With the VESD05A8A-HNH up to 8 signal- or data-lines (L1 - L8) can be protected against voltage transients.
With pin 9 connected to ground and pin 1 up to pin 8 connected to a signal- or data-line which has to be protected. As long as the voltage level on the data- or signal-line is between 0 V (ground level) and the specified
Maximum Reverse Working Voltage (V
isolation to the ground line. The protection device behaves like an open switch.
As soon as any positive transient voltage signal exceeds the break through voltage level of the protection
diode, the diode becomes conductive and shorts the transient current to ground. Now the protection device
behaves like a closed switch. The Clamping Voltage (V
plus the voltage drop at the series impedance (resistance and inductance) of the protection device.
Any negative transient signal will be clamped accordingly. The negative transient current is flowing in the forward direction of the protection diode. The low Forward Voltage (V
ground level.
Due to the different clamping levels in forward and reverse direction the VESD05A8A-HNH clamping behaviour
is Bi
directional and Asymmetrical (BiAs).
L1
L2
L3
L4
1
2
3
4
) the protection diode between data line and ground offer a high
RWM
) is defined by the BReakthrough Voltage (VBR) level
C
) clamps the negative transient close to the
F
8
9
7
6
5
L8
L7
L6
L5
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2
20524
For technical support, please contact: ESD-Protection@vishay.com
Document Number 81629
Rev. 1.2, 22-Feb-08
VESD05A8A-HNH
Vishay Semiconductors
Electrical Characteristics
Ratings at 25 °C, ambient temperature unless otherwise specified
VESD05A8A-HNH
BiAs mode: each input (pin 1 - pin 8) to ground (pin 9)
Protection pathsnumber of line which can be protectedN lines8lines
at I
Reverse current
Max. reverse current
Min. reverse breakdown
voltage
= 5 A acc. IEC 61000-4-5V
Max. clamping voltage
Max. forward clamping
voltage
Line capacitance
at I
PP
at I
= 5 A acc. IEC 61000-4-5V
F
at V
at V
If a higher surge current or Peak Pulse current (IPP) is needed, some protection diodes in the
VESD05A8A-HNH can also be used in parallel in order to "multiply" the performance.
If two diodes are switched in parallel you get
•double surge power = double peak pulse current (2 x I
•half of the line inductance = reduced clamping voltage
•half of the line resistance = reduced clamping voltage
•double line Capacitance (2 x C
•double Reverse leakage current (2 x I
= 1 µAV
R
= V
at V
R
at I
= 0 V; f = 1 MHzC
R
= 2.5 V; f = 1 MHzC
R
= 5 VI
RWM
= 1 mAV
R
)
D
)
R
RWM
R
BR
C
F
D
D
5V
< 0.11µA
68V
13V
4.5V
3035pF
1823pF
)
PPM
L1
L2
1
2
3
4
8
9
7
6
5
L4
L3
20525
Document Number 81629
Rev. 1.2, 22-Feb-08
For technical support, please contact: ESD-Protection@vishay.com
If a bipolar symmetrical protection device is needed the VESD05A8A-HNH can also be used as a seven-line
protection device. Therefore seven pins (example: pin 1, 2, 3, 4, 6, 7 and 8) has to be connected to the signalor data-line (L1 - L7) and pin 5 to ground. Pin 9 must not be connected!
Positive and negative voltage transients will be clamped in the same way. The clamping current from one data
line through the VESD05A8A-HNH to the ground passes one diode in forward direction and the other one in
reverse direction. The Clamping Voltage (V
plus the forward voltage of the other diode plus the voltage drop at the series impedances (resistances and
inductances) of the protection device.
Due to the same clamping levels in positive and negative direction the VESD05A8A-HNH voltage clamping
behaviour is also Bi
directional and Symmetrical (BiSy).
