Vishay IRFI9Z34G, SiHFI9Z34G Data Sheet

IRFI9Z34G, SiHFI9Z34G

www.vishay.com

Vishay Siliconix

 

 

Power MOSFET

PRODUCT SUMMARY

VDS (V)

 

-60

 

RDS(on) ( )

 

VGS = -10 V

0.14

Qg max. (nC)

 

34

 

Qgs (nC)

 

9.9

 

Qgd (nC)

 

16

 

Configuration

 

Single

 

 

 

 

S

TO-220 FULLPAK

 

 

 

 

 

G

 

 

 

 

D

 

G D S

P-Channel MOSFET

 

 

 

FEATURES

• Isolated package

• High voltage isolation = 2.5 kVRMS (t = 60 s;

Available

f = 60 Hz)

• Sink to lead creepage distance = 4.8 mm

Available

P-channel

175 °C operating temperature

Dynamic dV/dt rating

Low thermal resistance

Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note

*This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details.

DESCRIPTION

Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The FULLPAK is mounted to a heatsink using a single clip or by a single screw fixing.

ORDERING INFORMATION

Package

TO-220 FULLPAK

 

 

Lead (Pb)-free

IRFI9Z34GPbF

 

SiHFI9Z34G-E3

 

 

 

SnPb

IRFI9Z34G

 

SiHFI9Z34G

 

 

 

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER

 

 

SYMBOL

LIMIT

UNIT

 

 

 

 

 

 

Drain-Source Voltage

 

 

VDS

-60

V

Gate-Source Voltage

 

 

VGS

± 20

 

 

 

Continuous Drain Current

 

VGS at -10 V

TC = 25 °C

ID

-12

 

 

TC = 100 °C

-8.5

A

 

 

 

 

Pulsed Drain Current a

 

 

IDM

-48

 

Linear Derating Factor

 

 

 

0.28

W/°C

 

 

 

 

 

 

Single Pulse Avalanche Energy b

 

 

EAS

370

mJ

Repetitive Avalanche Current a

 

 

IAR

-12

A

Repetitive Avalanche Energy a

 

 

EAR

4.2

mJ

Maximum Power Dissipation

 

TC = 25 °C

PD

42

W

Peak Diode Recovery dV/dt c

 

 

dV/dt

-4.5

V/ns

Operating Junction and Storage Temperature Range

 

 

TJ, Tstg

-55 to +175

°C

Soldering Recommendations (Peak temperature) d

 

for 10 s

 

300

 

 

 

Mounting Torque

 

6-32 or M3 screw

 

10

lbf · in

 

 

 

 

 

 

1.1

N · m

 

 

 

 

 

 

 

 

 

 

 

 

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.VDD = -25 V, starting TJ = 25 °C, L = 3.0 mH, RG = 25 , IAS = -12 A (see fig. 12).

c.ISD -12 A, dI/dt 170 A/μs, VDD VDS, TJ 175 °C.

d.1.6 mm from case.

S16-0763-Rev. B, 02-May-16

1

Document Number: 91172

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFI9Z34G, SiHFI9Z34G

www.vishay.com

THERMAL RESISTANCE RATINGS

Vishay Siliconix

PARAMETER

SYMBOL

TYP.

MAX.

UNIT

 

 

 

 

 

Maximum Junction-to-Ambient

RthJA

-

65

°C/W

Maximum Junction-to-Case (Drain)

RthJC

-

3.6

 

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

Static

 

 

 

 

 

 

 

 

 

Drain-Source Breakdown Voltage

VDS

VGS = 0 V, ID = 250 μA

-60

-

-

V

VDS Temperature Coefficient

VDS/TJ

Reference to 25 °C, ID = -1 mA

-

-0.060

-

V/°C

Gate-Source Threshold Voltage

VGS(th)

VDS = VGS, ID = 250 μA

-2.0

-

-4.0

V

Gate-Source Leakage

IGSS

 

VGS = ± 20 V

 

-

-

± 100

nA

Zero Gate Voltage Drain Current

IDSS

VDS = -60 V, VGS = 0 V

-

-

-100

μA

VDS = -48 V, VGS = 0 V, TJ = 150 °C

-

-

-500

 

 

 

Drain-Source On-State Resistance

RDS(on)

VGS = -10 V

 

ID = -7.2 A b

-

-

0.14

 

Forward Transconductance

gfs

VDS = -25 V, ID = -7.2 A b

5.4

-

-

S

Dynamic

 

 

 

 

 

 

 

 

 

Input Capacitance

Ciss

 

VGS = 0 V,

 

-

1100

-

 

Output Capacitance

Coss

 

VDS = -25 V,

 

-

620

-

pF

Reverse Transfer Capacitance

Crss

f = 1.0 MHz, see fig. 5

-

100

-

 

 

 

 

 

 

Drain to Sink Capacitance

C

 

f = 1.0 MHz

 

-

12

-

 

Total Gate Charge

Qg

 

ID = -18 A, VDS = -48 V,

-

-

34

 

Gate-Source Charge

Qgs

VGS = -10 V

-

-

9.9

nC

 

see fig. 6 and 13 b

Gate-Drain Charge

Qgd

 

 

 

 

-

-

16

 

Turn-On Delay Time

td(on)

VDD = -30 V, ID = -18 A,

-

18

-

 

Rise Time

tr

-

120

-

 

RG = 12 , RD= 1.5 ,

ns

Turn-Off Delay Time

td(off)

-

20

-

 

see fig. 10 b

 

 

Fall Time

tf

 

 

 

 

-

58

-

 

Internal Drain Inductance

LD

Between lead,

 

D

-

4.5

-

 

6 mm (0.25") from

 

 

 

 

 

 

 

 

 

 

nH

 

 

package and center of

G

 

 

 

Internal Source Inductance

LS

die contact

 

 

 

-

7.5

-

 

 

 

 

S

 

Gate Input Resistance

Rg

f = 1 MHz, open drain

0.7

-

3.9

 

Drain-Source Body Diode Characteristics

 

 

 

 

 

 

 

 

 

Continuous Source-Drain Diode Current

IS

MOSFET symbol

 

D

-

-

-12

 

showing the

 

 

 

 

 

 

 

 

 

 

 

A

 

 

integral reverse

 

 

 

 

 

Pulsed Diode Forward Current a

 

 

G

 

 

 

 

I

p -n junction diode

 

S

-

-

-48

 

 

SM

 

 

 

 

 

 

 

Body Diode Voltage

VSD

TJ = 25 °C, IS = -12 A, VGS = 0

V b

-

-

-6.3

V

Body Diode Reverse Recovery Time

trr

TJ = 25 °C, IF = -18 A, dI/dt = 100

A/μs b

-

100

200

ns

Body Diode Reverse Recovery Charge

Qrr

-

0.28

0.52

μC

 

 

Forward Turn-On Time

ton

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Pulse width 300 μs; duty cycle 2 %.

S16-0763-Rev. B, 02-May-16

2

Document Number: 91172

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Vishay IRFI9Z34G, SiHFI9Z34G Data Sheet

IRFI9Z34G, SiHFI9Z34G

www.vishay.com

Vishay Siliconix

 

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

 

 

Fig. 1 - Typical Output Characteristics, TC= 25 °C

 

Fig. 3 - Typical Transfer Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig. 2 - Typical Output Characteristics, TC= 175 °C

Fig. 4 - Normalized On-Resistance vs. Temperature

S16-0763-Rev. B, 02-May-16

3

Document Number: 91172

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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