The IL410/ IL4108 consists of a GaAs IRLED optically
coupled to a photosensitive zero crossing TRIAC network. The TRIAC consists of two inverse parallel connected monolithic SCRs. These three semiconductors are assembled in a six pin dual in-line
package.
High input sensitivity is achieved by using an emitter
follower phototransistor and a cascaded SCR predriver resulting in an LED trigger current of less than
2.0 mA (DC).
The IL410/ IL4108 uses two discrete SCRs resulting
in a commutating dV/dt greater than 10 kV/µs. The
use of a proprietary dV/dt clamp results in a static dV/
dt of greater than 10 kV/µs. This clamp circuit has a
MOSFET that is enhanced when high dV/dt spikes
occur between MT1 and MT2 of the TRIAC. When
conducting, the FET clamps the base of the phototransistor, disabling the first stage SCR predriver.
The zero cross line voltage detection circuit consists
of two enhancement MOSFETS and a photodiode.
The inhibit voltage of the network is determined by the
enhancement voltage of the N-channel FET. The Pchannel FET is enabled by a photocurrent source that
permits the FET to conduct the main voltage to gate
on the N-channel FET. Once the main voltage can
enable the N-channel, it clamps the base of the phototransistor, disabling the first stage SCR predriver.
The 600/800 V blocking voltage permits control of offline voltages up to 240 VAC, with a safety factor of
more than two, and is sufficient for as much as
380 VAC.
The IL410/ IL4108 isolates low-voltage logic from
120, 240, and 380 VAC lines to control resistive,
inductive, or capacitive loads including motors, solenoids, high current thyristors or TRIAC and relays.
Document Number 83627
Rev. 1.4, 26-Apr-04
www.vishay.com
1
IL410/ IL4108
VISHAY
Vishay Semiconductors
Order Information
PartRemarks
IL410600 V V
IL4108800 V V
IL410-X006600 V V
IL410-X007600 V V
IL410-X009600 V V
IL4108-X006800 V V
IL4108-X007800 V V
IL4108-X009800 V V
For additional information on the available options refer to
Option Information.
, DIP-6
DRM
, DIP-6
DRM
, DIP-6 400 mil (option 6)
DRM
, SMD-6 (option 7)
DRM
, SMD-6 (option 9)
DRM
, DIP-6 400 mil (option 6)
DRM
, SMD-6 (option 7)
DRM
, SMD-6 (option 9)
DRM
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is
not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
Maximum Rating for extended periods of the time can adversely affect reliability.
Input
ParameterTest conditionSymbolValueUnit
Reverse voltageV
Forward currentI
Surge currentI
Power dissipationP
Derate from 25 °C1.33mW/°C
R
F
FSM
diss
6.0V
60mA
2.5A
100mW
Output
ParameterTest conditionPartSymbolVa lueUnit
Peak off-state voltageIL410V
IL4108V
RMS on-state currentI
Single cycle surge current3.0A
Total power dissipationP
Derate from 25 °C6.6mW/°C
DM
DM
TM
diss
600V
800V
300mA
500mW
Coupler
ParameterTest conditionSymbolValueUnit
Isolation test voltage (between
emitter and detector, climate per
DIN 500414, part 2, Nov. 74)
Pollution degree (DIN VDE
0109)
Creepage≥ 7.0mm
Clearance≥ 7.0mm
t = 1.0 min.V
ISO
5300V
2
RMS
www.vishay.com
2
Document Number 83627
Rev. 1.4, 26-Apr-04
VISHAY
IL410/ IL4108
Vishay Semiconductors
ParameterTest conditionSymbolValu eUnit
Comparative tracking index per
≥ 175
DIN IEC 112/VDE 0303 part 1,
group IIIa per DIN VDE 6110
Isolation resistanceV
= 500 V, T
IO
= 500 V, T
V
IO
= 25 °CR
amb
= 100 °CR
amb
Storage temperature rangeT
Ambient temperature rangeT
Soldering temperaturemax. ≤ 10 sec. dip soldering
≥ 0.5 mm from case bottom
T
IO
IO
stg
amb
sld
12
≥ 10
11
≥ 10
- 55 to + 150°C
- 55 to + 100°C
260°C
Ω
Ω
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
