Available
RoHS*
COMPLIANT
IRFB17N50L, SiHFB17N50L
Power MOSFET
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) 500
R
()V
DS(on)
Q
(Max.) (nC) 130
g
Q
(nC) 33
gs
Q
(nC) 59
gd
Configuration Single
= 10 V 0.28
GS
D
FEATURES
• Low Gate Charge Qg results in Simple Drive
Requirement
• Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
• Fully Characterized Capacitance and Avalanche Voltage
and Current
•Low t
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
G
S
N-Channel MOSFET
• Switch Mode Power Supply (SMPS)
• Uninterruptible Power Supply
• High Speed Power Switching
• ZVS and High Frequency Circuit
• PWM Inverters
ORDERING INFORMATION
Package TO-220AB
Lead (Pb)-free
SnPb
IRFB17N50LPbF
SiHFB17N50L-E3
IRFB17N50L
SiHFB17N50L
and Soft Diode Recovery
rr
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
T
= 25 °C
Continuous Drain Current V
Pulsed Drain Current
a
at 10 V
GS
C
= 100 °C 11
C
DS
± 30
GS
I
D
IDM 64
Linear Derating Factor 1.8 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
b
a
a
= 25 °C P
c
C
Operating Junction and Storage Temperature Range T
E
AS
I
AR
E
AR
D
dV/dt 13 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Mounting Torque 6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
c. I
SD
= 25 °C, L = 3.0 mH, Rg = 25 , IAS = 16 A (see fig. 12).
J
16 A, dI/dt 347 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91098 www.vishay.com
S11-0514-Rev. B, 21-Mar-11 1
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
500
16
390 mJ
16 A
22 mJ
220 W
- 55 to + 150
d
10 lbf · in
1.1 N · m
www.vishay.com/doc?91000
V
AT
°C
IRFB17N50L, SiHFB17N50L
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Maximum Junction-to-Case (Drain) R
thJA
thCS
thJC
-62
0.50 -
-0.56
°C/WCase-to-Sink, Flat, Greased Surface R
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
V
Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.6 - V/°C
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
DS
GS(th)
V
GSS
DSS
VGS = 10 V ID = 9.9 A
DS(on)
fs
Dynamic
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Output Capacitance C
Effective Output Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
iss
- 325 -
oss
-37-
rss
oss
eff. VGS = 0 V VDS = 0 V to 400 V
oss
g
--33
gs
--59
gd
d(on)
r
-50-
d(off)
-28-
f
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Reverse Recovery Current I
Forward Turn-On Time t
S
I
SM
SD
rr
RRM
on
rr
MOSFET symbol
showing the
integral reverse
p - n junction diode
T
T
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
www.vishay.com Document Number: 91098
2 S11-0514-Rev. B, 21-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
VGS = 0 V, ID = 250 μA 500 - - V
VDS = VGS, ID = 250 μA 3.0 - 5.0 V
= ± 30 V - - ± 100 nA
GS
VDS = 500 V, VGS = 0 V - - 50 μA
V
= 400 V, VGS = 0 V, TJ = 125 °C - - 2.0 mA
DS
b
VDS = 50 V, ID = 9.9 A
b
VGS = 0 V,
V
= 25 V,
DS
f = 1.0 MHz, see fig. 5
= 0 V VDS = 1.0 V , f = 1.0 MHz - 3690 -
V
GS
V
= 0 V VDS = 400 V , f = 1.0 MHz - 84 -
GS
c
- 0.28 0.32
11 - - S
- 2760 -
- 159 -
- - 130
= 16 A, VDS = 400 V,
I
V
GS
= 10 V
D
see fig. 6 and 13
b
-21-
= 250 V, ID = 16 A,
V
DD
R
= 7.5 , see fig. 10
g
TJ = 25 °C, IS = 16 A, VGS = 0 V
b
D
G
S
b
TJ = 25 °C
= 125 °C - 220 330
J
TJ = 25 °C - 470 710
= 125 °C - 810 1210
J
= 16 A, dI/dt = 100 A/μs
I
F
-51-
--16
--64
--1.5V
- 170 250
b
-7.311A
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
www.vishay.com/doc?91000
pF
nC Gate-Source Charge Q
ns
A
ns
nC
VDS, Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
0.1
1
10
100
0.01
0.1
1
10
100
VGS
15 V
12 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Top
Bottom
5.0 V
20 μs PULSE WIDTH
TJ = 25 °C
I
D
, Drain-to-Source Current (A)
0.1
1
10
100
VDS, Drain-to-Source Voltage (V)
0.1
1
10
100
VGS
15 V
12 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom
Top
5.0 V
20 μs PULSE WIDTH
TJ = 125 °C
VDS = 50 V
20 μs PULSE WIDTH
TJ = 25 °C
TJ = 150 °C
5.0
4.0
7.0
6.0
8.0
9.0
10.0
0.1
1
10
100
VGS, Gate-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
IRFB17N50L, SiHFB17N50L
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Fig. 1 - Typical Output Characteristics
Vishay Siliconix
Fig. 3 - Typical Transfer Characteristics
3.0
ID = 16 A
2.5
2.0
1.5
1.0
0.5
, Drain-to-Source On Resistance (Normalized)
80
VGS = 10 V
100
120
140
160
DS(on)
R
0.0
- 60
- 40
- 20
60
40
0
20
TJ, Junction Temperature
Fig. 2 - Typical Output Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91098 www.vishay.com
S11-0514-Rev. B, 21-Mar-11 3
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
www.vishay.com/doc?91000