Vishay IRF830AS, IRF830AL, SiHF830AS, SiHF830AL Data Sheet

D2PAK

(TO-263)

G

D

S

I2PAK

(

TO-262)

G

D

S

IRF830AS, IRF830AL, SiHF830AS, SiHF830AL

Vishay Siliconix

Power MOSFET

PRODUCT SUMMARY

VDS (V) 500

R

(Max.) ()V

DS(on)

Q

(Max.) (nC) 24

g

Q

(nC) 6.3

gs

Q

(nC) 11

gd

Configuration Single

= 10 V 1.40

GS

FEATURES

• Halogen-free According to IEC 61249-2-21
Definition

• Low Gate Charge Q
Requirement

• Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness

• Fully Characterized Capacitance and Avalanche Voltage

Results in Simple Drive

g

and Current

D

• Effective C

specified

oss

• Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

G

S

N-Channel MOSFET

• Switch Mode Power Supply (SMPS)

• Uninterruptible Power Supply

• High speed power switching

TYPICAL SMPS TOPOLOGIES

• Two Transistor Forward

• Half Bridge and Full Bridge

ORDERING INFORMATION

Package D2PAK (TO-263) D2PAK (TO-263) I2PAK (TO-262)

Lead (Pb)-free and Halogen-free SiHF830AS-GE3 SiHF830ASTRL-GE3

Lead (Pb)-free

IRF830ASPbF IRF830ASTRLPbF

SiHF830AS-E3 SiHF830ASTL-E3

a

a

a

SiHF830AL-GE3

IRF830ALPbF

SiHF830AL-E3

a

Note

a. See device orientation.

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT

Drain-Source Voltage V
Gate-Source Voltage V

T

= 25 °C

Continuous Drain Current V

Pulsed Drain Current

a, e

at 10 V

GS

C

= 100 °C 3.2

C

DS

± 30

GS

I

D

IDM 20

Linear Derating Factor 0.59 W/°C

c, e

b, e

a

T

= 25 °C

A

= 25 °C 74

T

C

Single Pulse Avalanche Energy
Avalanche Current

a

Repetiitive Avalanche Energy

Maximum Power Dissipation

Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range T

E

AS

I

AR

E

AR

P

D

dV/dt 5.3 V/ns

, T

J

stg

Soldering Recommendations (Peak Temperature) for 10 s 300

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
c. I

SD

d. 1.6 mm from case.
e. Uses SiHF830A data and test conditions.

= 25 °C, L = 18 mH, Rg = 25 , IAS = 5.0 A (see fig. 12).

J

 5.0 A, dI/dt  370 A/μs, VDD  VDS, TJ  150 °C.

500

5.0

230 mJ

5.0 A

7.4 mJ

3.1

- 55 to + 150

d

V

AT

W

°C

* Pb containing terminations are not RoHS compliant, exemptions may apply

Document Number: 91062
S11-1049-Rev. C, 30-May-11 1

www.vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

IRF830AS, IRF830AL, SiHF830AS, SiHF830AL

Vishay Siliconix

THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL TYP. MAX. UNIT

Maximum Junction-to-Ambient
(PCB Mounted, Steady-State)

a

Maximum Junction-to-Case (Drain) R

Note

a. When mounted on 1" square PCB (FR-4 or G-10 material).

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

Static

Drain-Source Breakdown Voltage V

V

Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA

DS

Gate-Source Threshold Voltage V

Gate-Source Leakage I

Zero Gate Voltage Drain Current I

Drain-Source On-State Resistance R

Forward Transconductance g

Dynamic

Input Capacitance C

Reverse Transfer Capacitance C

Output Capacitance C

Effective Output Capacitance C

Total Gate Charge Q

Gate-Drain Charge Q

Turn-On Delay Time t

Rise Time t

Turn-Off Delay Time t

Fall Time t

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current I

Pulsed Diode Forward Current

Body Diode Voltage V

Body Diode Reverse Recovery Time t

Body Diode Reverse Recovery Charge Q

Forward Turn-On Time t

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width  300 μs; duty cycle  2 %.
c. C

eff. is a fixed capacitance that gives the same charging time as C

oss

d. Uses SiHF830A data and test conditions.

