Vishay IRFP450A, SiHFP450A Data Sheet

IRFP450A, SiHFP450A

Vishay Siliconix

Power MOSFET

PRODUCT SUMMARY

VDS (V)

 

500

RDS(on) (Ω)

VGS = 10 V

 

0.40

Qg (Max.) (nC)

 

64

Qgs (nC)

 

16

Qgd (nC)

 

26

Configuration

 

Single

 

 

 

 

D

FEATURES

Low Gate Charge Qg Results in Simple Drive

 

 

Requirement

Available

 

 

Improved Gate, Avalanche and Dynamic dV/dt

RoHS*

 

Ruggedness

COMPLIANT

Fully Characterized Capacitance and Avalanche Voltage and Current

Effective Coss Specified

Lead (Pb)-free Available

TO-247

 

APPLICATIONS

 

 

• Switch Mode Power Supply (SMPS)

 

G

• Uninterruptable Power Supply

 

 

 

 

• High Speed Power Switching

S

 

TYPICAL SMPS TOPOLOGIES

D

S

• Two Transistor Forward

G

 

 

N-Channel MOSFET

• Half Bridge, Full Bridge

 

 

 

 

• PFC Boost

ORDERING INFORMATION

Package

TO-247

Lead (Pb)-free

IRFP450APbF

 

SiHFP450A-E3

 

SnPb

IRFP450A

SiHFP450A

 

 

 

ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted

PARAMETER

 

 

SYMBOL

LIMIT

UNIT

 

 

 

 

 

 

Drain-Source Voltage

 

 

VDS

500

V

Gate-Source Voltage

 

 

VGS

± 30

 

 

 

Continuous Drain Current

 

VGS at 10 V

TC = 25 °C

ID

14

 

 

TC = 100 °C

8.7

A

 

 

 

 

Pulsed Drain Currenta

 

 

 

IDM

56

 

Linear Derating Factor

 

 

 

1.5

W/°C

 

 

 

 

 

 

Single Pulse Avalanche Energyb

 

 

EAS

760

mJ

Repetitive Avalanche Currenta

 

 

IAR

14

A

Repetitive Avalanche Energya

 

 

EAR

19

mJ

Maximum Power Dissipation

 

TC = 25 °C

PD

190

W

Peak Diode Recovery dV/dtc

 

 

 

dV/dt

4.1

V/ns

Operating Junction and Storage Temperature Range

 

 

TJ, Tstg

- 55 to + 150

°C

Soldering Recommendations (Peak Temperature)

 

for 10 s

 

300d

 

Mounting Torque

 

6-32 or M3 screw

 

10

lbf · in

 

 

 

 

 

 

1.1

N · m

 

 

 

 

 

 

 

 

 

 

 

 

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Starting TJ = 25 °C, L = 7.8 mH, RG = 25 Ω, IAS = 14 A (see fig. 12).

c.ISD ≤ 14 A, dI/dt ≤ 130 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.

d.1.6 mm from case.

* Pb containing terminations are not RoHS compliant, exemptions may apply

Document Number: 91230

www.vishay.com

S-81271-Rev. A, 16-Jun-08

1

IRFP450A, SiHFP450A

Vishay Siliconix

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

TYP.

MAX.

UNIT

 

 

 

 

 

Maximum Junction-to-Ambient

RthJA

-

40

 

Case-to-Sink, Flat, Greased Surface

RthCS

0.24

-

°C/W

Maximum Junction-to-Case (Drain)

RthJC

-

0.65

 

SPECIFICATIONS TJ = 25 °C, unless otherwise noted

PARAMETER

 

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

Static

 

 

 

 

 

 

 

 

 

 

Drain-Source Breakdown Voltage

 

VDS

VGS = 0 V, ID = 250 µA

500

-

-

V

VDS Temperature Coefficient

 

VDS/TJ

Reference to 25 °C, ID = 1 mA

-

0.58

-

V/°C

Gate-Source Threshold Voltage

 

VGS(th)

