Si4852DY
Continuous Drain Current (T J = 150 C)
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V
(V) r
DS
30
0.0120 @ VGS = 10 V 11
0.0175 @ VGS = 4.5 V 9.5
(W ) I
DS(on)
(A)
D
FEATURES
D LITTLE FOOT r Plus
D 100% R
Tested
g
SCHOTTKY PRODUCT SUMMARY
SO-8
Top View
VSD (v)
8
7
6
5
I
(A)
F
D
D
D
G
S
N-Channel MOSFET
Schottky Diode
V
(V)
DS
30 0.53 V @ 3 A 4
SD
S
SD
G
Ordering Information: Si4852DY
Diode Forward Voltage
1
2
3
4
Si4852DY-T1 (with Tape and Reel)
ABSOLUTE MAXIMUM RATINGS (TA = 25_ C UNLESS OTHERWISE NOTED)
Parameter Symbol 10 secs Steady State Unit
Drain-Source Voltage (MOSFET) V
Reverse Voltage (Schottky) V
Gate-Source Voltage V
Continuous Drain Current (TJ = 150_C
(MOSFET)
Pulsed Drain Current (MOSFET) I
Continuous Source Current (MOSFET Diode Conduction)
Average Foward Current (Schottky) I
Pulsed Foward Current (Schottky) I
Maximum Power Dissipation (MOSFET)
Maximum Power Dissipation (Schottky)
Operating Junction and Storage Temperature Range TJ, T
a
a
a
TA = 25_C
TA = 70_C
a
TA = 25_C 2.5 1.47
TA = 70_C
TA = 25_C
TA = 70_C 1.45 0.88
P
I
DM
I
FM
DS
DA
GS
D
S
F
D
stg
11 8.7
9.0 7.0
2.3 1.3
4.0 2.5
1.6 0.94
2.27 1.38
30
30
"20
50
50
-55 to 150 _C
V
A
W
THERMAL RESISTANCE RATINGS
Maximum Junction-to-Ambient
Maximum Junction-to-Foot (Drain) Steady-State R
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71307
S-31726—Rev. D, 18-Aug-03
Parameter Symbol
a
t v 10 sec
Steady-State
MOSFET Schottky
Typ Max Typ Max
R
thJA
thJF
40 50 45 55
72 85 75 90
18 22 20 25
Unit
_ C/W
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1
Si4852DY
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_ C UNLESS OTHERWISE NOTED).
Parameter Symbol Test Condition Min TypaMax Unit
Static
Gate Threshold Voltage V
Gate-Body Leakage I
Zero Gate Voltage Drain Current I
On-State Drain Current
b
Drain-Source On-State Resistance
Forward Transconductance
b
Schottky Diode Forward Voltage
Dynamic
a
Total Gate Charge Q
Gate-Source Charge Q
Gate-Drain Charge Q
Gate Resistance R
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Source-Drain Reverse Recovery Time t
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v
300 m s, duty cycle v 2%.
