Vishay I-PAK - S, D-PAK Dimensional Sheet
I-PAK - S, D-PAK
E
D
L5
L4
ee
A
c2
L
c
H
D1
123
4
b
b3
b2
b3
E1
DIMENSIONS FOR I-PAK - S in millimeters
Outline Dimensions
Vishay Semiconductors
SYMBOL
E 6.40 6.60 6.70
L 3.98 4.13 4.28
L4 0.66 0.76 0.86
L5 1.96 2.16 2.36
D 6.00 6.10 6.20
H 11.05 11.25 11.45
b 0.64 0.76 0.88
b2 0.77 0.84 1.14
b3 5.21 5.34 5.46
b4 0.41 0.51 0.61
e 2.286 BSC
A 2.20 2.30 2.38
c 0.40 0.50 0.60
c2 0.40 0.50 0.60
D1 5.30 - -
E1 4.40 - -
DIMENSIONAL REQUIREMENTS
MIN. NOM. MAX.
Document Number: 95024 For technical questions within your region, please contact one of the following: www.vishay.com
Revision: 05-Jan-11 DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com 1
Outline Dimensions
Vishay Semiconductors
I-PAK - S, D-PAK
DIMENSIONS FOR D-PAK in millimeters and inches
(5)
(2) L5
Ø 2
(3)
3
A
L3 (3)
D (5)
b
0.010
Lead tip
0.010
B
L4
M
M
CAB
Detail “C”
CAB
Rotated 90 °CW
Ø 1
Detail “C”
Scale: 20:1
Gauge
plane
L2
E
b3
4
1
2
b2
e
2 x
A
Seating
plane
Ø
C
c2
c
C
C
L
A
H
A
(L1)
D1
A1
E1
3241
C
H
(7)
Seating
plane
0.488 (12.40)
0.409 (10.40)
0.06
MIN.
(1.524)
0.093 (2.38)
0.085 (2.18)
Pad layout
0.265
MIN.
(6.74)
0.245
(6.23)
0.089
(2.28)
MIN.
MIN.
SYMBOL
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
A 2.18 2.39 0.086 0.094 e 2.29 BSC 0.090 BSC
A1 - 0.13 - 0.005 H 9.40 10.41 0.370 0.410
b 0.64 0.89 0.025 0.035 L 1.40 1.78 0.055 0.070
b2 0.76 1.14 0.030 0.045 L1 2.74 BSC 0.108 REF.
b3 4.95 5.46 0.195 0.215 3 L2 0.51 BSC 0.020 BSC
c 0.46 0.61 0.018 0.024 L3 0.89 1.27 0.035 0.050 3
c2 0.46 0.89 0.018 0.035 L4 - 1.02 - 0.040
D 5.97 6.22 0.235 0.245 5 L5 1.14 1.52 0.045 0.060 2
D1 5.21 - 0.205 - 3 Ø 0° 10° 0° 10°
E 6.35 6.73 0.250 0.265 5 Ø1 0° 15° 0° 15°
E1 4.32 - 0.170 - 3 Ø2 25° 35° 25° 35°
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension uncontrolled in L5
(3)
Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4)
Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5)
Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6)
Dimension b1 and c1 applied to base metal only
(7)
Datum A and B to be determined at datum plane H
(8)
Outline conforms to JEDEC outline TO-252AA
www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 95024
2 DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com Revision: 05-Jan-11
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