Vishay Si1970DH Schematic

Si1970DH

New Product

Dual N-Channel 30-V (D-S) MOSFET

PRODUCT SUMMARY

VDS (V) r

30

0.225 at V

0.345 at V

DS(on)

(Ω)

GS

= 4.5 V

= 2.5 V

SOT-363

SC-70 (6-LEADS)

S

1

G

2

1

D

3

2

Top V iew

Ordering Information: Si1970DH-T1-E3 (Lead (Pb)-free)

D

6

1

5

G

2

S

4

2

I

(A)

D

1.3

a

Qg (Typ)

a

1.15 nC

a

M a rking Code

CD XX

Y Y

Lot Tr a ce ab ility a nd D a te Code

P a rt # Code

Vishay Siliconix

FEATURES

• TrenchFET® Power MOSFET

APPLICATIONS

• Load switch for portable applications

D

1

G

1

N-Ch a nnel MO S FET

S

1

G

D

2

S

2

N-Ch a nnel MO S FET

RoHS

COMPLIANT

ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted

Parameter Symbol Limit Unit

Drain-Source Voltage

Gate-Source Voltage

Continuous Drain Current (T

= 150 °C)

J

Pulsed Drain Current

Continuous Source-Drain Diode Current

Maximum Power Dissipation

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)

d, e

T

= 25 °C

C

= 70 °C

T

C

TA = 25 °C

TA = 70 °C

= 25 °C

T

C

= 25 °C

T

A

= 25 °C

T

C

= 70 °C

T

C

T

= 25 °C

A

TA = 70 °C

V

DS

V

GS

I

D

I

DM

I

S

30

± 12

1.3

1.1

4

1.0

0.61

V

a

A

c

1.25

P

D

, T

T

J

stg

0.8

b, c

0.74

b, c

0.47

- 55 to 150

260

W

°C

THERMAL RESISTANCE RATINGS

Parameter Symbol Typical Maximum Unit

Maximum Junction-to-Ambient

b, f

Maximum Junction-to-Foot (Drain)

Notes: a. Package limited. b. Surface Mounted on 1" x 1" FR4 Board. c. t = 5 sec. d. Maximum under Steady State conditions is 220 °C/W.

t ≤ 5 sec

Steady State

R

thJA

R

thJF

130 170

80 100

°C/W

Document Number: 74343 S-62441-Rev. A, 27-Nov-06

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1

Si1970DH

Vishay Siliconix

SPECIFICATIONS TJ = 25 °C, unless otherwise noted

Parameter Symbol Test Conditions Min Typ Max Unit

Static

Drain-Source Breakdown Voltage

V

Temperature Coefficient ΔVDS/T

DS

V

Temperature Coefficient ΔV

GS(th)

Gate-Source Threshold Voltage

Gate-Source Leakage

Zero Gate Voltage Drain Current

On-State Drain Current

Drain-Source On-State Resistance

Forward Transconductance

Dynamic

b

a

Input Capacitance

Reverse Transfer Capacitance

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Gate Resistance

Tur n - O n D e l a y T im e

Rise Time

Turn-Off Delay Time

Fall Time

Turn-on Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

V

DS

J

GS(th)/TJ

V

GS(th)

I

GSS

I

DSS

I

V

D(on)

r

DS(on)

g

fs

C

iss

C

oss

C

rss

Q

g

Q

gs

Q

gd

R

g

t

d(on)

t

r

t

d(off)

t

f

t

d(on)

t

r

t

d(off)

t

r

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current

Pulse Diode Forward Current

Body Diode Voltage

Body Diode Reverse Recovery Time

Body Diode Reverse Recovery Charge

Reverse Recovery Fall Time

Reverse Recovery Rise Time

Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

I

S

I

SM

V

SD

t

rr

Q

rr

t

a

t

b

VGS = 0 V, ID = 250 µA

ID = 250 µA

V

= VGS, ID = 250 µA

DS

VDS = 0 V, VGS = ± 12 V

V

DS

= 30 V, V

DS

= 30 V, V

V

GS

≤ 5 V, V

DS

V

= 4.5 V, ID = 1.2 A

GS

= 2.5 V, ID = 0.29 A

GS

= 0 V

GS

= 0 V, TJ = 55 °C

= 4.5 V

GS

VDS = 15 V, ID = 1.2 A

VDS = 15 V, V

= 10 V, V

V

DS

= 0 V, f = 1 MHz

GS

= 10 V, ID = 1.4 A

GS

= 4.5 V, ID = 1.4 A

GS

f = 1 MHz 4 Ω

V

= 15 V, RL = 13.6 Ω

DD

≅ 1.1 A, V

I

D

= 4.5 V, Rg = 1 Ω

GEN

VDD = 15 V, RL = 13.6 Ω

I

≅ 1.1 A, V

D

= 10 V, Rg = 1 Ω

GEN

TC = 25 °C

IS = 1.1 A, V

GS

= 0 V

IF = 1.1 A, di/dt = 100 A/µs, TJ = 25 °C

30 V

25

- 3.2

mV/°C

0.6 1.6 V

± 100 ns

1

10

µA

4A

0.185 0.225

0.285 0.345

Ω

2.5 S

95

17

pFOutput Capacitance

9

2.5 3.8

1.15 1.7

0.4

nC

0.3

915

20 30

15 25

510

ns

10 15

612

1

4

A

0.85 1.2 V

20 40 ns

10 20 nC

16.5

3.5

ns

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Document Number: 74343

S-62441-Rev. A, 27-Nov-06

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

1.8

Si1970DH

Vishay Siliconix

4

V

= 5 V thru 3.5 V

GS

3

) A ( t n e r r u C n i a r D - I

2

D

1

VGS = 2 V

V

GS

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

V

- Drain-to-Source Voltage (V)

DS

Output Characteristics

0.6

0.5

(Ω) e c n a t s i

0.4

s e R - n O -

0.3

) n o (

S D

r

0.2

V

GS

= 2.5 V

VGS = 4.5 V

V

GS

V

GS

= 1.5 V

= 3 V

= 2.5 V

2.0

1.6

) A ( t n e r r u C n i a r D - I

1.2

0.8

T

= 25 °C

D

0.4

0.0

C

T C = 125 °C

T C = - 55 °C

0.0 0.5 1.0 1.5 2.0 2.5 3.0

V

- Gate-to-Source Voltage (V)

GS

Transfer Characteristics

150

120

)Fp( ecnat

90

icapa

60

C

- C

30

C

iss

C

oss

0.1 0123 4

On-Resistance vs. Drain Current

10

I D = 1.4 A

)V

8

( ega

t

loV

6

e c

r uoS

-ot

-e

4

taG -

SG

2

V

0

0.0 0.5 1.0 1.5 2.0 2.5

Qg - Total Gate Charge (nC)

Gate Charge

Document Number: 74343 S-62441-Rev. A, 27-Nov-06

- Drain Current (A)

I

D

V

= 15 V

DS

V

DS

= 24 V

C

rss

0

0 5 10 15 20 25 30

VDS - Drain-Source Voltage (V)

Capacitance

V

= 4.5 V, I D = 1.4 A

1.6

e c

1.4

n atsiseR-nO

)d ez

i

lam

1.2

ro

-

N

)n

(

o

1.0

(S D

r

GS

V

= 2.5 V, I D = 0.3 A

GS

0.8

0.6

- 50 - 25 0 25 50 75 100 125 150

TJ- Junction Temperature (°C)

On-Resistance vs. Junction Temperature

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Vishay Si1970DH Schematic [ru]