Vishay Rectifiers Application Note
VISHAY SEMICONDUCTORS
Maximum temperature
can not exceed 265 °C
for PC board mounting
Time (s)
235 °C to 260 °C wave temperature
50
0 60 120 180 240
0
100
150
200
250
27 °C
Second wave
First Wave
Preheat zone
- 2 °C/s
- 5 °C/s
+ 200 °C/s
+ 2 °C/s
Temperature (°C)
Sn-Pb Wave Soldering Prole
0 50 100 150 200 250
0
50
100
150
200
250
300
Time (s)
Temperature (°C)
Full line: Typical
Dotted line: Process limits
235 °C ~ 260 °C
< 105 °C
to 165 °C
Second wave
First wave
ca. 5 K/s
ca. 2 K/s
ca. 2 K/s
100 °C ~
130 °C
2 K/s
forced
cooling
10 s
Activation
of Flux
Lead (Pb)-free Wave Soldering Prole
Time
Temperature
ts
Preheat
t 25 °C to peak
tp
T
P
T
L
Ramp-up
Ramp-down
Ts min.
Ts max.
25
Critical zone
T
L
to T
P
t
L
See Table 1 and Table 2
Rectifiers
Soldering Process Notes
WAVE SOLDERING (THROUGH HOLE ONLY)
Application Note
REFLOW PROFILE (SURFACE MOUNT ONLY)
Document Number: 95418 For technical questions within your region, please contact one of the following: www.vishay.com
Revision: 19-Oct-10 DiodesAmericas@vishay.com
TABLE 1 - Sn-Pb EUTECTIC PROCESS
PACKAGE REFLOW TEMPERATURES
PACKAGE
THICKNESS
VOLUME mm
< 350
3
VOLUME mm
350
< 2.5 mm 240 + 0/- 5 °C 225 + 0/- 5 °C
2.5 mm 225 + 0/- 5 °C 225 + 0/- 5 °C
3
TABLE 2 - LEAD (Pb)-FREE PROCESS
PACKAGE CLASSIFICATION REFLOW
TEMPERATURE
3
(1)
(1)
(1)
VOLUME
mm
350 TO 2000
260 + 0 °C
250 + 0 °C
245 + 0 °C
PACKAGE
THICKNESS
VOLUME
mm
< 350
< 1.6 mm 260 + 0 °C
< 1.6 mm to 2.5 mm 260 + 0 °C
2.5 mm 250 + 0 °C
Note
(1)
Tolerance: The device manufacturer/supplier shall assure
process compatibility up to and including the stated
classification temperature at the rated MSL level.
, DiodesAsia@vishay.com, DiodesEurope@vishay.com 1
3
VOLUME
(1)
260 + 0 °C
(1)
245 + 0 °C
(1)
245 + 0 °C
mm
> 2000
3
(1)
(1)
(1)
APPLICATION NOTE
Application Note
Vishay Semiconductors
Soldering Process Notes
CLASSIFICATION REFLOW PROFILE
PROFILE FEATURE Sn-Pb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
Average ramp-up rate (Ts max. to TP) 3 °C/s maximum 3 °C/s maximum
Preheat
- Temperature minimum (Ts min.)
- Temperature maximum (Ts max.)
- Time (min. to max.) (ts)
Time maintained above:
- Temperature (T
- Time (t
L
Peak temperature See table 1 See table 2
Time within 5 °C to actual peak temperature (tp) 10 s to 30 s 20 s to 40 s
Ramp-down rate 6 °C/s maximum 6 °C/s maximum
Time 25 °C to peak temperature 6 min maximum 8 min maximum
Note
• All temperatures refer to top side of the package, measured on the package body surface.
)
L
)
100 °C
150 °C
60 s to 120 s
183 °C
60 s to 150 s
150 °C
200 °C
60 s to 180 s
217 °C
60 s to 150 s
APPLICATION NOTE
www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 95418
2 DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com Revision: 19-Oct-10
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