Input
ParameterTest conditionSymbolMinTy p.MaxUnit
Forward voltageI
Reverse currentV
Input capacitanceV
Thermal resistance, junction to
ambient
= 10 mAV
F
= 6.0 VI
R
= 0 V, f = 1.0 MHzC
F
F
R
IN
R
thja
1.161.35V
0.110µA
25pF
750°C/W
Output
ParameterTest conditionPartSymbolMinTy p.MaxUnit
Off-state voltageI
Repetitive peak off-state voltage I
Off-state currentV
On-state voltageI
On-state currentPF = 1.0, V
Surge (non-repetitive), on-state
current
Trigger current 1V
Trigger current 2V
Trigger current temp. gradient∆I
Inhibit voltage temp. gradient∆V
Off-state current in inhibit stateI
Holding currentI
Latching currentV
Zero cross inhibit voltageI
Turn-on timeV
Turn-off timePF = 1.0, I
= 70 µAIL410V
D(RMS)
IL4108V
= 100 µAIL410V
DRM
IL4108V
= V
, T
D
DRM
= 0 mA
I
F
V
= V
D
DRM
= 300 mAV
T
= 100 °C,
amb
, IF = Rated I
T(RMS)
FT
= 1.7 VI
f = 50 HzI
= 5.0 VI
D
= 220 V, f = 50 Hz,
OP
T
= 100 °C, tpF > 10 ms
J
∆I
= I
, V
F
FT1
DRM
= 2.2 VI
T
= Rated I
F
RM
FT
= VDM = V
D(RMS)
= 300 mAt
T
D(RMS)
D(RMS)
DRM
DRM
I
D(RMS)1
I
D(RMS)2
TM
TM
TSM
FT1
I
FT2
FT1
FT2
DINH
I
DINH
H
L
V
IH
t
on
off
/∆T
/∆T
/∆T
424460V
565V
600V
800V
10100µA
1.73.0V
j
j
j
7.014µA/°C
7.014µA/°C
-20mV/°C
50200µA
65500µA
5.0mA
1525V
35µs
50µs
200µA
300mA
3.0A
2.0mA
6.0mA
Document Number 83627
Rev. 1.4, 26-Apr-04
www.vishay.com
3
IL410/ IL4108
iil410_01
400350300250200150100500
.001
.01
.1
1
IL - Load Current - mA(RMS)
Cs - Shunt Capacitance - µF
Cs(µF) = 0.0032 (µF)* 10^(0.0066IL (mA)
Ta = 25°C, PF = 0.3
IF = 2.0 mA
Vishay Semiconductors
ParameterTest conditionPartSymbolMinTy p.MaxUnit
Critical rate of rise of off-state
voltage
Critical rate of rise of voltage at
current commutation
Critical rate of rise of on-statedI/dt
Thermal resistance, junction to
ambient
Coupler
ParameterTest conditionSymbolMinTy p.MaxUnit
Critical rate of rise of coupled
input/output voltage
Common mode coupling
capacitance
Capacitance (input-output)f = 1.0 MHz, V
Isolation resistanceV
VD = 0.67 V
= 0.67 V
V
D
= 0.67 V
V
D
≤ 15 A/ms, TJ = 25 °C
dI/dt
crq
V
= 0.67 V
D
≤ 15 A/ms, TJ = 80 °C
dI/dt
crq
= 0 A, VRM = VDM = V
I
T
= 500 V, T
IO
= 500 V, T
V
IO
, TJ = 25 °CdV/dt
DRM
, TJ = 80 °CdV/dt
DRM
,
DRM
,
DRM
= 0 VC
IO
= 25 °CR
amb
= 100 °CR
amb
D(RMS)
dV/dt
dV/dt
dVIO/dt10000V/µs
C
CM
IO
IO
IO
VISHAY
10000V/µs
cr
cr
crq
crq
cr
R
thja
5000V/µs
10000V/µs
5000V/µs
8.0A/µs
150°C/W
0.01pF
0.8pF
≥ 10
≥ 10
12
11
Ω
Ω
Power Factor Considerations
A snubber isn’t needed to eliminate false operation of
the TRIAC driver because of the IL410/ IL4108’s high
static and commutating dV/dt with loads between 1.0
and 0.8 power factors. When inductive loads with
power factors less than 0.8 are being driven, include
a RC snubber or a single capacitor directly across the
device to damp the peak commutating dV/dt spike.
Normally a commutating dV/dt causes a turning-off
device to stay on due to the stored energy remaining
in the turning-off device.
But in the case of a zero voltage crossing optotriac,
the commutating dV/dt spikes can inhibit one half of
the TRIAC from turning on. If the spike potential
exceeds the inhibit voltage of the zero cross detection
circuit, half of the TRIAC will be held-off and not turnon. This hold-off condition can be eliminated by using
a snubber or capacitor placed directly across the
optotriac as shown in Figure 1. Note that the value of
the capacitor increases as a function of the load current.
Fig. 1 Shunt Capacitance vs. Load Current
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4
Document Number 83627
Rev. 1.4, 26-Apr-04
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