Vishay IRF9640, SiHF9640 Datasheet

P-Channel MOSFET

TO-220AB

Power MOSFET

IRF9640, SiHF9640

Vishay Siliconix

PRODUCT SUMMARY

VDS (V) - 200

(Ω)V

DS(on)

(Max.) (nC) 44

(nC) 7.1

(nC) 27

Configuration Single

= - 10 V 0.50

FEATURES

• Dynamic dV/dt Rating

• Repetitive Avalanche Rated

• P-Channel

•Fast Switching

• Ease of Paralleling

• Simple Drive Requirements

• Compliant to RoHS Directive 2002/95/EC

DESCRIPTION

Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220AB contribute to its wide acceptance throughout the industry.

ORDERING INFORMATION

Package TO-220AB

Lead (Pb)-free

SnPb

IRF9640PbF SiHF9640-E3 IRF9640 SiHF9640

Available

RoHS*

COMPLIANT

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT

Drain-Source Voltage

Gate-Source Voltage V

= 25 °C

Continuous Drain Current V

Pulsed Drain Current

at - 10 V

= 100 °C - 6.8

± 20 V

IDM - 44

Linear Derating Factor 1.0 W/°C

Single Pulse Avalanche Energy

Repetitive Avalanche Current

Repetitive Avalanche Energy

Maximum Power Dissipation T

Peak Diode Recovery dV/dt

= 25 °C P

Operating Junction and Storage Temperature Range T

dV/dt - 5.0 V/ns

, T

stg

Soldering Recommendations (Peak Temperature) for 10 s 300

Mounting Torque 6-32 or M3 screw

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V

= - 50 V, starting TJ = 25 °C, L = 8.7 mH, Rg = 25 Ω, IAS = - 11 A (see fig. 12).

c. I

≤ - 11 A, dI/dt ≤ 150 A/μs, VDD ≤ VDS, TJ ≤ 150 °C.

d. 1.6 mm from case.

* Pb containing terminations are not RoHS compliant, exemptions may apply

Document Number: 91086 www.vishay.com S11-0513-Rev. B, 21-Mar-11 1

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

This datasheet is subject to change without notice.

- 200 V

- 11

700 mJ

- 11 A

13 mJ

125 W

- 55 to + 150

10 lbf · in

1.1 N · m

www.vishay.com/doc?91000

°C

IRF9640, SiHF9640

Vishay Siliconix

THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL TYP. MAX. UNIT

Maximum Junction-to-Ambient R

Maximum Junction-to-Case (Drain) R

thJA

thCS

thJC

-62

0.50 -

-1.0

°C/WCase-to-Sink, Flat, Greased Surface R

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

Static

Drain-Source Breakdown Voltage V

Temperature Coefficient ΔVDS/TJ Reference to 25 °C, ID = - 1 mA - -0.2 -

Gate-Source Threshold Voltage V

Gate-Source Leakage I

Zero Gate Voltage Drain Current I

Drain-Source On-State Resistance R

Forward Transconductance g

GS(th)

GSS

DSS

VGS = - 10 V ID = - 6.6 A

DS(on)

Dynamic

Input Capacitance C

Reverse Transfer Capacitance C

Total Gate Charge Q

Gate-Drain Charge Q

Turn-On Delay Time t

Rise Time t

Turn-Off Delay Time t

Fall Time t

Internal Drain Inductance L

Internal Source Inductance L

iss

- 370 -

oss

-81-

rss

--7.1

--27

d(on)

-39-

d(off)

-38-

Between lead, 6 mm (0.25") from package and center of

die contact

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current I

Pulsed Diode Forward Current

Body Diode Voltage V

Body Diode Reverse Recovery Time t

Body Diode Reverse Recovery Charge Q

Forward Turn-On Time t

MOSFET symbol showing the integral reverse p - n junction diode

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %.

VGS = 0 V, ID = - 250 μA - 200 - -

VDS = VGS, ID = - 250 μA - 2.0 -

= ± 20 V - -

VDS = - 200 V, VGS = 0 V - -

= - 160 V, VGS = 0 V, TJ = 125 °C - -

VDS = - 50 V, ID = - 6.6 A

VGS = 0 V,

= - 25 V,

4.1 - -

- 1200 -

- 4.0 V

± 100 nA

- 100

- 500

0.50 Ω

f = 1.0 MHz, see fig. 5

--44

= - 11 A, VDS = - 160 V,

= - 10 V

see fig. 6 and 13

-14-

= - 100 V, ID = - 11 A

= 9.1 Ω, RD = 8.6 Ω, see fig. 10

-43-

-4.5-

-7.5-

TJ = 25 °C, IS = - 11 A, VGS = 0 V

TJ = 25 °C, IF = - 11 A, dI/dt = 100 A/μs

--- 11

--- 44

250 300 ns

2.9 3.6 μC

- 5 V

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

V/°C

μA

pFOutput Capacitance C

nC Gate-Source Charge Q

www.vishay.com Document Number: 91086 2 S11-0513-Rev. B, 21-Mar-11

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

This datasheet is subject to change without notice.

www.vishay.com/doc?91000

91086_01

Bottom

To p

- 15 V

- 10 V

- 8.0 V

- 7.0 V

- 6.0 V

- 5.5 V

- 5.0 V

- 4.5 V

20 µs Pulse Width T

= 25 °C

- 4.5 V

- VDS, Drain-to-Source Voltage (V)

- I

, Drain Current (A)

- V

Drain-to-Source Voltage (V)

- I

, Drain Current (A)

Bottom

To p

- 15 V

- 10 V

- 8.0 V

- 7.0 V

- 6.0 V

- 5.5 V

- 5.0 V

- 4.5 V

20 µs Pulse Width T

= 150 °C

91086_02

- 4.5 V

20 µs Pulse Width V

= - 50 V

- I

, Drain Current (A)

- V

Gate-to-Source Voltage (V)

5678910

25 °C

150 °C

91086_03

IRF9640, SiHF9640

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Fig. 1 - Typical Output Characteristics, TC = 25 °C

Vishay Siliconix

Fig. 3 - Typical Transfer Characteristics

3.0 I

= - 11 A

= - 10 V

2.5

2.0

1.5

(Normalized)

1.0

, Drain-to-Source On Resistance

0.5

DS(on)

0.0

- 60 - 40 - 20 0 20 40 6080100 120 140 160

Junction Temperature (°C)

91086_04

Fig. 2 - Typical Output Characteristics, T

= 150 °C

Fig. 4 - Normalized On-Resistance vs. Temperature

Document Number: 91086 www.vishay.com S11-0513-Rev. B, 21-Mar-11 3

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

This datasheet is subject to change without notice.

www.vishay.com/doc?91000

+ 6 hidden pages