Vishay IRFP26N60L, SiHFP26N60L Data Sheet

IRFP26N60L, SiHFP26N60L

www.vishay.com

Vishay Siliconix

 

 

Power MOSFET

PRODUCT SUMMARY

VDS (V)

 

 

 

600

 

 

 

 

RDS(on) (Ω)

 

VGS = 10 V

 

 

 

 

 

0.21

Qg (Max.) (nC)

 

 

 

180

 

 

 

 

Qgs (nC)

 

 

 

61

 

 

 

 

 

Qgd (nC)

 

 

 

85

 

 

 

 

 

Configuration

 

 

 

Single

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D

TO-247AC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D

 

 

 

 

 

S

 

 

 

 

 

 

 

 

G

N-Channel MOSFET

FEATURES

• Superfast body diode eliminates the need for

external diodes in ZVS applications

Available

 

• Lower gate charge results in simpler drive

Available

requirements

 

Enhanced dV/dt capabilities offer improved ruggedness

Higher gate voltage threshold offers improved noise immunity

Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note

*This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details.

APPLICATIONS

Zero voltage switching (SMPS)

Telecom and server power supplies

Uninterruptible power supplies

Motor control applications

ORDERING INFORMATION

Package

TO-247AC

 

 

Lead (Pb)-free

IRFP26N60LPbF

 

SiHFP26N60L-E3

 

 

 

SnPb

IRFP26N60L

 

SiHFP26N60L

 

 

 

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER

 

 

SYMBOL

LIMIT

UNIT

 

 

 

 

 

 

Drain-Source Voltage

 

 

VDS

600

V

Gate-Source Voltage

 

 

VGS

± 30

 

 

 

Continuous Drain Current

 

VGS at 10 V

TC = 25 °C

ID

26

 

 

TC = 100 °C

17

A

 

 

 

 

Pulsed Drain Current a

 

 

IDM

100

 

Linear Derating Factor

 

 

 

3.8

W/°C

 

 

 

 

 

 

Single Pulse Avalanche Energy b

 

 

EAS

570

mJ

Repetitive Avalanche Current a

 

 

IAR

26

A

Repetitive Avalanche Energy a

 

 

EAR

47

mJ

Maximum Power Dissipation

 

TC = 25 °C

PD

470

W

Peak Diode Recovery dV/dt c

 

 

dV/dt

21

V/ns

Operating Junction and Storage Temperature Range

 

 

TJ, Tstg

-55 to +150

°C

Soldering Recommendations (Peak Temperature) d

 

for 10 s

 

300

 

 

 

Mounting Torque

 

6-32 or M3 screw

 

10

lbf · in

 

 

 

 

 

 

1.1

N · m

 

 

 

 

 

 

 

 

 

 

 

 

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Starting TJ = 25 °C, L = 1.7 mH, Rg = 25 Ω, IAS = 26 A, dV/dt = 21 V/ns (see fig. 12).

c.ISD ≤ 26 A, dI/dt ≤ 480 A/μs, VDD ≤ VDS, TJ ≤ 150 °C.

d.1.6 mm from case.

S15-0456-Rev. D, 16-Mar-15

1

Document Number: 91218

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP26N60L, SiHFP26N60L

www.vishay.com

THERMAL RESISTANCE RATINGS

Vishay Siliconix

PARAMETER

SYMBOL

TYP.

MAX.

UNIT

 

 

 

 

 

Maximum Junction-to-Ambient

RthJA

-

40

 

Case-to-Sink, Flat, Greased Surface

RthCS

0.24

-

°C/W

Maximum Junction-to-Case (Drain)

RthJC

-

0.27

 

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER

 

SYMBOL

 

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Static

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-Source Breakdown Voltage

 

VDS

 

VGS = 0 V, ID = 250 μA

600

-

-

V

VDS Temperature Coefficient

 

VDS/TJ

 

Reference to 25 °C, ID = 1 mA

-

0.33

-

V/°C

Gate-Source Threshold Voltage

 

VGS(th)

 

VDS = VGS, ID = 250 μA

3.0

-

5.0

V

Gate-Source Leakage

 

IGSS

 

VGS = ± 30 V

-

-

± 100

nA

Zero Gate Voltage Drain Current

 

IDSS

 

VDS = 600 V, VGS = 0 V

-

-

50

μA

 

VDS = 480 V, VGS = 0 V, TJ = 125 °C

-

-

2.0

mA

 

 

 

Drain-Source On-State Resistance

 

RDS(on)

VGS = 10 V

 

ID = 10 A b

-

0.21

0.25

Ω

Forward Transconductance

 

gfs

 

VDS = 50 V, ID = 16 A

13

-

-

S

Dynamic

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

Ciss

 

 

VGS = 0 V,

-

5020

-

 

Output Capacitance

 

Coss

 

 

VDS = 25 V,

-

450

-

 

 

 

 

 

f = 1.0 MHz, see fig. 5

 

 

 

 

Reverse Transfer Capacitance

 

Crss

 

-

34

-

pF

 

 

 

 

 

 

 

 

 

 

Effective Output Capacitance

 

Coss eff.

