Vishay HFA30TA60CSPBF Data Sheet

VS-HFA30TA60CSPbF

Vishay High Power Products

Ultrafast Soft Recovery Diode, 2 x 15 A

D2PAK

PRODUCT SUMMARY

V

R

V

at 15 A at 25 °C 1.7 V

F

I

F(AV)

t

(typical) 19 ns

rr

T

(maximum) 150 °C

J

Q

(typical) 80 nC

rr

/dt (typical) at 125 °C 160 A/μs

dI

(rec)M

I

(typical) 4.0 A

RRM

Anode Anode

Base

common

cathode

1

Common

cathode

2

2

600 V

2 x 15 A

HEXFRED

3

®

FEATURES

• Ultrafast recovery

• Ultrasoft recovery

• Very low I

• Very low Q

• Specified at operating conditions

• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C

• Halogen-free according to IEC 61249-2-21
definition

• Compliant to RoHS directive 2002/95/EC

• AEC-Q101 qualified

BENEFITS

• Reduced RFI and EMI

• Reduced power loss in diode and switching transistor

• Higher frequency operation

• Reduced snubbing

• Reduced parts count

DESCRIPTION

VS-HFA30TA60CS is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial
construction and advanced processing techniques it
features a superb combination of characteristics which
result in performance which is unsurpassed by any rectifier
previously available. With basic ratings of 600 V and 15 A
per leg continuous current, the VS-HFA30TA60CS is
especially well suited for use as the companion diode for
IGBTs and MOSFETs. In addition to ultrafast recovery time,
the HEXFRED
peak recovery current (I
tendency to “snap-off” during the tb portion of recovery. The
HEXFRED features combine to offer designers a rectifier
with lower noise and significantly lower switching losses in
both the diode and the switching transistor. These
HEXFRED advantages can help to significantly reduce
snubbing, component count and heatsink sizes. The
HEXFRED VS-HFA30TA60CS is ideally suited for
applications in power supplies and power conversion
systems (such as inverters), motor drives, and many other
similar applications where high speed, high efficiency is
needed.

RRM

rr

®

product line features extremely low values of

) and does not exhibit any

RRM

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Cathode to anode voltage V

Maximum continuous forward current

Single pulse forward current I

Maximum repetitive forward current I

Maximum power dissipation P

Operating junction and storage temperature range T

Document Number: 94071 For technical questions, contact: [e-mail]
Revision: 22-Feb-10 1

per leg

per device 30

J

I

F

FSM

FRM

, T

R

TC = 100 °C

D

TC = 25 °C 74

T

= 100 °C 29

C

Stg

600 V

15

150

60

°C

- 55 to + 150 W

www.vishay.com

A

VS-HFA30TA60CSPbF

Vishay High Power Products

HEXFRED

®

Ultrafast Soft Recovery Diode, 2 x 15 A

ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Cathode to anode
breakdown voltage

Maximum forward voltage V

Maximum reverse
leakage current

V

BR

FM

I

RM

Junction capacitance C

Series inductance L

DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

t

dI

dI

t

I

RRM1

I

RRM2

Q

Q

(rec)M

(rec)M

rr

rr1

rr2

rr1

rr2

Reverse recovery time
See fig. 5, 10

Peak recovery current
See fig. 6

Reverse recovery charge
See fig. 7

Peak rate of fall of recovery
current during t

b

See fig. 8

IR = 100 μA 600 - -

IF = 15 A

I

= 30 A - 1.5 2.0

F

I

= 15 A, TJ = 125 °C - 1.2 1.6

F

VR = VR rated

T

= 125 °C, VR = 0.8 x VR rated - 400 1000

J

VR = 200 V See fig. 3 - 25 50 pF

T

Measured lead to lead 5 mm from package body - 8.0 - nH

S

See fig. 1

See fig. 2

-1.31.7

-1.010

IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V - 19 -

TJ = 25 °C

-4260

TJ = 125 °C - 70 90

TJ = 25 °C - 4.0 6.0

TJ = 125 °C - 6.5 10

TJ = 25 °C - 80 180

TJ = 125 °C - 220 450

I

= 15 A

F

dI

/dt = 200 A/μs

F

V

= 200 V

R

/dt1 TJ = 25 °C - 188 -

/dt2 TJ = 125 °C - 160 -

V

μA

nst

A

nC

A/μs

THERMAL - MECHANICAL SPECIFICATIONS PER LEG

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Lead temperature T

lead

Junction to case,
single leg conducting

Junction to case,

R

thJC

both legs conducting

Thermal resistance,
junction to ambient

R

thJA

Weight

Mounting torque

Marking device Case style D

www.vishay.com For technical questions, contact: [e-mail]
2 Revision: 22-Feb-10

0.063" from case (1.6 mm) for 10 s - - 300 °C

--1.7

- - 0.85

Typical socket mount - - 80

-2.0- g

-0.07- oz.

