VS-10ETF..SPbF Soft Recovery Series
Vishay High Power Products
Fast Soft Recovery Rectifier Diode, 10 A
Base
common
cathode
+
2
FEATURES
• Meets MSL level 1, per J-STD-020, LF
maximum peak of 260 °C
• Compliant to RoHS directive 2002/95/EC
• Halogen-free according to IEC 61249-2-21
definition
• Designed and qualified for industrial level
APPLICATIONS
• Output rectification and freewheeling in inverters,
D2PAK (SMD-220)
1
--
Anode
3
Anode
choppers and converters
• Input rectifications where severe restrictions on
conducted EMI should be met
PRODUCT SUMMARY
V
RRM
V
at 10 A < 1.2 V
F
t
rr
200 V to 600 V
50 ns
DESCRIPTION
The VS-10ETF..SPbF fast soft recovery rectifier series has
been optimized for combined short reverse recovery time
and low forward voltage drop.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
V
I
F(AV)
I
FSM
t
rr
V
T
RRM
F
J
Sinusoidal waveform 10
1 A, 100 A/μs 50 ns
10 A, TJ = 25 °C 1.2 V
Range - 40 to 150 °C
200 to 600 V
150
A
VOLTAGE RATINGS
, MAXIMUM PEAK
V
RRM
PART NUMBER
VS-10ETF02SPbF 200 300
VS-10ETF06SPbF 600 700
REVERSE VOLTAGE
V
V
, MAXIMUM NON-REPETITIVE
RSM
PEAK REVERSE VOLTAGE
V
I
RRM
AT 150 °C
mA
2 VS-10ETF04SPbF 400 500
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average forward current I
Maximum peak one cycle
non-repetitive surge current
Maximum I
Maximum I
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2
t for fusing I2t
2
√ t for fusing I 2√ t t = 0.1 ms to 10 ms, no voltage reapplied 1125 A 2√ s
F(AV)
I
FSM
TC = 128 °C, 180° conduction half sine wave 10
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied 160
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied 160
applied 150
RRM
applied 112.5
RRM
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A
2
A
s
VS-10ETF..SPbF Soft Recovery Series
Vishay High Power Products
Fast Soft Recovery
Rectifier Diode, 10 A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop V
Forward slope resistance r
Threshold voltage V
Maximum reverse leakage current I
FM
t
F(TO)
RM
RECOVERY CHARACTERISTICS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Reverse recovery time t
Reverse recovery current I
rr
rr
Reverse recovery charge Q
Snap factor S 0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range
Maximum thermal resistance
junction to case
Maximum thermal resistance
junction to ambient (PCB mount)
Soldering temperature T
Approximate weight
Marking device Case style D
Note
(1)
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 μm) copper 40 °C/W.
For recommended footprint and soldering techniques refer to application note #AN-994.
T
, T
J
R
thJC
R
thJA
S
10 A, TJ = 25 °C 1.2 V
12.7 mΩ
1.25 V
0.1
I
FM
t
rr
dir
dt
- 40 to 150 °C
rr
Stg
TJ = 150 °C
TJ = 25 °C
T
= 150 °C 2.0
J
IF at 10 Apk
25 A/μs
25 °C
V
= Rated V
R
145 ns
2.75 A
0.32 μC
RRM
DC operation 1.5
(1)
40
240 °C
2g
0.07 oz.
10ETF02S
2
PAK (SMD-220)
10ETF04S
10ETF06S
mA
I
RM(REC)
°C/W
t
Q
rr
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Document Number: 94091
2 Revision: 26-Apr-10
VS-10ETF..SPbF Soft Recovery Series
150
145
140
135
130
Temperature (°C)
125
Maximum Allowable Case
120
0
Fig. 1 - Current Rating Characteristics
150
145
140
135
Fast Soft Recovery
Rectifier Diode, 10 A
10ETF..S Series
(DC) = 1.5 °C/W
R
thJC
Ø
Conduction angle
120°
60°
30°
28
4
Average Forward Current (A)
90°
6
10ETF..S Series
(DC) = 1.5 °C/W
R
thJC
Conduction period
180°
10 12
Ø
Vishay High Power Products
20
10ETF..S Series
= 150 °C
T
J
16
12
RMS limit
8
30°
Power Loss (W)
4
Maximum Average Forward
0
0
48
Average Forward Current (A)
Fig. 4 - Forward Power Loss Characteristics
160
140
120
100
At any rated load condition and with
rated V
applied following surge.
RRM
90°
120°
60°
Conduction period
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
12
180°
DC
Ø
16
130
Temperature (°C)
125
Maximum Allowable Case
120
01 0
16
14
12
10
8
6
Power Loss (W)
4
Maximum Average Forward
2
0
0
Fig. 3 - Forward Power Loss Characteristics
60°
120°
30°
21 2
48 1 4
90°
6
DC
180°
16
Average Forward Current (A)
Fig. 2 - Current Rating Characteristics
120°
90°
RMS limit
2
60°
30°
Conduction angle
10ETF..S Series
= 150 °C
T
J
46
180°
Ø
8
10
Average Forward Current (A)
80
Forward Current (A)
Peak Half Sine Wave
60
10ETF..S Series
40
1 10 100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
180
Maximum non-repetitive surge current
160
140
120
100
80
Forward Current (A)
Peak Half Sine Wave
60
40
0.01 0.1 1
versus pulse train duration.
