VISHAY Si7900EDN Technical data

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Si7900EDN
Dual N-Channel 20-V (D-S) MOSFET, Common Drain
PRODUCT SUMMARY
V
(V) r
DS
20
3.30 mm 3.30 mm
D
8
D
7
6
DS(on)
0.026 @ VGS = 4.5 V 9
0.031 @ VGS = 2.5 V 8
0.039 @ VGS = 1.8 V 7
PowerPAKt 1212-8
D
D
5
Bottom View
(W) I
S1
1
G1
2
S2
3
G2
4
New Product
(A)
D
2.4 kW
G
1
N-Channel N-Channel
Vishay Siliconix
FEATURES
D TrenchFETr Power MOSFETS: 1.8-V Rated D New PowerPakt Package
– Low-Thermal Resistance, R – Low 1.07-mm Profile
D 3000-V ESD Protection
APPLICATIONS
D
G
2
S
1
2.4 kW
thJC
D
S
2
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol 10 secs Steady State Unit
Drain-Source Voltage V Gate-Source Voltage V
a
Continuous Drain Current (TJ = 150_C)
Pulsed Drain Current I Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range TJ, T
_
a
a
TA = 25_C 9 6 TA = 85_C
TA = 25_C 3.2 1.5 TA = 85_C
P
I
DM
I
DS GS
D
S
D
stg
6.4 4.3
2.9 1.4
1.7 0.79
20
"12
30
–55 to 150 _C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
Maximum Junction-to-Case Steady State R
Notes a. Surface Mounted on 1” x 1” FR4 Board.
a
t v 10 sec 30 38
Steady State
R
thJA
thJC
65 82
1.9 2.4
V
A
W
_C/W
Document Number: 71425 S-03369—Rev. A, 02-Apr-01
www.vishay.com
1
Si7900EDN
W
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Test Condition Min Typ Max Unit
Static
Gate Threshold Voltage V
Gate-Body Leakage I
Zero Gate Voltage Drain Current I
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance Diode Forward Voltage
Dynamic
b
a
a
a
a
GS(th)
GSS
DSS
I
D(on)
r
DS(on)
DS(on)
g
V
fs
SD
VDS = VGS, I
= 250 mA 0.40 V
D
VDS = 0 V, VGS = "4.5 V
VDS = 0 V, VGS = "12 V
VDS = 16 V, VGS = 0 V 1
VDS = 16 V, VGS = 0 V, TJ = 85_C 20
VDS = 5 V, VGS = 4.5 V 20 A VGS = 4.5 V, ID = 6.5 A 0.021 0.026
VGS = 2.5 V, I VGS = 1.8 V, I
= 5.8 A
D
= 5.0 A
D
VDS = 10 V, ID = 6.5 A 25 S
IS = 1.5 A, VGS = 0 V 0.65 1.1 V
"1 mA
"10 mA
0.025 0.031
0.031 0.039
mA
W
Total Gate Charge Q Gate-Source Charge Q Gate-Drain Charge Q Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
d(on)
d(off)
g
V
gs gd
r
f
= 10 V, VGS = 4.5 V, ID = 6.5 A 2.7 nC
DS
VDD = 10 V, RL = 10 W
VDD = 10 V, RL = 10
ID ^ 1 A, V
= 4.5 V, RG = 6 W
GEN
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate-Current vs. Gate-Source Voltage
8
6
4
– Gate Current (mA)I
GSS
2
mA)
– Gate Current (I
GSS
10,000
1,000
100
0.1
12.5 18
2.7
0.7 1.0
1.3 2.0
5.5 8.0
ms
4.6 7.0
Gate Current vs. Gate-Source V oltage
TJ = 150_C
10
1
TJ = 25_C
0
0 3 6 9 12 15 18
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2
VGS – Gate-to-Source Voltage (V)
0.01
V
– Gate-to-Source Voltage (V)
GS
Document Number: 71425
S-03369Rev. A, 02-Apr-01
150 36912
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