Vishay HFA30PA60CPbF User Manual
HFA30PA60CPbF
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 15 A
TO-2 47 AC
PRODUCT SUMMARY
V
R
V
at 15 A at 25 °C 1.7 V
F
I
F(AV)
(typical) 19 ns
t
rr
T
(maximum) 150 °C
J
Q
(typical) 80 nC
rr
dI
/dt (typical) 160 A/µs
(rec)M
(typical) 4.0 A
I
RRM
Base
common
cathode
2
13
Anode
1
Common
cathode
2 x 15 A
2
600 V
Anode
2
HEXFRED
FEATURES
• Ultrafast recovery
• Ultrasoft recovery
• Very low I
• Very low Q
• Specified at operating conditions
• Lead (Pb)-free
• Designed and qualified for industrial level
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
DESCRIPTION
HFA30PA60C is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial construction
and advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 600 V and 15 A per leg continuous
current, the HFA30PA60C is especially well suited for use as
the companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED
extremely low values of peak recovery current (I
does not exhibit any tendency to “snap-off” during the
t
portion of recovery. The HEXFRED features combine to
b
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA30PA60C is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
®
RRM
rr
Pb-free
Available
RoHS*
COMPLIANT
®
product line features
RRM
) and
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
Maximum continuous forward current
Single pulse forward current I
Maximum repetitive forward current I
Maximum power dissipation P
Operating junction and storage temperature range T
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 94068 For technical questions, contact: diodes-tech@vishay.com
Revision: 25-Jul-08 1
per leg
per device 30
J
I
F
FSM
FRM
, T
R
TC = 100 °C
D
TC = 25 °C 74
T
= 100 °C 29
C
Stg
600 V
15
150
60
W
- 55 to + 150 °C
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A
HFA30PA60CPbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 2 x 15 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
Maximum forward voltage V
Maximum reverse
leakage current
V
BR
FM
I
RM
Junction capacitance C
Series inductance L
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
t
dI
dI
rr1
t
rr2
I
RRM1
I
RRM2
Q
Q
(rec)M
(rec)M
rr
rr1
rr2
Reverse recovery time
See fig. 5, 10
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of fall of
recovery current during t
See fig. 8
b
IR = 100 µA 600 - -
IF = 15 A
I
= 30 A - 1.5 2.0
F
I
= 15 A, TJ = 125 °C - 1.2 1.6
F
VR = VR rated
T
= 125 °C, VR = 0.8 x VR rated - 400 1000
J
VR = 200 V See fig. 3 - 25 50 pF
T
Measured lead to lead 5 mm from package body - 12 - nH
S
See fig. 1
See fig. 2
-1.31.7
-1.010
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 19 -
TJ = 25 °C
-4260
TJ = 125 °C - 70 120
TJ = 25 °C - 4.0 6.0
TJ = 125 °C - 6.5 10
TJ = 25 °C - 80 180
TJ = 125 °C - 220 600
I
= 15 A
F
/dt = 200 A/µs
dI
F
V
= 200 V
R
/dt1 TJ = 25 °C - 250 -
/dt2 TJ = 125 °C - 160 -
V
µA
nst
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
lead
Junction to case,
single leg conduction
Junction to case,
R
thJC
both legs conducting
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
R
thJA
R
thCS
Weight
Mounting torque
Marking device Case style TO-247AC (JEDEC) HFA30PA60C
www.vishay.com For technical questions, contact: diodes-tech@vishay.com
2 Revision: 25-Jul-08
0.063” from case (1.6 mm) for 10 s - - 300 °C
--1.7
- - 0.85
Typical socket mount - - 40
Mounting surface, flat, smooth and greased - 0.25 -
-6.0- g
-0.21- oz.
6.0
(5.0)
-
12
(10)
Document Number: 94068
K/W
kgf · cm
(lbf · in)
A
HFA30PA60CPbF
100
HEXFRED
®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 15 A
10000
T = 150°C
1000
100
10
1
0.1
0.01
T = 150°C
J
T = 125°C
10
J
T = 25°C
J
100
J
T = 125°C
J
T = 25°C
J
0 100 200 300 400 500 600
Reverse Voltage - V (V)
R
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage (Per Leg)
A
1
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Forward Voltage Drop - V (V)
FM
Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous
Forward Current (Per Leg)
10
thJC
1
D = 0.50
0.20
0.10
0.05
0.1
0.02
0.01
Thermal Response (Z )
0.01
0.00001 0.0001 0.001 0.01 0.1 1
SINGLE PULSE
(THERMAL RESPONSE)
t , Rectangular Pulse Duration (sec)
1
T = 25°C
J
10
0 100 200 300 400 500 600
Reverse Voltage - V (V)
R
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
P
DM
t
1
t
2
Notes:
1. Duty f actor D = t / t
2. Peak T =P x Z + T
1 2
J DM thJC C
Fig. 4 - Maximum Thermal Impedance Z
Characteristics (Per Leg)
thJC
Document Number: 94068 For technical questions, contact: diodes-tech@vishay.com
Revision: 25-Jul-08 3
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