IRFP31N50L, SiHFP31N50L
Available
RoHS*
COMPLIANT
Power MOSFET
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) 500
R
()V
DS(on)
Q
(Max.) (nC) 210
g
Q
(nC) 58
gs
Q
(nC) 100
gd
Configuration Single
= 10 V 0.15
GS
FEATURES
• Super Fast Body Diode Eliminates the Need for
External Diodes in ZVS Applications
• Lower Gate Charge Results in Simpler Drive
Requirements
• Enhanced dV/dt Capabilities Offer Improved Ruggedness
• Higher Gate Voltage Threshold Offers Improved Noise
Immunity
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Zero Voltage Switching SMPS
• Telecom and Server Power Supplies
• Uninterruptible Power Supplies
• Motor Control Applications
ORDERING INFORMATION
Package TO-247AC
Lead (Pb)-free
SnPb
IRFP31N50LPbF
SiHFP31N50L-E3
IRFP31N50L
SiHFP31N50L
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
= 25 °C
T
Continuous Drain Current V
Pulsed Drain Current
a
at 10 V
GS
C
= 100 °C 20
C
DS
± 30
GS
I
D
IDM 124
Linear Derating Factor 3.7 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range T
b
a
a
= 25 °C P
c
C
E
AS
I
AR
E
AR
D
dV/dt 19 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Mounting Torque 6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
c. I
SD
= 25 °C, L = 1 mH, Rg = 25 , IAS = 31 A (see fig. 12).
J
31 A, dI/dt 422 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91220 www.vishay.com
S11-0488-Rev. C, 21-Mar-11 1
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
500
31
460 mJ
31 A
46 mJ
460 W
- 55 to + 150
d
10 lbf · in
1.1 N · m
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V
AT
°C
IRFP31N50L, SiHFP31N50L
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Case-to-Sink, Flat, Greased Surface R
Maximum Junction-to-Case (Drain) R
thJA
thCS
thJC
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.28 -
V
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
Dynamic
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Output Capacitance C
Effective Output Capacitance C
Effective Output Capacitance
Total Gate Charge Q
Gate-Source Charge Q
Gate-Drain Charge Q
Internal Gate Resistance R
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Reverse Recovery Current I
Forward Turn-On Time t
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
c. C
eff. is a fixed capacitance that gives the same charging time as C
oss
eff. (ER) is a fixed capacitance that stores the same energy as C
C
oss
www.vishay.com Document Number: 91220
2 S11-0488-Rev. C, 21-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
DS
GS(th)
V
GSS
DSS
VGS = 10 V ID = 19 A
DS(on)
fs
iss
- 553 -
oss
-59-
rss
oss
eff.
oss
C
oss eff. (ER)
g
gs
gd
g
d(on)
r
-54-
d(off)
-53-
f
S
V
V
GS
- 200 -
V
GS
MOSFET symbol
showing the
integral reverse
I
SM
SD
rr
RRM
on
rr
p - n junction diode
This datasheet is subject to change without notice.
-40
0.24 -
°C/W
-0.26
VGS = 0 V, ID = 250 μA 500 - -
VDS = VGS, ID = 250 μA 3.0 -
= ± 30 V - -
GS
VDS = 500 V, VGS = 0 V - -
= 400 V, VGS = 0 V, TJ = 125 °C - -
DS
VDS = 50 V, ID = 19 A
VGS = 0 V,
V
= 25 V,
DS
f = 1.0 MHz, see fig. 5
V
DS
V
= 0 V
DS
= 1.0 V , f = 1.0 MHz - 6630 -
= 400 V , f = 1.0 MHz - 155 -
= 0 V to 400 V
V
DS
b
b
-0.15
15 - -
- 5000 -
c
- 276 -
5.0 V
± 100 nA
50 μA
2.0 mA
0.18
- - 210
= 31 A, VDS = 400 V,
I
= 10 V
D
see fig. 7 and 13
b
--58
- - 100
f = 1 MHz, open drain - 1.1 -
-28-
V
= 250 V, ID = 31 A,
DD
R
= 4.3 , see fig. 10
g
b
- 115 -
--31
- - 124
TJ = 25 °C, IS = 31 A, VGS = 0 V
b
--1.5V
TJ = 25 °C, IF = 31 A - 170 250
= 125 °C, dI/dt = 100 A/μs
T
J
TJ = 25 °C, IS = 31 A, VGS = 0 V
= 125 °C, dI/dt = 100 A/μs
T
J
b
b
b
- 220 330
- 570 860
-1.21.8
TJ = 25 °C - 7.9 12 A
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
while VDS is rising from 0 % to 80 % VDS.
oss
while VDS is rising from 0 % to 80 % VDS.
oss
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V
V/°C
S
pF
nC
ns
A
ns
nC
μC
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
VDS, Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
0.1
1
10
100
0.01
0.1
1
10
100
100
VGS
15 V
12 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Top
Bottom
5.0 V
20 μs PULSE WIDTH
TJ = 25 °C
VDS, Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
0.1
1
10
100
0.01
0.1
1
10
100
VGS
15 V
12 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Top
Bottom
5.0 V
20 μs PULSE WIDTH
TJ = 150 °C
TJ, Junction Temperature
R
DS(on)
, Drain-to-Source On Resistance (Normalized)
- 60
- 20
- 40
0
20
40
60
80
100
120
140
160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
ID = 31 A
VGS = 10 V
Fig. 1 - Typical Output Characteristics
IRFP31N50L, SiHFP31N50L
Vishay Siliconix
1000
100
TJ = 150 °C
10
TJ = 25 °C
, Drain-to-Source Current (A)
1
D
I
VDS = 50 V
0.1
54
6810
VGS, Gate-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
20 μs PULSE WIDTH
7
911
Document Number: 91220 www.vishay.com
S11-0488-Rev. C, 21-Mar-11 3
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
Fig. 2 - Typical Output Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
This datasheet is subject to change without notice.
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