GS(th)
GSS
DSS
I
D(on)
r
DS(on)
g
V
d(on)
d(off)
fs
SD
g
gs
gd
g
r
f
rr
VDS = VGS, I
VDS = 0 V, V
= 250 mA 1 V
D
= "20 V "100 nA
GS
VDS = 24 V, VGS = 0 V 0.007 0.100
VDS = 24 V, VGS = 0 V, TJ = 100_C 1.5 10
VDS = 24 V, VGS = 0 V, TJ = 125_C 6.5 20
V
5 V, VGS = 10 V 20 A
w
DS
VGS = 10 V, ID = 11 A 0.0100 0.0120
VGS = 4.5 V, ID = 9.5 A 0.0145 0.0175
VDS = 15 V, ID = 11 A 28 S
IS = 3.0 A, VGS = 0 V 0.485 0.53
IS = 3.0 A, VGS = 0 V, TJ = 125_C 0.416 0.47
V
= 15 V, V GS = 5 V, ID = 11 A
DS
VDD = 15 V, RL = 15 W
ID ^ 1 A, V
= 10 V, RG = 6 W
GEN
IF = 3.o A, di/dt = 100 A/ms 40 70
24 35
9
7.5
0.5 2.6 W
17 30
10 20
60 100
18 30
mA
W
V
nC
ns
SCHOTTKY SPECIFICATIONS (TJ = 25_ C UNLESS OTHERWISE NOTED)
Parameter Symbol Test Condition Min Typ Max Unit
Forward Voltage Drop V
Maximum Reverse Leakage Current I
Junction Capacitance C
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2
F
rm
T
IF = 3.0 A 0.485 0.53
IF = 3.0 A, TJ = 125_C 0.416 0.47
Vr = 24 V 0.007 0.100
Vr = 24 V, TJ = 100_C 1.5 10
Vr = -24 V, TJ = 125_C 6.4 20
Vr = 10 V
V
mA
115 pF
Document Number: 71307
S-31726—Rev. D, 18-Aug-03
TYPICAL CHARACTERISTICS (25_ C UNLESS NOTED)
Si4852DY
Vishay Siliconix
- Drain Current (A) I
D
W )
- On-Resistance ( r
DS(on)
40
Output Characteristics Transfer Characteristics
VGS = 10 thru 4 V
32
24
16
8
2 V
0
024681 0
VDS - Drain-to-Source Voltage (V)
0.020
0.016
0.012
0.008
0.004
On-Resistance vs. Drain Current
VGS = 4.5 V
3 V
VGS = 10 V
50
40
30
20
- Drain Current (A) I
D
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
4200
3500
2800
2100
1400
C - Capacitance (pF)
700
TC = 125_C
25_ C
VGS - Gate-to-Source Voltage (V)
Capacitance
C
iss
C
oss
C
-55_C
rss
0.000
0 8 16 24 32 40
10
VDS = 15 V
I
= 9.8 A
D
8
6
4
- Gate-to-Source Voltage (V)
GS
2
V
0
0 9 18 27 36 45
Document Number: 71307
S-31726—Rev. D, 18-Aug-03
ID - Drain Current (A)
Gate Charge
Qg - Total Gate Charge (nC)
W )
(Normalized)
- On-Resistance ( r
DS(on)
0
0 6 12 18 24 30
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Junction Temperature
1.8
1.6
1.4
1.2
1.0
0.8
0.6
VGS = 10 V
I
= 9.8 A
D
-50 - 25 0 25 50 75 100 125 150
T
- Junction Temperature (_C)
J
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Si4852DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_ C UNLESS NOTED)
Source-Drain Diode Forward Voltage
100
TJ = 150_C
10
TJ = 25_C
- Source Current (A) I
1
S
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
VSD - Source-to-Drain Voltage (V)
Reverse Current (Schottky)
30
10
1
0.1
0.01
- Reverse Curent (mA) I
R
0.001
30 V
10 V
20 V
On-Resistance vs. Gate-to-Source Voltage
0.05
0.04
W )
0.03
0.02
- On-Resistance (
DS(on)
r
0.01
0.00
024681 0
100
80
60
Power (W)
40
20
ID = 9.8 A
VGS - Gate-to-Source Voltage (V)
Single Pulse Power, Junction-to-Ambient
0.0001
0 2 55 07 51 0 0
2
1
0.1
Thermal Impedance
Normalized Effective Transient
0.01
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Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
-4
10
TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
-3
10
-2
10
125 150
-1
10
Square Wave Pulse Duration (sec)
0
0.001
0.01
1
Time (sec)
Notes:
P
DM
t
1
t
2
t
thJA
100
thJA
1
t
2
= 72_C/W
(t)
1. Duty Cycle, D =
2. Per Unit Base = R
3. TJM - TA = PDMZ
4. Surface Mounted
1 10 600
Document Number: 71307
S-31726—Rev. D, 18-Aug-03
10 0.1
TYPICAL CHARACTERISTICS (25_ C UNLESS NOTED)
Si4852DY
Vishay Siliconix
2
1
0.1
Thermal Impedance
Normalized Effective Transient
0.01
10
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
-4
Normalized Thermal Transient Impedance, Junction-to-Foot
-3
10
-2
10
Square Wave Pulse Duration (sec)
-1
11 0 10
Document Number: 71307
S-31726—Rev. D, 18-Aug-03
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Document Number: 91000 www.vishay.com
Revision: 08-Apr-05 1