VISHAY IRF 9520 Datasheet

Page 1
Power MOSFET
IRF9520, SiHF9520
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) - 100
R
(Ω)V
DS(on)
Q
(Max.) (nC) 18
g
Q
(nC) 3.0
gs
Q
(nC) 9.0
gd
Configuration Single
= - 10 V 0.60
GS
S
FEATURES
• Dynamic dV/dt Rating
• P-Channel
• 175 °C Operating Temperature
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
TO-220
DESCRIPTION
G
S
D
G
D
P-Channel MOSFET
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
ORDERING INFORMATION
Package TO-220
Lead (Pb)-free
SnPb
IRF9520PbF SiHF9520-E3 IRF9520 SiHF9520
Available
RoHS*
COMPLIANT
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
T
= 25 °C
Continuous Drain Current V
Pulsed Drain Current
a
at - 10 V
GS
C
= 100 °C - 4.8
C
DS
± 20
GS
I
D
IDM - 27
Linear Derating Factor 0.40 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
b
a
a
= 25 °C P
c
C
Operating Junction and Storage Temperature Range T
E
AS
I
AR
E
AR
D
dV/dt - 5.5 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Mounting Torque 6-32 or M3 screw
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V
= - 25 V, starting TJ = 25 °C, L = 9.7 mH, RG = 25 Ω, IAS = - 6.8 A (see fig. 12).
DD
c. I
- 6.8 A, dI/dt 110 A/µs, VDD VDS, TJ 175 °C.
SD
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91074 www.vishay.com S-81272-Rev. A, 16-Jun-08 1
- 100
- 6.8
300 mJ
- 6.8 A
6.0 mJ
60 W
- 55 to + 175
d
10 lbf · in
1.1 N · m
V
AT
°C
Page 2
IRF9520, SiHF9520
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
Maximum Junction-to-Case (Drain) R
thJA
thCS
thJC
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
Temperature Coefficient ΔVDS/TJ Reference to 25 °C, ID = - 1 mA - - 0.10 -
V
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
Dynamic
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Internal Drain Inductance L
Internal Source Inductance L
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Forward Turn-On Time t
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 µs; duty cycle 2 %.
DS
GS(th)
V
GSS
DSS
VGS = - 10 V ID = - 4.1 A
DS(on)
fs
iss
- 170 -
oss
-45-
rss
g
--3.0
gs
--9.0
gd
d(on)
r
-21-
d(off)
-25-
f
D
V
V
GS
R
Between lead, 6 mm (0.25") from package and center of
S
S
die contact
MOSFET symbol showing the integral reverse
I
SM
SD
rr
rr
on
p - n junction diode
TJ = 25 °C, IS = - 6.8 A, VGS = 0 V
TJ = 25 °C, IF = - 6.8 A, dI/dt = 100 A/µs
-62
0.50 -
°C/WCase-to-Sink, Flat, Greased Surface R
-2.5
VGS = 0 V, ID = - 250 µA - 100 - -
VDS = VGS, ID = - 250 µA - 2.0 -
= ± 20 V - - ± 100
GS
- 4.0 V
VDS = - 100 V, VGS = 0 V - - - 100
= - 80 V, VGS = 0 V, TJ = 150 °C - - - 500
DS
VDS = - 50 V, ID = - 4.1 A
VGS = 0 V,
V
= - 25 V,
DS
f = 1.0 MHz, see fig. 5
b
b
- - 0.60
2.0 - -
- 390 -
--18
= - 6.8 A, VDS = - 80 V,
I
= - 10 V
D
see fig. 6 and 13
b
-9.6-
V
= - 50 V, ID = - 6.8 A,
DD
= 18 Ω, RD = 7.1 Ω, see fig. 10
G
G
G
b
D
S
D
S
b
-29-
-4.5-
-7.5-
--- 6.8
--- 27
--- 6.3
-98200
b
- 0.33 0.66
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
V
V/°C
nA
µA
Ω
S
pFOutput Capacitance C
nC Gate-Source Charge Q
ns
nH
A
V
ns
µC
www.vishay.com Document Number: 91074 2 S-81272-Rev. A, 16-Jun-08
Page 3
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
IRF9520, SiHF9520
Vishay Siliconix
Fig. 1 - Typical Output Characteristics, TC = 25 °C
Fig. 2 - Typical Output Characteristics, T
= 175 °C
C
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91074 www.vishay.com S-81272-Rev. A, 16-Jun-08 3
Page 4
IRF9520, SiHF9520
Vishay Siliconix
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
Fig. 8 - Maximum Safe Operating Area
www.vishay.com Document Number: 91074 4 S-81272-Rev. A, 16-Jun-08
Page 5
IRF9520, SiHF9520
Vishay Siliconix
R
D.U.T.
D
-
+
V
DS
V
GS
R
G
- 10 V
Pulse width 1 µs Duty factor 0.1 %
Fig. 10a - Switching Time Test Circuit
V
DD
Fig. 9 - Maximum Drain Current vs. Case Temperature
V
10 %
90 %
V
t
t
d(on)
GS
DS
r
t
d(off)
t
f
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Vary tp to obtain required I
AS
R
G
- 10 V
V
L
DS
D.U.T
I
AS
t
p
0.01 Ω
-
V
+
DD
I
AS
V
DS
V
t
p
V
DD
DS
Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms
Document Number: 91074 www.vishay.com S-81272-Rev. A, 16-Jun-08 5
Page 6
IRF9520, SiHF9520
Vishay Siliconix
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Q
- 10 V
V
Q
GS
G
G
Q
GD
Charge
Fig. 13a - Basic Gate Charge Waveform
Current regulator
Same type as D.U.T.
50 kΩ
0.2 µF
12 V
0.3 µF
D.U.T.
V
GS
- 3 mA
I
G
Current sampling resistors
I
D
Fig. 13b - Gate Charge Test Circuit
-
V
+
DS
www.vishay.com Document Number: 91074 6 S-81272-Rev. A, 16-Jun-08
Page 7
IRF9520, SiHF9520
Peak Diode Recovery dV/dt Test Circuit
Vishay Siliconix
D.U.T.
+
Circuit layout considerations
Low stray inductance
Ground plane
Low leakage inductance
-
current transformer
+
-
R
G
dV/dt controlled by R
ISD controlled by duty factor "D"
D.U.T. - device under test
Compliment N-Channel of D.U.T. for driver
Driver gate drive
P.W.
Period
-
D =
G
P.W.
Period
+
+
V
DD
-
= - 10 V*
V
GS
waveform
SD
Body diode forward
current
waveform
DS
Body diode forward drop
Ripple 5 %
= - 5 V for logic level and - 3 V drive devices
GS
dI/dt
Diode recovery
dV/dt
V
DD
I
SD
Reverse recovery current
Re-applied voltage
D.U.T. I
D.U.T. V
Inductor current
* V
Fig. 14 - For P-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?91074.
Document Number: 91074 www.vishay.com S-81272-Rev. A, 16-Jun-08 7
Page 8
Legal Disclaimer Notice
Vishay

Disclaimer

All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com Revision: 18-Jul-08 1
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