Initial TJ = 150 °C
No voltage reapplied
Rated V
10ETF..S Series
Pulse Train Duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
reapplied
RRM
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Revision: 26-Apr-10 3
VS-10ETF..SPbF Soft Recovery Series
Vishay High Power Products
100
10ETF..S Series
TJ = 150 °C
= 25 °C
T
10
Instantaneous Forward Current (A)
1
0.5 1.0 1.5 2.0 2.5 3.0
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
0.20
0.15
0.10
- Maximum Reverse
0.05
Recovery Time (µs)
rr
t
10ETF..S Series
= 25 °C
T
J
0
0 40 80 120 160 200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, T
J
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
Fast Soft Recovery
Rectifier Diode, 10 A
= 25 °C
J
1.4
- Maximum Reverse
rr
Q
10ETF..S Series
= 25 °C
T
J
1.2
1.0
0.8
0.6
0.4
Recovery Charge (µC)
0.2
0
0 40 80 120 160 200
IFM = 20 A
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 10 - Recovery Charge Characteristics, T
2.5
- Maximum Reverse
rr
Q
10ETF..S Series
= 150 °C
T
J
2.0
1.5
1.0
Recovery Charge (µC)
0.5
0
0 40 80 120 160 200
IFM = 20 A
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 11 - Recovery Charge Characteristics, T
IFM = 10 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
IFM = 10 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
= 25 °C
J
= 150 °C
J
0.4
10ETF..S Series
= 150 °C
T
J
0.3
IFM = 20 A
IFM = 10 A
IFM = 1 A
- Maximum Reverse
rr
t
0.2
0.1
Recovery Time (µs)
0
0 40 80 120 160 200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, T
IFM = 5 A
IFM = 2 A
= 150 °C
J
15
12
9
6
- Maximum Reverse
Recovery Current (A)
rr
3
I
0
10ETF..S Series
= 25 °C
T
J
0 40 80 120 160 200
IFM = 20 A
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, T
IFM = 10 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
= 25 °C
J
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Document Number: 94091
4 Revision: 26-Apr-10
VS-10ETF..SPbF Soft Recovery Series
Fast Soft Recovery
Vishay High Power Products
Rectifier Diode, 10 A
20
10ETF..S Series
= 150 °C
T
J
16
12
8
- Maximum Reverse
Recovery Current (A)
rr
4
I
0
0 40 80 120 160 200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
10
1
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 2 A
IFM = 1 A
0.1
0.01
Single pulse
0.001
- Transient Thermal Impedance (°C/W)
thJC
Z
Fig. 14 - - Thermal Impedance Z
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Square Wave Pulse Duration (s)
Characteristics
thJC
Steady state value
(DC operation)
10ETF..S Series
10 0.001 0.01 0.1 1
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Document Number: 94091
6 Revision: 26-Apr-10
VS-10ETF..SPbF Soft Recovery Series
Vishay High Power Products
Fast Soft Recovery
Rectifier Diode, 10 A
2 - Current rating (10 = 10 A)
3 - Circuit configuration:
E = Single diode
4
- Package:
T = D
2
PAK (TO-220AC)
5 - Type of silicon:
F = Fast soft recovery rectifier
6 - Voltage code x 100 = V
RRM
7 - S = Surface mountable
- PbF = Lead (Pb)-free
8 -
None = Tube
TRR = Tape and reel (right oriented)
TRL = Tape and reel (left oriented)
9
02 = 200 V
04 = 400 V
06 = 600 V
1 - HPP product suffix
Device code
5 1 3 246789
VS- 10 E T F 06 S TRL PbF
DIMENSIONS in millimeters and inches
Outline Dimensions
Vishay High Power Products
D2PAK
Conforms to JEDEC outline D
(2)(3)
E
(3)
L1
D
L2
2 x
Lead assignments
Diodes
1. - Anode (tw o die)/open (one die)
2., 4. - Cathode
3. - Anode
4
13 2
BB
e
2
H
2 x b 2
2 x b
0.010
PAK (SMD-220)
A
Detail A
(2)
C
MM
A
Lead tip
B
A
c2
AA
A
c
M
± 0.004
B
Gau ge
0° to 8 °
plane
L3
B
L
L4
Detail “A”
Rotated 90 °CW
Scale: 8 :1
(E)
E1
V iew A - A
A1
(3)
(D1)
17.90 (0.70)
15.00 (0.625)
2.32
(0.08 )
Plating
Seating
plane
2.64 (0.103)
2.41 (0.096)
(3)
H
B
Pad layout
11.00
MIN .
(0.43)
MIN .
(4)
b 1, b 3
(c)
(b , b 2)
Section B - B and C - C
Scale: N one
9.65
(0.38 )
3.81
(0.15)
c1
MIN .
MIN .
Base
Metal
(4)
SYMBOL
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5 M-1994
(2)
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3)
Thermal pad contour optional within dimension E, L1, D1 and E1
(4)
Dimension b1 and c1 apply to base metal only
(5)
Datum A and B to be determined at datum plane H
(6)
Controlling dimension: inch
(7)
Outline conforms to JEDEC outline TO-263AB
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1
D2PAK
Part Marking Information
Vishay High Power Products
Assemb ly
lot code
xxxxxxS
V PYWWXA
802 4
Part nu mb er
Produ ct v ersion (optional):
P = Lead (Pb )-free
N one = Standard
Date code:
Year 0 = 2000
Week 02
Line X
Child lot A
Example: This is a xxxxxxS with
assembly lot code 8024,
assembled on WW 02, 2000
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
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Product names and markings noted herein may be trademarks of their respective owners.
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Revision: 18-Jul-08 1