Vishay HFA25TB60PbF User Manual

HFA25TB60PbF
Ultrafast Soft Recovery Diode, 25 A
Base
cathode
1
Cathode
TO-220AC
PRODUCT SUMMARY
VR 600 V
V
at 25 A at 25 °C 1.7 V
F
I
F(AV)
t
(typical) 23 ns
rr
T
(maximum) 150 °C
J
(typical) 112 nC
Q
rr
dI
/dt (typical) 250 A/µs
(rec)M
I
10 A
RRM
Anode
HEXFRED
®
FEATURES
• Ultrafast recovery
• Ultrasoft recovery
• Very low I
• Very low Q
RRM
rr
• Specified at operating conditions
• Lead (Pb)-free
• Designed and qualified for industrial level
Available
RoHS*
COMPLIANT
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
3
• Reduced snubbing
• Reduced parts count
DESCRIPTION
HFA25TB60 is a state of the art ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 25 A continuous current, the HFA25TB60 is especially well suited for use as the
25 A
companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED extremely low values of peak recovery current (I does not exhibit any tendency to “snap-off” during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA25TB60 is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed.
®
product line features
) and
RRM
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
Maximum continuous forward current I
Maximum repetitive forward current I
Maximum power dissipation P
Operating junction and storage temperature range T
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 94065 For technical questions, contact: diodes-tech@vishay.com Revision: 25-Jul-08 1
J
F
FSM
FRM
, T
R
TC = 100 °C 25
D
TC = 25 °C 125
T
= 100 °C 50
C
Stg
600 V
225
100
W
- 55 to + 150 °C
www.vishay.com
ASingle pulse forward current I
HFA25TB60PbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 25 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode breakdown voltage
Maximum forward voltage V
Maximum reverse leakage current
V
BR
FM
I
RM
Junction capacitance C
Series inductance L
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
t
dI
dI
rr1
t
rr2
I
RRM1
I
RRM2
Q
Q
(rec)M
(rec)M
rr
rr1
rr2
Reverse recovery time See fig. 5, 6 and 16
Peak recovery current See fig. 7 and 8
Reverse recovery charge See fig. 9 and 10
Peak rate of fall of recover curent during t
b
See fig. 11 and 12
IR = 100 µA 600 - -
IF = 25 A
I
= 50 A - 1.5 2.0
F
I
= 25 A, TJ = 125 °C - 1.3 1.7
F
VR = VR rated
T
= 125 °C, VR = 0.8 x VR rated - 600 2000
J
VR = 200 V See fig. 3 - 55 100 pF
T
Measured lead to lead 5 mm from package body - 8.0 - nH
S
See fig. 1
See fig. 2
-1.31.7
-1.520
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 23 -
TJ = 25 °C
-5075
TJ = 125 °C - 105 160
TJ = 25 °C - 4.5 10
I
TJ = 125 °C - 8.0 15
TJ = 25 °C - 112 375
TJ = 125 °C - 420 1200
= 25 A
F
/dt = 200 A/µs
dI
F
= 200 V
V
R
/dt1 TJ = 25 °C - 250 -
/dt2 TJ = 125 °C - 160 -
V
µA
nst
A
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
Thermal resistance, junction to case
Thermal resistance, junction to ambient
Thermal resistance, case to heatsink
lead
R
thJC
R
thJA
R
thCS
Weight
Mounting torque
Marking device Case style TO-220AC HFA25TB60
www.vishay.com For technical questions, contact: diodes-tech@vishay.com 2 Revision: 25-Jul-08
0.063” from case (1.6 mm) for 10 s - - 300 °C
--1.0
Typical socket mount - - 80
K/W
Mounting surface, flat, smooth and greased - 0.5 -
-2.0- g
-0.07- oz.
6.0
(5.0)
-
12
(10)
kgf · cm (lbf · in)
Document Number: 94065
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