VDS = VGS, ID = 250 µA

2.0

-

4.0

V

Gate-Source Leakage

 

IGSS

 

VGS = ± 30 V

-

-

± 100

nA

Zero Gate Voltage Drain Current

 

IDSS

VDS = 500 V, VGS = 0 V

-

-

25

µA

 

VDS = 400 V, VGS = 0 V, TJ = 125 °C

-

-

250

 

 

 

 

Drain-Source On-State Resistance

 

RDS(on)

VGS = 10 V

 

 

 

ID = 8.4 Ab

-

-

0.40

Ω

Forward Transconductance

 

gfs

VDS = 50 V, ID = 8.4 Ab

7.8

-

-

S

Dynamic

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

Ciss

 

 

VGS = 0 V,

-

2038

-

 

Output Capacitance

 

Coss

 

 

 

 

 

 

 

 

 

VDS = 25 V,

-

307

-

 

 

 

 

f = 1.0 MHz, see fig. 5

 

 

 

 

Reverse Transfer Capacitance

 

Crss

-

10

-

pF

 

 

 

 

 

 

Output Capacitance

 

Coss

VGS = 0 V; VDS = 1.0 V, f = 1.0 MHz

 

2859

 

 

 

 

 

Output Capacitance

 

Coss

VGS = 0 V; VDS = 400 V, f = 1.0 MHz

 

81

 

 

Effective Output Capacitance

 

Coss eff.

VGS = 0 V; VDS = 0 V to 400 Vc

 

96

 

 

Total Gate Charge

 

Qg

 

 

 

ID = 14 A, VDS = 400 V,

-

-

64

 

Gate-Source Charge

 

Qgs

VGS = 10 V

 

 

-

-

16

nC

 

 

 

see fig. 6 and 13b

Gate-Drain Charge

 

Qgd

 

 

 

 

 

-

-

26

 

Turn-On Delay Time

 

td(on)

 

 

 

 

 

-

15

-

 

Rise Time

 

tr

VDD = 250 V, ID = 14 A,

-

36

-

ns

 

 

 

 

 

 

Turn-Off Delay Time

 

td(off)

RG = 6.2 Ω, RD = 17

Ω, see fig. 10b

-

35

-

 

Fall Time

 

tf

 

 

 

 

 

-

29

-

 

Drain-Source Body Diode Characteristics

 

 

 

 

 

 

 

 

 

 

Continuous Source-Drain Diode Current

 

IS

MOSFET symbol

D

-

-

14

 

 

 

 

showing the

 

 

 

 

 

 

 

A

 

 

 

integral reverse

G

 

 

 

Pulsed Diode Forward Currenta

 

ISM

-

-

56

 

 

 

p - n junction diode

S

 

Body Diode Voltage

 

VSD

TJ = 25 °C, IS = 14 A, VGS = 0 Vb

-

-

1.4

V

Body Diode Reverse Recovery Time

 

trr

T = 25 °C, I

 

= 14 A, dI/dt = 100 A/µsb

-

487

731

ns

 

 

 

F

 

 

 

 

 

 

 

 

 

 

 

Body Diode Reverse Recovery Charge

 

Qrr

J

 

 

 

-

3.9

5.8

µC

 

 

 

 

 

 

Forward Turn-On Time

 

ton

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Pulse width ≤ 300 µs; duty cycle ≤ 2 %.

c.Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80 % VDS.

www.vishay.com

Document Number: 91230

2

S-81271-Rev. A, 16-Jun-08

Vishay IRFP450A, SiHFP450A Data Sheet

IRFP450A, SiHFP450A

Vishay Siliconix

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

Fig. 1 - Typical Output Characteristics

 

Fig. 3 - Typical Transfer Characteristics

 

 

 

 

 

 

 

 

 

 

 

Fig. 2 - Typical Output Characteristics

Fig. 4 - Normalized On-Resistance vs. Temperature

 

Document Number: 91230

www.vishay.com

S-81271-Rev. A, 16-Jun-08

3

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