• Precision tolerance of value: ± 0.1 and ± 0.25 %
• Superior overall stability: class 0.1 and 0.25
• Pure Sn termination on Ni barrier layer
• Compatible with lead (Pb)-free and lead containing
soldering processes
• Lead (Pb)-free and RoHS compliant
APPLICATIONS
Thin Film Flat Chip Resistors combine the proven reliability
of the professional products with an advanced level of
precision and stability. Therefore they are perfectly suited for
applications in the fields of test and measuring equipment
together with industrial and medical electronics. The latest
member of this product family size 0402 follows the ongoing
trend of miniaturisation and enables precision applications in
micro circuit designs.
• Automotive
• Test and measuring equipment
• Medical equipment
• Industrial equipment
METRIC SIZE
INCH:0402060308051206
METRIC:RR 1005M RR 1608M RR 2012M RR 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
Metric sizeRR 1005MRR 1608MRR 2012MRR 3216M
Resistance range100 Ω to 221 kΩ39 Ω to 511 kΩ39 Ω to 1.5 MΩ39 Ω to 2 MΩ
Resistance tolerance± 0.25 %; ± 0.1 %
Temperature coefficient± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
0.016 W0.063 W0.032 W0.1 W0.050 W0.125 W0.1 W0.25 W
100 Ω to 221 kΩ39 Ω to 511 kΩ39 Ω to 1.5 MΩ39 Ω to 2 MΩ
75 V100 V200 V300 V
-9
/h≤ 2 x 10-9/h≤ 2 x 10-9/h≤ 2 x 10-9/h
MCT 0603MCU 0805MCA 1206
Note
1. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded.
1. Products can be ordered using either the PRODUCT DESCRIPTION or the 12 NC.
2. The PART NUMBER is shown to facilitate the introduction of a unified part numbering system. Currently, this PART NUMBER is applicable
in the Americas only.
3. Please refer to table PACKING, page 151.
DIMENSIONS - CHIP resistor types, mass and relevant physical dimensions
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a super high
grade (96 % Al
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. A further conditioning is applied in order to
stabilize the trimming result. The resistor elements are
covered by a blue protective coating designed for electrical,
mechanical and climatic protection. The terminations receive
a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with EN 60 286-3.
) ceramic substrate and conditioned to
203
APPROVALS
The resistors are tested in accordance with EN 140401-801
(superseding CECC 40401-801) which refers to EN 60115-1and EN 140400. Approval of conformity is indicated by the
CECC logo on the package label.
Vishay BEYSCHLAG has achieved "Approval ofManufacturer" in accordance with EN 100114-1. The
release certificate for "Technology Approval Schedule" in
accordance with CECC 240001 based on EN 100114-6 is
granted for the Vishay BEYSCHLAG manufacturing process.
SPECIALS
On request, resistors are available with established reliability
in accordance with EN 140 401-801Version E. Please refer
to the special data sheet for information on failure rate level,
available resistance ranges and order codes.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems and for automatic soldering using wave,
reflow or vapour phase. The encapsulation is resistant to all
cleaning solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
resistors are lead (Pb)-free, the pure tin plating provides
compatibility with lead (Pb)-free and lead-containing
soldering processes. The immunity of the plating against tin
whisker growth has been proven under extensive testing. All
products comply with the CEFIC-EECA-EICTA list of legal
restrictions on hazardous substances.
This includes full compatibility with the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV)
2000/53/EC Annex II to End of Vehicle Life Directive (ELV II)
•
• 2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
All tests are carried out in accordance with the following
specifications:
EN 60115-1, Generic specification (includes tests)
EN 140 400, Sectional specification (includes schedule for
qualification approval)
EN 140 401-801, Detail specification (includes schedule for
conformance inspection)
The components are approved in accordance with the
European CECC-system, where applicable. The following
table contains only the most important tests. For the full test
schedule refer to the documents listed above. The testing
also covers most of the requirements specified by
EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60 068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid. Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified.
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140 401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
1. See 4.25.1 (above): special requirements for type MCA 1206.
2. The pulse load stability of professional MFC resistors applies for precision resistors also. However, severe pulse loads are likely to jeopardise
precision stability requirements.
IEC
60068-2
TEST
METHOD
)shear
3
-endurance at
TESTPROCEDURE
soldering heat
solvent
resistance
bending
70 °C:
precision
operation
mode
70 °C:
standard
operation
mode
STABILITY CLASS 0.1STABILITY CLASS 0.25
stability for product types:
MCS 0402470 Ω to 10 kΩ> 10 kΩ to 52.3 kΩ
MCT 0603100 Ω to 10 kΩ39 Ω to < 100 Ω;
MCU 0805100 Ω to 47.5 kΩ39 Ω to < 100 Ω;
MCA 120647 Ω to 332 kΩ
10 to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.