VISHAY VLMB41 Technical data

19225

Standard SMD LED PLCC-2

FEATURES

• High efficient InGaN technology

• EIA and ICE standard package

• Compatible with IR reflow, vapor phase
and wave solder processes acc. to CECC
00802 and J-STD-020C

• Available in 8 mm tape reel

• Lead (Pb)-free device

• Preconditioning: according to JEDEC level 2a

• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC

•

ESD-withstand voltage: up to 2 kV according to
JESD22-A114-B

• Automotive qualified AEC-Q101

VLMB41..

Vishay Semiconductors

e3

DESCRIPTION

This device has been designed to meet the increasing
demand for blue SMD LED.

The package of the VLMB41.. is the PLCC-2.
It consists of a lead frame which is embedded in a

white thermoplast. The reflector inside this package is
filled with clear epoxy.

APPLICATIONS

• Automotive: backlighting in dashboards and
switches

• Telecommunication: indicator and backlighting in
telephone and fax

• Backlighting for audio and video equipment

• Backlighting in office equipment

• Indoor and outdoor message boards

PRODUCT GROUP AND PACKAGE DATA

• Product group: LED

• Package: SMD PLCC-2

• Product series: standard

• Flat backlight for LCDs, switches and symbols

• Illumination purposes, alternative to incandescent
lamps

• General use

• Angle of half intensity: ± 60°

PARTS TABLE

PART COLOR, LUMINOUS INTENSITY TECHNOLOGY

= (45 to 112) mcd

VLMB41P1Q2-GS08

VLMB41P1Q2-GS18

VLMB41P1Q1-GS08

VLMB41P1Q1-GS18

VLMB41P2Q2-GS08

VLMB41P2Q2-GS18

Blue, I

V

Blue, I

= (45 to 112) mcd

V

Blue, I

= (45 to 90) mcd

V

= (45 to 90) mcd

Blue, I

V

Blue, I

= (56 to 112) mcd

V

Blue, I

= (56 to 112) mcd

V

InGaN on Sapphire

InGaN on Sapphire

InGaN on Sapphire

InGaN on Sapphire

InGaN on Sapphire

InGaN on Sapphire

Document Number 81641
Rev. 1.2, 23-Oct-07

www.vishay.com

1

VLMB41..

Vishay Semiconductors

ABSOLUTE MAXIMUM RATINGS1) VLMB41..

PARAMETER TEST CONDITION SYMBOL VALUE UNIT

≤ 80 °C I

DC forward current

Surge forward current

Power dissipation

Junction temperature

Storage temperature range

Operating temperature range

Thermal resistance junction/
ambient

Note:

1)

T

= 25 °C, unless otherwise specified

amb

T

amb

≤ 10 µs I

t

p

mounted on PC board

(pad size > 16 mm

2

)

T

T

R

F

FSM

P

T

stg

amb

thJA

V

j

OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMB41.., BLUE

PARAMETER TEST CONDITION PART SYMBOL MIN TYP. MAX UNIT

I

V

I

V

I

V

d

p

ϕ ± 60 deg

F

VF

IV

Luminous intensity

Dominant wavelength

Peak wavelength

Angle of half intensity

Forward voltage

Temperature coefficient of V

Temperature coefficient of I

F

V

Note:
Not designed for reverse operation

1)

T

= 25 °C, unless otherwise specified

amb

VLMB41P1Q2

= 10 mA

I

F

VLMB41P1Q1

VLMB41P2Q2

I

= 10 mA λ

F

= 10 mA λ

I

F

= 10 mA

I

F

= 20 mA V

I

F

IF = 10 mA TC

IF = 10 mA TC

20 mA

0.1 A

84 mW

110 °C

- 40 to + 100 °C

- 40 to + 100 °C

360 K/W

45 112 mcd

45 90 mcd

56 112 mcd

462 476 nm

464 nm

3.2 4.2 V

- 3 mV/K

- 0.4 %/K

LUMINOUS INTENSITY CLASSIFICATION

GROUP LIGHT INTENSITY (MCD)

STANDARD OPTIONAL MIN MAX

P

Q

Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above type numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In
order to ensure availability, single brightness groups are not be
orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped on
any one reel.
In order to ensure availability, single wavelength groups are not be
orderable.

