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IRFP460B, SiHG460B
Vishay Siliconix
D Series Power MOSFET
PRODUCT SUMMARY
VDS (V) at TJ max. 550
R
max. at 25 °C ()VGS = 10 V 0.25
DS(on)
Q
max. (nC) 170
g
Q
(nC) 14
gs
Q
(nC) 28
gd
Configuration Single
G
N-Channel MOSFET
FEATURES
•Optimal Design
- Low Area Specific On-Resistance
- Low Input Capacitance (C
iss
)
- Reduced Capacitive Switching Losses
- High Body Diode Ruggedness
- Avalanche Energy Rated (UIS)
• Optimal Efficiency and Operation
D
- Low Cost
- Simple Gate Drive Circuitry
- Low Figure-of-Merit (FOM): Ron x Q
g
- Fast Switching
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Note
* Lead (Pb)-containing terminations are not RoHS-compliant.
S
Exemptions may apply.
APPLICATIONS
• Consumer Electronics
- Displays (LCD or Plasma TV)
• Server and Telecom Power Supplies
- SMPS
• Industrial
- Welding
- Induction Heating
- Motor Drives
• Battery Chargers
•SMPS
- Power Factor Correction (PFC)
ORDERING INFORMATION
Package TO-247AC
Lead (Pb)-free IRFP460BPbF
Lead (Pb)-free and Halogen-free SiHG460B-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage AC (f > 1 Hz) 30
= 25 °C
T
Continuous Drain Current (T
Pulsed Drain Current
Linear Derating Factor 2.2 W/°C
Single Pulse Avalanche Energy
Maximum Power Dissipation P
Operating Junction and Storage Temperature Range T
Drain-Source Voltage Slope T
Reverse Diode dV/dt
Soldering Recommendations (Peak Temperature) for 10 s 300
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
= 50 V, starting TJ = 25 °C, L = 10 mH, Rg = 25 , IAS = 7.5 A.
b. V
DD
c. 1.6 mm from case.
ID, starting TJ = 25 °C.
d. I
SD
S12-0812-Rev. B, 16-Apr-12
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
= 150 °C) VGS at 10 V
J
a
b
d
For technical questions, contact: hvm@vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
C
= 100 °C 13
C
= 125 °C
J
1
DS
V
GS
I
D
IDM 62
E
AS
D
, T
J
stg
dV/dt
500
± 20
20
281 mJ
278 W
- 55 to + 150 °C
24
0.36
c
Document Number: 91502
V Gate-Source Voltage
AT
V/ns
°C
IRFP460B, SiHG460B
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THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Maximum Junction-to-Case (Drain)
thJA
R
thJC
-40
-0.45
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
V
Temperature Coefficient
DS
Gate-Source Threshold Voltage (N) V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
Dynamic
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Effective output capacitance, energy
a
related
Effective output capacitance, time
b
related
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Gate Input Resistance R
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current I
Diode Forward Voltage V
Reverse Recovery Time t
Reverse Recovery Charge Q
Reverse Recovery Current I
Notes
a. C
b. C
is a fixed capacitance that gives the same energy as C
oss(er)
is a fixed capacitance that gives the same charging time as C
oss(tr)
DS
V
DS/TJ
GS(th)
V
GSS
DSS
V
DS(on)
fs
iss
- 152 -
oss
-13-
rss
C
o(er)
C
o(tr)
g
-28-
gd
d(on)
r
- 117 176
d(off)
- 56 112
f
g
S
MOSFET symbol
showing the
integral reverse
SM
SD
rr
rr
RRM
p - n junction diode
VGS = 0 V, ID = 250 μA 500 - - V
Reference to 25 °C, I
= 250 μA
D
VDS = VGS, ID = 250 μA 2 - 4 V
= ± 20 V - - ± 100 nA
GS
VDS = 500 V, VGS = 0 V - - 1
= 400 V, VGS = 0 V, TJ = 125 °C - - 10
V
DS
= 10 V ID = 10 A - 0.2 0.25
GS
VDS = 50 V, ID = 10 A - 12 - S
VGS = 0 V,
V
= 100 V,
DS
f = 1 MHz
VGS = 0 V,
V
= 0 V to 400 V
DS
V
= 10 V ID = 10 A, VDS = 400 V
GS
= 400 V, ID = 10 A,
V
DD
V
= 10 V, Rg = 9.1
GS
f = 1 MHz, open drain - 1.8 -
TJ = 25 °C, IS = 10 A, VGS = 0 V - - 1.2 V
TJ = 25 °C, IF = IS = 10 A,
dI/dt = 100 A/μs, V
while VDS is rising from 0 % to 80 % VDS.
oss
while VDS is rising from 0 % to 80 % VDS.
oss
= 20 V
R
Vishay Siliconix
°C/W
-0.56-
- 3094 -
- 131 -
- 189 -
- 85 170
-2450
-3162
--20
--80
- 437 - ns
-5.9-μC
-25-A
V/°C
μA
pF
nC Gate-Source Charge Qgs -14-
ns
A
S12-0812-Rev. B, 16-Apr-12
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: hvm@vishay.com
2
Document Number: 91502
11 V
0
20
40
60
80
VDS, Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
0 5 10 15 20 25 30
TJ = 25 °C
TOP 15 V
14 V
13 V
12 V
11 V
10 V
9 V
8 V
7 V
6 V
BOTTOM 5 V
11 V
0
10
20
30
40
VDS, Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
0 5 10 15 20 25 30
TJ = 150 °C
TOP 15 V
14 V
13 V
12 V
11 V
10 V
9 V
8 V
7 V
6 V
BOTTOM 5 V
TJ, Junction Temperature (°C)
R
DS(on)
, Drain-to-Source
- 60 - 40 - 20020 40 60 80 100 120
140
160
On Resistance (Normalized)
0
0.5
1
1.5
2
2.5
3
VGS = 10 V
ID = 10 A
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
IRFP460B, SiHG460B
Vishay Siliconix
Fig. 1 - Typical Output Characteristics
Fig. 2 - Typical Output Characteristics
80
TJ = 25 °C
60
40
TJ = 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
10 000
C
10
iss
C
oss
C
rss
V
= 0 V, f = 1 MHz
GS
= Cgs + Cgd, Cds Shorted
C
iss
= C
C
rss
gd
C
= Cds + C
oss
gd
1000
100
Capacitance (pF)
1
0 100 200 300 400 500
VDS, Drain-to-Source Voltage (V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
24
VDS = 400 V
V
20
DS
V
DS
16
12
= 250 V
= 100 V
S12-0812-Rev. B, 16-Apr-12
20
, Drain-to-Source Current (A)
D
I
0
Fig. 3 - Typical Transfer Characteristics
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
0 5 10 15 20
VGS, Gate-to-Source Voltage (V)
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
25
3
For technical questions, contact: hvm@vishay.com
8
, Gate-to-Source Voltage (V)
4
GS
V
0
0306090
120
150 180
Qg, Total Gate Charge (nC)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Document Number: 91502