Vishay Si2343DS Schematic [ru]

P-Channel 30-V (D-S) MOSFET
Si2343DS
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) R
- 30
DS(on)
0.053 at V
0.086 at V
GS
GS
(Ω)I
= - 10 V
= - 4.5 V
(A)
D
- 4.0
- 3.1
FEATURES
TrenchFET
®
Power MOSFET
APPLICATIONS
• Load Switch
• PA Switch
TO-236
(SOT-23)
G
1
3
D
2
S
Top V ie w
Si2343DS (F3)*
* Marking Code
Ordering Information: Si2343DS-T1
Si2343DS-T1-E3 (Lead (Pb)-free) Si2343DS-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol 5 s Steady State Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 150 °C)
J
a, b
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
a, b
a, b
Operating Junction and Storage Temperature Range
TA = 25 °C
= 70 °C
T
A
TA = 25 °C
= 70 °C
T
A
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
, T
J
stg
- 4.0 - 3.1
- 3.2 - 2.5
- 1.0 - 0.6
1.25 0.75
- 30
± 20
- 15
0.8 0.48
- 55 to 150 °C
V
A
W
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 5 s
Steady State 120 166
Maximum Junction-to-Foot (Drain) Steady State
Notes: a. Surface Mounted on 1" x 1" FR4 board. b. Pulse width limited by maximum junction temperature.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 72079 S09-0133-Rev. B, 02-Feb-09
R
thJA
R
thJF
75 100
°C/W
40 50
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Si2343DS
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions
Static
V
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-Resistance
Forward Transconductance
a
a
a
Diode Forward Voltage
Dynamic
b
Total Gate Charge
Gate-Drain Charge
Input Capacitance
Reverse Transfer Capacitance
Switching
c
Tur n -O n T im e
Turn-Off Time
V
(BR)DSS
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
V
Q
Q
Q
C
C
C
t
d(on)
t
d(off)
fs
SD
gs
gd
iss
oss
rss
t
r
t
f
g
V
DS
V
VDS = - 15 V, VGS = 0 V, f = 1 MHz
= 0 V, ID = - 250 µA
GS
V
= VGS, ID = - 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
= - 24 V, V
DS
= - 24 V, V
DS
V
GS
V
GS
GS
- 5 V, V
= - 10 V, ID = - 4.0 A
= - 4.5 V, ID = - 3.1 A
= 0 V
GS
= 0 V, TJ = 55 °C
= - 10 V
GS
VDS = - 5 V, ID = - 4.0 A
IS = - 1.0 A, V
V
= - 15 V, V
DS
V
I
D
- 4.0 A
I
D
= - 15 V, RL = 15 Ω
DD
- 1.0 A, V
R
G
GS
GEN
= 6 Ω
= 0 V
GS
= - 10 V
= - 10 V
Notes: a. Pulse test: PW 300 µs, duty cycle 2 %. b. For DESIGN AID ONLY, not subject to production testing. c. Switching time is essentially independent of operating temperature.
Min. Typ. Max.
- 30
- 1 - 3
± 100 nA
- 15 A
Limits
- 1
- 10
0.043 0.053
0.068 0.086
10 S
- 0.7 - 1.2 V
14 21
1.9
3.7
540
131
105
10 15
15 25
31 50
20 30
Unit
V
µA
Ω
nCGate-Source Charge
pFOutput Capacitance
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the de vice. These are stress rating s only, and functiona l operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 72079
S09-0133-Rev. B, 02-Feb-09
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si2343DS
Vishay Siliconix
15
VGS = 10 thru 5 V
12
9
6
- Drain Current (A)I
D
3
0
012345
0.12
0.10
0.08
0.06
- On-Resistance (Ω)
0.04
DS(on)
R
0.02
- Drain-to-Source Voltage (V)
V
DS
Output Characteristics
VGS = 4.5 V
VGS = 10 V
4 V
3 V
15
12
9
6
- Drain Current (A)I
D
3
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
- Gate-to-Source Voltage (V)
V
GS
TC = 125 °C
25 °C
Transfer Characteristics
1000
800
C
600
400
C - Capacitance (pF)
200
C
rss
C
oss
iss
- 55 °C
0.00 03691215
On-Resistance vs. Drain Current
10
VDS =15 V
= 4.0 A
I
D
8
6
4
- Gate-to-Source Voltage (V)
GS
2
V
0
03691215
Document Number: 72079 S09-0133-Rev. B, 02-Feb-09
ID - Drain Current (A)
Qg - Total Gate Charge (nC)
Gate Charge
0
0 5 10 15 20 25 30
VDS - Drain-to-Source Voltage (V)
Capacitance
1.6
VGS = 4.0 V I
= 4.0 A
D
- 50 - 25 0 25 50 75 100 125 150
T
- Junction Temperature (°C)
J
- On-ResistanceR
DS(on)
(Normalized)
1.4
1.2
1.0
0.8
0.6
On-Resistance vs. Junction Temperature
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