Vishay IRFD224, SiHFD224 Data Sheet

Power MOSFET

HVMDIP

D

S

G

RoHS

COMPLIANT

IRFD224, SiHFD224

Vishay Siliconix

PRODUCT SUMMARY

VDS (V) 250

R

()V

DS(on)

Q

(Max.) (nC) 14

g

Q

(nC) 2.7

gs

Q

(nC) 7.8

gd

Configuration Single

= 10 V 1.1

GS

FEATURES

• Dynamic dV/dt Rating

• Repetitive Avalanche Rated

• For Automatic Insertion

•End Stackable

•Fast Switching

• Ease of Paralleling

• Simple Drive Requirements

D

• Compliant to RoHS Directive 2002/95/EC

DESCRIPTION

Third generation Power MOSFETs from Vishay provide the

G

designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertiable

S

N-Channel MOSFET

case style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain serveres as a
thermal link to the mounting surface for power dissipation
levels up to 1 W.

ORDERING INFORMATION

Package HVMDIP

Lead (Pb)-free

IRFD224PbF
SiHFD224-E3

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT

Drain-Source Voltage V

Gate-Source Voltage V

= 25 °C

T

Continuous Drain Current V

Pulsed Drain Current

a

at 10 V

GS

A

= 100 °C 0.40

A

DS

± 20

GS

I

D

IDM 5.0

Linear Derating Factor 0.0083 W/°C

Single Pulse Avalanche Energy

Avalanche Current

a

Repetitive Avalanche Energy

Maximum Power Dissipation T

Peak Diode Recovery dV/dt

b

a

= 25 °C P

A

c

Operating Junction and Storage Temperature Range T

E

AS

I

AR

E

AR

D

dV/dt 4.8 V/ns

, T

J

stg

Soldering Recommendations (Peak Temperature) for 10 s 300

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V

= 50 V, starting TJ = 25 °C, L = 15 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).

DD

 4.4 A, dI/dt  90 A/μs, VDD  VDS, TJ  150 °C.

c. I

SD

d. 1.6 mm from case.

250

0.63

60 mJ

0.63 A

0.10 mJ

1.0 W

- 55 to + 150

d

V

AT

°C

Document Number: 91132 www.vishay.com
S10-2462-Rev. C, 08-Nov-10 1

IRFD224, SiHFD224

Vishay Siliconix

THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL TYP. MAX. UNIT

Maximum Junction-to-Ambient R

thJA

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

Static

Drain-Source Breakdown Voltage V

Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.36 - V/°C

V

DS

Gate-Source Threshold Voltage V

Gate-Source Leakage I

Zero Gate Voltage Drain Current I

Drain-Source On-State Resistance R

Forward Transconductance g

Dynamic

Input Capacitance C

Reverse Transfer Capacitance C

Total Gate Charge Q

Gate-Drain Charge Q

Turn-On Delay Time t

Rise Time t

Turn-Off Delay Time t

Fall Time t

Internal Drain Inductance L

Internal Source Inductance L

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current I

Pulsed Diode Forward Current

a

Body Diode Voltage V

Body Diode Reverse Recovery Time t

Body Diode Reverse Recovery Charge Q

Forward Turn-On Time t

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width  300 μs; duty cycle  2 %.

DS

GS(th)

V

GSS

DSS

VGS = 10 V ID = 0.38 A

DS(on)

fs

iss

-77-

oss

-15-

rss

g

--2.7

gs

--7.8

gd

d(on)

r

-20-

d(off)

-12-

f

D

V

V

GS

R

Between lead,
6 mm (0.25") from
package and center of

S

S

die contact

MOSFET symbol
showing the

integral reverse

I

SM

SD

rr

rr

on

p - n junction diode

TJ = 25 °C, IS = 0.63 A, VGS = 0 V

TJ = 25 °C, IF = 4.4 A, dI/dt = 100 A/μs

- 120 °C/W

VGS = 0 V, ID = 250 μA 250 - - V

VDS = VGS, ID = 250 μA 2.0 - 4.0 V

= ± 20 V - - ± 100 nA

GS

VDS = 250 V, VGS = 0 V - - 25

= 200 V, VGS = 0 V, TJ = 125 °C - - 250

DS

b

--1.1

VDS = 50 V, ID = 2.6 A 1.5 - - S

VGS = 0 V,

V

= 25 V,

DS

f = 1.0 MHz, see fig. 5

- 260 -

--14

= 4.4 A, VDS = 200 V,

I

= 10 V

D

see fig. 6 and 13

b

-7.0-

V

= 125 V, ID = 4.4 A,

DD

= 18 , RD = 28 , see fig. 10

g

G

G

b

D

S

D

S

b

-13-

-4.0-

-6.0-

- - 0.63

--5.0

--1.8V

- 200 400 ns

b

- 0.93 1.9 μC

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

μA

pFOutput Capacitance C

nC Gate-Source Charge Q

ns

nH

A

www.vishay.com Document Number: 91132
2 S10-2462-Rev. C, 08-Nov-10

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

TA = 25 °C

TA = 150 °C

IRFD224, SiHFD224

Vishay Siliconix

Fig. 1 - Typical Output Characteristics, TA = 25 °C

Fig. 2 - Typical Output Characteristics, T

= 150 °C

A

Fig. 3 - Typical Transfer Characteristics

Fig. 4 - Normalized On-Resistance vs. Temperature

Document Number: 91132 www.vishay.com
S10-2462-Rev. C, 08-Nov-10 3