VISHAY MUR 820 VIS Datasheet

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Anode
1
3
Cathode
Base
cathode
2
2L TO-220AC
1
2
3
VS-MUR820-M3
Vishay Semiconductors
Ultrafast Rectifier, 8 A FRED Pt
PRIMARY CHARACTERISTICS
I
F(AV)
V
R
V
at I
F
F
t
typ. See Recovery table
rr
T
max. 175 °C
J
Package 2L TO-220AC
Circuit configuration Single
8 A
200 V
0.895 V
®
FEATURES
• Ultrafast recovery time
• Low forward voltage drop
• 175 °C operating junction temperature
• Low leakage current
®
• Designed and qualified according to JEDEC
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
DESCRIPTION / APPLICATIONS
VS-MUR820 is the state of the art ultrafast recovery rectifier specifically designed with optimized performance of forward voltage drop and ultrafast recovery time.
The planar structure and the platinum doped life time control, guarantee the best overall performance, ruggedness and reliability characteristics.
These devices are intended for use in the output rectification stage of SMPS, UPS, DC/DC converters as well as freewheeling diode in low voltage inverters and chopper motor drives.
Their extremely optimized stored charge and low recovery current minimize the switching losses and reduce over dissipation in the switching element and snubbers.
-JESD 47
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Peak repetitive reverse voltage V
Average rectified forward current I
Peak repetitive forward current I
Operating junction and storage temperatures T
F(AV)
FSM
, T
J
RRM
FM
Total device, rated VR, TC = 150 °C 8
Rated VR, square wave, 20 kHz, TC = 150 °C 16
Stg
200 V
100
-65 to +175 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Breakdown voltage, blocking voltage
Forward voltage V
Reverse leakage current I
Junction capacitance C
Series inductance L
Revision: 23-Nov-17
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V
,
BR
V
R
IR = 100 μA 200 - -
R
IF = 8 A - - 0.975
F
I
= 8 A, TJ = 150 °C - - 0.895
F
VR = VR rated - - 5
= 150 °C, VR = VR rated - - 250
T
J
VR = 200 V - 25 - pF
T
Measured lead to lead 5 mm from package body - 8.0 - nH
S
1
Document Number: 96186
ANon-repetitive peak surge current I
V
μA
Page 2
VS-MUR820-M3
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V - - 35
I
Reverse recovery time t
Peak recovery current I
Reverse recovery charge Q
rr
RRM
= 0.5 A, IR = 1.0 A, I
F
T
= 25 °C
J
T
= 125 °C - 34 -
J
TJ = 25 °C - 1.7 -
= 125 °C - 4.2 -
T
J
rr
TJ = 25 °C - 23 -
= 125 °C - 75 -
T
J
= 0.25 A - - 25
REC
= 8 A
I
F
dI
/dt = 200 A/μs
F
V
= 160 V
R
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Maximum junction and storage temperature range
Thermal resistance, junction to case
Thermal resistance, junction to ambient
Thermal resistance, case to heatsink
Weight
Mounting torque
Marking device Case style 2L TO-220AC MUR820
, T
T
J
Stg
R
--3.0
thJC
R
thJA
R
thCS
Mounting surface, flat, smooth, and greased
Vishay Semiconductors
-20-
-65 - 175 °C
--50
-0.5-
-2.0- g
-0.07- oz.
6.0
(5.0)
-
12
(10)
ns
A
nC
°C/W
kgf · cm
(lbf · in)
100
10
1
0.1
- Instantaneous Forward Current (A)
F
I
0 1.80.4 0.8
TJ = 175 °C
= 150 °C
T
J
= 25 °C
T
J
0.2 0.6 1.0 1.4 1.6
1.2
VFM - Forward Voltage Drop (V)
100
10
1
0.1
- Reverse Current (µA)
0.01
R
I
0.001
0 100 150
TJ = 175 °C
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
TJ = 25 °C
200 25050
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
Revision: 23-Nov-17
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0.01
0.1
10
0.00001 0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance (°C/W)
.
.