6.0

(5.0)

2

PAK HFA30TA60CS

-

Document Number: 94071

12

(10)

K/W

kgf · cm

(lbf · in)

VS-HFA30TA60CSPbF

100

10

- Instantaneous Forward Current (A)

F

I

94071_01

HEXFRED

Ultrafast Soft Recovery Diode, 2 x 15 A

TJ = 150 °C

= 125 °C

T

J

= 25 °C

T

J

1

1.0 1.2 1.4 1.6 2.01.8 2.2 2.4

VFM - Forward Voltage Drop (V)

Fig. 1 - Maximum Forward Voltage Drop vs.

Instantaneous Forward Current (Per Leg)

100

®

10 000

1000

100

10

- Reverse Current (μA)

R

0.1

I

0.01

94071_02

Vishay High Power Products

TJ = 150 °C

TJ = 125 °C

1

TJ = 25 °C

0 100 200 300 500400 600

VR - Reverse Voltage (V)

Fig. 2 - Typical Reverse Current vs.

Reverse Voltage (Per Leg)

TJ = 25 °C

- Junction Capacitance (pF)

T

C

10

0200400100 300 500 600

94071_03

VR - Reverse Voltage (V)

Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)

10

1

D = 0.50

0.1

- Thermal Response

thJC

Z

0.01

0.00001 0.0001 0.001 0.01 0.1

94071_04

Single pulse

(thermal response)

t1 - Rectangular Pulse Duration (s)

D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01

Fig. 4 - Maximum Thermal Impedance Z

Notes:

1. Duty factor D = t

2. Peak TJ = PDM x Z

Characteristics (Per Leg)

thJC

P

DM

t

1

t

2

1/t2

+ T

thJC

C

101

Document Number: 94071 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 22-Feb-10 3

VS-HFA30TA60CSPbF

Vishay High Power Products

Ultrafast Soft Recovery Diode, 2 x 15 A

100

80

60

(ns)

rr

t

40

VR = 200 V

20

T

= 125 °C

J

= 25 °C

T

J

0

100 1000

94071_05

dIF/dt (A/μs)

Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg)

25

VR = 200 V

= 125 °C

T

J

= 25 °C

T

J

20

IF = 30 A

= 15 A

I

F

(A)

rr

I

15

10

= 5 A

I

F

5

IF = 30 A

= 15 A

I

F

= 5 A

I

F

HEXFRED

800

600

400

(nC)

rr

Q

200

0

100 1000

94071_07

Fig. 7 - Typical Stored Charge vs. dI

10 000

1000

/dt (A/μs)

(rec)M

dI

®

VR = 200 V

= 125 °C

T

J

= 25 °C

T

J

IF = 30 A

= 15 A

I

F

= 5 A

I

F

VR = 200 V

= 125 °C

T

J

= 25 °C

T

J

IF = 30 A

= 15 A

I

F

= 5 A

I

F

dIF/dt (A/μs)

/dt (Per Leg)

F

0

100 1000

94071_06

dIF/dt (A/μs)

Fig. 6 - Typical Recovery Current vs. dI

/dt (Per Leg)

F

94071_08

100

100 1000

dIF/dt (A/μs)

Fig. 8 - Typical dI

/dt vs. dIF/dt (Per Leg)

(rec)M

www.vishay.com For technical questions, contact: [e-mail]

Document Number: 94071

4 Revision: 22-Feb-10

VS-HFA30TA60CSPbF

HEXFRED

®

Ultrafast Soft Recovery Diode, 2 x 15 A

= 200 V

V

R

0.01 Ω

L = 70 μH

D.U.T.