www.vishay.com Document Number: 91062
2 S11-1049-Rev. C, 30-May-11

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

a

R

thJA

thJC

DS

GS(th)

V

GSS

-40

-1.7

VGS = 0, ID = 250 μA 500 - - V

d

-0.60-V/°C

VDS = VGS, ID = 250 μA 2.0 - 4.5 V

= ± 30 V - - ± 100 nA

GS

VDS = 500 V, VGS = 0 V - - 25

DSS

VGS = 10 V ID = 3.0 A

DS(on)

fs

iss

-93-

oss

-4.3-

rss

oss

eff. VDS = 0 V to 400 V

oss

g

--6.3

gs

--11

gd

d(on)

r

-21-

d(off)

-15-

f

S

I

SM

SD

rr

rr

on

V

= 400 V, VGS = 0 V, TJ = 125 °C - - 250

DS

VDS = 50 V, ID = 3.0 A

f = 1.0 MHz, see fig. 5

V

= 0 V

GS

b

d

VGS = 0 V,

V

= 25 V,

DS

V

= 1.0 V, f = 1.0 MHz - 886 -

DS

= 400 V, f = 1.0 MHz - 27 -

V

DS

d

c, d

--1.4

2.8 - - S

- 620 -

-39-

--24

= 5.0 A, VDS = 400 V,

I

V

GS

= 10 V

D

see fig. 6 and 13

b, d

-10-

V

= 250 V, ID = 5.0 A,

DD

R

= 14 , RD = 49 , see fig. 10

g

b, d

MOSFET symbol
showing the
integral reverse

G

p - n junction diode

TJ = 25 °C, IS = 5.0 A, VGS = 0 V

b

TJ = 25 °C, IF = 5.0 A, dI/dt = 100 A/μs

D

S

b, d

-21-

--5.0

--20

--1.5V

- 430 650 ns

-2.03.0μC

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

while VDS is rising from 0 to 80 % VDS.

oss

This document is subject to change without notice.

www.vishay.com/doc?91000

°C/W

μA

pFOutput Capacitance C

nC Gate-Source Charge Q

ns

A

91062_01

Bottom

To p

V

GS

15 V
10 V

8.0 V

7.0 V

6.0 V

5.5 V

5.0 V

4.5 V

20 µs Pulse Width
T

J

= 25 °C

4.5 V

VDS, Drain-to-Source Voltage (V)

I

D

, Drain-to-Source Current (A)

10

10

2

10

10

-2

1

0.1

0.1 1 10

2

V

DS

,

Drain-to-Source Voltage (V)

I

D

, Drain-to-Source Current (A)

Bottom

To p

V

GS

15 V
10 V

8.0 V

7.0 V

6.0 V

5.5 V

5.0 V

4.5 V

20 µs Pulse Width
T

J

= 150 °C

91062_02

4.5 V

10

2

10

1

0.1
10110

2

I

D

= 5.0 A

V

GS

= 10 V

0.0

0.5

1.0

1.5

2.0

2.5

T

J

,

Junction Temperature (°C)

R

DS(on)

, Drain-to-Source On Resistance

(Normalized)

91062_04

- 60 - 40 - 20 0 20 40 60 80 100 120 140 160

IRF830AS, IRF830AL, SiHF830AS, SiHF830AL

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Vishay Siliconix

2

10

Fig. 1 - Typical Output Characteristics

10

1

, Drain-to-Source Current (A)

D

I

0.1

91062_03

TJ = 150 °C

5.0 6.0 7.0 8.04.0

V

GS

Fig. 3 - Typical Transfer Characteristics

TJ = 25 °C

20 µs Pulse Width

= 50 V

V

DS

Gate-to-Source Voltage (V)

,

Document Number: 91062 www.vishay.com
S11-1049-Rev. C, 30-May-11 3

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

Fig. 2 - Typical Output Characteristics

This document is subject to change without notice.

Fig. 4 - Normalized On-Resistance vs. Temperature

www.vishay.com/doc?91000