HFA135NH40PbF
Vishay High Power Products
Ultrafast Soft Recovery Diode, 275 A
HALF-PAK (D-67)
PRODUCT SUMMARY
IF (maximum) 275 A
V
R
I
at T
F(DC)
C
Lug terminal
anode
Base
cathode
400 V
138 A at 100 °C
HEXFRED
FEATURES
• Very low Qrr and t
• Lead (Pb)-free
• Designed and qualified for industrial level
BENEFITS
• Reduced RFI and EMI
• Reduced snubbing
DESCRIPTION
HEXFRED® diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for
different values of current, temperature and dI/dt simplifies
the calculations of losses in the operating conditions. The
softness of the recovery eliminates the need for a snubber in
most applications. These devices are ideally suited for
power converters, motors drives and other applications
where switching losses are significant portion of the total
losses.
®
rr
RoHS
COMPLIANT
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
Continuous forward current I
Single pulse forward current I
Non-repetitive avalanche energy E
Maximum power dissipation P
Operating junction and storage
temperature range
T
J
FSM
, T
F
AS
R
TC = 25 °C 275
= 100 °C 138
C
Limited by junction temperature 900
L = 100 µH, duty cycle limited by maximum T
D
TC = 25 °C 463
T
= 100 °C 185
C
Stg
J
400 V
AT
1.4 mJ
W
- 55 to + 150 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
Maximum forward voltage V
Maximum reverse
leakage current
Junction capacitance C
Series inductance L
V
BR
FM
I
RM
T
S
IR = 100 µA 400 - -
IF = 135 A
I
= 270 A - 1.2 2.0
F
I
= 135 A, TJ = 125 °C - 0.96 1.58
F
TJ = 125 °C, VR = 400 V See fig. 2 - - 3 mA
VR = 200 V See fig. 3 - 280 380 pF
From top of terminal hole to mounting plane - 6.0 - nH
See fig. 1
- 1.06 1.65
V
Document Number: 94050 For technical questions, contact: ind-modules@vishay.com
Revision: 01-Aug-08 1
www.vishay.com
HFA135NH40PbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery
Diode, 275 A
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of recovery current
See fig. 8
dI
t
rr
I
RRM
Q
(rec)M
TJ = 25 °C
T
= 125 °C - 280 440
J
TJ = 25 °C - 7.5 14
= 135 A
I
T
= 125 °C - 15 30
J
TJ = 25 °C - 150 780
rr
T
= 125 °C - 2800 6300
J
= 25 °C - 350 -
T
J
/dt
T
= 125 °C - 300 -
J
F
/dt = 200 A/µs
dI
F
V
= 200 V
R
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to case
Typical thermal resistance,
case to heatsink
Approximate weight
Mounting torque
Terminal torque
Case style HALF-PAK module
minimum 3 (26.5)
maximum 4 (35.4)
minimum 3.4 (30)
maximum 5 (44.2)
,
T
J
T
Stg
R
thJC
R
thCS
DC operation
See fig. 4
Mounting surface, flat, smooth and greased 0.05
- 77 120
- 55 to 150 °C
0.27
°C/W
30 g
1.06 oz.
N · m
(lbf · in)
ns
A
nC
A/µs
www.vishay.com For technical questions, contact: ind-modules@vishay.com
2 Revision: 01-Aug-08
Document Number: 94050
HFA135NH40PbF
1000
100
10
- Istantaneous Forward Current (A)
1
F
I
0.2 3.21.2
Fig. 1 - Maximum Forward Voltage Drop vs.
10
1
0.1
0.01
- Reverse Current (µA)
0.001
R
I
0.0001
100
Fig. 2 - Typical Reverse Current vs.
Ultrafast Soft Recovery Diode,
TJ = 150 °C
= 125 °C
T
J
= 25 °C
T
J
0.7 2.2
VFM - Forward Voltage Drop (V)
Instantaneous Forward Current
VR - Reverse Voltage (V)
1.7
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
200 400300
Reverse Voltage
2.7
HEXFRED
275 A
®
Maximum Allowable
Case Temperature (°C)
Vishay High Power Products
160
140
120
100
80
60
40
20
0
50 150 200 300
0 100 250 350
I
- DC Forward Current (A)
F(AV)
DC
Fig. 4 - Maximum Allowable Case Temperature vs. DC
Forward Current
(ns)
rr
t
450
400
350
300
250
200
150
100
50
0
100
TJ = 125 °C
TJ = 25 °C
IF = 200 A
= 135 A
I
F
= 50 A
I
F
1000
dIF/dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dI
/dt
F
10 000
1000
- Junction Capacitance (pF)
T
C
100
1 10 100 1000
TJ = 25 °C
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
(A)
RRM
I
70
TJ = 125 °C
TJ = 25 °C
60
50
IF = 200 A
= 135 A
I
F
40
= 50 A
I
F
30
20
10
0
100
dIF/dt (A/µs)
Fig. 6 - Typical Recovery Current vs. dI
F
1000
/dt
Document Number: 94050 For technical questions, contact: ind-modules@vishay.com
www.vishay.com
Revision: 01-Aug-08 3