Vishay IRF9630, SiHF9630 Data Sheet

www.vishay.com
S
G
D
P-Channel MOSFET
TO-220AB
G
D
S
IRF9630, SiHF9630
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V) -200
R
max. ()V
DS(on)
Q
max. (nC) 29
g
Q
(nC) 5.4
gs
Q
(nC) 15
gd
Configuration Single
= -10 V 0.80
GS
FEATURES
• Dynamic dV/dt rating
• Repetitive avalanche rated
•P-channel
• Fast switching
• Ease of paralleling
• Simple drive requirements
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Note
*
Thi s datasheet pro vi des information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details.
DESCRIPTION
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220AB contribute to its wide acceptance throughout the industry.
ORDERING INFORMATION
Package TO-220AB
Lead (Pb)-free
SnPb
IRF9630PbF
SiHF9630-E3
IRF9630
SiHF9630
Available
Available
  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
T
= 25 °C
Continuous Drain Current V
Pulsed Drain Current
a
at -10 V
GS
C
= 100 °C -4.0
C
DS
± 20
GS
I
D
IDM -26
Linear Derating Factor 0.59 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range T
Soldering Recommendations (Peak temperature)
b
a
a
= 25 °C P
c
d
C
for 10 s 300
E
AS
I
AR
E
AR
D
dV/dt -5.0 V/ns
, T
J
stg
Mounting Torque 6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V
= -50 V, starting TJ = 25 °C, L = 17 mH, Rg = 25 , IAS = -6.5 A (see fig. 12).
DD
c. I
-6.5 A, dI/dt 20 A/μs, VDD VDS, TJ 150 °C.
SD
d. 1.6 mm from case.
S16-0754-Rev. D, 02-May-16
1
For technical questions, contact: hvm@vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
-200
-6.5
500 mJ
-6.4 A
7.4 mJ
74 W
-55 to +150
10 lbf · in
1.1 N · m
Document Number: 91084
V
AT
°C
IRF9630, SiHF9630
www.vishay.com
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Maximum Junction-to-Case (Drain) R
thJA
thCS
thJC
-62
0.50 -
-1.7
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
V
Temperature Coefficient VDS/TJ Reference to 25 °C, ID = -1 mA - -0.24 - V/°C
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
DS
GS(th)
V
GSS
DSS
VGS = -10 V ID = -3.9 A
DS(on)
fs
Dynamic
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Internal Drain Inductance L
Internal Source Inductance L
Gate Input Resistance R
iss
- 200 -
oss
-40-
rss
g
--5.4
gs
--15
gd
d(on)
r
-28-
d(off)
-24-
f
D
S
g
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Forward Turn-On Time t
S
I
SM
SD
rr
rr
on
TJ = 25 °C, IF = -6.5 A, dI/dt = 100 A/μs
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 μs; duty cycle  2 %.
VGS = 0 V, ID = -250 μA -200 - - V
VDS = VGS, ID = -250 μA -2.0 - -4.0 V
= ± 20 V - - ± 100 nA
GS
VDS = -200 V, VGS = 0 V - - -100
= -160 V, VGS = 0 V, TJ = 125 °C - - -500
V
DS
VDS = -50 V, ID = -3.9 A
b
b
VGS = 0 V,
V
= -25 V,
DS
f = 1.0 MHz, see fig. 5
= -6.5 A,
I
D
V
= -10 V
GS
V
= -100 V, ID = -6.5 A,
DD
R
= 12 , RD = 15, see fig. 10
g
Between lead,
V
= -160 V,
DS
see fig. 6 and 13
b
b
D
6 mm (0.25") from package and center of die contact
G
S
f = 1 MHz, open drain 0.6 - 3.7
MOSFET symbol showing the integral reverse
p -n junction diode
TJ = 25 °C, IS = -6.5 A, VGS = 0 V
D
G
S
b
b
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Vishay Siliconix
°C/WCase-to-Sink, Flat, Greased Surface R
- - 0.80
2.8 - - S
- 700 -
--29
-12-
-27-
-4.5-
-7.5-
---6.5
---26
---6.5V
- 200 300 ns
-1.92.C
μA
pFOutput Capacitance C
nC Gate-Source Charge Q
ns
nH
A
S16-0754-Rev. D, 02-May-16
2
Document Number: 91084
For technical questions, contact: hvm@vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com
10
1
10
0
10
-1
10
0
10
1
- V, Drain-to-Source Voltage (V)
- I
D
, Drain Current (A)
Bottom
To p
V
GS
- 15 V
- 10 V
- 8.0 V
- 7.0 V
- 6.0 V
- 5.5 V
- 5.0 V
- 4.5 V
20 µs Pulse Width T
C
= 150 °C
91084_02
- 4.5 V
10
-1
I
D
= - 6.5 A
V
GS
= - 10 V
3.0
0.0
0.5
1.0
1.5
2.0
2.5
T
J
,
Junction Temperature (°C)
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
91084_04
- 60 - 40 - 20 0 20 40 6080100 120 140 160
1200
1000
800
600
0
200
400
10
0
10
1
Capacitance (pF)
- V
DS
,
Drain-to-Source Voltage (V)
C
iss
C
rss
C
oss
V
GS
= 0 V, f = 1 MHz
C
iss
= Cgs + Cgd, Cds Shorted
C
rss
= C
gd
C
oss
= Cds + C
gd
91084_05
QG, Total Gate Charge (nC)
- V
GS
, Gate-to-Source Voltage (V)
20
16
12
8
0
4
0
5
25
2015
10
V
DS
= - 40 V
V
DS
= - 100 V
For test circuit see figure 13
V
DS
= - 160 V
91084_06
ID = - 6.5 A
30
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
V
GS
- 15 V
- 10 V
- 8.0 V
- 7.0 V
- 6.0 V
- 5.5 V
- 5.0 V
- 4.5 V
20 µs Pulse Width
= 25 °C
T
C
0
10
1
10
- VDS, Drain-to-Source Voltage (V)
- 4.5 V
1
10
0
10
, Drain Current (A)
D
- I
-1
10
10
91084_01
To p
Bottom
-1
IRF9630, SiHF9630
Vishay Siliconix
Fig. 1 - Typical Output Characteristics, TC = 25 °C
Fig. 2 - Typical Output Characteristics, T
1
10
25 °C
150 °C
= 150 °C
C
Fig. 4 - Normalized On-Resistance vs. Temperature
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
, Drain Current (A)
D
- I
91084_03
S16-0754-Rev. D, 02-May-16
0
10
4
5678910
- V
GS
Gate-to-Source Voltage (V)
,
20 µs Pulse Width V
= - 50 V
DS
Fig. 3 - Typical Transfer Characteristics
For technical questions, contact: hvm@vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
3
Document Number: 91084
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