) is defined by the BReakthrough Voltage (VBR) level of one diode
C
L1
L2
L3
L4
1
2
3
4
8
9
7
6
5
L7
L6
L5
20526_1
Electrical Characteristics
Ratings at 25 °C, ambient temperature unless otherwise specified
VESD05A8A-HNH
BiSy mode: each input (pin 1 - pin 8) to any other input pin connected to ground; pin 9 not connected
Protection pathsnumber of line which can be protected
= 1 µAV
Reverse current
Max. reverse current
Min. reverse breakdown
voltage
Max. clamping voltage
Line capacitance
at I
at I
R
= V
at V
R
at I
= 2.5 A acc. IEC 61000-4-5V
PP
at V
= 0 V; f = 1 MHzC
R
= 2.5 V; f = 1 MHzC
at V
R
= 5.5 VI
RWM
= 1 mAV
R
N
lines
RWM
R
BR
C
D
D
5.5V
< 0.11µA
6.58.7V
1518pF
1315pF
7lines
13V
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4
For technical support, please contact: ESD-Protection@vishay.com
Document Number 81629
Rev. 1.2, 22-Feb-08
Typical Characteristics
T
= 25 °C, unless otherwise specified
amb
8µs to 100 %
I
100 %
80 %
60 %
PPM
40 %
20 µs to 50 %
VESD05A8A-HNH
100
Pin 9 to
Pin 1, 2, 3, 4, 5, 6, 7 or 8
10
1
(mA)
F
I
0.1
Vishay Semiconductors
20 %
0 %
010203040
20548
Time (µs)
Figure 1. 8/20 µs Peak Pulse Current Wave Form
acc. IEC 61000-4-5
120 %
100 %
ESD
Discharge Current I
20557
80 %
60 %
53 %
40 %
27 %
20 %
0 %
- 10 0 10 20 30 40 50 60 70 80 90 100
rise time = 0.7 ns to 1 ns
Time (ns)
Figure 2. ESD Discharge Current Wave Form
acc. IEC 61000-4-2 (330 Ω/150 pF)
0.01
0.001
0.50.60.70.80.91
20559
VF (V)
Figure 4. Typical Forward Current IF vs. Forward Voltage V
8
Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9
7
6
5
(V)
4
R
V
3
2
1
0
0.01 0.1110100 1000 10000
20560
IR (µA)
Figure 5. Typical Reverse Voltage VR vs.
Reverse Current I
R
F
35
f = 1 MHz
30
(pF)
D
C
20558
25
20
15
10
5
0
Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9
BiSy-mode
between 2 Pins (1 - 8)
Pin 9 not connetced
012456
Figure 3. Typical Capacitance C
Document Number 81629
Rev. 1.2, 22-Feb-08
14
12
BiAs-mode
VR (V)
3
vs. Reverse Voltage V
D
R
10
(V)
C
V
- 2
- 4
- 6
20561
Figure 6. Typical Peak Clamping Voltage VC vs.
For technical support, please contact: ESD-Protection@vishay.com
Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9
positive surge
8
6
Measured
acc. IEC 61000-4-5
4
(8/20 µs - wave form)
2
0
negative surge
0123456
V
C
IPP (A)
Peak Pulse Current I
PP
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5
VESD05A8A-HNH
Vishay Semiconductors
80
60
40
(V)
20
C-ESD
V
0
- 20
- 40
- 10 0 10 20 30 40 50 60 70 8090
20562
acc. IEC 61000-4-2
+ 8 kV
contact discharge
t (ns)
Figure 7. Typical Clamping Performance at + 8 kV
Contact Discharge (Acc. IEC 61000-4-2)
40
20
0
acc. IEC 61000-4-2
- 8 kV
contact discharge
(V)
- 20
C-ESD
V
- 40
- 60
- 80
- 10 0 10 20 30 40 50 60 70 8090
20563
t (ns)
Figure 8. Typical Clamping Performance at - 8 kV Contact
Discharge (acc. IEC 61000-4-2)
250
acc. IEC 61000-4-2 contact discharge
Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9
200
150
positive discharge
100
50
(V)
0
C-ESD
V
- 50
- 100
negative discharge
- 150
- 200
051015202530
20564
V
C-ESD
V
(kV)
ESD
Figure 9. Typical Peak Clamping Voltage at ESD Contact
Discharge (acc. IEC 61000-4-2)
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6
For technical support, please contact: ESD-Protection@vishay.com
Document Number 81629
Rev. 1.2, 22-Feb-08
Package Dimensions in millimeters (inches): LLP1713-9L
VESD05A8A-HNH
Vishay Semiconductors
20386
Document Number 81629
Rev. 1.2, 22-Feb-08
For technical support, please contact: ESD-Protection@vishay.com
www.vishay.com
7
VESD05A8A-HNH
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively.
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA.
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages,
and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated
For technical support, please contact: ESD-Protection@vishay.com
Document Number 81629
Rev. 1.2, 22-Feb-08
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.