Vishay IRF740, SiHF740 Data Sheet
TO-220AB
G
D
S
Available
RoHS*
COMPLIANT
Power MOSFET
IRF740, SiHF740
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) 400
R
(Ω)V
DS(on)
Q
(Max.) (nC) 63
g
Q
(nC) 9.0
gs
Q
(nC) 32
gd
Configuration Single
= 10 V 0.55
GS
D
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
•Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
G
cost-effectiveness.
The TO-220AB package is universally preferred for all
commercial-industrial applications at power dissipation
S
N-Channel MOSFET
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220AB contribute to its
wide acceptance throughout the industry.
ORDERING INFORMATION
Package TO-220AB
Lead (Pb)-free
SnPb
IRF740PbF
SiHF740-E3
IRF740
SiHF740
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
T
= 25 °C
Continuous Drain Current V
Pulsed Drain Current
a
at 10 V
GS
C
= 100 °C 6.3
C
DS
GS
I
D
IDM 40
Linear Derating Factor 1.0 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range T
b
a
a
= 25 °C P
c
C
E
AS
I
AR
E
AR
D
dV/dt 4.0 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Mounting Torque 6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
= 50 V, starting TJ = 25 °C, L = 9.1 mH, Rg = 25 Ω, IAS = 10 A (see fig. 12).
DD
c. I
≤ 10 A, dI/dt ≤ 120 A/μs, VDD ≤ VDS, TJ ≤ 150 °C.
SD
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91054 www.vishay.com
S11-0507-Rev. C, 21-Mar-11 1
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
400
± 20
10
520 mJ
10 A
13 mJ
125 W
- 55 to + 150
d
10 lbf · in
1.1 N · m
www.vishay.com/doc?91000
V
AT
°C
IRF740, SiHF740
D
S
G
S
D
G
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Maximum Junction-to-Case (Drain) R
thJA
thCS
thJC
-62
0.50 -
-1.0
°C/WCase-to-Sink, Flat, Greased Surface R
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
Temperature Coefficient ΔVDS/TJ Reference to 25 °C, ID = 1 mA - 0.49 -
V
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
DS
GS(th)
V
GSS
DSS
V
DS(on)
fs
Dynamic
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Internal Drain Inductance L
Internal Source Inductance L
iss
- 330 -
oss
- 120 -
rss
g
--9.0
gs
--32
gd
d(on)
r
-50-
d(off)
-24-
f
D
Between lead,
6 mm (0.25") from
package and center of
S
die contact
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Forward Turn-On Time t
S
I
SM
SD
rr
rr
on
MOSFET symbol
showing the
integral reverse
p - n junction diode
TJ = 25 °C, IF = 10 A, dI/dt = 100 A/μs
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
VGS = 0 V, ID = 250 μA 400 - -
VDS = VGS, ID = 250 μA 2.0 -
= ± 20 V - -
GS
VDS = 400 V, VGS = 0 V - -
= 320 V, VGS = 0 V, TJ = 125 °C - -
V
DS
= 10 V ID = 6.0 A
GS
VDS = 50 V, ID = 6.0 A
VGS = 0 V,
= 25 V,
V
DS
b
b
--
5.8 - -
- 1400 -
4.0 V
± 100 nA
25
250
0.55 Ω
f = 1.0 MHz, see fig. 5
--63
= 10 A, VDS = 320 V,
I
V
GS
= 10 V
D
see fig. 6 and 13
b
-14-
V
= 200 V, ID = 10 A
DD
R
= 9.1 Ω, RD = 20 Ω, see fig. 10
g
b
-27-
-4.5-
-7.5-
--10
--40
TJ = 25 °C, IS = 10 A, VGS = 0 V
b
--
-
b
-
2.0 V
370 790 ns
3.8 8.2 μC
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
V
V/°C
μA
S
pFOutput Capacitance C
nC Gate-Source Charge Q
ns
nH
A
www.vishay.com Document Number: 91054
2 S11-0507-Rev. C, 21-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
www.vishay.com/doc?91000
VDS, Drain-to-Source Voltage (V)
I
D
, Drain Current (A)
91054_01
Bottom
To p
V
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
4.5 V
20 µs Pulse Width
T
C
= 25 °C
4.5 V
10
1
10
0
10
-1
10
0
10
1
IRF740, SiHF740
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
91054_03
Fig. 1 - Typical Output Characteristics, TC = 25 °C
1
10
0
10
, Drain Current (A)
D
I
-1
10
4
Fig. 3 - Typical Transfer Characteristics
Vishay Siliconix
150 °C
25 °C
20 µs Pulse Width
V
= 50 V
DS
5678910
V
Gate-to-Source Voltage (V)
,
GS
3.0
ID= 10 A
V
= 10 V
GS
2.5
2.0
1.5
ormalized)
(N
1.0
, Drain-to-Source On Resistance
0.5
DS(on)
0.0
R
- 60 - 40 - 20 0 20 40 60 80 100 120 140 160
T
Junction Temperature (°C)
91054_04
,
J
Fig. 4 - Normalized On-Resistance vs. Temperature
V
To p
1
10
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom
4.5 V
0
10
, Drain Current (A)
D
I
91054_02
-1
10
V
DS
0
10
Drain-to-Source Voltage (V)
,
Fig. 2 - Typical Output Characteristics, T
4.5 V
20 µs Pulse Width
= 150 °C
T
C
1
10
= 150 °C
C
Document Number: 91054 www.vishay.com
S11-0507-Rev. C, 21-Mar-11 3
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This datasheet is subject to change without notice.
www.vishay.com/doc?91000
Loading...