Sample length 200 mm Frequency 5 times
Inspection date < one year
Luminous transmittance: 89.8 %
Must also meet all requirements of EIA-standard #EIA-481C,
taping of surface mount components for automatic placement
Free of heat marks
No sharp edges allowed
No burrs allowed
Document Number: 95032 For technical questions concerning discrete products, contact: diodes-tech@vishay.com Revision: 18-May-09 For technical questions concerning module products, contact: ind-modules@vishay.com
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3
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com Revision: 18-Jul-08 1
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