Vishay IRFI720G, SiHFI720G Data Sheet

IRFI720G, SiHFI720G

www.vishay.com

Vishay Siliconix

 

 

Power MOSFET

PRODUCT SUMMARY

VDS (V)

 

400

RDS(on) (Ω)

VGS = 10 V

1.8

Qg (Max.) (nC)

 

20

Qgs (nC)

 

3.3

Qgd (nC)

 

11

Configuration

 

Single

TO-220 FULLPAK

 

D

 

 

 

G

 

 

S

S

G D

 

 

N-Channel MOSFET

FEATURES

• Isolated package

• High voltage isolation = 2.5 kVRMS (t = 60 s;

Available

f = 60 Hz)

 

• Sink to lead creepage distance = 4.8 mm

Available

Dynamic dV/dt rating

Low thermal resistance

Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Note

*This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details.

DESCRIPTION

Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The FULLPAK is mounted to a heatsink using a single clip or by a single screw fixing.

ORDERING INFORMATION

Package

TO-220 FULLPAK

Lead (Pb)-free

IRFI720GPbF

 

SiHFI720G-E3

 

 

 

SnPb

IRFI720G

SiHFI720G

 

 

 

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER

 

 

SYMBOL

LIMIT

UNIT

 

 

 

 

 

 

Drain-Source Voltage

 

 

VDS

400

V

Gate-Source Voltage

 

 

VGS

± 20

 

 

 

Continuous Drain Current

 

VGS at 10 V

TC = 25 °C

ID

2.6

 

 

TC = 100 °C

1.7

A

 

 

 

 

Pulsed Drain Current a

 

 

IDM

10

 

Linear Derating Factor

 

 

 

0.24

W/°C

 

 

 

 

 

 

Single Pulse Avalanche Energy b

 

 

EAS

150

mJ

Repetitive Avalanche Current a

 

 

IAR

2.6

A

Repetitive Avalanche Energy a

 

 

EAR

3.0

mJ

Maximum Power Dissipation

 

TC = 25 °C

PD

30

W

Peak Diode Recovery dV/dt c

 

 

dV/dt

4.0

V/ns

Operating Junction and Storage Temperature Range

 

 

TJ, Tstg

-55 to +150

°C

Soldering Recommendations (Peak Temperature) d

 

for 10 s

 

300

 

 

 

Mounting Torque

 

6-32 or M3 screw

 

10

lbf · in

 

 

 

 

 

 

1.1

N · m

 

 

 

 

 

 

 

 

 

 

 

 

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.VDD = 50 V, starting TJ = 25 °C, L = 38 mH, RG = 25 Ω, IAS = 2.6 A (see fig. 12).

c.ISD ≤ 3.3 A, dI/dt ≤ 65 A/μs, VDD ≤ VDS, TJ ≤ 150 °C.

d.1.6 mm from case.

S14-2355-Rev. B, 08-Dec-14

1

Document Number: 91152

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFI720G, SiHFI720G

www.vishay.com

THERMAL RESISTANCE RATINGS

Vishay Siliconix

PARAMETER

SYMBOL

TYP.

MAX.

UNIT

 

 

 

 

 

Maximum Junction-to-Ambient

RthJA

-

65

°C/W

Maximum Junction-to-Case (Drain)

RthJC

-

4.1

 

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER

 

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Static

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-Source Breakdown Voltage

 

VDS

VGS = 0 V, ID = 250 μA

400

-

-

V

VDS Temperature Coefficient

 

VDS/TJ

Reference to 25 °C, ID = 1 mA

-

0.51

-

V/°C

Gate-Source Threshold Voltage

 

VGS(th)

VDS = VGS, ID = 250 μA

2.0

-

4.0

V

Gate-Source Leakage

 

IGSS

 

VGS = ± 20 V

-

-

± 100

nA

Zero Gate Voltage Drain Current

 

IDSS

VDS = 400 V, VGS = 0 V

-

-

25

μA

 

