VISHAY MCT 0603 AT, MCU 0805 AT, MCA 1206 AT User Manual

MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

FEATURES

• Superior moisture resistivity, |ΔR/R| < 0.5 %
(85 °C; 85 % RH; 1000 h)

• Rated dissipation P70 up to 0.4 W for size 1206

• AEC-Q200 qualified

• Approved according to EN 140401-801

• Lead (Pb)-free solder contacts

• Compliant to RoHS directive 2002/95/EC

APPLICATIONS

• Automotive

• Telecommunication

• Medical equipment

Automotive-Grade MC AT Precision Thin Film Chip
Resistors are the perfect choice for most fields of modern
precision electronics where reliability and stability is of major
concern. Typical applications include automotive,
telecommunication, industrial, medical equipment, precision
test and measuring equipment.

• Industrial equipment

METRIC SIZE

INCH: 0603 0805 1206

METRIC: RR 1608M RR 2012M RR 3216M

TECHNICAL SPECIFICATIONS

DESCRIPTION MCT 0603 AT MCU 0805 AT MCA 1206 AT

Metric size RR 1608M RR 2012M RR 3216M

Resistance range 47 Ω to 100 kΩ 47 Ω to 100 kΩ 47 Ω to 100 kΩ

Resistance tolerance ± 0.1 %

Temperature coefficient ± 25 ppm/K; ± 15 ppm/K

Rated dissipation P

Operating voltage, U

Permissible film temperature

Insulation voltage

(1)

70

AC/DC 75 V 150 V 200 V

max.

(1)

1 min; U

ins

0.125 W 0.200 W 0.400 W

155 °C

100 V 200 V 300 V

Continuous 75 V 75 V 75 V

Note

(1)

Please refer to APPLICATION INFORMATION below

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1 Revision: 09-Apr-09

MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Precision Thin Film Chip Resistor

Vishay Beyschlag

Superior Moisture Resistivity

APPLICATION INFORMATION

The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support
of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not
exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint,
hence special solder alloys or board materials may be required to maintain the reliability of the assembly.

These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and
temperature limits in order to maintain a desired stability.

MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION

Operation mode Standard Power

Rated dissipation P

MCT 0603 AT 0.100 W 0.125 W

70

P

70

MCU 0805 AT 0.125 W 0.200 W

MCA 1206 AT 0.250 W 0.400 W

Film temperature 125 °C 155 °C

Max. resistance change at rated dissipation for
resistance range:

MCT 0603 AT 47 Ω to 100 kΩ 47 Ω to 100 kΩ

MCU 0805 AT 47 Ω to 100 kΩ 47 Ω to 100 kΩ

MCA 1206 AT 47 Ω to 100 kΩ 47 Ω to 100 kΩ

|ΔR/R| max., after:

1000 h ≤ 0.1 % ≤ 0.2 %

8000 h ≤ 0.2 % ≤ 0.4 %

225 000 h ≤ 0.6 % -

Document Number: 28785 For technical questions, contact: [e-mail]
Revision: 09-Apr-09 2

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

PART NUMBER AND PRODUCT DESCRIPTION

PART NUMBER: MCT0603MD4641BPW00

CT0603MD4M 41BPW006

MODEL/SIZE VERSION TCR VALUE TOLERANCE PACKAGING SPECIAL

MCT0603
MCU0805
MCA1206

PRODUCT DESCRIPTION: MCT 0603 - 25 0.1 % AT PW 4K64

MCT

MODEL SIZE TCR

MCT
MCU
MCA

M = AT

(Automotive)

0603 - 25 0.1 % AT

0603
0805
1206

E

= ± 15 ppm/K

D

= ± 25 ppm/K

± 15 ppm/K
± 25 ppm/K

(1)

3 digit value

1 digit

multiplier

MULTIPLIER

TOLERANCE

0

0 = *10

1

1 = *10

2

2 = *10

3

3 = *10

VAL UE

± 0.1 % AT = Automotive P1

B = ± 0.1 % P1

VERSION PACKAGING

Up to 2 digits

P5

PW

PW 4K64

P5

PW

00 = Standard

RESISTANCE

47K = 47 kΩ

VALUE

Note

(1)

Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

DESCRIPTION RESISTANCE VALUE

TCR TOLERANCE MCT 0603 AT MCU 0805 AT MCA 1206 AT

± 25 ppm/K

± 15 ppm/K

Note

(2)

Resistance values to be selected from E96 and E192

± 0.1 % 47 Ω to 100 kΩ 47 Ω to 100 kΩ 47 Ω to 100 kΩ

(2)

PACKAGING

REEL

MODEL

MCT 0603 AT

MCU 0805 AT

MCA 1206 AT

PIECES/

PAPER TAPE ON REEL

1000 P1

5000 P5

20 000 PW

1000 P1

5000 P5

20 000 PW

1000 P1

5000 P5

CODE

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

DIMENSIONS

DIMENSIONS AND MASS

TYPE

MCT 0603 AT

MCU 0805 AT

MCA 1206 AT

H

(mm)

