Vishay HFA30TA60C User Manual

HFA30TA60C

Vishay High Power Products

Ultrafast Soft Recovery Diode, 2 x 15 A

Base

common

cathode

2

2

Common

Anode

PRODUCT SUMMARY

V

R

V

at 15 A at 25 °C 1.7 V

F

I

F(AV)

(typical) 19 ns

t

rr

T

(maximum) 150 °C

J

Q

(typical) 80 nC

rr

dI

/dt (typical) at 125 °C 160 A/µs

(rec)M

I

(typical) 4.0 A

RRM

cathode

13

TO-220AB

Anode

600 V

2 x 15 A

HEXFRED

FEATURES

• Ultrafast recovery

• Ultrasoft recovery

• Very low I

• Very low Q

• Guaranteed avalanche

• Specified at operating conditions

• Designed and qualified for industrial level

BENEFITS

• Reduced RFI and EMI

• Reduced power loss in diode and switching transistor

• Higher frequency operation

• Reduced snubbing

• Reduced parts count

DESCRIPTION

HFA30TA60C is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial construction
and advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 600 V and 15 A per leg continuous
current, the HFA30TA60C is especially well suited for use as
the companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED
extremely low values of peak recovery current (I
does not exhibit any tendency to “snap-off” during the
tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA30TA60C is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.

®

RRM

rr

®

product line features

) and

RRM

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Cathode to anode voltage V

Maximum continuous forward current

Single pulse forward current I

Maximum repetitive forward current I

Maximum power dissipation P

Operating junction and storage temperature range T

Document Number: 93091 For technical questions, contact: [e-mail]
Revision: 29-Jul-08 1

per leg

per device 30

J

I

F

FSM

FRM

, T

R

TC = 100 °C

D

TC = 25 °C 74

T

= 100 °C 29

C

Stg

600 V

15

150

60

W

- 55 to + 150 °C

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A

HFA30TA60C

Vishay High Power Products

HEXFRED

®

Ultrafast Soft Recovery Diode, 2 x 15 A

ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Cathode to anode
breakdown voltage

Maximum forward voltage V

Maximum reverse
leakage current

V

BR

FM

I

RM

Junction capacitance C

Series inductance L

DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

t

dI

dI

rr1

t

rr2

I

RRM1

I

RRM2

Q

Q

(rec)M

(rec)M

rr

rr1

rr2

Reverse recovery time
See fig. 5 and 10

Peak recovery current
See fig. 6

Reverse recovery charge
See fig. 7

Peak rate of fall of
recovery current during t
See fig. 8

b

IR = 100 µA 600 - -

IF = 15 A

I

= 30 A - 1.5 2.0

F

I

= 15 A, TJ = 125 °C - 1.2 1.6

F

VR = VR rated

T

= 125 °C, VR = 0.8 x VR rated - 400 1000

J

VR = 200 V See fig. 3 - 25 50 pF

T

Measured lead to lead 5 mm from package body - 8 - nH

S

See fig. 1

See fig. 2

-1.31.7

-1.010

IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 19 -

TJ = 25 °C

-4260

TJ = 125 °C - 70 120

TJ = 25 °C - 4.0 6.0

TJ = 125 °C - 6.5 10

TJ = 25 °C - 80 180

TJ = 125 °C - 220 600

I

= 15 A

F

/dt = 200 A/µs

dI

F

V

= 200 V

R

/dt1 TJ = 25 °C - 250 -

/dt2 TJ = 125 °C - 160 -

V

µA

nst

A

nC

A/µs

THERMAL - MECHANICAL SPECIFICATIONS PER LEG

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Lead temperature T

lead

Junction to case,
single leg conducting

Junction to case,

R

thJC

both legs conducting

Thermal resistance,
junction to ambient

Thermal resistance,
case to heatsink

R

thJA

R

thCS

Weight

Mounting torque

Marking device Case style TO-220AB HFA30TA60C

www.vishay.com For technical questions, contact: [e-mail]
2 Revision: 29-Jul-08

0.063" from case (1.6 mm) for 10 s - - 300 °C

1.7

- - 0.85

Typical socket mount - - 40

Mounting surface, flat, smooth and greased - 0.25 -

-6.0- g

-0.21- oz.

6.0

(5.0)

-

12

(10)

Document Number: 93091

K/W

kgf · cm
(lbf · in)