Vishay IRFP9140, SiHFP9140 Data Sheet
Power MOSFET
S
G
D
P-Channel MOSFET
TO-247AC
G
D
S
Available
RoHS*
COMPLIANT
IRFP9140, SiHFP9140
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) - 100
(Ω)V
R
DS(on)
Q
(Max.) (nC) 61
g
Q
(nC) 14
gs
Q
(nC) 29
gd
Configuration Single
= - 10 V 0.20
GS
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• P-Channel
• Isolated Central Mounting Hole
• 175 °C Operating Temperature
•Fast Switching
• Ease of Paralleling
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The TO-247AC package is preferred for
commercial-industrial applications where higher power
levels preclude the use of TO-220AB devices. The
TO-247AC is similar but superior to the earlier TO-218
package because of its isolated mouting hole. It also
provides greater creepage distance between pins to meet
the requirements of most safety specifications.
ORDERING INFORMATION
Package TO-247AC
Lead (Pb)-free
SnPb
IRFP9140PbF
SiHFP9140-E3
IRFP9140
SiHFP9140
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
T
= 25 °C
Continuous Drain Current V
Pulsed Drain Current
a
at - 10 V
GS
C
= 100 °C - 15
C
DS
± 20
GS
I
D
IDM - 84
Linear Derating Factor 1.2 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
b
a
a
= 25 °C P
c
C
Operating Junction and Storage Temperature Range T
E
AS
I
AR
E
AR
D
dV/dt - 5.5 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Mounting Torque 6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
= - 25 V, starting TJ = 25 °C, L = 3.3 mH, Rg = 25 Ω, IAS = - 21 A (see fig. 12).
DD
≤ - 21 A, dI/dt ≤ 200 A/μs, VDD ≤ VDS, TJ ≤ 175 °C.
c. I
SD
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91238 www.vishay.com
S11-0444-Rev. B, 14-Mar-11 1
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
- 100
- 21
960 mJ
- 21 A
18 mJ
180 W
- 55 to + 175
d
10 lbf · in
1.1 N · m
www.vishay.com/doc?91000
V
AT
°C
IRFP9140, SiHFP9140
D
S
G
S
D
G
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Maximum Junction-to-Case (Drain) R
thJA
thCS
thJC
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
Temperature Coefficient ΔVDS/TJ Reference to 25 °C, ID = - 1 mA - - 0.087 -
V
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
Dynamic
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Internal Drain Inductance L
Internal Source Inductance L
DS
GS(th)
V
GSS
DSS
VGS = - 10 V ID = - 13 A
DS(on)
fs
iss
- 590 -
oss
- 140 -
rss
g
--14
gs
--29
gd
d(on)
r
-34-
d(off)
-57-
f
D
V
V
GS
R
Between lead,
6 mm (0.25") from
package and center of
S
die contact
-40
0.24 -
-0.83
VGS = 0 V, ID = - 250 μA - 100 - -
VDS = VGS, ID = - 250 μA - 2.0 - - 4.0
= ± 20 V - - ± 100 nA
GS
VDS = - 100 V, VGS = 0 V - - - 100
= - 80 V, VGS = 0 V, TJ = 150 °C - - - 500
DS
VDS = - 50 V, ID = - 13 A
VGS = 0 V,
V
= - 25 V,
DS
f = 1.0 MHz, see fig. 5
b
b
--0.20
6.2 - -
- 1400 -
--61
= - 19 A, VDS = - 80 V,
I
= - 10 V
D
see fig. 6 and 13
b
-16-
V
= - 50 V, ID = - 19 A,
DD
= 9.1 Ω, RD = 2.4 Ω, see fig. 10
g
b
-73-
-5.0-
-13-
°C/WCase-to-Sink, Flat, Greased Surface R
V
V/°C
V
μA
Ω
S
pFOutput Capacitance C
nC Gate-Source Charge Q
ns
nH
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Forward Turn-On Time t
S
I
SM
SD
rr
rr
on
MOSFET symbol
showing the
integral reverse
p - n junction diode
TJ = 25 °C, IS = - 21 A, VGS = 0 V
b
TJ = 25 °C, IF = - 19 A, dI/dt = 100 A/μs
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
--- 21
--- 84
--- 5.0V
- 130 260 ns
b
- 0.35 0.70 μC
A
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
www.vishay.com Document Number: 91238
2 S11-0444-Rev. B, 14-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
IRFP9140, SiHFP9140
Vishay Siliconix
Fig. 1 - Typical Output Characteristics, TC = 25 °C
Fig. 2 - Typical Output Characteristics, T
= 175 °C
C
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91238 www.vishay.com
S11-0444-Rev. B, 14-Mar-11 3
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
www.vishay.com/doc?91000
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