Silicon Phototransistor in 0805 Package
20043-1
DESCRIPTION
TEMT7100X01 is a silicon NPN epitaxial planar
phototransistor with daylight blocking filter in a miniature,
black 0805 package for surface mounting. Filter bandwidth is
matched with 830 nm to 950 nm IR emitters.
TEMT7100X01
Vishay Semiconductors
FEATURES
• Package type: surface mount
• Package form: 0805
• Dimensions (L x W x H in mm): 2 x 1.25 x 0.85
• AEC-Q101 qualified
• High photo sensitivity
• Daylight blocking filter matches with 830 nm to
950 nm IR emitters
• Angle of half sensitivity: ϕ = ± 60°
• Package matched with IR emitter series VSMB1940X01
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
• Find out more about Vishay’s Automotive Grade Product
requirements at: www.vishay.com/applications
APPLICATIONS
• Detector in automotive applications
• Photo interrupters
• Miniature switches
• Counters
• Encoders
• Position sensors
PRODUCT SUMMARY
COMPONENT I
TEMT7100X01 225 to 675 ± 60 750 to 1010
Note
Test condition see table “Basic Characteristics”
(µA) ϕ (deg) λ
caE
0.5
(nm)
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
TEMT7100X01 Tape and reel MOQ: 3000 pcs, 3000 pcs/reel 0805
Note
MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Collector emitter voltage V
Emitter collector voltage V
Collector current I
Power power dissipation T
Junction temperature T
Operating temperature range T
Storage temperature range T
Soldering temperature Acc. reflow profile fig. 7 T
Thermal resistance junction/ambient Acc. J-STD-051 R
Note
T
= 25 °C, unless otherwise specified
amb
Document Number: 81770 For technical questions, contact: detectortechsupport@vishay.com
Rev. 1.0, 12-May-09 1
≤ 55 °C P
amb
CEO
ECO
C
V
j
amb
stg
sd
thJA
20 V
7V
20 mA
100 mW
100 °C
- 40 to + 100 °C
- 40 to + 100 °C
260 °C
270 K/W
www.vishay.com
TEMT7100X01
Vishay Semiconductors
120
100
80
60
R
= 270 K/W
thJA
40
- Power Dissipation (mW)
V
20
P
0
0 10203040 50607080 90 100
21331
T
- Ambient Temperature (°C)
amb
Silicon Phototransistor in 0805 Package
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
BASIC CHARACTERISTICS
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Collector emitter breakdown voltage I
Collector dark current V
Collector emitter capacitance V
E
Collector light current
e
Angle of half sensitivity ϕ ± 60 deg
Wavelength of peak sensitivity λ
Range of spectral bandwidth λ
Collector emitter saturation voltage I
Note
= 25 °C, unless otherwise specified
T
amb
= 0.1 mA V
C
= 5 V, E = 0 I
CE
= 0 V, f = 1 MHz, E = 0 C
CE
= 1 mW/cm2, λ = 950 nm,
V
= 5 V
CE
= 0.05 mA V
C
CEO
CEO
CEO
I
CA
p
0.5
CEsat
20 V
1 100 nA
25 pF
225 450 675 µA
870 nm
750 to 1010 nm
0.4 V
BASIC CHARACTERISTICS
T
= 25 °C, unless otherwise specified
amb
10 000
IF = 0
1000
100
10
VCE = 70 V
V
= 25 V
CE
V
= 5 V
CE
- Collector Dark Current (nA)
CE0
I
1
0 1020304050607080 90 100
20594
- Ambient Temperature (°C)
T
amb
Fig. 2 - Collector Dark Current vs. Ambient Temperature Fig. 3 - Collector Light Current vs. Irradiance
www.vishay.com For technical questions, contact: detectortechsupport@vishay.com
2 Rev. 1.0, 12-May-09
10
1
0.1
0.01
- Collector Light Current (mA)
ca
I
0.001
0.01 0.1 1 10
21551
Ee - Irradiance (mW/cm²)
VCE = 5 V
Document Number: 81770
TEMT7100X01
Silicon Phototransistor in 0805 Package
100
90
80
70
60
50
40
30
- Rise/Fall Time (µs)
f
t
/t
r
t
20599
r
20
10
0
0 250 500 750 1000 1250 1500 1750 2000
Fig. 4 - Rise/Fall Time vs. Collector Current
1.2
1.0
RL = 100 Ω
t
f
- Collector Current (µA)
I
C
Vishay Semiconductors
0°
10° 20°
1.0
0.9
0.8
- Relative Radiant Intensity
e rel
0.7
I
0.4 0.2 0
0.6
94 8013
Fig. 6 - Relative Radiant Sensitivity vs. Angular Displacement
30°
40°
50°
60°
70°
80°
ϕ - Angular Displacement
0.8
0.6
0.4
- Relative Spectral Sensitivity
0.2
rel
S(λ)
0
600 700 800 900 1000 1100
21552
λ - Wavelength (nm)
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
REFLOW SOLDER PROFILE
300
255 °C
250
240 °C
217 °C
200
150
100
max. 120 s
Temperature (°C)
50
max. ramp up 3 °C/s
0
0 50 100 150 200 250 300
19841
max. ramp down 6 °C/s
Time (s)
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
max. 260 °C
245 °C
max. 30 s
max. 100 s
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
< 30 °C, RH < 60 %
amb
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Document Number: 81770 For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com
Rev. 1.0, 12-May-09 3