P
DM
t
1
t
2
Notes:
1. Duty factor D = t
1/t2
2. Peak TJ = PDM x Z
thJC
+ T
C
1
Single pulse
(thermal resistance)
D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01
03
Allowable Case Temperature (°C)
I
F(AV)
- Average Forward Current (A)
160
170
180
See note (1)
150
DC
140
130
69
Square wave (D = 0.50) Rated V
R
applied
12
06
Average Power Loss (W)
I
F(AV)
- Average Forward Current (A)
0
D = 0.01 D = 0.02 D = 0.05 D = 0.10 D = 0.20 D = 0.50
DC
39
2
4
10
6
8
RMS limit
12
VS-MUR820-M3
Vishay Semiconductors
1000
100
- Junction Capacitance (pF)
T
C
10
1 10 100 1000
TJ = 25 °C
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Maximum Thermal Impedance Z
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Revision: 23-Nov-17
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3
thJC
Characteristics
Fig. 6 - Forward Power Loss Characteristics
Document Number: 96186
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100 1000
Q
rr
(nC)
dIF/dt (A/µs)
40
IF = 16 A I
F
= 8 A
I
F
= 4 A
200
120
VR = 160 V T
J
= 125 °C
T
J
= 25 °C
80
160
0
Q
rr
0.5 I
RRM
di
(rec)M
/dt
0.75 I
RRM
I
RRM
t
rr
t
b
t
a
I
F
diF/dt
0
(1)
(2)
(3)
(4)
(5)
(1) di
F
/dt - rate of change of current
through zero crossing
(2) I
RRM
- peak reverse recovery current
(3) t
rr
- reverse recovery time measured from zero crossing point of negative going I
F
to point where a line passing
through 0.75 I
RRM
and 0.50 I
RRM
extrapolated to zero current.
(4) Q
rr
- area under curve dened by t
rr
and I
RRM
trr x I
RRM
2
Qrr =
(5) di
(rec)M
/dt - peak rate of change of
current during t
b
portion of t
rr
VS-MUR820-M3
Vishay Semiconductors
50
40
30
(ns)
rr
t
20
10
100 1000
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
(1)
Formula used: TC = TJ - (Pd + Pd Pd = forward power loss = I Pd
= inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
REV
VR = 160 V
= 125 °C
T
J
= 25 °C
T
J
REV
x VFM at (I
F(AV)
) x R
IF = 16 A
= 8 A
I
F
= 4 A
I
F
;
thJC
F(AV)
/D) (see fig. 6);
Revision: 23-Nov-17
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 9 - Reverse Recovery Waveform and Definitions
4
Document Number: 96186
Page 5
VS-MUR820-M3
2 - Ultrafast MUR series
3 - Current rating (8 = 8 A)
- Voltage rating (20 = 200 V)
4
1
-Vishay Semiconductors product
5
Device code
51 32 4
VS- MUR 8 20 -M3
-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
- Environmental digit:
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ORDERING INFORMATION TABLE
ORDERING INFORMATION (Example)
PREFERRED P/N QUANTITY PER T/R MINIMUM ORDER QUANTITY PACKAGING DESCRIPTION
VS-MUR820-M3 50 1000 Antistatic plastic tube
Vishay Semiconductors
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?96156
Part marking information www.vishay.com/doc?95391
Revision: 23-Nov-17
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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12
C
C
D
D
2 x b22 x b
(b, b2)
b1, b3
0.014 AB
M M
0.015 AB
M M
Conforms to JEDEC® outline TO-220AC
(6)
(6)
(6)
(7)
L1
(2)
Detail B
Section C - C and D - D
Base metal Plating
(4)
(4)
c1
c
(6)
(6)
Ø P
E
Q
D
L
c
D1
e
e1
2 x
A
B
A
A
A
C
A2
A1
Thermal pad
H1
(E)
(H1)
D2
Detail B
E1
View A - A
Lead tip
DIMENSIONS in millimeters and inches
Outline Dimensions
Vishay Semiconductors
2L TO-220AC
SYMBOL
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
A 4.25 4.65 0.167 0.183 D2 11.68 12.88 0.460 0.507 6 A1 1.14 1.40 0.045 0.055 E 10.11 10.51 0.398 0.414 3, 6 A2 2.50 2.92 0.098 0.115 E1 6.86 8.89 0.270 0.350 6
b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105 b1 0.38 0.97 0.015 0.038 4 e1 4.88 5.28 0.192 0.208 b2 1.20 1.73 0.047 0.068 H1 6.09 6.48 0.240 0.255 6, 7 b3 1.14 1.73 0.045 0.068 4 L 13.52 14.02 0.532 0.552
c 0.36 0.61 0.014 0.024 L1 3.32 3.82 0.131 0.150 2 c1 0.36 0.56 0.014 0.022 4 Ø P 3.54 3.91 0.139 0.154
D 14.85 15.35 0.585 0.604 3 Q 2.60 3.00 0.102 0.118 D1 8.38 9.02 0.330 0.355
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension and finish uncontrolled in L1
(3)
Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body
(4)
Dimension b1, b3, and c1 apply to base metal only
(5)
Controlling dimensions: inches
(6)
Thermal pad contour optional within dimensions E, H1, D2, and E1
(7)
Outline conforms to JEDEC® TO-220, except D2 (minimum)
Revision: 06-Dec-17
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Document Number: 96156
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Disclaimer
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