(3)

a

(2)

D

IRFP250

S

t

rr

t

b

I

RRM

0.5 I

dI

0.75 I

RRM

(4) Q

- area under curve dened by t

rr

and I

RRM

(5) dI
current during t

Q

/dt - peak rate of change of

(rec)M

dIF/dt

adjust

G

Fig. 9 - Reverse Recovery Parameter Test Circuit

I

F

0

dIF/dt

(1)

(1) dI

/dt - rate of change of current

F

through zero crossing

- peak reverse recovery current

(2) I

RRM

- reverse recovery time measured

(3) t

rr

from zero crossing point of negative
going I
through 0.75 I
extrapolated to zero current.

to point where a line passing

F

and 0.50 I

RRM

RRM

Fig. 10 - Reverse Recovery Waveform and Definitions

t

Vishay High Power Products

(4)

Q

rr

RRM

(5)

/dt

(rec)M

rr

trr x I

RRM

=

rr

2

portion of t

b

rr

Document Number: 94071 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 22-Feb-10 5

VS-HFA30TA60CSPbF

Vishay High Power Products

ORDERING INFORMATION TABLE

Device code

VS- HF A 30 TA 60 C S TRL PbF

1 - HPP product suffix

2 - HEXFRED® family

- Process designator: A = Electron irradiated

3

-Current rating (30 = 30 A)

4

- Package outline (TA = TO-220, 3 leads)

5

- Voltage rating (60 = 600 V)

6

- Circuit configuration (C = Common cathode)

7

- S = D2PAK

8

- None = Tube (50 pieces)

9

TRL = Tape and reel (left oriented)

TRR = Tape and reel (right oriented)

- PbF = Lead (Pb)-free

10

HEXFRED

®

Ultrafast Soft Recovery Diode, 2 x 15 A

324

51

678910

LINKS TO RELATED DOCUMENTS

Dimensions www.vishay.com/doc?95046

Part marking information www.vishay.com/doc?95054

Packaging information www.vishay.com/doc?95032

www.vishay.com For technical questions, contact: [e-mail]
6 Revision: 22-Feb-10

Document Number: 94071

DIMENSIONS in millimeters and inches

c

B

Detail A

c2

AA

A

± 0.004

B

M

A

Lead tip

(3)

(3)

View A - A

(E)

(D1)

E1

B

H

A1

Detail “A”

Rotated 90 °CW

Scale: 8:1

L

Gauge

plane

0° to 8°

L3

L4

Seating

plane

Section B - B and C - C

Scale: None

(4)

(4)

(b, b2)

b1, b3

(c)

c1

Base
Metal

Plating

Conforms to JEDEC outline D

2

PAK (SMD-220)

132

D

C

A

L2

E

(2)(3)

(2)

4

H

BB

2 x b

2 x b2

L1

0.010

A

B

MM

(3)

e

2 x

Pad layout

MIN.

11.00
(0.43)

MIN.

9.65

(0.38)

MIN.

3.81

(0.15)

MIN.

2.32

(0.08)

17.90 (0.70)

15.00 (0.625)

2.64 (0.103)

2.41 (0.096)

Lead assignments

Diodes

1. - Anode (two die)/open (one die)

2., 4. - Cathode

3. - Anode

Outline Dimensions

Vishay Semiconductors

D2PAK

SYMBOL

A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3

A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3

b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3

b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC

b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625

b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110

c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3

c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070

c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC

D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208

Notes

(1)

(2)

(3)

(4)

(5)

(6)

(7)

Document Number: 95046 For technical questions within your region, please contact one of the following: www.vishay.com
Revision: 31-Mar-11 [e-mail]

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

Dimensioning and tolerancing per ASME Y14.5 M-1994
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at

the outmost extremes of the plastic body
Thermal pad contour optional within dimension E, L1, D1 and E1
Dimension b1 and c1 apply to base metal only
Datum A and B to be determined at datum plane H
Controlling dimension: inch
Outline conforms to JEDEC outline TO-263AB

MILLIMETERS INCHES

MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.

NOTES SYMBOL

This document is subject to change without notice.

, [e-mail], [e-mail] 1

MILLIMETERS INCHES

www.vishay.com/doc?91000

NOTES

Legal Disclaimer Notice

Vishay

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Document Number: 91000 www.vishay.com
Revision: 11-Mar-11 1