0.45 + 0.1/- 0.05

0.52 ± 0.1

0.55 ± 0.1

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

T

1

W

W

T

H

T

2

L

(mm)

1.55 ± 0.05 0.85 ± 0.1 > 75 % of W

2.0 ± 0.1 1.25 ± 0.15 > 75 % of W

3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W

W

(mm)

L

W

T

(mm)

Vishay Beyschlag

T

1

(mm)

0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2

0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2

0.5 ± 0.25 0.5 ± 0.25

T

2

(mm)

MASS

(mg)

1.9

4.6

9.2

SOLDER PAD DIMENSIONS

G

Z

Y

X

RECOMMENDED SOLDER PAD DIMENSIONS

WAVE SOLDERING REFLOW SOLDERING

TYPE

MCT 0603 AT 0.5 1.2 1.1 2.9 0.5 0.95 0.95 2.4

MCU 0805 AT 0.65 1.4 1.5 3.45 0.65 1.1 1.4 2.85

MCA 1206 AT 1.5 1.6 1.9 4.7 1.5 1.25 1.75 4.0

Note

• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the
reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.

The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.

Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.

Document Number: 28785 For technical questions, contact: [e-mail]
Revision: 09-Apr-09 4

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

DESCRIPTION

Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade (Al
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations receive
a final pure tin on nickel plating.

The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3

ASSEMBLY

The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in

IEC 61760-1

solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.

The resistors are RoHS compliant; the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.

All products comply with the GADSL

CEFIC-EECA-EICTA

hazardous substances. This includes full compliance with
the following directives:

• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)

• 2002/95/EC Restriction of the use of Hazardous
Substances directive (RoHS)

• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)

) ceramic substrate and conditioned to

2O3

(3)

.

(3)

. The encapsulation is resistant to all cleaning

(1)

(2)

list of legal restrictions on

and the

APPROVALS

The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,

EN 140400 and the variety of environmental test procedures

(3)

of the IEC 60068

series. The detail specification refers to
the climatic categories 55/125/56, which relates to the
“standard operation mode” of this datasheet.

Conformity is attested by the use of the CECC Logo ( ) as
the Mark of Conformity on the package label.

Vishay BEYSCHLAG has achieved “Approval of

Manufacturer” in accordance with IEC QC 001002-3,
clause 2. The release certificate for “Technology Approval
Schedule” in accordance with CECC 240001 based on
IEC QC 001002-3, clause 6 is granted for the

Vishay BEYSCHLAG manufacturing process.

The resistors are qualified according to AEC-Q200.

RELATED PRODUCTS

For more information about products with higher operation
temperature please refer to the professional datasheet
document no. 28760.

Chip resistor arrays may be used in sensing applications or
precision amplifiers where close matching between multiple
resistors is necessary. Please refer to the
ACAS AT - Precision datasheet document no. 28770.

Notes

(1)

Global Automotive Declarable Substance List, see www.gadsl.org

(2)

CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org
environment policy → chemicals → chemicals for electronics

(3)

The quoted IEC standards are also released as EN standards with the same number and identical contents

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

FUNCTIONAL PERFORMANCE

100

80

Rated Power in %

60

40

20

0

For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED POWER, above

Derating

1

3

A

1

µV/V

Current Noise

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

70

100- 55

Ambient Temperature in °C

125050

Vishay Beyschlag

Standard Mode

Power Mode

155

MCT 0603 AT

MCU 0805 AT

MCA 1206 AT

180

0.1

0.01
100 Ω

Current noise A1 in accordance with IEC 60195

100 kΩ 10 kΩ 1 kΩ 10 Ω

Resistance Value

1 MΩ

R

Current Noise

TESTS AND REQUIREMENTS

All tests are carried out in accordance with the following
specifications:

EN 60115-1, generic specification

EN 140400, sectional specification

EN 140401-801, detail specification

The components are approved in accordance with the
IECQ-CECC-system, where applicable. The following table
contains only the most important tests. For the full test
schedule refer to the documents listed above. The testing
also covers most of the requirements specified by
EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper

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Revision: 09-Apr-09 6

category temperature; damp heat, long term, 56 days) is
valid (LCT = - 55 °C/UCT = 125 °C).

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

The components are mounted for testing on boards in
accordance with EN 140400, 2.3.3 unless otherwise
specified.

The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Vishay Beyschlag

Precision Thin Film Chip Resistor

Superior Moisture Resistivity

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

4.5 - Resistance ± 0.1 % R

4.8.4.2 -

4.25.1 -

4.25.3 -

4.24 78 (Cab)

4.39 67 (Cy)

4.23 Climatic sequence:

4.23.2 2 (Ba) dry heat 125 °C; 16 h

4.23.3 30 (Db) damp heat, cyclic

4.23.4 1 (Aa) cold - 55 °C; 2 h

4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C

4.23.6 30 (Db) damp heat, cyclic

4.23.7 - DC load U = ≤ U

-1 (Aa)

4.19 14 (Na)

4.13 -

4.27 -

Note

(1)

According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their
respective test conditions.