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2

1 45 56

2 56 71

1 71 90

2 90 112

COLOR CLASSIFICATION

BLUE

GROUP

DOM. WAVELENGTH (NM)

MIN. MAX.

3 462 468

4 466 472

5 470 476

Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of ± 1 nm.

CROSSING TABLE

VISHAY OSRAM

VLMB41.. LBT67C

Document Number 81641

Rev. 1.2, 23-Oct-07

TYPICAL CHARACTERISTICS

T

= 25 °C, unless otherwise specified

amb

VLMB41..

Vishay Semiconductors

30

20

10

- Forward Current (mA)

F

I

0

0 20406080 100

20913

T

- Ambient Temperature (°C)

amb

120

Figure 1. Forward Current vs. Ambient Temperature

0°

1.0

0.9

0.8

- Relative Luminous Intensity

0.7

V rel

I

95 10319

0.4 0.2 0 0.2 0.4

0.6

10° 20°

30°

40°

50°

60°

70°

80°

0.6

Figure 2. Rel. Luminous Intensity vs. Angular Displacement

100

10

- Forward Current (mA)

F

I

1

4.5

20519

3.53.02.5

4.0

VF - Forward Voltage (V)

Figure 4. Forward Current vs. Forward Voltage

10

1

- Relative Luminous Intensity

V rel

I

20520

0.1

I

- Forward Current (mA)

F

100101

Figure 5. Relative Luminous Intensity vs. Forward Current

1.010

1.005

1.000

0.995

Relative Dominant Wavelength (nm)

0.990

20518

IF - Forward Current (mA)

100101

Figure 3. Relative Dominant Wavelength vs. Forward Current

Document Number 81641
Rev. 1.2, 23-Oct-07

1.50

1.25

1.00

0.75

- Relative Luminous Intensity

V rel

I

0.50
0102030405060708090

T

20221

- Ambient Temperature (°C)

amb

Figure 6. Rel. Luminous Intensity vs. Ambient Temperature

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3

VLMB41..

Vishay Semiconductors

3.65

3.60

3.55

3.50

3.45

3.40

- Forward Voltage (V)

F

3.35

V

3.30

3.25
0102030405060708 090100

20114

Figure 7. Forward Voltage vs. Ambient Temperature

PACKAGE DIMENSIONS in millimeters

T

- Ambient Temperature (°C)

amb

20541

Mounting Pad Layout

1.2
area covered with

solder resist

4

2.6 (2.8)

4

1.6 (1.9)

A

Protection Diode

C

20242

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4

Document Number 81641

Rev. 1.2, 23-Oct-07

VLMB41..

Vishay Semiconductors

METHOD OF TAPING/POLARITY AND TAPE
AND REEL

SMD LED (VLM.3.../.4... - SERIES)

Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN
IEC 40 (CO) 564) for automatic component insertion.
The blister tape is a plastic strip with impressed
component cavities, covered by a top tape.

Adhesive T ape

Blister T ape

Component Cavity

94 8670

TAPING OF VLM.3.../.4...

3.5

3.1

5.75

5.25

3.6

3.4

1.85

1.6

1.4

4.1

3.9

2.05

1.95

4.1

3.9

1.65

Figure 8. Tape Dimensions in mm for PLCC-2

2.2

2.0

4.0

8.3

7.7

3.6

0.25

94 8668

REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED

10.4

13.00

12.75

14.4 max.

