IRFD224, SiHFD224
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V) |
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250 |
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RDS(on) ( ) |
VGS = 10 V |
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1.1 |
Qg (Max.) (nC) |
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14 |
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Qgs (nC) |
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2.7 |
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Qgd (nC) |
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7.8 |
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Configuration |
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Single |
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D
HVMDIP
G
S
G
D S
N-Channel MOSFET
FEATURES |
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• Dynamic dV/dt Rating |
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• Repetitive Avalanche Rated |
RoHS |
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• For Automatic Insertion |
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COMPLIANT |
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•End Stackable
•Fast Switching
•Ease of Paralleling
•Simple Drive Requirements
•Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertiable case style which can be stacked in multiple combinations on standard 0.1" pin centers. The dual drain serveres as a thermal link to the mounting surface for power dissipation levels up to 1 W.
ORDERING INFORMATION
Package |
HVMDIP |
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Lead (Pb)-free |
IRFD224PbF |
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SiHFD224-E3 |
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ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER |
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SYMBOL |
LIMIT |
UNIT |
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Drain-Source Voltage |
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VDS |
250 |
V |
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Gate-Source Voltage |
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VGS |
± 20 |
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Continuous Drain Current |
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VGS at 10 V |
TA = 25 °C |
ID |
0.63 |
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TA = 100 °C |
0.40 |
A |
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Pulsed Drain Currenta |
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IDM |
5.0 |
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Linear Derating Factor |
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0.0083 |
W/°C |
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Single Pulse Avalanche Energyb |
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EAS |
60 |
mJ |
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Avalanche Currenta |
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IAR |
0.63 |
A |
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Repetitive Avalanche Energya |
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EAR |
0.10 |
mJ |
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Maximum Power Dissipation |
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TA = 25 °C |
PD |
1.0 |
W |
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Peak Diode Recovery dV/dtc |
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dV/dt |
4.8 |
V/ns |
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Operating Junction and Storage Temperature Range |
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TJ, Tstg |
- 55 to + 150 |
°C |
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Soldering Recommendations (Peak Temperature) |
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for 10 s |
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300d |
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Notes
a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b.VDD = 50 V, starting TJ = 25 °C, L = 15 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).
c.ISD 4.4 A, dI/dt 90 A/μs, VDD VDS, TJ 150 °C.
d.1.6 mm from case.
Document Number: 91132 |
www.vishay.com |
S10-2462-Rev. C, 08-Nov-10 |
1 |
IRFD224, SiHFD224
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER |
SYMBOL |
TYP. |
MAX. |
UNIT |
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Maximum Junction-to-Ambient |
RthJA |
- |
120 |
°C/W |
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER |
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SYMBOL |
TEST CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
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Static |
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Drain-Source Breakdown Voltage |
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VDS |
VGS = 0 V, ID = 250 μA |
250 |
- |
- |
V |
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VDS Temperature Coefficient |
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VDS/TJ |
Reference to 25 °C, ID = 1 mA |
- |
0.36 |
- |
V/°C |
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Gate-Source Threshold Voltage |
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VGS(th) |
VDS = VGS, ID = 250 μA |
2.0 |
- |
4.0 |
V |
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Gate-Source Leakage |
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IGSS |
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VGS = ± 20 V |
- |
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± 100 |
nA |
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Zero Gate Voltage Drain Current |
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IDSS |
VDS = 250 V, VGS = 0 V |
- |
- |
25 |
μA |
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VDS = 200 V, VGS = 0 V, TJ = 125 °C |
- |
- |
250 |
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Drain-Source On-State Resistance |
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RDS(on) |
VGS = 10 V |
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ID = 0.38 Ab |
- |
- |
1.1 |
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Forward Transconductance |
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gfs |
VDS = 50 V, ID = 2.6 A |
1.5 |
- |
- |
S |
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Dynamic |
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Input Capacitance |
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Ciss |
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VGS = 0 V, |
- |
260 |
- |
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Output Capacitance |
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Coss |
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pF |
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VDS = 25 V, |
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77 |
- |
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f = 1.0 MHz, see fig. 5 |
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Reverse Transfer Capacitance |
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Crss |
- |
15 |
- |
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Total Gate Charge |
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Qg |
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ID = 4.4 A, VDS = 200 V, |
- |
- |
14 |
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Gate-Source Charge |
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Qgs |
VGS = 10 V |
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- |
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2.7 |
nC |
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see fig. 6 and 13b |
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Gate-Drain Charge |
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Qgd |
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- |
- |
7.8 |
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Turn-On Delay Time |
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td(on) |
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- |
7.0 |
- |
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Rise Time |
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tr |
VDD |
= 125 V, ID = 4.4 A, |
- |
13 |
- |
ns |
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Turn-Off Delay Time |
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td(off) |
Rg = 18 , RD = 28 |
, see fig. 10b |
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20 |
- |
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Fall Time |
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tf |
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12 |
- |
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Internal Drain Inductance |
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LD |
Between lead, |
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D |
- |
4.0 |
- |
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6 mm (0.25") from |
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Internal Source Inductance |
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LS |
package and center of |
G |
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- |
6.0 |
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nH |
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die contact |
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S |
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Drain-Source Body Diode Characteristics |
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Continuous Source-Drain Diode Current |
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IS |
MOSFET symbol |
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D |
- |
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0.63 |
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showing the |
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A |
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integral reverse |
G |
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Pulsed Diode Forward Currenta |
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ISM |
p - n junction diode |
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S |
- |
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5.0 |
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Body Diode Voltage |
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VSD |
TJ = 25 °C, IS = 0.63 A, VGS = 0 Vb |
- |
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1.8 |
V |
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Body Diode Reverse Recovery Time |
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trr |
TJ = 25 °C, IF = 4.4 A, dI/dt = 100 A/μsb |
- |
200 |
400 |
ns |
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Body Diode Reverse Recovery Charge |
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Qrr |
- |
0.93 |
1.9 |
μC |
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Forward Turn-On Time |
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ton |
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) |
Notes
a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b.Pulse width 300 μs; duty cycle 2 %.
www.vishay.com |
Document Number: 91132 |
2 |
S10-2462-Rev. C, 08-Nov-10 |
IRFD224, SiHFD224
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
TA = 25 °C
Fig. 1 - Typical Output Characteristics, TA = 25 °C |
Fig. 3 - Typical Transfer Characteristics |
TA = 150 °C
Fig. 2 - Typical Output Characteristics, TA = 150 °C |
Fig. 4 - Normalized On-Resistance vs. Temperature |
Document Number: 91132 |
www.vishay.com |
S10-2462-Rev. C, 08-Nov-10 |
3 |