IEC

60068-2

TEST

METHOD

TEST PROCEDURE

Temperature

coefficient

Endurance at 70 °C:

Standard operation mode

Endurance at 70 °C:

Power operation mode

Endurance at

upper category

temperature

Damp heat,

steady state

Damp heat,

steady state,

accelerated

Storage at low

temperature

Rapid change of

temperature

Short time overload;

standard operation mode

Single pulse high
voltage overload;

standard operation mode

Stability for product types:

MCT 0603 AT 47 Ω to 100 kΩ

MCU 0805 AT 47 Ω to 100 kΩ

MCA 1206 AT 47 Ω to 100 kΩ

At (20/- 55/20) °C and

(20/155/20) °C

P70 x R

U = or U = U

whichever is the less severe;

1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h

U = or U = U

P70 x R

whichever is the less severe;

1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h

125 °C; 1000 h
155 °C; 1000 h

(40 ± 2) °C; 56 days;

(93 ± 3) % RH

(85 ± 2) °C

(85 ± 5) % RH

U = 0.1 x

≤ 100 V;

1000 h

55 °C; 24 h; > 90 % RH;

55 °C; 5 days > 90 % RH;

1 cycle

5 cycles

P70 x R

- 55 °C; 2 h ± (0.05 % R +0.01Ω)

30 min at - 55 °C and

30 min at 125 °C;

1000 cycles

U = 2.5 x

≤ 2 × U

max.

Severity no. 4:

U = 10 x

≤ 2 x U

10 pulses

P70 x R

max.

P70 x R

; 5 s

P70 x R

;

max.

max.

max.

; 1 min

STABILITY CLASS 0.25 OR BETTER

;

;

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

± 25 ppm/K; ± 15 ppm/K

± (0.1 % R +0.02Ω)
± (0.2 % R +0.02Ω)

± (0.2 % R +0.02Ω)
± (0.4 % R +0.05Ω)

± (0.15 % R + 0.02 Ω)

± (0.3 % R + 0.02 Ω)

± (0.1 % R +0.02Ω)

± (0.5 % R + 0.05 Ω)

± (0.25 % R +0.02 Ω)

± (0.25 % R +0.02 Ω)

± (0.05 % R +0.01Ω)

± (0.25 % R +0.05Ω)

(1)

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision

Precision Thin Film Chip Resistor

Vishay Beyschlag

Superior Moisture Resistivity

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

4.37 -

4.40 -

4.22 6 (Fc) Vibration

4.17.2 58 (Td) Solderability

4.18.2 58 (Td)

4.29 45 (XA)

4.32 21 (Ue

4.33 21 (Ue

4.7 - Voltage proof U

4.35 - Flammability Needle flame test; 10 s No burning after 30 s

IEC

60068-2

TEST

METHOD

standard operation mode

(Electro Static Discharge)

) Shear (adhesion)

3

) Substrate bending Depth 2 mm, 3 times

1

TEST PROCEDURE

Stability for product types:

Periodic electric

overload;

ESD

Resistance to

soldering heat

Component solvent

resistance

U =

0.1 s on; 2.5 s off;

(equivalent to MIL-STD-883,

MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V

Endurance by sweeping;

10 Hz to 2000 Hz;

amplitude ≤ 1.5 mm or

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

Isopropyl alcohol + 50 °C;

RMS

STABILITY CLASS 0.25 OR BETTER

MCT 0603 AT 47 Ω to 100 kΩ

MCU 0805 AT 47 Ω to 100 kΩ

MCA 1206 AT 47 Ω to 100 kΩ

15 x P70 x R

≤ 2 x U

1000 cycles

IEC 61340-3-1;
3 pos. + 3 neg.

Method 3015)

no resonance;

≤ 200 m/s

method 2

RR 1608M; 9 N

RR 2012M and

RR 3216M; 45 N

= U

;

max.

2

; 6 h

no visible damage; no open circuit in bent position

; (60 ± 5) s No flashover or breakdown

ins

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

± (0.5 % R +0.05Ω)

± (0.5 % R +0.05Ω)

± (0.05 % R +0.01Ω)

no visible damage

Good tinning (≥ 95 % covered);

no visible damage

Good tinning (≥ 95 % covered);

no visible damage

± (0.05 % R +0.01Ω)

no visible damage

No visible damage

No visible damage

± (0.05 % R +0.01Ω)

(1)

Document Number: 28785 For technical questions, contact: [e-mail]
Revision: 09-Apr-09 8

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Legal Disclaimer Notice

Vishay

Disclaimer

All product specifications and data are subject to change without notice.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.

Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.

Product names and markings noted herein may be trademarks of their respective owners.

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