Vishay Si2308DS Schematic [ru]

N-Channel 60-V (D-S) MOSFET
Si2308DS
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) R
60
0.16 at V
0.22 at V
(Ω)I
DS(on)
GS
GS
= 10 V
= 4.5 V
D
(A)
2.0
1.7
FEATURES
• TrenchFET
100 % R
®
Power MOSFET
Tested
g
TO-236
(SOT-23)
G
1
D
3
S
2
Top View
Si2308DS (A8)*
* Marking Code
Ordering Information: Si2308DS-T1
Si2308DS-T1-E3 (Lead (Pb)-free) Si2308DS-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
Pulsed Drain Current
= 150 °C)
J
b
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
a
a
a
Operating Junction and Storage Temperature Range
TA = 25 °C
= 70 °C
T
A
TA = 25 °C
T
= 70 °C
A
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
, T
J
stg
60
± 20
2.0
1.6
10
1.0
1.25
0.80
W
- 55 to 150 °C
V
A
THERMAL RESISTANCE RATINGS
Parameter Symbol Maximum Unit
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
a
c
R
thJA
Notes: a. Surface Mounted on FR4 board, t 5 s. b. Pulse width limited by maximum junction temperature. c. Surface Mounted on FR4 board.
For SPICE model information via the Worldwide Web: www.vishay.com/www/product/spice.htm
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 70797 S09-0133-Rev. D, 02-Feb-09
100
166
°C/W
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Si2308DS
Vishay Siliconix
MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
Forward Transconductance
Diode Forward Voltage
a
a
V
(BR)DSS
V
GS(th)
I
GSS
I
DSS
I
D(on)
a
R
DS(on)
g
fs
V
SD
Dynamic
Total Gate Charge
Gate-Drain Charge
Gate Resistance
Input Capacitance
Reverse Transfer Capacitance
Q
g
Q
gs
Q
gd
R
g
C
iss
C
oss
C
rss
Switching
Tur n -O n De l ay Ti m e
Rise Time
Turn-Off Delay Time
Fall Time
t
d(on)
t
d(off)
t
r
t
f
Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 %.
VDS = 0 V, ID = 250 µA
V
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
V
DS
= 60 V, V
DS
= 60 V, V
V
V
GS
4.5 V, V
DS
4.5 V, V
DS
V
= 10 V, ID = 2.0 A
GS
V
= 4.5 V, ID = 1.7 A
GS
= 0 V
GS
= 0 V, TJ = 55 °C
= 10 V
GS
= 4.5 V
GS
VDS = 4.5 V, ID = 2.0 A
V
DS
IS = 1 A, V
= 30 V, V
= 0 V
GS
= 10 V, ID = 2.0 A
GS
VDS = 25 V, VGS = 0 V, f = 1 MHz
V
= 30 V, RL = 30 Ω
DD
1 A, V
I
D
= 4.5 V, Rg = 6 Ω
GEN
60
1.5 3.0
± 100 nA
0.5
10
µA
6
4
0.125 0.16
0.155 0.22
4.6 S
0.77 1.2 V
4.8 10
0.8
nCGate-Source Charge
1.0
0.5 3.3 Ω
240
50
15
715
10 20
17 35
615
V
A
Ω
pFOutput Capacitance
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the de vice. These are stress rating s only, and functiona l operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 70797
S09-0133-Rev. D, 02-Feb-09
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si2308DS
Vishay Siliconix
12
VGS = 10 thru 5 V
9
4 V
6
- Drain Current (A)I
D
3
3 V
0
0246810
V
- Drain-to-Source Voltage (V)
DS
1 V, 2 V
Output Characteristics
1.0
0.8
0.6
- On-Resistance (Ω)R
0.4
DS(on)
0.2
0.0 036912
VGS = 4.5 V
VGS = 10 V
ID - Drain Current (A)
On-Resistance vs. Drain Current
12
9
6
- Drain Current (A)I
D
3
TC = 125 °C
25 °C
0
012345
- Gate-to-Source Voltage (V)
V
GS
- 55 °C
Transfer Characteristics
400
300
C
iss
200
C - Capacitance (pF)
100
C
0
0 6 12 18 24 30
C
oss
rss
VDS - Drain-to-Source Voltage (V)
Capacitance
10
VDS = 30 V I
= 2.0 A
D
8
6
4
- Gate-to-Source Voltage (V)
GS
2
V
0
012345
Document Number: 70797 S09-0133-Rev. D, 02-Feb-09
Qg - Total Gate Charge (nC)
Gate Charge
2.0
1.8
1.6
1.4
1.2
- On-Resistance (Normalized)
DS(on)
1.0
R
0.8
0.6
VGS = 10 V I
= 2.0 A
D
- 50 - 25 0 25 50 75 100 125 150
T
- Junction Temperature (°C)
J
On-Resistance vs. Junction Temperature
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