 

 

 

 

 

 

 

 

 

-

230

-

 

Effective Output Capacitance

 

 

V

= 0 V

 

V = 0 V to 480 V c

 

 

 

 

 

Coss eff. (ER)

 

GS

 

DS

-

170

-

 

(Energy related)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Total Gate Charge

 

Qg

 

 

 

ID = 26 A, VDS = 480 V,

-

-

180

 

Gate-Source Charge

 

Qgs

VGS = 10 V

 

-

-

61

nC

 

 

see fig. 7 and 15b

Gate-Drain Charge

 

Qgd

 

 

 

-

-

85

 

 

 

 

 

 

 

 

 

 

 

 

Turn-On Delay Time

 

td(on)

 

VDD = 300 V, ID = 26 A,

-

31

-

 

Rise Time

 

tr

 

-

110

-

 

 

 

Rg = 4.3 Ω,VGS = 10 V

ns

Turn-Off Delay Time

 

td(off)

 

-

47

-

 

 

see fig. 11a and 11b b

 

Fall Time

 

tf

 

 

 

 

 

 

 

 

 

-

42

-

 

Drain-Source Body Diode Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Continuous Source-Drain Diode Current

 

IS

MOSFET symbol

-

-

26

 

 

 

 

showing the

 

 

 

 

 

D

 

 

 

A

 

 

 

 

 

 

 

 

 

 

 

 

Pulsed Diode Forward Current a

 

I

integral reverse

G

 

 

 

 

-

-

100

 

 

 

 

 

 

 

 

p - n junction diode

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SM

 

 

 

 

 

 

 

 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Body Diode Voltage

 

VSD

 

TJ = 25 °C, IS = 26 A, VGS = 0 V b

-

-

1.5

V

Body Diode Reverse Recovery Time

 

trr

 

TJ = 25 °C, IF = 26 A

-

170

250

ns

 

 

TJ = 125 °C, dI/dt = 100 A/μs b

-

210

320

 

 

 

 

 

Body Diode Reverse Recovery Charge

 

Qrr

 

TJ = 25 °C, IF = 26 A, VGS = 0 V b

-

670

1000

nC

 

 

TJ = 125 °C, dI/dt = 100 A/μs b

-

1050

1570

 

 

 

 

 

Reverse Recovery Current

 

IRRM

 

 

 

TJ = 25 °C

-

7.3

11

A

Forward Turn-On Time

 

ton

 

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Pulse width ≤ 300 μs; duty cycle ≤ 2 %.

c.Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDS. Coss eff. (ER) is a fixed capacitance that stores the same energy as Coss while VDS is rising from 0 % to 80 % VDS.

S15-0456-Rev. D, 16-Mar-15

2

Document Number: 91218

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Vishay IRFP26N60L, SiHFP26N60L Data Sheet

IRFP26N60L, SiHFP26N60L

www.vishay.com

Vishay Siliconix

 

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

 

 

1000

VGS

 

 

 

Top

 

 

 

15 V

 

 

 

 

12 V

 

 

 

 

10 V

 

 

 

100

8.0 V

 

 

<![if ! IE]>

<![endif]>(A)

7.0 V

 

 

 

6.5 V

 

 

<![if ! IE]>

<![endif]>Current

Bottom

6.0 V

 

 

5.5 V

 

 

10

 

 

 

<![if ! IE]>

<![endif]>-to-Source

 

 

 

1

 

 

 

<![if ! IE]>

<![endif]>, Drain

 

 

 

 

<![if ! IE]>

<![endif]>D

 

5.5 V

 

<![if ! IE]>

<![endif]>I

0.1

 

 

 

 

 

 

 

 

 

20 μs PULSE WIDTH

 

 

0.01

 

TJ = 25 °C

 

 

 

 

 

 

0.1

1

10

100

VDS, Drain-to-Source Voltage (V)

Fig. 1 - Typical Output Characteristics

 

100

Top

VGS

 

 

 

 

15 V

 

 

 

 

 

 

 

 

 

 

12 V

 

 

 

 

 

10 V

 

 

<![if ! IE]>

<![endif]>(A)

 

 

8.0 V

 

 

 

 

7.0 V

 

 

 

 

6.5 V

 

 

<![if ! IE]>

<![endif]>Current

 

 

 

 

 

Bottom

6.0 V

 

 

10

5.5 V

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>-to-Source

 

 

 

5.5 V

 

 

 

 

 

 

<![if ! IE]>

<![endif]>, Drain

1

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>D

 

 

 

 

 

<![if ! IE]>

<![endif]>I

 

 

 

 

 

 

 

 

 

20 μs PULSE WIDTH

 

 

0.1

 

 

TJ = 150 °C

 

 

 

 

 

 

 

 

0.1

1

10

100

VDS, Drain-to-Source Voltage (V)

Fig. 2 - Typical Output Characteristics

 

1000.00

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>(A)

 

100.00

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>Current

 

 

TJ = 150 °C

 

 

 

 

 

<![if ! IE]>

<![endif]>-to-Source

 

 

 

 

 

 

 

 

10.00

 

 

 

 

 

 

 

 

 

 

 

TJ = 25 °C

 

 

 

<![if ! IE]>

<![endif]>,Drain

 

 

 

 

 

 

 

 

1.00

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>I

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDS = 50 V

 

 

 

 

0.10

 

 

 

20 μs PULSE WIDTH

 

 

 

 

 

 

 

 

 

 

 

 

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

VGS, Gate-to-Source Voltage (V)

Fig. 3 - Typical Transfer Characteristics

<![if ! IE]>

<![endif]>(Normalized)

3.0

 

 

 

 

 

 

 

 

 

 

 

 

ID

= 26

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>ResistanceOn

2.5

VGS =

10 V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>Source-to-Drain

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>,

1.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>DS(on)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

<![if ! IE]>

<![endif]>R

0.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

- 60 - 40 - 20 0 20 40 60 80 100 120 140 160

TJ, Junction Temperature

Fig. 4 - Normalized On-Resistance vs. Temperature

S15-0456-Rev. D, 16-Mar-15

3

Document Number: 91218

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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