VDS = 320 V, VGS = 0 V, TJ = 125 °C

-

-

250

 

 

 

 

Drain-Source On-State Resistance

 

RDS(on)

VGS = 10 V

 

 

ID = 1.6 A b

-

-

1.8

Ω

Forward Transconductance

 

gfs

VDS = 50 V, ID = 1.6 A b

1.5

-

-

S

Dynamic

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

Ciss

 

 

VGS = 0 V,

-

410

-

 

Output Capacitance

 

Coss

 

 

VDS = 25 V,

-

120

-

pF

 

 

 

f = 1.0 MHz, see fig. 5

 

 

 

Reverse Transfer Capacitance

 

Crss

-

47

-

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain to Sink Capacitance

 

C

 

 

f = 1.0 MHz

-

12

-

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Total Gate Charge

 

Qg

 

 

ID = 3.3 A, VDS = 320 V,

-

-

20

 

Gate-Source Charge

 

Qgs

VGS = 10 V

 

-

-

3.3

nC

 

 

see fig. 6 and 13 b

Gate-Drain Charge

 

Qgd

 

 

-

-

11

 

 

 

 

 

 

 

 

 

 

 

 

Turn-On Delay Time

 

td(on)

VDD = 200 V, ID = 3.3 A,

-

10

-

 

Rise Time

 

tr

-

14

-

 

 

RG = 18 Ω, RD= 56 Ω,

ns

Turn-Off Delay Time

 

td(off)

-

30

-

 

 

 

see fig. 10 b

 

Fall Time

 

tf

 

 

 

 

 

 

 

 

 

-

13

-

 

Internal Drain Inductance

 

LD

Between lead,

 

 

 

 

D

-

4.5

-

 

 

6 mm (0.25") from

 

 

 

 

 

 

 

 

 

 

package and center of

G

 

 

 

 

 

 

 

nH

Internal Source Inductance

 

LS

die contact

 

 

 

 

 

 

S

-

7.5

-

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain-Source Body Diode Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Continuous Source-Drain Diode Current

 

IS

MOSFET symbol

 

 

 

 

 

D

-

-

2.6

 

 

 

 

showing the

 

 

 

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pulsed Diode Forward Currenta

 

I

integral reverse

G

 

 

 

 

-

-

10

 

p - n junction diode

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SM

 

 

 

 

 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Body Diode Voltage

 

VSD

TJ = 25 °C, IS = 2.6 A, VGS = 0 V b

-

-

1.6

V

Body Diode Reverse Recovery Time

 

trr

TJ = 25 °C, IF = 3.3 A, dI/dt = 100 A/μs b

-

300

600

ns

Body Diode Reverse Recovery Charge

 

Qrr

-

1.5

3.0

μC

 

 

 

 

 

 

 

 

 

 

Forward Turn-On Time

 

ton

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes

a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

b.Pulse width ≤ 300 μs; duty cycle ≤ 2 %.

S14-2355-Rev. B, 08-Dec-14

2

Document Number: 91152

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Vishay IRFI720G, SiHFI720G Data Sheet

www.vishay.com

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

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<![endif]>D

<![if ! IE]>

<![endif]>I , Drain-to-Source Current (A)

Fig. 1 - Typical Output Characteristics, TC = 25 °C

IRFI720G, SiHFI720G

Vishay Siliconix

10

TJ = 25 °C

TJ = 150 °C

1

0.1

VDS = 26.2V

0.01

4

5

6

7

8

9

10

VGS, Gate-to-Source Voltage (V)

Fig. 3 - Typical Transfer Characteristics

 

 

 

 

Fig. 2 - Typical Output Characteristics, TC = 150 °C

Fig. 4 - Normalized On-Resistance vs. Temperature

S14-2355-Rev. B, 08-Dec-14

3

Document Number: 91152

 

For technical questions, contact: hvm@vishay.com

 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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