8.4

62.5

60.0

18857

Identification

Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity

120°

4.5

3.5

2.5

1.5

321
329

Figure 10. Reel Dimensions - GS18

SOLDERING PROFILE

IR Reflow Soldering Profile for Lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 2a

300

255 °C

250

240 °C
217 °C

200

150

Temperature (°C)

max. 120 s

100

max. ramp up 3 °C/s

50

0

0 50 100 150 200 250 300

19885

Time (s)

max. 100 s

max. ramp down 6 °C/s

Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020C)

max. 260 °C

245 °C

max. 30 s

max. 2 cycles allowed

REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)

10.0

13.00

12.75

14.4 max.

9.0

63.5

60.5

94 8665

Identification

Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity

Figure 9. Reel Dimensions - GS08

Document Number 81641
Rev. 1.2, 23-Oct-07

120°

4.5

3.5

2.5

1.5

180
178

TTW Soldering

300

250

235 °C...260 °C

200

150

first wave

ca. 200 K/s

(acc. to CECC00802)

5 s

Lead Temperature

second
wave

dotted line: process limits

ca. 2 K/s

full line: typical

948626-1

100 °C...130 °C

100

Temperature (°C)

150

ca. 5 K/s

200

250

50

0

0

2 K/s

forced cooling

50

100

Time (s)

Figure 12. Double Wave Soldering of Opto Devices (all Packages)

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VLMB41..

Vishay Semiconductors

BAR CODE PRODUCT LABEL
EXAMPLE:

106

A

BC D E F G

H

VISHAY

37

20216

A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):

e.g.: R1 = code for luminous intensity group

5L = code for chrom. coordinate group
D) Date code year/week
E) Day code (e.g. 4: Thursday)
F) Batch no.
G) Total quantity
H) Company code

DRY PACKING

The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during
transportation and storage.

Aluminum bag

Label

Reel

RECOMMENDED METHOD OF STORAGE

Dry box storage is recommended as soon as the
aluminum bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:

• Storage temperature 10 °C to 30 °C

• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture

content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover

to the former condition by drying under the following
condition:

192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/
nitrogen) or

96 h at 60 °C + 5 °C and < 5 % RH for all device
containers or

24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label

is included on all dry bags.

CAUTION

1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)

2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.

260°C) must be:

a) Mounted within
b) Stored at <1

3. Devices require baking before mounting if:
a) Humidity Indicator Card is >10% when read at 23°C +
b) 2a or 2b is not met.

4. If baking is required, devices may be baked for:

192 hours
96 hours
24 hours

Bag Seal Date: ______________________________

(If blank, see bar code label)

This bag contains

MOISTURE –SENSITIVE DEVICES

672 hours

0% RH.

at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
at 60±5
at 100±5°C Not suitable for

Note: LEVEL defined by EIA JEDEC Standard JESD22-A113

at factory condition of <

o

Cand <5%RH For

all

device containers or

L E V E L

30°C/60%RH or

5°C or

reels or tubes

2a

or

19786

Example of JESD22-A112 level 2a label

15973

FINAL PACKING

The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.

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6

ESD PRECAUTION

Proper storage and handling procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the antistatic
shielding bag. Electro-static sensitive devices warning
labels are on the packaging.

VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS

The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.

Document Number 81641

Rev. 1.2, 23-Oct-07

VLMB41..

Vishay Semiconductors

Ozone Depleting Substances Policy Statement

It is the policy of Vishay Semiconductor GmbH to

1. Meet all present and future national and international statutory requirements.

2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.

It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).

The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.

Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.

1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively

2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA

3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.

Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.

We reserve the right to make changes to improve technical design

and may do so without further notice.

Parameters can vary in different applications. All operating parameters must be validated for each customer

application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or

unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and

expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such

unintended or unauthorized use.

Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany

Document Number 81641
Rev. 1.2, 23-Oct-07

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7

Legal Disclaimer Notice

Vishay

Notice

Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.

Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.

Document Number: 91000 www.vishay.com
Revision: 08-Apr-05 1